Circuit board and electric equipment
By setting isolation grooves and slots on the circuit board, the risk of short circuits caused by air bubbles between solder pads is solved, improving the safety and production efficiency of the circuit board.
Patent Information
- Application Number
- CN202520309884.2
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-02-25
- Publication Date
- 2026-02-17
- Estimated Expiration
- 2035-02-25
AI Technical Summary
Air bubbles may form on existing circuit boards after glue filling, increasing the risk of short circuits between pads.
Isolation grooves and slots are set on the circuit board to separate conductive areas and guide air bubbles between the pads into the slots or isolation grooves, thereby reducing the area between the pads and reducing the probability of short circuits.
The design of isolation grooves and slots reduces the probability of air bubbles between solder pads, improving the safety and production efficiency of the circuit board.
Smart Images
Figure CN223928519U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to the field of circuit board technology, specifically to a circuit board and an electrical device. Background Technology
[0002] Circuit board 1' in related technologies, such as Figure 1 As shown, the copper foil 200' is divided into different conductive areas 210' by providing a slot 240' on the copper foil 200'. Each conductive area 210' is provided with a pad 100'. Then, the circuit board 1' is encapsulated with glue. There may be air bubbles in the glue. When soldering components on the pad 100', the solder paste on the bottom of the component may be electrically connected to its adjacent conductive area 210' through the air bubbles, causing a short circuit. Utility Model Content
[0003] In view of this, the present invention provides a circuit board and electrical equipment to solve the problem of increased short circuit risk caused by air bubbles generated after glue filling.
[0004] In a first aspect, the present invention provides a circuit board, comprising: a board body; a conductive layer disposed on the board body, including a first conductive region and a second conductive region, wherein an isolation groove is provided between the first conductive region and the second conductive region, the first conductive region having a first slot, the first slot and the isolation groove being in communication; a first pad group disposed on the first conductive region, including a first pad and a second pad, the first pad and the second pad being electrically connected, the first slot being located between the first pad and the second pad; and a second pad group disposed on the second conductive region.
[0005] Beneficial Effects: The circuit board of this invention, by setting an isolation groove, can divide the conductive layer into different conductive areas, enabling the circuit board to have different conductive networks and increasing the flexibility of its use. Furthermore, by setting a first groove located between the first and second pads, air bubbles in the adhesive between the first and second pads can be discharged into the first groove, or even into the isolation groove, during encapsulation on the circuit board. This reduces the probability of air bubbles existing between the first and second pads and decreases the area of the first conductive area located between the first and second pads. Consequently, when soldering components onto the first or second pads, solder is prevented from connecting to the second conductive area through air bubbles in the adhesive, reducing the probability of short circuits and improving circuit safety.
[0006] In one optional embodiment, the second conductive area is provided with a second slot, the second slot being connected to the isolation slot; the second pad group includes a third pad and a fourth pad, the third pad and the fourth pad being electrically connected, and the second slot being located between the third pad and the fourth pad.
[0007] Beneficial effects: When packaging on a circuit board, air bubbles in the adhesive between the third and fourth pads can be discharged into the second slot or even into the isolation slot, reducing the probability of air bubbles between the third and fourth pads and reducing the area of the second conductive area between the third and fourth pads. As a result, when soldering components on the third or fourth pads, solder is prevented from connecting to the first conductive area through air bubbles in the adhesive, reducing the probability of short circuits on the circuit board and improving circuit safety.
[0008] In one alternative implementation, the first slot and the second slot are arranged symmetrically.
[0009] Beneficial effects: The first and second slots can be processed and formed simultaneously, reducing processing difficulty. Moreover, it can greatly reduce the probability of solder connecting through air bubbles in the areas where the first and second slots are located, further improving circuit safety.
[0010] In one alternative implementation, both the first pad and the second pad extend beyond the end of the first slot away from the isolation slot; and / or, the second slot extends beyond the third pad and the fourth pad.
[0011] Beneficial effects: While reducing the risk of short circuits, it shortens the length of the first and second slots, reduces processing difficulty, and improves production efficiency.
[0012] In one optional embodiment, on a plane perpendicular to the isolation groove, the overlap size of the projection of the first slot and the projection of the first pad group is L1, and the overlap size of the projection of the first pad and the projection of the second pad is L2, 0.3≤L1 / L2≤0.5; and / or, on a plane perpendicular to the isolation groove, the overlap size of the projection of the second slot and the projection of the second pad group is L3, and the overlap size of the projection of the third pad and the projection of the fourth pad is L4, 0.3≤L3 / L4≤0.5.
[0013] Beneficial effects: It can effectively reduce the probability of short circuits without causing the first or second slot to be too large, thus reducing processing costs and processing difficulty.
[0014] In one optional embodiment, the circuit board further includes a fifth pad, and the conductive layer further includes a third conductive region, with the fifth pad disposed on the third conductive region; wherein a third slot is provided between the third conductive region and the first conductive region, and a fourth slot is provided between the third conductive region and the second conductive region, and both the third slot and the fourth slot are connected to the isolation slot.
[0015] Beneficial effects: By setting the third and fourth slots, the third conductive area can be insulated from the first and second conductive areas, adding a conductive network to the circuit board. In addition, connecting the third and fourth slots to the isolation slots facilitates the one-time forming of the third and fourth slots and the isolation slots, reducing processing difficulty and improving production efficiency.
[0016] In one optional embodiment, the end of the third slot near the first conductive region is the first end, and the projection of the first end and the projection of the first pad group at least partially overlap on a plane perpendicular to the isolation slot; and / or, the end of the fourth slot near the second conductive region is the second end, and the projection of the second end and the projection of the second pad group at least partially overlap on a plane perpendicular to the isolation slot.
[0017] Beneficial effects: It increases the width of the third slot between the fifth pad and the first conductive area, preventing solder from making electrical connections through air bubbles in the glue, reducing the probability of short circuits and improving circuit safety.
[0018] In one alternative embodiment, the third slot and the fourth slot are connected and surround the third conductive region.
[0019] Beneficial effects: The third and fourth slots can be integrally formed, improving production efficiency.
[0020] In one optional embodiment, the circuit board further includes: a component disposed on the first pad or the second pad, wherein the isolation groove extends beyond the component by a dimension H in its length direction, where H ≥ 0.15 mm.
[0021] Beneficial effects: Isolation slots can effectively separate different components, reduce the probability of electrical connection between adjacent components, and improve circuit safety.
[0022] Secondly, this utility model also provides an electrical device, including: the circuit board described in the first aspect.
[0023] Beneficial effects: The electrical equipment according to this utility model can improve circuit safety through the above-mentioned circuit board. Attached Figure Description
[0024] To more clearly illustrate the specific embodiments of this utility model or the technical solutions in the prior art, the drawings used in the description of the specific embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are some embodiments of this utility model. For those skilled in the art, other drawings can be obtained from these drawings without creative effort.
[0025] Figure 1 This is a schematic diagram of the structure of a circuit board in the prior art;
[0026] Figure 2 This is one of the schematic diagrams of the circuit board structure according to an embodiment of the present utility model;
[0027] Figure 3 This is a second schematic diagram of the circuit board structure according to an embodiment of the present utility model.
[0028] Explanation of reference numerals in the attached figures:
[0029] 1. Circuit board;
[0030] 100. Plate body;
[0031] 200, Conductive layer; 210, First conductive region; 220, Second conductive region; 230, Third conductive region; 240, Isolation groove; 250, First slot; 260, Second slot; 270, Third slot; 271, First end; 280, Fourth slot; 281, Second end;
[0032] 300, First pad group; 310, First pad; 320, Second pad;
[0033] 400, second pad group; 410, third pad; 420, fourth pad;
[0034] 500, the fifth pad. Detailed Implementation
[0035] To make the objectives, technical solutions, and advantages of the embodiments of this utility model clearer, the technical solutions of the embodiments of this utility model will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this utility model, not all embodiments. Based on the embodiments of this utility model, all other embodiments obtained by those skilled in the art without creative effort are within the protection scope of this utility model.
[0036] In the description of this utility model, it should be understood that the terms "center", "longitudinal", "transverse", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc., indicating the orientation or positional relationship are based on the orientation or positional relationship shown in the accompanying drawings, and are only for the convenience of describing this utility model and simplifying the description, and are not intended to indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this utility model.
[0037] In the description of this utility model, "a plurality of" means two or more. Furthermore, the terms "first," "second," and "third" are used for descriptive purposes only and should not be construed as indicating or implying relative importance.
[0038] In the description of this utility model, it should be noted that, unless otherwise explicitly specified and limited, the terms "installation," "connection," and "joining" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model according to the specific circumstances.
[0039] The following is combined Figure 2 and Figure 3 The following describes embodiments of the present invention.
[0040] According to an embodiment of the present invention, a circuit board 1 is provided, the circuit board 1 including a board body 100, a first pad group 300 and a second pad group 400.
[0041] A conductive layer 200 is disposed on the board 100, and the conductive layer 200 includes a first conductive region 210 and a second conductive region 220. An isolation groove 240 is provided between the first conductive region 210 and the second conductive region 220. The first conductive region 210 has a first slot 250, and the first slot 250 and the isolation groove 240 are connected. A first pad group 300 is disposed on the first conductive region 210, and the first pad group 300 includes a first pad 310 and a second pad 320. The first pad 310 and the second pad 320 are electrically connected, and the first slot 250 is located between the first pad 310 and the second pad 320. A second pad group 400 is disposed on the second conductive region 220.
[0042] The circuit board 1 can be packaged using a system-in-a-package (SIP) process, and the circuit board 1 can be configured with an isolation groove 240 and a first groove 250 using an ink-based windowing method. The conductive layer 200 can be a copper layer.
[0043] The circuit board 1 of this invention, by providing an isolation groove 240, can divide the conductive layer 200 into different conductive areas, enabling the circuit board 1 to have different conductive networks and increasing the flexibility of its use. Furthermore, by providing a first slot 250 located between the first pad 310 and the second pad 320, air bubbles in the adhesive between the first pad 310 and the second pad 320 can be discharged into the first slot 250, and even into the isolation groove 240, during encapsulation on the circuit board 1. This reduces the probability of air bubbles existing between the first pad 310 and the second pad 320, and also reduces the area of the first conductive area 210 located between the first pad 310 and the second pad 320. Figure 1 As shown, in the prior art, the distance H' between the portion of the conductive area 210' located between the pads 100' and the adjacent conductive area 210' can be about 160μm. In this utility model, by setting the first slot 250, the distance H1 between the portion of the first conductive area 210 located between the first pad 310 and the second pad 320 and the second conductive area 220 can be at least 214μm. Thus, when soldering components on the first pad 310 or the second pad 320, solder is prevented from connecting to the second conductive area 220 through air bubbles in the glue, reducing the probability of short circuit on the circuit board 1 and improving circuit safety.
[0044] like Figure 2 and Figure 3 As shown, in some embodiments, the second conductive region 220 is provided with a second slot 260, which is connected to the isolation slot 240. The second pad group 400 includes a third pad 410 and a fourth pad 420, which are electrically connected, and the second slot 260 is located between the third pad 410 and the fourth pad 420.
[0045] When encapsulating on circuit board 1, air bubbles in the adhesive between the third pad 410 and the fourth pad 420 can be discharged into the second slot 260, or even into the isolation slot 240, reducing the probability of air bubbles between the third pad 410 and the fourth pad 420, and reducing the area of the second conductive area 220 located between the third pad 410 and the fourth pad 420. In this invention, by setting the first slot 250 and the second slot 260, the distance H2 between the portion of the first conductive area 210 located between the first pad 310 and the second pad 320 and the portion of the second conductive area 220 located between the third pad 410 and the fourth pad 420 is at least 268μm. Therefore, when soldering components on the third pad 410 or the fourth pad 420, solder is prevented from connecting to the first conductive area 210 through air bubbles in the adhesive, reducing the probability of short circuit on circuit board 1 and improving circuit safety.
[0046] like Figure 2 and Figure 3As shown, in some embodiments, the first slot 250 and the second slot 260 are symmetrically arranged. In this way, the first slot 250 and the second slot 260 can be processed and formed simultaneously, reducing the processing difficulty, and can greatly reduce the probability of solder connecting through air bubbles in the areas where the first slot 250 and the second slot 260 are located, further improving circuit safety.
[0047] like Figure 2 and Figure 3 As shown, in some embodiments, both the first pad 310 and the second pad 320 extend beyond the end of the first slot 250 away from the isolation slot 240. This reduces the risk of short circuits while shortening the length of the first slot 250, reducing processing difficulty and improving production efficiency.
[0048] Both the third pad 410 and the fourth pad 420 extend beyond the end of the second slot 260 away from the isolation slot 240. This reduces the risk of short circuits while shortening the length of the first slot 250, reducing processing difficulty and improving production efficiency.
[0049] Specifically, on the plane perpendicular to the isolation groove 240, the overlap size between the projection of the first slot 250 and the projection of the first pad group 300 is L1, and the overlap size between the projection of the first pad 310 and the projection of the second pad 320 is L2, where 0.3 ≤ L1 / L2 ≤ 0.5. L1 / L2 can be 0.3, 0.4, or 0.5.
[0050] This effectively reduces the probability of short circuits without making the first slot 250 too large, thus reducing processing costs and difficulty.
[0051] On a plane perpendicular to the isolation groove 240, the overlap size between the projection of the second slot 260 and the projection of the second pad group 400 is L3, and the overlap size between the projection of the third pad 410 and the projection of the fourth pad 420 is L4, where 0.3 ≤ L3 / L4 ≤ 0.5. Here, L3 / L4 can be 0.3, 0.4, or 0.5.
[0052] This effectively reduces the probability of short circuits without making the second slot 260 too large, thus reducing processing costs and difficulty.
[0053] like Figure 2 and Figure 3As shown, in some embodiments, the circuit board 1 further includes a fifth pad 500, and the conductive layer 200 further includes a third conductive region 230, with the fifth pad 500 disposed in the third conductive region 230. A third slot 270 is provided between the third conductive region 230 and the first conductive region 210, and a fourth slot 280 is provided between the third conductive region 230 and the second conductive region 220. Both the third slot 270 and the fourth slot 280 are connected to the isolation groove 240. The third pad 410 may be elliptical in shape.
[0054] By setting the third slot 270 and the fourth slot 280, the third conductive area 230 can be insulated from the first conductive area 210 and the second conductive area 220, and a new conductive network, namely the third conductive area 230, can be added to the circuit board 1. Components can be soldered to the third conductive area 230 through the fifth solder pad 500.
[0055] In addition, connecting the third slot 270 and the fourth slot 280 to the isolation slot 240 facilitates the one-time forming of the third slot 270, the fourth slot 280 and the isolation slot 240, reducing processing difficulty and improving production efficiency.
[0056] Specifically, the circuit board 1 has two fifth pads 500, and the conductive layer 200 has two third conductive areas 230. The two third conductive areas 230 are connected to the two fifth pads 500 in a one-to-one correspondence. The two third conductive areas 230 are located on opposite sides of the length direction of the isolation groove 240, and are insulated from each other. In this way, the number of conductive networks is further increased, and the space utilization on the circuit board 1 is improved.
[0057] Furthermore, the end of the third slot 270 closest to the first conductive area 210 is designated as the first end 271. On a plane perpendicular to the isolation slot 240, the projection of the first end 271 at least partially overlaps with the projection of the first pad group 300. This increases the width of the third slot 270 between the fifth pad 500 and the first conductive area 210. When soldering components on the fifth pad 500, or on the first pad 310 or the second pad 320, it prevents solder from making electrical connections through air bubbles in the adhesive, reducing the probability of short circuits and improving circuit safety.
[0058] The end of the fourth slot 280 closest to the second conductive area 220 is designated as the second end 281. On a plane perpendicular to the isolation slot 240, the projection of the second end 281 at least partially overlaps with the projection of the second pad group 400. This increases the width of the fourth slot 280 between the fifth pad 500 and the second conductive area 220. When soldering components on the fifth pad 500, or on the third pad 410 or the fourth pad 420, it prevents solder from forming electrical connections through air bubbles in the adhesive, reducing the probability of short circuits and improving circuit safety.
[0059] like Figure 2 and Figure 3 As shown, the third slot 270 and the fourth slot 280 are connected and surround the third conductive area 230. In this way, the third slot 270 and the fourth slot 280 can be integrally formed, improving production efficiency.
[0060] like Figure 2 and Figure 3 As shown, in some embodiments, the circuit board 1 further includes components (not shown in the figure), which are disposed on the first pad 310 or the second pad 320. The isolation trench 240 extends beyond the component by a dimension H in its length direction, where H ≥ 0.15 mm. The component may be a metal-oxide-semiconductor field-effect transistor (MOSFET).
[0061] In this way, the isolation groove 240 can effectively separate components in different conductive areas, reduce the probability of electrical connection between components in adjacent conductive areas, and improve circuit safety.
[0062] According to an embodiment of the present invention, another aspect provides an electrical device, which includes the aforementioned circuit board 1. The electrical device can be a vehicle, mobile phone, tablet computer, laptop computer, watch, etc.
[0063] According to the present invention, the electrical equipment can reduce the risk of short circuits and improve circuit safety through the aforementioned circuit board 1.
[0064] Although embodiments of the present invention have been described in conjunction with the accompanying drawings, those skilled in the art can make various modifications and variations without departing from the spirit and scope of the present invention, and such modifications and variations all fall within the scope defined by the appended claims.
Claims
1. A circuit board, characterized by, The utility model relates to a printed circuit board, comprising: a board body (100); a conductive layer (200) provided on the board body (100) and comprising a first conductive area (210) and a second conductive area (220), an isolation groove (240) being provided between the first conductive area (210) and the second conductive area (220), the first conductive area (210) being provided with a first slot (250), the first slot (250) and the isolation groove (240) being in communication; a first pad group (300) provided on the first conductive area (210) and comprising a first pad (310) and a second pad (320), the first pad (310) and the second pad (320) being electrically connected, the first slot (250) being located between the first pad (310) and the second pad (320); a second pad group (400) provided on the second conductive area (220).
2. The circuit board of claim 1, wherein The second conductive area (220) is provided with a second slot (260), the second slot (260) and the isolation groove (240) being in communication; the second pad group (400) comprises a third pad (410) and a fourth pad (420), the third pad (410) and the fourth pad (420) being electrically connected, the second slot (260) being located between the third pad (410) and the fourth pad (420).
3. The circuit board of claim 2, wherein, The first slot (250) and the second slot (260) are symmetrically arranged.
4. The circuit board of claim 2, wherein The first slot (250) exceeds the first pad (310) and the second pad (320); and / or, the second slot (260) exceeds the third pad (410) and the fourth pad (420).
5. The circuit board of claim 4, wherein, In a plane perpendicular to the isolation groove (240), the overlapping size of the projection of the first slot (250) and the projection of the first pad group (300) is L1, the overlapping size of the projection of the first pad (310) and the projection of the second pad (320) is L2, and 0.3≤L1 / L2≤0.5; and / or, in a plane perpendicular to the isolation groove (240), the overlapping size of the projection of the second slot (260) and the projection of the second pad group (400) is L3, the overlapping size of the projection of the third pad (410) and the projection of the fourth pad (420) is L4, and 0.3≤L3 / L4≤0.
5.
6. The circuit board according to any one of claims 1 to 5, characterized in that, Further comprising: a fifth pad (500), the conductive layer (200) further comprising a third conductive area (230), the fifth pad (500) being provided on the third conductive area (230); wherein a third slot (270) is provided between the third conductive area (230) and the first conductive area (210), a fourth slot (280) is provided between the third conductive area (230) and the second conductive area (220), and the third slot (270) and the fourth slot (280) are both in communication with the isolation groove (240).
7. The circuit board of claim 6, wherein The third slot (270) has a first end (271) near one end of the first conductive region (210), and a projection of the first end (271) and a projection of the first pad group (300) at least partially overlap in a plane perpendicular to the isolation groove (240); and / or, The fourth slot (280) has a second end (281) near one end of the second conductive region (220), and a projection of the second end (281) and a projection of the second pad group (400) at least partially overlap in a plane perpendicular to the isolation groove (240).
8. The circuit board of claim 6, wherein, The third slot (270) and the fourth slot (280) are connected and surround the third conductive region (230).
9. The circuit board according to any one of claims 1 to 5, characterized by Further comprising: A component is disposed on the first pad (310) or the second pad (320), and the isolation groove (240) exceeds a size of the component in a length direction by H, H≥0.15mm.
10. An electric device, characterized by The circuit board (1) according to any one of claims 1-9.