Information acquisition device, key structure and electronic equipment

Abstract

The utility model provides an information acquisition device, a key structure and electronic equipment, and relates to the technical field of biological recognition, the information acquisition device comprises an information acquisition module, a pressing pad and a pressure sensor, and an acquisition link in which the deformation of the pressing pad is acquired by the pressure sensor is constructed. On the basis, when the information acquisition module is not pressed by the target object, a gap should be formed between the sensing surface of the pressure sensor and the pressing pad. Due to the existence of the gap, when the information acquisition module is not pressed by the target object, the sensing surface of the pressure sensor is not in contact with the pressing pad, so that when the information acquisition module is not pressed, the pressure sensor also outputs the non-pressed information, and the states of the information acquisition module and the pressure sensor are kept consistent. And when the target presses the information acquisition module, the information acquisition module can promote the pressing pad to deform and cross the gap to act on the sensing surface of the pressure sensor, so that when the information acquisition module is pressed, the pressure sensor can also output pressed information, and the states of the information acquisition module and the pressure sensor are still kept consistent.

Description

Technical Field

[0001] This application relates to the field of biometric technology, and more specifically, to an information acquisition device, a button structure, and an electronic device. Background Technology

[0002] With technological innovation, many new types of products have emerged in the consumer electronics field, among which smart terminals are gaining an increasingly larger market share. Smart terminal products are actively incorporating more functional modules to achieve richer interactive experiences. For example, fingerprint modules are being installed in smart terminals to enable fingerprint recognition, allowing for functions such as unlocking the screen and confirming payments, depending on the scenario.

[0003] To further enrich the functionality of fingerprint modules, a solution integrating a pressure sensor into the module has gradually emerged. This solution uses the pressure sensor to collect the pressure applied when a finger presses the fingerprint module and uses this information to implement various functions. However, the current placement of the pressure sensor in fingerprint modules has certain drawbacks. When the fingerprint module is not under pressure, the sensing surface of the pressure sensor comes into contact with other components within the module, thus outputting a pressure signal. This design is not conducive to accurately sensing the pressure state of the fingerprint module, affecting the effectiveness of related functions. Utility Model Content

[0004] The purpose of this application is to address the shortcomings of the prior art by providing an information acquisition device, a button structure, and an electronic device.

[0005] To achieve the above objectives, the technical solutions adopted in the embodiments of this application are as follows:

[0006] One aspect of this application provides an information collection device, including:

[0007] The information acquisition module is used to collect the biometric information of the target object when it is pressed.

[0008] Press pad, the press pad is set in the information acquisition module;

[0009] The pressure sensor works in conjunction with the pressure pad. When the information acquisition module is not pressed by the target object, there is a gap between the sensing surface of the pressure sensor and the pressure pad. The pressure sensor is used to output an electrical signal that characterizes the pressure state of the information acquisition module.

[0010] Optionally, the pressing pad is opposite to the side of the information collection module that is pressed by the target object.

[0011] Optionally, a receiving cavity is provided in the pressing pad, and the pressure sensor is located in the receiving cavity, with the sensing surface facing the wall of the receiving cavity and having a gap.

[0012] Optionally, a groove is formed on the side of the pressing pad near the information acquisition module. The internal space of the groove serves as a receiving cavity. The pressure sensor is fixed to the information acquisition module, with its sensing surface facing away from the information acquisition module and its sensing surface facing the bottom surface of the groove with a gap.

[0013] Optionally, the width of the gap is 0.1 mm to 0.2 mm.

[0014] Optionally, the information collection module includes:

[0015] The acquisition module is used to collect biometric information;

[0016] The circuit board, the acquisition module, and the pressure pad are disposed on opposite sides of the circuit board, and the acquisition module and the pressure sensor are electrically connected to the circuit board respectively. The orthographic projections of the acquisition module and the pressure pad along the thickness direction of the circuit board at least partially overlap.

[0017] Optionally, the circuit board is a long strip board, which includes a first sub-board and a second sub-board that are bent along its length to form a stacked sub-board. The acquisition module is located on the side of the first sub-board away from the second sub-board, and the pressing pad is located on the side of the second sub-board away from the first sub-board.

[0018] Optionally, the information collection module also includes:

[0019] The first reinforcing component and the acquisition module are located on opposite sides of the first sub-board;

[0020] The second reinforcing member and the pressing pad are located on opposite sides of the second sub-plate, and the first reinforcing member and the second reinforcing member are stacked and fixedly connected.

[0021] Optionally, a positioning structure is provided on the first reinforcing member and the second reinforcing member. The positioning structure includes a positioning hole and a positioning post that are mutually engaged and inserted into each other. The positioning hole is provided on one of the first reinforcing member and the second reinforcing member, and the positioning post is provided on the other of the first reinforcing member and the second reinforcing member.

[0022] Optionally, the positioning post is located on the first reinforcing member, the positioning hole is located on the second reinforcing member, and a through hole communicating with the positioning hole is provided on the second sub-plate, with the positioning post being inserted into the positioning hole and the through hole in sequence.

[0023] Optionally, through holes are provided on the first reinforcing member and / or the second reinforcing member for insertion with the equipment body.

[0024] In another aspect of this application, a button structure is provided, including a switch module and any of the above-described information acquisition devices. The switch module is used to be assembled to a middle frame, and the pressing pad of the information acquisition device and the switch module are configured to cooperate. The information acquisition module of the information acquisition device is pressed to press the switch module through the pressing pad.

[0025] In another aspect of this application, an electronic device is provided, including a mid-frame, a motherboard located inside the mid-frame, and a button structure as described above. The button structure is assembled in the mid-frame and electrically connected to the motherboard.

[0026] The beneficial effects of this application include:

[0027] This application provides an information acquisition device, a button structure, and an electronic device, including: an information acquisition module, a pressing pad, and a pressure sensor. The pressed information acquisition module causes the pressing pad to deform. Therefore, by cooperating with the pressing pad, a data acquisition link can be established where the pressure pad deformation is collected by the pressure sensor. Furthermore, when the information acquisition module is not pressed by a target object, there should be a small gap between the sensing surface of the pressure sensor and the pressing pad. This gap ensures that the sensing surface of the pressure sensor does not contact the pressing pad when the information acquisition module is not pressed. Thus, when the information acquisition module is not pressed, the pressure sensor will also output information indicating that it is not pressed, maintaining consistency between the two states. When a target object presses the information acquisition module, the information acquisition module causes the pressing pad to deform and extend across the gap to the sensing surface of the pressure sensor. Thus, when the information acquisition module is pressed, the pressure sensor will also output information indicating that it is pressed, maintaining consistency between the two states. Attached Figure Description

[0028] To more clearly illustrate the technical solutions of the embodiments of this application, the accompanying drawings used in the embodiments will be briefly introduced below. It should be understood that the following drawings only show some embodiments of this application and should not be regarded as a limitation of the scope. For those skilled in the art, other related drawings can be obtained based on these drawings without creative effort.

[0029] Figure 1 An isometric view of an information acquisition device provided in an embodiment of this application;

[0030] Figure 2 A side view of an information acquisition device provided in an embodiment of this application;

[0031] Figure 3 This is one of the partial structural schematic diagrams of an information acquisition device provided in an embodiment of this application;

[0032] Figure 4This is a second partial structural schematic diagram of an information acquisition device provided in an embodiment of this application;

[0033] Figure 5 This is a partial structural schematic diagram of another information acquisition device provided in an embodiment of this application;

[0034] Figure 6 This is a schematic diagram of an information collection device provided in an embodiment of this application, in its unfolded state.

[0035] Icons: 100 - Information acquisition module; 110 - Acquisition module; 111 - Pressing side; 120 - Circuit board; 121 - First sub-board; 122 - Second sub-board; 130 - Reinforcing structure; 131 - First reinforcing member; 1311 - Through hole; 132 - Second reinforcing member; 141 - Positioning post; 142 - Positioning hole; 143 - Through hole; 150 - Connector; 200 - Pressing pad; 210 - Receiving cavity; 220 - Pressing part; 230 - Groove; 240 - Hole structure; 300 - Pressure sensor; 310 - Sensing surface. Detailed Implementation

[0036] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. Based on the embodiments of this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application.

[0037] When integrating a pressure sensor into a fingerprint module, the sensing surface of the pressure sensor is bonded to other components (usually a circuit board) within the fingerprint module. While this configuration allows the pressure sensor to detect the deformation of the circuit board when a finger presses on the fingerprint module, it can also cause the pressure sensor to still experience pressure from the circuit board when the fingerprint module is not under pressure. This pressure can be caused by factors such as assembly errors and circuit board flatness, resulting in the pressure sensor outputting pressure information even when the fingerprint module is not actually being pressed, thus affecting the functionality of related functions.

[0038] Based on this, one aspect of the present application provides an information acquisition device, which includes: an information acquisition module for acquiring biometric information of a target object when pressed by the target object; a pressing pad disposed in the information acquisition module; and a pressure sensor that cooperates with the pressing pad, wherein when the information acquisition module is not pressed by the target object, there is a gap between the sensing surface of the pressure sensor and the pressing pad, and the pressure sensor is used to output an electrical signal characterizing the pressure state of the information acquisition module.

[0039] When the target object is pressed onto the information acquisition module, the information acquisition module can collect the biometric information of the target object, and then use it to realize multiple functions such as target object recognition and pressing position recognition. The side of the information acquisition module that is pressed by the target object can be called the pressing side.

[0040] The pressed information acquisition module causes the pressure pad on it to deform. Therefore, by coordinating the pressure sensor with the pressure pad, a data acquisition link can be established where the pressure pad deformation is collected by the pressure sensor. Furthermore, when the information acquisition module is not pressed by a target object, there should be a small gap between the sensing surface of the pressure sensor and the pressure pad. This gap ensures that the sensing surface of the pressure sensor does not contact the pressure pad when the information acquisition module 100 is not pressed. Thus, when the information acquisition module is not under pressure, the pressure sensor will also output information indicating that it is not under pressure, and the two states remain consistent. Conversely, when a target object presses on the information acquisition module, the module causes the pressure pad to deform and extend across the gap to the sensing surface of the pressure sensor. Thus, when the information acquisition module is under pressure, the pressure sensor will also output information indicating that it is under pressure, and the two states remain consistent.

[0041] Especially when the pressing pad and the pressing side of the information acquisition module are opposite each other, the pressed information acquisition module can make the pressing pad interact with the electronic devices (such as the switch module) outside the information acquisition device, causing the pressing pad to produce a large deformation, so that it can easily cross the gap and act on the pressure sensor. This allows the sensing surface of the pressure sensor to be smoothly acted on by the pressing pad when the information acquisition module is pressed by the target object.

[0042] Figure 1 This is an isometric view of an information acquisition device provided in an embodiment of this application. Figure 2 This is a side view of an information collection device provided in an embodiment of this application. Figure 3 This is one of the partial structural schematic diagrams of an information acquisition device provided in the embodiments of this application. Figure 4 This is a second partial structural schematic diagram of an information acquisition device provided in an embodiment of this application. Specifically, Figure 3 yes Figure 2 A magnified view of region A in the information acquisition device shown. Figure 3 The partial structure shown represents the state of the information acquisition module when it is not pressed by the target object. Figure 4 The local structure shown represents the state of the target object when the information acquisition module is pressed.

[0043] Please refer to Figure 1 and Figure 2The pressing side 111 of the information acquisition module 100 can contact the target object, thus facilitating pressing by the target object. Pressing by the target object enables the information acquisition module 100 to collect its biometric information. It should be understood that the target object can be a finger, palm, etc., and the corresponding biometric information can be fingerprints, palm prints, etc. Furthermore, the information acquisition module 100 can be a capacitive fingerprint module or an ultrasonic fingerprint module, etc. For example, when the information acquisition module 100 is used as a capacitive fingerprint module to collect biometric information, changes in capacitance can be used to characterize fingerprint information.

[0044] The collected biometric information can be used for two main purposes. First, it can be used for identity verification, such as device unlocking and payment confirmation. Biometric information, combined with subsequent data analysis and processing, enables identity verification. Second, it can be used for pressure (or touch) location recognition. For example, in scenarios like volume adjustment, song switching, answering or ending voice calls, and swiping, the location of the biometric information within an image can be used to identify the pressure point. Specifically, in volume adjustment scenarios, different pressure points can be used to increase or decrease the volume. Figure 2 In the process, when the information acquisition module 100 detects that the target object's pressing position is closer to the left end, the volume can be increased or decreased; conversely, when the information acquisition module 100 detects that the target object's pressing position is closer to the right end, the volume is adjusted in the opposite direction. In sliding operation scenarios, multiple pressing positions within a preset time period are used to identify the sliding operation of the target object on the surface of the information acquisition module 100, such as... Figure 2 As shown, within a preset time period, when the pressing position of the target object gradually shifts from the left end to the right end of the information collection module 100, the sliding operation of the target object from left to right can be identified, and the reverse sliding operation is similar.

[0045] When enriching the functions of an information acquisition device, it may be used in conjunction with other electronic devices, such as combining the information acquisition device with a switch module to form a button structure. To facilitate the information acquisition device's interaction with the paired electronic devices, a pressure pad 200 can be provided on the information acquisition module 100. When a target object presses the information acquisition module 100, the information acquisition module 100 can act on the electronic device through the pressure pad 200, causing the electronic device to output a corresponding signal. This allows for the expansion of various functions based on this signal. To facilitate the application of the pressure pad 200 to the paired electronic devices, the pressure pad 200 can be positioned on one side of the information acquisition module 100, opposite to the pressing side 111 of the information acquisition module 100. For example… Figure 2 In the middle, the pressing side 111 of the information collection module 100 is the upper side, while the pressing pad 200 is located on the lower side of the information collection module 100.

[0046] Please refer to the reference. Figures 1 to 3 The purpose of combining the pressure sensor 300 with the pressure pad 200 is to establish a data acquisition link whereby the pressure sensor 300 senses the deformation of the pressure pad 200. For example... Figure 3 As shown, when the information acquisition module 100 is not pressed by a target object, that is, when the pressure pad 200 does not undergo the expected deformation, there is a gap W between the sensing surface 310 of the pressure sensor 300 and the pressure pad 200, so that the pressure pad 200 does not contact the sensing surface 310 of the pressure sensor 300. The expected deformation refers to the deformation of the pressure pad 200 that can cross the gap and act on the sensing surface 310 when the information acquisition module 100 is pressed by a target object.

[0047] The pressure pad 200 can be made of a material that easily deforms under stress. When applied to an electronic device, the pressure pad 200 can deform significantly using the reaction force. This serves two purposes: firstly, it provides soft contact protection; secondly, it allows the deformed pressure pad 200 to easily cross the gap and reach the sensing surface 310 of the pressure sensor 300. It should be understood that the width of the gap W should not be too large. Its purpose is solely to prevent the pressure pad 200 from contacting the sensing surface 310 of the pressure sensor 300 and thus avoiding the output of erroneous information when the information acquisition module 100 is not pressed by the target object. Therefore, when the target object presses on the information acquisition module 100, causing the pressure pad 200 to deform, the deformation of the pressure pad 200 should be greater than the width of the gap so that the pressure pad 200 can smoothly cross the gap and contact the sensing surface 310 of the pressure sensor 300.

[0048] Optionally, the width of the gap is 0.1mm to 0.2mm, such as 0.1mm, 0.13mm, 0.15mm, 0.17mm, 0.2mm, etc. This allows the pressing pad 200 to smoothly cross the gap and contact the sensing surface 310 when the information acquisition module 100 is pressed, while simultaneously preventing the sensing surface 310 from contacting the pressing pad 200 when the information acquisition module 100 is not pressed. Furthermore, considering assembly errors, the above-mentioned range also accommodates assembly errors while achieving the aforementioned effects.

[0049] The following is an illustrative description of the work process:

[0050] Reference Figure 3 When the target object does not press the information acquisition module 100, the information acquisition module 100 will not cause the pressure pad 200 to undergo the expected deformation. Therefore, a gap is maintained between the sensing surface 310 of the pressure sensor 300 and the pressure pad 200. At this time, the electrical signal output by the pressure sensor 300 indicates that the information acquisition module 100 is not pressed by the target object.

[0051] Reference Figure 4 When the target object presses the information acquisition module 100, the information acquisition module 100 causes the pressing pad 200 to undergo the expected deformation. Therefore, the pressing pad 200 crosses the gap and contacts and acts on the sensing surface 310 of the pressure sensor 300 through the expected deformation. The electrical signal output by the pressure sensor 300 indicates that the information acquisition module 100 is pressed by the target object.

[0052] The pressure sensor 300 can characterize the pressure state of the information acquisition module 100 by sensing the deformation of the pressure pad 200. Specifically, when a target object presses on the information acquisition module 100, the deformation generated by the pressure pad 200 acts on the pressure sensor 300, thereby enabling it to sense the pressure state of the information acquisition module 100 and output an electrical signal characterizing the pressure state of the information acquisition module 100. The pressure state of the information acquisition module 100 includes the pressure intensity and the duration of pressure. The electrical signal output by the pressure sensor 300 can be characterized by voltage or current waveforms. For example, during the pressure process of the information acquisition module 100, the pressure intensity can be characterized by the amplitude of the waveform in the electrical signal, and the duration of pressure can be characterized by the output duration of the electrical signal waveform. Therefore, based on the electrical signal output by the pressure sensor 300, and with the help of subsequent data analysis and processing, different operations such as light press, heavy press, long press, and short press of the target object can be identified. This enables functions such as connecting / hanging up calls, playing / pausing playback, switching audio and video, increasing / decreasing volume, and launching different applications, thus enriching the application scenarios of the information collection device.

[0053] After clarifying the working process of the information acquisition device, the structure of the information acquisition module 100 is explained: Please refer to... Figure 1 and Figure 2 The information acquisition module 100 includes an acquisition module 110 and a circuit board 120. The acquisition module 110 and the pressure sensor 300 can be electrically connected to the circuit board 120, thereby enabling them to interact with external devices (such as the motherboard of an electronic device) via the circuit board 120. Both the acquisition module 110 and the pressure pad 200 can be disposed on the circuit board 120, wherein the acquisition module 110 and the pressure pad 200 are disposed on opposite sides of the circuit board 120, and the orthographic projections of the acquisition module 110 and the pressure pad 200 along the thickness direction of the circuit board 120 at least partially overlap, for example... Figure 2 In the vertical direction (thickness direction of circuit board 120), the acquisition module 110 is located directly above the pressing pad 200, so their orthographic projections partially overlap.

[0054] The side of the acquisition module 110 away from the circuit board 120 ( Figure 2The upper surface of the module 110 is the aforementioned pressing side 111, and the acquisition module 110 is capable of acquiring biometric information; therefore, the acquisition module 110 should have a built-in acquisition chip. In different embodiments, the acquisition module 110 can be an encapsulated module or an unencapsulated module, for example... Figure 1 and Figure 2 The acquisition module 110 consists of a chip (bare die or packaged chip) and a package encapsulating the chip. To increase the durability of the acquisition module 110, a cover or coating can be added to its pressing side 111. Furthermore, the number of acquisition chips is not limited; for example, the acquisition module 110 may include one or more chips. A single chip facilitates miniaturization of the acquisition module 110, while multiple chips expand the acquisition area, allowing for a larger acquisition area to perceive more biometric information about the target object.

[0055] The circuit board 120 facilitates interaction between the data acquisition module 110 and the pressure sensor 300 with external devices, while also providing a mounting platform so that the data acquisition module 110, pressure sensor 300, and pressure pad 200 are all mounted on the circuit board 120 to form a module. In this application, the circuit board 120 can be a rigid circuit board, a flexible circuit board, or a rigid-flex board. Figure 1 and Figure 2 As shown, a connector 150 can be provided on the circuit board 120 to facilitate connection with external devices.

[0056] The following explains the interaction between the pressure pad 200 and the pressure sensor 300:

[0057] Figure 5 This is a partial structural schematic diagram of another information acquisition device provided in an embodiment of this application. Please refer to... Figures 1 to 5 To facilitate the interaction between the pressure pad 200 and the pressure sensor 300, a receiving cavity 210 can be provided within the pressure pad 200. The pressure sensor 300 is then assembled into this receiving cavity 210, at which point the sensing surface 310 of the pressure sensor 300 will be in a face-to-face relationship with certain walls constituting the receiving cavity 210. A certain gap W should exist between the sensing surface 310 and the walls, provided that the information acquisition module 100 is not pressed by the target object.

[0058] By placing the pressure sensor 300 in the receiving cavity 210 within the pressure pad 200, the pressure sensor 300 avoids occupying additional space, thus making the overall size of the information acquisition device smaller, especially suitable for scenarios with limited space. Furthermore, since the pressure sensor 300 is located within the receiving cavity 210, the pressure pad 200 can accurately act on the sensing surface 310 of the pressure sensor 300 after deformation, resulting in more accurate coordination and improving the stability and reliability of the acquisition link.

[0059] The receiving cavity 210 in the pressing pad 200 has several configuration forms. Two of them will be illustrated below:

[0060] In some possible implementations, please refer to the references. Figures 1 to 3 A pressure pad 200 is disposed on the lower surface of the information acquisition module 100, and a groove 230 is formed on the side surface of the pressure pad 200 near the information acquisition module 100. In other words, the opening of the groove 230 is located on the side surface of the pressure pad 200 near the information acquisition module 100, and the groove 230 extends towards the interior of the pressure pad 200. Thus, the interior space of the groove 230 serves as a receiving cavity 210, allowing the pressure sensor 300 to be disposed within the groove 230, fully utilizing the space of the groove 230 in the pressure pad 200. Furthermore, since the opening of the groove 230 faces the information acquisition module 100, the pressure sensor 300 can also be directly fixed to the information acquisition module 100 through the opening of the groove 230, facilitating wiring of the pressure sensor 300 within the information acquisition module 100. To facilitate sensing the deformation of the pressure pad 200, the sensing surface 310 of the pressure sensor 300 is opposite to the information acquisition module 100, that is, the sensing surface 310 of the pressure sensor 300 is directly opposite to the bottom surface of the groove 230 (that is, the wall surface of the receiving cavity 210 opposite to the sensing surface) and has a gap W.

[0061] Combination Figure 3 and Figure 4 As shown, when the electronic device (not shown) associated with the information acquisition device is located below the pressing pad 200, the target object presses the information acquisition module 100, causing the pressing pad 200 to first contact the electronic device below it, and through the reaction force, the pressing pad 200 deforms and then crosses the gap to contact and act with the sensing surface 310 of the pressure sensor 300.

[0062] When the information acquisition module 100 includes an acquisition module 110 and a circuit board 120, such as Figure 2As shown, the pressure pad 200 can be fixed to the circuit board 120. Meanwhile, the groove 230 faces the surface of the circuit board 120, which makes it easy to directly fix the pressure sensor 300 to the circuit board 120 and easily achieve electrical connection between the two, thus having a shorter line and avoiding increasing the wiring length.

[0063] In other possible implementations, please refer to Figure 5 A hole structure 240 is formed in the pressure pad 200, and the internal space of the hole structure 240 serves as the aforementioned receiving cavity 210. The internal space of the hole structure 240 is separated from the information acquisition module 100 by a portion of the pressure pad 200. A pressure sensor 300 is disposed inside the hole structure 240, and the non-sensing surface of the pressure sensor 300 is fixed to the wall of the hole structure 240 (not directly fixed to the information acquisition module 100 as in the previous embodiment), while the sensing surface 310 faces away from the information acquisition module 100. The sensing surface 310 of the pressure sensor 300 is directly opposite the wall of the hole structure 240 and has a gap between it and the wall, for example... Figure 5 In the process, the upper surface of the pressure sensor 300 is fixed to the upper wall of the hole structure 240, and the lower surface of the pressure sensor 300, as the sensing surface 310, is directly opposite the lower wall of the hole structure 240 and has a gap W.

[0064] When the information acquisition module 100 includes an acquisition module 110 and a circuit board 120, such as Figure 5 As shown, the pressure pad 200 can be fixed to the circuit board 120, while the pressure sensor 300 is fixed to the inner wall of the hole structure 240. At this time, the pressure sensor 300 can be electrically connected to the circuit board 120 through wiring.

[0065] Optionally, the contact point between the pressure pad 200 and the electronic device can correspond precisely to the center of the sensing surface 310 of the pressure sensor 300. This allows the area of ​​maximum deformation of the pressure pad 200 to contact and act upon the sensing surface 310. For example... Figures 1 to 5 As shown, the pressing pad 200 has a pressing part 220, which can be in a raised shape. The center of the pressing part 220 and the center of the sensing surface 310 are directly opposite. After the pressing pad 200 is acted upon by the information acquisition module 100, the pressing pad 200 acts on the electronic device through the pressing part 220, and uses the reaction force to generate the maximum deformation at the position of the pressing part 220, thereby contacting the sensing surface 310.

[0066] Optionally, to facilitate increased strength, a reinforcing structure 130, such as a rigid reinforcement structure, can be provided on the circuit board 120.

[0067] Optionally, such as Figure 6As shown, circuit board 120 is a long strip, which makes its overall shape more regular. This allows for the cutting of more circuit boards 120 from the same area of ​​raw material, reducing waste. To optimize the size of the information acquisition device and prevent it from being too long in one direction, circuit board 120 can be folded to form a stacked structure: as shown... Figure 6 As shown, the circuit board 120 can be kept unfolded without being folded. At this time, the aforementioned acquisition module 110, pressure sensor 300, pressing pad 200 and reinforcing structure 130 can be assembled on the circuit board 120. Then, the circuit board 120 is folded along its length direction a to form... Figure 1 and Figure 2 The stacked structure is shown. Therefore, the folded circuit board 120 includes a first sub-board 121 and a second sub-board 122 stacked on top of each other, with the first sub-board 121 and the second sub-board 122 connected at the bend or fold (e.g., Figure 1 and Figure 2 (Position on the left side of the middle rigid supplement structure), at this time, the acquisition module 110 is located on the side of the first sub-board 121 away from the second sub-board 122, and the pressing pad 200 is located on the side of the second sub-board 122 away from the first sub-board 121.

[0068] Optionally, such as Figure 1 and Figure 2 and combined Figure 6 The reinforcing structure 130 includes a first reinforcing member 131 and a second reinforcing member 132. After the circuit board 120 is folded in half, as shown... Figure 1 and Figure 2 As shown, the first reinforcing member 131 and the acquisition module 110 are located on opposite sides of the first sub-plate 121, and the second reinforcing member 132 and the pressing pad 200 are located on opposite sides of the second sub-plate 122. The first reinforcing member 131 and the second reinforcing member 132 are stacked and fixedly connected. Of course, in some possible embodiments, the first reinforcing member and the second reinforcing member can be an integral structure.

[0069] Optionally, the first reinforcing member 131 can be fixed to the first sub-plate 121 by means of bonding, welding or other methods, and the second reinforcing member 132 can be fixed in the same way.

[0070] Optionally, the pressing pad 200 can be glued to the second sub-board 122.

[0071] Optionally, such as Figure 1 and Figure 2 and combined Figure 6 Positioning structures can be provided on the first reinforcing member 131 and the second reinforcing member 132. These positioning structures include positioning holes 142 and positioning posts 141 that fit together. Figure 6As shown, the positioning post 141 is fixed to the first reinforcing member 131, and the positioning hole 142 is located in the second reinforcing member 132. After folding, positioning can be achieved by inserting the positioning post 141 into the positioning hole 142, and then it can be fixed by adhesive, welding, or snap-fitting. Of course, in other embodiments, the positioning post 141 can also be located in the second reinforcing member 132, and the positioning hole 142 can also be located in the first reinforcing member 131.

[0072] Optionally, to further improve the accuracy of positioning, such as Figure 1 As shown, a through hole 143 communicating with the positioning hole 142 can also be provided on the second sub-plate 122, combined with Figure 2 As shown, the positioning pin 141 is inserted into the positioning hole 142 and the through hole 143 in sequence, and passes through one side of the second sub-plate 122, which can form a more stable positioning.

[0073] Optionally, through holes 1311 are provided on the first reinforcing member 131 and / or the second reinforcing member 132. The through holes 1311 are used for insertion and connection with the main body of the equipment, thereby assisting in fixing or positioning the information acquisition device. For example... Figure 1 and Figure 2 As shown, a through hole 1311 is provided on the first reinforcing member 131. The through hole 1311 can reduce weight and save materials. More importantly, it can cooperate with the main body of the equipment.

[0074] In another aspect of the embodiments of this application, a button structure is provided, including a switch module and any of the above-mentioned information acquisition devices. The switch module is used to be assembled to the middle frame. The pressing pad 200 of the information acquisition device and the switch module are configured to cooperate. The information acquisition module 100 of the information acquisition device is pressed so as to press the switch module through the pressing pad 200.

[0075] The switch module may include a push-button switch and a push-button circuit board 120. The push-button switch is disposed on the push-button circuit board 120 and is electrically connected to the push-button circuit board 120 so that the push-button switch can be led out through the push-button circuit board 120. The push-button switch can be a Domekey device, such as a membrane switch or a dome switch. The push-button switch can be glued to the push-button circuit board 120, and is not limited to glue or adhesive film bonding. It can also be achieved through thermoforming, surface mounting, etc. The specific selection can be reasonably changed according to the usage environment and requirements.

[0076] In another aspect, this application provides an electronic device including a mid-frame, a motherboard located inside the mid-frame, and a button structure as described above. The button structure is mounted on the mid-frame and electrically connected to the motherboard. This allows for the enrichment of the electronic device's functionality and optimization of its user experience based on the aforementioned information acquisition device.

[0077] Electronic devices may include a main body, which is configured according to the specific type of electronic device. For example, mobile phones and smartwatches may include a display panel, a back panel, a mid-frame, a motherboard, etc. The back panel, mid-frame, and display panel can be fastened together to form an inner cavity, and the motherboard and other components are placed in the inner cavity. The aforementioned button structure can be assembled to the mid-frame.

[0078] Electronic devices can be laptops, mobile phones, handheld or portable computers, cameras, camcorders, in-vehicle smart control screens, calculators, smartwatches, GPS navigators, projectors, etc.

[0079] The basic principles of this application have been described above with reference to specific embodiments. However, it should be noted that the advantages, benefits, and effects mentioned in this application are merely examples and not limitations, and should not be considered as essential features of each embodiment of this application. Furthermore, the specific details disclosed above are for illustrative and facilitative purposes only, and are not limitations. These details do not limit the application to the necessity of employing the aforementioned specific details for implementation.

[0080] The block diagrams of devices, apparatuses, devices, and systems involved in this application are merely illustrative examples and are not intended to require or imply that they must be connected, arranged, or configured in the manner shown in the block diagrams. As those skilled in the art will recognize, these devices, apparatuses, devices, and systems can be connected, arranged, and configured in any manner. Words such as “comprising,” “including,” “having,” etc., are open-ended terms meaning “including but not limited to,” and are used interchangeably with them. The terms “or” and “and” as used herein refer to the terms “and / or,” and are used interchangeably with them unless the context clearly indicates otherwise. The term “such as” as used herein refers to the phrase “such as but not limited to,” and is used interchangeably with it.

[0081] It should also be noted that in the apparatus, equipment, and methods of this application, the components or steps can be disassembled and / or recombined. These disassemblies and / or recombinations should be considered as equivalent solutions of this application.

[0082] The above description of the disclosed aspects is provided to enable any person skilled in the art to make or use this application. Various modifications to these aspects will be readily apparent to those skilled in the art, and the general principles defined herein can be applied to other aspects without departing from the scope of this application. Therefore, this application is not intended to be limited to the aspects shown herein, but rather to be accorded the widest scope consistent with the principles and novel features disclosed herein.

[0083] The above description has been given for purposes of illustration and description. Furthermore, this description is not intended to limit the embodiments of this application to the forms disclosed herein. Although numerous exemplary aspects and embodiments have been discussed above, those skilled in the art will recognize certain variations, modifications, alterations, additions, and sub-combinations thereof.

Claims

1. An information collecting apparatus characterized by comprising: The information acquisition module comprises: an information acquisition module for acquiring biological feature information of the target object when the target object presses the information acquisition module; a pressing pad arranged on the information acquisition module; a pressure sensor arranged on the pressing pad and having a gap between a sensing surface of the pressure sensor and the pressing pad when the information acquisition module is not pressed by the target object, the pressure sensor being configured to output an electrical signal representing a pressing state of the information acquisition module.

2. The information gathering device of claim 1, wherein, The pressing pad is provided with a receiving cavity, and the pressure sensor is arranged in the receiving cavity, the sensing surface of the pressure sensor being opposite to a wall surface of the receiving cavity and having a gap.

3. The information gathering device of claim 2, wherein, A groove is arranged on a side of the pressing pad close to the information acquisition module, an inner space of the groove serving as the receiving cavity, the pressure sensor being fixed to the information acquisition module and the sensing surface being opposite to a bottom surface of the groove and having a gap.

4. The information collection apparatus according to any one of claims 1 to 3, characterized by The gap has a width of 0.1 mm to 0.2 mm.

5. The information collection apparatus according to any one of claims 1 to 3, wherein The information acquisition module comprises: an acquisition module for acquiring the biological feature information; a circuit board, the acquisition module and the pressing pad being arranged on opposite sides of the circuit board, and the acquisition module and the pressure sensor being electrically connected to the circuit board, respectively, the acquisition module and the pressing pad at least partially overlapping in a normal projection along a thickness direction of the circuit board.

6. The information gathering device of claim 5, wherein, The circuit board is a long strip-shaped board, the long strip-shaped board comprising a first sub-board and a second sub-board stacked with each other by being bent along a length direction of the long strip-shaped board, the acquisition module being arranged on a side of the first sub-board away from the second sub-board, and the pressing pad being arranged on a side of the second sub-board away from the first sub-board.

7. The information gathering device of claim 6, wherein, The information acquisition module further comprises: a first reinforcing member, the first reinforcing member and the acquisition module being arranged on opposite sides of the first sub-board; a second reinforcing member, the second reinforcing member and the pressing pad being arranged on opposite sides of the second sub-board, and the first reinforcing member and the second reinforcing member being stacked and fixedly connected.

8. The information gathering device of claim 7, wherein, Positioning structures are arranged on the first reinforcing member and the second reinforcing member, the positioning structures comprising positioning holes and positioning columns that are inserted into each other, the positioning holes being arranged on one of the first reinforcing member and the second reinforcing member, and the positioning columns being arranged on the other of the first reinforcing member and the second reinforcing member.

9. The information gathering device of claim 8, wherein, The positioning columns are arranged on the first reinforcing member, the positioning holes are arranged on the second reinforcing member, and a via hole is arranged on the second sub-board and in communication with the positioning holes, the positioning columns being inserted into the positioning holes and the via hole in sequence.

10. The information gathering device of claim 7, wherein, A through hole is arranged on the first reinforcing member and / or the second reinforcing member, the through hole being configured to be inserted into a main body of a device.

11. A key structure characterized by comprising: The information acquisition device comprises a switch module and the information acquisition device according to any one of claims 1 to 10, the switch module being configured to be assembled to a middle frame, the pressing pad of the information acquisition device being arranged in cooperation with the switch module, and the information acquisition module of the information acquisition device being pressed to press the switch module through the pressing pad.

12. An electronic device, comprising: The key structure is assembled to the middle frame, and the key structure is electrically connected with the mainboard.

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