LED support, LED device and side-entry backlight module

Abstract

The utility model discloses an LED support, an LED device and a side-in type backlight module. The LED support comprises a lead frame, a bottom reflection layer, a side reflection layer and a placement cavity. The plurality of lead frames are combined with the bottom reflecting layer to form a base body of the bracket, and the plurality of lead frames are separated from one another after being combined with the bottom reflecting layer; the side reflecting layer is arranged on the base body, and a placement cavity is defined by the side reflecting layer; the LED device comprises a plurality of LED chips, an electric connection layer, a protection layer and the LED support. The plurality of LED chips are arranged in the placement cavity in an inverted manner, and are connected with the corresponding lead frames through the electric connection layers respectively; the protection layer is arranged in the placement cavity, covers the LED chip, covers the surface of the lead frame and the bottom reflection layer in the placement cavity, and covers the surface of the side reflection layer in the placement cavity; meanwhile, the LED device and the PCB can be assembled to form a side-in backlight module; according to the utility model, the purpose of arranging a large flip chip with a long-strip-shaped small packaging size can be achieved.

Description

Technical Field

[0001] This utility model belongs to the field of LED lighting technology, specifically relating to an LED bracket, LED device and side-lit backlight module. Background Technology

[0002] Side-lit backlighting, due to its side-mounted light source design (such as a backlight module positioned on the side of an electronic screen), eliminates the need for numerous lamps or LED modules below the panel, resulting in a more compact and thinner overall structure. In recent years, side-lit LED chips have increasingly trended towards miniaturization and thinner designs, leading to a growing demand for elongated, small-package LED chips. As the demand for high brightness increases, chip size (such as luminous area) is increasing. For conventional chips, the bonding wires require space, limiting the increase in chip area. Therefore, flip-chip design is a superior solution. However, the narrow lead frames in traditional elongated brackets make it difficult to connect the novel dual-crystal flip-chip design. One method involves connecting them via the bracket's lead frames, but this suffers from design limitations and low manufacturing yield. Using a module with two LEDs connected in series increases costs. Therefore, a solution is needed to address the issue of connecting elongated, small-package flip-chip chips.

[0003] The above analysis shows that currently, there is a lack of a new type of LED bracket to achieve the purpose of setting up flip chips in a long, small package size, which would facilitate the mass production of the bracket and ensure its quality. Currently, there is a lack of a new type of LED device to meet the demand for high brightness. Currently, there is a lack of a new type of side-lit backlight module to realize the series connection of two flip chips within each LED device, thus ensuring the reliability of the entire module.

[0004] Therefore, a new technology is needed to address the lack of a new type of LED bracket in existing technologies; a new technology is needed to address the lack of a new type of LED device in existing technologies; and a new technology is needed to address the lack of a new type of side-lit backlight module in existing technologies. Utility Model Content

[0005] To address the aforementioned problems in the prior art, this utility model provides an LED bracket that is reliable, durable, has a reasonable structural design, is easy to mold, has a high yield rate, and better airtightness, enabling the installation of flip-chips in elongated, small-package sizes.

[0006] The present invention adopts the following technical solution:

[0007] An LED bracket includes a plurality of lead frames, a bottom reflective layer, a side reflective layer, and a mounting cavity; the plurality of lead frames combined with the bottom reflective layer constitute the base of the LED bracket, and the plurality of lead frames combined with the bottom reflective layer are spaced apart from each other; at least four lead frames are provided; the side reflective layer is disposed on the base and surrounds the mounting cavity, the mounting cavity being used to house LED chips and a protective layer.

[0008] Further, the plurality of lead frames include a first lead frame, a second lead frame, a third lead frame, and a fourth lead frame; the side reflective layer includes a first side surface, a second side surface, a third side surface, and a fourth side surface; one long side of the first lead frame and one long side of the second lead frame are respectively connected to the first side surface; one long side of the third lead frame and one long side of the fourth lead frame are respectively connected to the second side surface; one short side of the first lead frame and one short side of the third lead frame are respectively connected to the third side surface; one short side of the second lead frame and one short side of the fourth lead frame are respectively connected to the fourth side surface.

[0009] Furthermore, the mounting cavity is elongated when viewed from above; the length of the first side is equal to the length of the second side; the length of the third side is equal to the length of the fourth side; the length of the first side is greater than the length of the third side; the ratio of the long side to the short side of the LED bracket is in the range of 1.25 to 4.5.

[0010] Furthermore, the first lead frame is the same size as the fourth lead frame located diagonally opposite it; the second lead frame is located on the same side as the first lead frame, and the second lead frame is the same size as the third lead frame located on the opposite side of the first lead frame.

[0011] Furthermore, the height of the third side is equal to the height of the fourth side, and the height of the first side is equal to the height of the second side; the height of the third side is lower than or equal to the height of the first side.

[0012] Another objective of this invention is to provide a novel LED device to meet people's demand for high brightness.

[0013] An LED device includes a plurality of LED chips, an electrical connection layer, a protective layer, and an LED bracket; the plurality of LED chips are flip-chip disposed in the mounting cavity, and the plurality of LED chips are respectively connected to the corresponding lead frame through the electrical connection layer; the protective layer is disposed in the mounting cavity, covering the LED chips, covering the lead frame and the bottom reflective layer on the surface of the mounting cavity, and covering the side reflective layer on the surface of the mounting cavity.

[0014] Furthermore, the protective layer is one of a silicone layer and an epoxy resin layer, or the protective layer is a mixture of silicone and epoxy resin.

[0015] Furthermore, the protective layer is provided with light-converting particles that can be excited by the LED chip.

[0016] Furthermore, the protective layer is provided with filler particles; the filler particles are one or more of SiO2, ZnO, and Al3O2.

[0017] Another objective of this invention is to provide a novel side-lit backlight module that connects two flip-chips within each LED device in series, thereby ensuring the reliability of the entire module.

[0018] A side-lit backlight module includes at least one PCB board and one LED device; each LED device has two LED chips; each LED device has four lead frames; each PCB board has a first pad, a second pad, and a third pad; for each LED device, the first pad is connected to the lead frame corresponding to the positive terminal of the first LED chip; the second pad is connected to the lead frame corresponding to the negative terminal of the second LED chip; the third pad is connected to the remaining two lead frames; each PCB board has a connection terminal for connecting to a power supply line.

[0019] Compared with the prior art, the beneficial effects of this utility model are as follows:

[0020] Traditionally, connecting flip chips in series within elongated, small packages presents significant challenges in lead frame design and mass production. Molding is difficult, leading to issues such as insufficient plastic fill, lead frame cracking, low yield, and poor hermeticity. This invention presents a newly developed LED lead frame that avoids directly connecting chips through lead frame design, making lead frame molding easier, resulting in higher yield and better hermeticity. This LED lead frame is reliable, durable, and rationally designed, enabling the installation of large or multiple flip chips within elongated, small packages.

[0021] This utility model discloses an LED device, which contains several LED chips, thereby increasing the light-emitting area of ​​the chips and meeting people's demand for high brightness.

[0022] This invention discloses a side-lit backlight module that connects two flip-chip LEDs in series within each LED device via a PCB board. This design differs from previous bracket designs, reducing design and mass production difficulties and enabling high-quality bracket molding, thus ensuring the reliability of the entire module. The PCB board-based connection of the two flip-chip LEDs increases the light-emitting area, allowing for improved LED brightness within a small, elongated package size, thus better meeting market demands. Attached Figure Description

[0023] The present invention will be further described in detail below with reference to the accompanying drawings and specific embodiments:

[0024] Figure 1 This is a top view of the LED device according to the first embodiment of this utility model;

[0025] Figure 2 yes Figure 1 Cross-sectional view;

[0026] Figure 3 yes Figure 1 Longitudinal section view;

[0027] Figure 4 This is a top view of the LED device according to the second embodiment of this utility model;

[0028] Figure 5 yes Figure 4 Cross-sectional view;

[0029] Figure 6 yes Figure 4 Longitudinal section view;

[0030] Figure 7 This is a top view of the LED device according to the third embodiment of this utility model;

[0031] Figure 8 yes Figure 7 The left view (where the LED chips are indicated by dashed lines);

[0032] Figure 9 yes Figure 7 Longitudinal section view;

[0033] Figure 10 This is a top view of the PCB board of the first embodiment of this utility model;

[0034] Figure 11 yes Figure 3 LED device preparation and Figure 10 A frontal view showing the PCB boards combined together;

[0035] Figure 12 yes Figure 6 LED device preparation and Figure 10 A frontal view showing the PCB boards combined together;

[0036] Figure 13 yes Figure 9 LED device preparation and Figure 10 A frontal view showing the PCB boards combined together;

[0037] Figure 14 This is a top view of the LED device according to the fourth embodiment of this utility model;

[0038] Figure 15 yes Figure 14 Cross-sectional view;

[0039] Figure 16 yes Figure 14 Longitudinal cross-sectional view;

[0040] Figure 17 This is a top view of the PCB board according to the second embodiment of this utility model;

[0041] Figure 18 yes Figure 16 LED device preparation and Figure 17 An elevation view showing the PCB boards combined together.

[0042] Figure label:

[0043] 1-Leader frame; 11-First lead frame; 12-Second lead frame; 13-Third lead frame; 14-Fourth lead frame;

[0044] 2-Bottom reflective layer; 3-Side reflective layer; 31-First side surface; 32-Second side surface; 33-Third side surface; 34-Fourth side surface; C-Sloping surface;

[0045] A-Substrate; B-Installation cavity;

[0046] 6-LED device; 61-LED chip; D-first LED chip; E-second LED chip; 62-protective layer; M-light conversion particle; N-filling particle; 63-LED bracket; L1-long side; L2-short side;

[0047] 7-PCB board; 71-First pad; 72-Second pad; 73-Third pad; 74-PCB insulating layer;

[0048] G - Small pad; H - Angled pad. Detailed Implementation

[0049] The following will provide a clear and complete description of the concept, specific structure, and technical effects of this utility model in conjunction with the embodiments and accompanying drawings, so as to fully understand the purpose, solution, and effects of this utility model. It should be noted that, unless otherwise specified, the embodiments and features described in this application can be combined with each other. The same reference numerals used throughout the drawings indicate the same or similar parts.

[0050] It should be noted that, unless otherwise specified, when a feature is referred to as "fixed" or "connected" to another feature, it can be directly fixed or connected to the other feature, or it can be indirectly fixed or connected to the other feature. Furthermore, the descriptions of "upper," "lower," "left," and "right" used in this utility model are only relative to the relative positional relationships of the various components of this utility model in the accompanying drawings.

[0051] Reference Figure 1 , Figure 2 , Figure 3 , Figure 10 and Figure 11 (or refer to) Figure 4 , Figure 5 , Figure 6 , Figure 10 and Figure 12 (or refer to) Figure 7 , Figure 8 , Figure 9 , Figure 10 and Figure 13 (or refer to) Figure 14 , Figure 15 , Figure 16 , Figure 17 and Figure 18 An LED bracket 63 includes a plurality of lead frames 1, a bottom reflective layer 2, a side reflective layer 3, and a mounting cavity B; the plurality of lead frames 1 combined with the bottom reflective layer 2 constitute the base A of the LED bracket, and the plurality of lead frames 1 combined with the bottom reflective layer 2 are spaced apart from each other; at least four lead frames 1 are provided; the side reflective layer 3 is disposed on the base A and surrounds the mounting cavity B, the mounting cavity B being used to house the LED chip 61 and the protective layer 62.

[0052] Reference Figure 1 , Figure 2 , Figure 3 , Figure 10 and Figure 11 (or refer to) Figure 4 , Figure 5 , Figure 6 , Figure 10 and Figure 12 (or refer to) Figure 7 , Figure 8 , Figure 9 , Figure 10 and Figure 13 (or refer to) Figure 14 , Figure 15 , Figure 16 , Figure 17 and Figure 18 In one embodiment, the plurality of lead frames 1 include a first lead frame 11, a second lead frame 12, a third lead frame 13, and a fourth lead frame 14; the side reflective layer 3 includes a first side surface 31, a second side surface 32, a third side surface 33, and a fourth side surface 34; one long side of the first lead frame 11 and one long side of the second lead frame 12 are respectively connected to the first side surface 31; one long side of the third lead frame 13 and one long side of the fourth lead frame 14 are respectively connected to the second side surface 32; one short side of the first lead frame 11 and one short side of the third lead frame 13 are respectively connected to the third side surface 33; one short side of the second lead frame 12 and one short side of the fourth lead frame 14 are respectively connected to the fourth side surface 34.

[0053] Reference Figure 1 , Figure 2 , Figure 3 , Figure 10 and Figure 11 (or refer to) Figure 4 , Figure 5 , Figure 6 , Figure 10 and Figure 12 (or refer to) Figure 7 , Figure 8 , Figure 9 , Figure 10 and Figure 13 (or refer to) Figure 14 , Figure 15 , Figure 16 , Figure 17 and Figure 18 In one embodiment, the mounting cavity B is elongated in plan view (indicating a small elongated package size); the length of the first side 31 is equal to the length of the second side 32; the length of the third side 33 is equal to the length of the fourth side 34; the length of the first side 31 is greater than the length of the third side 33; the ratio of the long side L1 to the short side L2 of the LED bracket 63 is in the range of 1.25 to 4.5.

[0054] Reference Figure 1 , Figure 2 , Figure 3 , Figure 10 and Figure 11 (or refer to) Figure 4 , Figure 5 , Figure 6 , Figure 10 and Figure 12 (or refer to) Figure 7 , Figure 8 , Figure 9 , Figure 10 and Figure 13 (or refer to) Figure 14 , Figure 15 , Figure 16 , Figure 17 and Figure 18 In one embodiment, the first lead frame 11 is the same size as the fourth lead frame 14 located diagonally opposite it; the second lead frame 12 is located on the same side as the first lead frame 11, and the second lead frame 12 is the same size as the third lead frame 13 located on the opposite side of the first lead frame 11. Preferably, the length of the first lead frame 11 is greater than the length of the third lead frame 13.

[0055] Reference Figure 1 , Figure 2 , Figure 3 , Figure 10 and Figure 11 (or refer to) Figure 4 , Figure 5 , Figure 6 , Figure 10 and Figure 12 (or refer to) Figure 7 , Figure 8 , Figure 9 , Figure 10 and Figure 13 (or refer to) Figure 14 , Figure 15 , Figure 16 , Figure 17 and Figure 18 In one embodiment, the height of the third side 33 is equal to the height of the fourth side 34, and the height of the first side 31 is equal to the height of the second side 32; the height of the third side 33 is lower than or equal to the height of the first side 31.

[0056] Reference Figure 1 , Figure 2 , Figure 3 , Figure 10 and Figure 11 (or refer to) Figure 4 , Figure 5 , Figure 6 , Figure 10 and Figure 12 (or refer to) Figure 7 , Figure 8 , Figure 9 , Figure 10 and Figure 13 (or refer to) Figure 14 , Figure 15 , Figure 16 , Figure 17 and Figure 18In one embodiment, the side reflective layer 3 facing the mounting cavity B is a sloping surface C, which is beneficial for light emission.

[0057] Reference Figure 1 , Figure 2 , Figure 3 , Figure 10 and Figure 11 (or refer to) Figure 4 , Figure 5 , Figure 6 , Figure 10 and Figure 12 (or refer to) Figure 7 , Figure 8 , Figure 9 , Figure 10 and Figure 13 (or refer to) Figure 14 , Figure 15 , Figure 16 , Figure 17 and Figure 18 In one embodiment, the bottom reflective layer 2 and the side reflective layer 3 are made of the same material; during the injection molding process of the LED bracket 63, the bottom reflective layer 2 and the side reflective layer 3 are injection molded using the same mold. (See reference...) Figure 1 , Figure 2 , Figure 3 , Figure 10 and Figure 11 (or refer to) Figure 4 , Figure 5 , Figure 6 , Figure 10 and Figure 12 (or refer to) Figure 7 , Figure 8 , Figure 9 , Figure 10 and Figure 13 (or refer to) Figure 14 , Figure 15 , Figure 16 , Figure 17 and Figure 18 The arrangement of the LED bracket of this utility model is beneficial for the bottom reflective layer 2 and the side reflective layer 3 to be injection molded together, which helps to ensure the molding quality of the LED bracket and solves the problems of insufficient filling of plastic material, dark cracks in the bracket, low yield and poor air tightness that existed in the past after the bracket was molded.

[0058] Reference Figure 1 , Figure 2 , Figure 3 , Figure 10 and Figure 11 (or refer to) Figure 4 , Figure 5 , Figure 6 , Figure 10 and Figure 12 (or refer to) Figure 7 , Figure 8 , Figure 9 , Figure 10 and Figure 13 (or refer to) Figure 14 , Figure 15 , Figure 16 , Figure 17 and Figure 18 In one embodiment, the bottom reflective layer 2 and the side reflective layer 3 are one of polyphthalamide, "poly(1,4-cyclohexanedimethyl terephthalate)", and epoxy resin molding compound.

[0059] Reference Figure 1 , Figure 2 , Figure 3 , Figure 10 and Figure 11 (or refer to) Figure 4 , Figure 5 , Figure 6 , Figure 10 and Figure 12 (or refer to) Figure 7 , Figure 8 , Figure 9 , Figure 10 and Figure 13 (or refer to) Figure 14 , Figure 15 , Figure 16 , Figure 17 and Figure 18 In one embodiment, several of the lead frames 1 are made of metal.

[0060] Another objective of this invention is to provide a novel LED device to meet people's demand for high brightness.

[0061] Reference Figure 1 , Figure 2 , Figure 3 , Figure 10 and Figure 11 (or refer to) Figure 4 , Figure 5 , Figure 6 , Figure 10 and Figure 12 (or refer to) Figure 7 , Figure 8 , Figure 9 , Figure 10 and Figure 13 (or refer to) Figure 14 , Figure 15 , Figure 16 , Figure 17 and Figure 18An LED device 6 includes a plurality of LED chips 61, an electrical connection layer, a protective layer 62, and an LED bracket 63. The plurality of LED chips 61 are flip-chip mounted in a mounting cavity B, and each LED chip 61 is connected to a corresponding lead frame 1 via the electrical connection layer. The protective layer 62 is disposed in the mounting cavity B, covering the LED chips 61, the lead frame 1 and the bottom reflective layer 2 on their surfaces within the mounting cavity B, and the side reflective layer 3 on their surfaces within the mounting cavity B. The newly designed LED bracket 63 of this invention has good airtightness, and combined with the protective layer 62, it can better protect the LED chips 61, which is beneficial to improving the service life of the LED device 6.

[0062] In one embodiment, the electrical connection layer is solder paste.

[0063] Reference Figure 1 , Figure 2 , Figure 3 , Figure 10 and Figure 11 (or refer to) Figure 4 , Figure 5 , Figure 6 , Figure 10 and Figure 12 (or refer to) Figure 7 , Figure 8 , Figure 9 , Figure 10 and Figure 13 (or refer to) Figure 14 , Figure 15 , Figure 16 , Figure 17 and Figure 18 In one embodiment, the protective layer 62 is one of silicone and epoxy resin, or the protective layer 62 is a mixture of silicone and epoxy resin. Preferably, the protective layer 62 is not limited to the materials mentioned in this utility model; any material that can be used to realize the packaging of the LED chip 61 of this utility model falls within the scope of protection of the protective layer 62 of this utility model.

[0064] Reference Figure 4 , Figure 5 , Figure 6 , Figure 10 and Figure 12 In one embodiment, the protective layer 62 is provided with light-converting particles M (such as phosphors) that can be excited by the LED chip 61.

[0065] Reference Figure 7 , Figure 8 , Figure 9 , Figure 10 and Figure 13In one embodiment, the protective layer 62 is provided with filling particles N; the filling particles are one or more of SiO2, ZnO, and Al3O2.

[0066] Another objective of this invention is to provide a novel side-lit backlight module that connects two flip-chips within each LED device in series, thereby ensuring the reliability of the entire module.

[0067] Reference Figure 1 , Figure 2 , Figure 3 , Figure 10 and Figure 11 (or refer to) Figure 4 , Figure 5 , Figure 6 , Figure 10 and Figure 12 (or refer to) Figure 7 , Figure 8 , Figure 9 , Figure 10 and Figure 13 (or refer to) Figure 14 , Figure 15 , Figure 16 , Figure 17 and Figure 18 A side-lit backlight module includes at least one PCB board 7 and one LED device 6; each LED device 6 has two LED chips 61; each LED device 6 has four lead frames 1; each PCB board 7 has a first pad 71, a second pad 72, and a third pad 73; for each LED device 6, the first pad 71 is connected to the lead frame 1 corresponding to the positive terminal of the first LED chip D; the second pad 72 is connected to the lead frame 1 corresponding to the negative terminal of the second LED chip E; the third pad 73 connects the remaining two lead frames 1, connecting the two LED chips in series; each PCB board 7 has a connection terminal (not shown in the figure), which is used to connect to a power line to supply power to the LED chips.

[0068] In one embodiment, the side-lit backlight module consists of a plurality of PCB boards 7 and a plurality of LED devices 6, with each PCB board 7 and each LED device 6 being assembled accordingly; the side-lit backlight module can be arranged on the side of the electronic screen to achieve a side-lit setting.

[0069] Reference Figure 10 or Figure 17In one embodiment, the first pad 71, the second pad 72, and the third pad 73 are made of the same material; the first pad 71 is a metallic material, or a hybrid material of "metal coated on ceramic". The first pad 71, the second pad 72, and the third pad 73 can achieve the functions of electrical conductivity and heat dissipation.

[0070] Reference Figure 10 or Figure 17 In one embodiment, the PCB board 7 further includes a PCB insulating layer 74, wherein the first pad 71, the second pad 72 and the third pad 73 are spaced apart from each other after being bonded to the PCB insulating layer 74.

[0071] Preferably, each pad on the PCB board 7 is connected to the corresponding lead frame 1 on the LED bracket 63 via solder paste.

[0072] Reference Figure 1 , Figure 2 , Figure 3 , Figure 10 and Figure 11 In the first preferred embodiment, the length of the first side 31 is equal to the length of the second side 32; the length of the third side 33 is equal to the length of the fourth side 34; the ratio of the long side L1 to the short side L2 of the LED bracket 63 is 4.5; the plurality of LED chips 61 includes a first LED chip D and a second LED chip E; the first LED chip D is flip-chip disposed in the mounting cavity B, the positive pad of the first LED chip D is connected to the first lead frame 11, and the negative pad of the first LED chip D is connected to the third lead frame 13; the second LED chip E is flip-chip disposed in the mounting cavity B, and the second LED chip E... The negative pad of the second LED chip E is connected to the second lead frame 12, and the positive pad of the second LED chip E is connected to the fourth lead frame 14. The PCB board 7 is provided with a first pad 71, a second pad 72, and a third pad 73. The first pad 71 is connected to the first lead frame 11, and the second pad 72 is connected to the second lead frame 12. The third pad 73 connects the third lead frame 13 and the fourth lead frame 14. The PCB board 7 enables two flip-chip LED chips 61 in the LED device 6 to be connected in series. Preferably, the third pad 73 is a continuous long strip pad, the length of which is greater than the sum of the lengths of the first pad 71 and the second pad 72.

[0073] Reference Figure 4 , Figure 5 , Figure 6 , Figure 10 and Figure 12The second preferred embodiment differs from the first preferred embodiment in that: in the second preferred embodiment, light-converting particles M (such as phosphors) that can be excited by the LED chip 61 are added to the protective layer 62 of the LED device 6, thereby changing the emitted light color of the LED device 6.

[0074] Reference Figure 7 , Figure 8 , Figure 9 , Figure 10 and Figure 13 The third preferred embodiment differs from the first preferred embodiment in that the height of the third side 33 and the height of the fourth side 34 are less than the height of the first side 31 (Note: the height of the first side is equal to the height of the second side, and the height of the third side is equal to the height of the fourth side), thereby increasing the light emission angle of the short side of the LED device 6; at the same time, in this third preferred embodiment, filler particles N are added to the protective layer 62 of the LED device 6.

[0075] Reference Figure 14 , Figure 15 , Figure 16 , Figure 17 and Figure 18In the fourth preferred embodiment, the length of the first side 31 is equal to the length of the second side 32; the length of the third side 33 is equal to the length of the fourth side 34; the ratio of the long side L1 to the short side L2 of the LED bracket 63 is 1.25; the plurality of LED chips 61 include a first LED chip D and a second LED chip E; the first LED chip D and the second LED chip E are flip-chip mounted in the mounting cavity B, and the positive terminals of the first LED chip D and the second LED chip E are respectively connected to two lead frames 1 on the same side of the LED bracket 63; the negative terminals of the first LED chip D and the second LED chip E are respectively connected to two lead frames 1 on the other side of the LED bracket 63; the three pads of each PCB board 7 are adjusted according to the positive and negative terminal arrangement positions of the two LED chips 61 in each LED device 6 to realize the series connection of the two LED chips 61 in each LED device 6, such as... Specifically, the PCB board 7 is provided with a first pad 71, a second pad 72, and a third pad 73. The positive terminal of the first LED chip D is connected to the first lead frame 11, and the negative terminal of the first LED chip D is connected to the third lead frame 13. The positive terminal of the second LED chip E is connected to the second lead frame 12, and the negative terminal of the second LED chip E is connected to the fourth lead frame 14. The first pad 71 is connected to the first lead frame 11, and the second pad 72 is connected to the fourth lead frame 14. The wireframe 14, the third pad 73 connects the second leadframe 12 and the third leadframe 13; the PCB board 7 enables two flip-chip LEDs 61 in the LED device 6 to be connected in series; preferably, the third pad 73 is composed of two small pads G and one slanted pad H; preferably, the first pad 71 and the second pad 72 have the same shape and surface area, and the surface area of ​​either of the two small pads G in the third pad 73 is equivalent to the surface area of ​​the first pad 71.

[0076] Other aspects of the LED bracket, LED device, and side-lit backlight module described in this utility model are referred to in the prior art and will not be repeated here.

[0077] The above description is merely a preferred embodiment of the present utility model and is not intended to limit the present utility model in any way. Therefore, any modifications, equivalent changes, and alterations made to the above embodiments based on the technical essence of the present utility model without departing from the technical solution of the present utility model shall still fall within the scope of the technical solution of the present utility model.

Claims

1. An LED bracket, characterized in that, It includes several lead frames, a bottom reflective layer, a side reflective layer, and a mounting cavity; the several lead frames combined with the bottom reflective layer constitute the base of the LED bracket, and the several lead frames combined with the bottom reflective layer are spaced apart from each other; at least four lead frames are provided; the side reflective layer is disposed on the base and surrounds the mounting cavity, the mounting cavity is used to place the LED chip and the protective layer.

2. The LED bracket according to claim 1, characterized in that, The plurality of lead frames include a first lead frame, a second lead frame, a third lead frame, and a fourth lead frame; the side reflective layer includes a first side surface, a second side surface, a third side surface, and a fourth side surface; one long side of the first lead frame and one long side of the second lead frame are respectively connected to the first side surface; one long side of the third lead frame and one long side of the fourth lead frame are respectively connected to the second side surface; one short side of the first lead frame and one short side of the third lead frame are respectively connected to the third side surface; one short side of the second lead frame and one short side of the fourth lead frame are respectively connected to the fourth side surface.

3. The LED bracket according to claim 2, characterized in that, The mounting cavity is elongated when viewed from above; the length of the first side is equal to the length of the second side; the length of the third side is equal to the length of the fourth side; the length of the first side is greater than the length of the third side; the ratio of the long side to the short side of the LED bracket is in the range of 1.25 to 4.

5.

4. The LED bracket according to claim 2, characterized in that, The first lead frame is the same size as the fourth lead frame located diagonally opposite it; the second lead frame is located on the same side as the first lead frame, and the second lead frame is the same size as the third lead frame located on the opposite side of the first lead frame.

5. The LED bracket according to any one of claims 2 to 4, characterized in that, The height of the third side is the same as the height of the fourth side, and the height of the first side is the same as the height of the second side; the height of the third side is lower than or equal to the height of the first side.

6. An LED device, characterized in that, The device includes a plurality of LED chips, an electrical connection layer, a protective layer, and an LED bracket as described in any one of claims 1 to 5; the plurality of LED chips are flip-chip disposed in the mounting cavity, and the plurality of LED chips are respectively connected to the corresponding lead frame through the electrical connection layer; the protective layer is disposed in the mounting cavity, covering the LED chips, covering the surface of the lead frame and the bottom reflective layer in the mounting cavity, and covering the surface of the side reflective layer in the mounting cavity.

7. The LED device according to claim 6, characterized in that, The protective layer is either a silicone layer or an epoxy resin layer.

8. The LED device according to claim 6, characterized in that, The protective layer contains light-converting particles that can be excited by the LED chip.

9. The LED device according to claim 6, characterized in that, The protective layer contains filler particles.

10. A side-lit backlight module, characterized in that, The device includes at least one PCB board and an LED device according to any one of claims 6 to 9; each LED device has two LED chips; each LED device has four lead frames; each PCB board has a first pad, a second pad, and a third pad; for each LED device, the first pad is connected to the lead frame corresponding to the positive terminal of the first LED chip; the second pad is connected to the lead frame corresponding to the negative terminal of the second LED chip; the third pad is connected to the remaining two lead frames; each PCB board has a connection terminal for connecting to a power supply line.

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