Laminated PCB large current transmission device

Abstract

The utility model belongs to the technical field of current transmission devices, and particularly relates to a laminated PCB (Printed Circuit Board) high-current transmission device, which comprises an upper guide pin, a lower guide sleeve and a nut column welded on a PCB, the upper guide pin is provided with a first external thread, and the first external thread is connected with an internal thread of a nut column on the PCB in a matched mode. The lower guide sleeve is provided with a second external thread, and the second external thread is connected with an internal thread of a nut column on the other PCB in a matched mode. The laminated PCB large current transmission device effectively solves the problems of large contact resistance, unreliable connection and the like of PCB large current transmission in the prior art through unique structural design. The power supply device has the advantages of reducing contact impedance, improving connection stability, adapting to different working conditions, being convenient to produce and maintain and the like, can be widely applied to various scenes, such as power supply of a reinforced server backboard, distributed power supply of a power supply system, embedded power supply of a vehicle-mounted detection instrument / vehicle-mounted equipment and the like, and has remarkable economic benefits and practical values.

Description

Technical Field

[0001] This utility model relates to the technical field of current transmission devices, specifically a high current transmission device for stacked PCBs. Background Technology

[0002] In the manufacturing and application of electronic devices, traditional connection methods reveal a series of problems when large currents need to be transferred between two stacked PCBs. Traditional connection structures often have small contact areas, resulting in high contact resistance. This not only causes significant energy loss and excessive heat generation during current transmission, affecting the overall performance and stability of the electronic device, but may also shorten its lifespan. Furthermore, after repeated insertion and removal operations, traditional connections are prone to loosening and poor contact, leading to interruptions or instability in current transmission, failing to meet the growing demands for high performance and high reliability in electronic devices. Moreover, in some special applications with extremely high requirements for current transmission stability, such as automotive electronics and industrial control equipment, traditional connection methods are even more inadequate. Therefore, it is necessary to develop high-current transmission devices for stacked PCBs. Summary of the Invention

[0003] The purpose of this section is to outline some aspects of the embodiments of this utility model and to briefly introduce some preferred embodiments. Simplifications or omissions may be made in this section, as well as in the abstract and title of this application, to avoid obscuring the purpose of these documents; however, such simplifications or omissions should not be used to limit the scope of this utility model.

[0004] To solve the above-mentioned technical problems, according to one aspect of the present invention, the present invention provides the following technical solution:

[0005] A high-current transmission device for stacked PCBs includes an upper guide pin, a lower guide sleeve, and a nut post soldered onto the PCB. The upper guide pin has a first external thread, which engages with the internal thread of the nut post on the PCB. The lower guide sleeve has a second external thread, which engages with the internal thread of the nut post on another PCB. The front end of the upper guide pin has a banana-head gold-plated drum spring. When the upper and lower PCBs are inserted together, the drum spring portion of the upper guide pin is in tight contact with the inner wall of the lower guide sleeve.

[0006] In a preferred embodiment of the stacked PCB high current transmission device of this utility model, the first external thread of the upper guide pin is of M4 specification.

[0007] In a preferred embodiment of the stacked PCB high current transmission device of this utility model, the second external thread of the lower guide sleeve is of M4 specification.

[0008] In a preferred embodiment of the stacked PCB high current transmission device of this utility model, the internal thread of the nut post is M4 specification.

[0009] In a preferred embodiment of the stacked PCB high current transmission device of this utility model, the gold-plated drum spring of the banana head of the upper guide pin is arranged around the outer periphery of the front plug portion of the upper guide pin.

[0010] In a preferred embodiment of the stacked PCB high current transmission device of this utility model, the inner wall of the lower guide sleeve is a smooth cylindrical surface, and the smooth cylindrical surface is adapted to the drum spring of the upper guide pin.

[0011] In a preferred embodiment of the stacked PCB high current transmission device of this utility model, the nut post is vertically welded to the PCB surface, and the central axis of its threaded hole is perpendicular to the PCB surface.

[0012] Compared with existing technologies, this utility model's stacked PCB high-current transmission device effectively solves the problems of high contact impedance and unreliable connection in existing PCB high-current transmission technologies through a unique structural design. It offers advantages such as reduced contact impedance, improved connection stability, adaptability to different operating conditions, and ease of production and maintenance. It can be widely applied in various high-current demand scenarios, such as ruggedized server backplane power supply, distributed power supply for power systems, and embedded power supplies for vehicle-mounted testing instruments / equipment, demonstrating significant economic benefits and practical value. Attached Figure Description

[0013] To more clearly illustrate the technical solutions of the embodiments of this utility model, the present utility model will be described in detail below with reference to the accompanying drawings and detailed embodiments. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort. Among them:

[0014] Figure 1 This is a schematic diagram of the structure of the upper and lower PCBs after they are interlocked.

[0015] Figure 2 This is a schematic diagram of the inverted structure of the upper PCB and upper guide pin 100 of this utility model;

[0016] Figure 3 This is a structural schematic diagram of the lower PCB and lower guide sleeve 200 of this utility model. Detailed Implementation

[0017] To make the above-mentioned objectives, features and advantages of this utility model more apparent and understandable, the specific embodiments of this utility model will be described in detail below with reference to the accompanying drawings.

[0018] Many specific details are set forth in the following description in order to provide a full understanding of the present invention. However, the present invention may also be implemented in other ways different from those described herein. Those skilled in the art can make similar extensions without departing from the spirit of the present invention. Therefore, the present invention is not limited to the specific embodiments disclosed below.

[0019] Secondly, this utility model is described in detail with reference to the schematic diagrams. When describing the embodiments of this utility model, for ease of explanation, the cross-sectional views showing the device structure may be partially enlarged, not according to the usual scale. Furthermore, the schematic diagrams are merely examples and should not limit the scope of protection of this utility model. In addition, in actual manufacturing, the three-dimensional spatial dimensions of length, width, and depth should be included.

[0020] To make the objectives, technical solutions, and advantages of this utility model clearer, the embodiments of this utility model will be described in further detail below with reference to the accompanying drawings.

[0021] Please see Figures 1-3 The diagram shown is a structural schematic of an embodiment of the high-current transmission device for stacked PCBs of this utility model. Please refer to [link / reference]. Figures 1-3 This paper provides a detailed introduction to high current transmission devices for stacked PCBs.

[0022] A high-current transmission device for stacked PCBs includes an upper guide pin 100, a lower guide sleeve 200, and a nut post 300 soldered onto the PCB. The upper guide pin 100 has a first external thread 101, which engages with the internal thread of the nut post 300 on the PCB. The lower guide sleeve 200 has a second external thread 201, which engages with the internal thread of the nut post 300 on another PCB. The front end of the upper guide pin 100 has a banana-head gold-plated drum spring 102. When the upper and lower PCBs are inserted together, the drum spring 102 of the upper guide pin 100 makes tight contact with the inner circumference of the lower guide sleeve 200. Through the cooperation of the upper guide pin 100, the lower guide sleeve 200, and the nut post 300, and by utilizing the banana-head gold-plated drum spring 102 at the front end of the upper guide pin 100 to make tight contact with the inner circumference of the lower guide sleeve 200, the effective contact area for current transmission is greatly increased. Compared to traditional connection methods, it significantly reduces contact impedance and improves the reliability of high-current interconnect transmission.

[0023] Furthermore, the first external thread 101 of the upper guide pin 100 is of M4 specification. The M4 specification of the first external thread 101 of the upper guide pin 100 can precisely match the M4 internal thread of the nut post 300, providing suitable tightening torque and connection strength. During long-term use of the equipment, even under the action of external forces such as vibration and impact, the upper guide pin 100 and the nut post 300 on the PCB are not prone to loosening, ensuring the stability of current transmission.

[0024] Furthermore, the second external thread 201 of the lower guide sleeve 200 is of M4 specification. The M4 specification second external thread 201 of the lower guide sleeve 200 tightly engages with the M4 internal thread of the nut post 300, ensuring the robust connection between the lower guide sleeve 200 and the PCB. In multiple insertion and removal tests, the connection between the lower guide sleeve 200 and the nut post 300 remained stable and reliable, providing a stable connection foundation for current transmission between the upper and lower guide pins 100 and the guide sleeve 200, avoiding poor contact problems caused by loose connections, and ensuring stable current transmission performance.

[0025] Furthermore, the internal thread of the nut post 300 is M4 specification. The uniform M4 specification internal thread of the nut post 300 ensures consistency and versatility in its mating with the external threads of the upper guide pin 100 and the lower guide sleeve 200. During production, this facilitates mass production and quality control; during equipment maintenance, it facilitates component replacement and repair, reducing production and maintenance costs.

[0026] Furthermore, the banana-shaped gold-plated drum spring 102 of the upper guide pin 100 is arranged around the outer periphery of the front plug portion of the upper guide pin 100. This surrounding structure design further increases the contact area and improves contact reliability. Moreover, it can adapt to minor positional deviations between the upper and lower PCBs to a certain extent, ensuring good contact under various conditions and guaranteeing the continuity of current transmission.

[0027] Furthermore, the inner wall of the lower guide sleeve 200 is a smooth cylindrical surface 202, which is adapted to the drum spring 102 of the upper guide needle 100. The smooth cylindrical surface 202 of the inner wall of the lower guide sleeve 200 is adapted to the drum spring 102 of the upper guide needle 100, which reduces the frictional resistance between the two, makes the contact tighter, and lowers the contact resistance.

[0028] Furthermore, the nut post 300 is vertically soldered onto the PCB surface, with the central axis of its threaded hole perpendicular to the PCB surface. This vertical soldering ensures the perpendicularity and concentricity of the upper guide pin 100 and the lower guide sleeve 200 after installation. This allows the drum spring 102 of the upper guide pin 100 to make uniform contact with the inner wall of the lower guide sleeve 200 during the mating of the upper and lower PCBs, avoiding poor local contact and ensuring that current flows evenly through the contact area, thus improving the reliability and stability of current transmission. In actual assembly, installing the nut post 300 according to this requirement can significantly improve assembly efficiency and product quality.

[0029] Although the present invention has been described above with reference to embodiments, various modifications can be made and components can be replaced with equivalents without departing from the scope of the present invention. In particular, as long as there is no structural conflict, the features in the embodiments disclosed in this invention can be combined with each other in any way. The lack of an exhaustive description of these combinations in this specification is merely for the sake of brevity and resource conservation. Therefore, the present invention is not limited to the specific embodiments disclosed herein, but includes all technical solutions falling within the scope of the claims.

Claims

1. A high-current transmission device for stacked PCBs, characterized in that, It includes an upper guide pin (100), a lower guide sleeve (200), and a nut post (300) soldered onto a PCB; the upper guide pin (100) is provided with a first external thread (101), which is engaged with the internal thread of the nut post (300) on the PCB; the lower guide sleeve (200) is provided with a second external thread (201), which is engaged with the internal thread of the nut post (300) on another PCB; the front plug of the upper guide pin (100) is provided with a banana-head gold-plated drum spring (102), which, when the upper and lower PCBs are inserted together, the drum spring (102) of the upper guide pin (100) is in tight contact with the inner wall of the lower guide sleeve (200).

2. The high current transfer device for stacked PCBs according to claim 1, characterized in that: The first external thread (101) of the upper guide pin (100) is of M4 specification.

3. The high current transfer device for stacked PCBs according to claim 1, characterized in that: The second external thread (201) of the lower guide sleeve (200) is of M4 specification.

4. The high current transfer device for stacked PCBs according to claim 1, characterized in that: The internal thread of the nut post (300) is M4 specification.

5. The high current transfer device for stacked PCBs according to claim 1, characterized in that: The banana-shaped gold-plated drum spring (102) of the upper guide pin (100) is arranged around the outer periphery of the front plug portion of the upper guide pin (100).

6. The high current transfer device for stacked PCBs according to claim 1, characterized in that: The inner wall of the lower guide sleeve (200) is a smooth cylindrical surface (202), which is adapted to the drum spring (102) of the upper guide needle (100).

7. The high current transfer device for stacked PCBs according to claim 1, characterized in that: The nut post (300) is vertically welded to the PCB surface, and the central axis of its threaded hole is perpendicular to the PCB surface.

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