Mass transfer equipment

Abstract

The utility model discloses a chip supply device and a mass transfer device thereof, the chip supply device comprises a pedestal and a rotating disc, the rotating disc is connected with the pedestal, the rotating disc is provided with a plurality of material storage platforms, each material storage platform is provided with an adsorption structure, and the adsorption structures are used for adsorbing chips on the material storage platforms. By means of the mode, after mass transfer of chips of one color is completed, the rotating disc rotates to convey chips of the next color to the processing station for mass transfer, rapid switching of chips of different colors is achieved, and mass transfer efficiency is improved.

Description

Technical Field

[0001] This utility model relates to the field of wafer processing technology, and in particular to a chip supply device and its mass transfer equipment. Background Technology

[0002] Mass transfer technology involves transferring Micro-LED devices onto a wafer to form a two-dimensional periodic array. During mass transfer, an onboard stage holds the red, green, and blue (RGB) chips, while a downstream stage holds the substrate. Lasers transfer the RGB chips onto the substrate to create a high-density, high-quality display array. However, in current technology, the onboard stage can only hold one color chip at a time. Therefore, after transferring one color chip, the process must be stopped to replace the chip on the onboard stage before transferring the next color chip, resulting in low mass transfer efficiency. Utility Model Content

[0003] This invention provides a chip supply device to solve the technical problem of low efficiency in mass transfers caused by stopping the machine after transferring one color chip to replace the chip on the loading stage and then transferring the next color chip.

[0004] This utility model is achieved through the following technical solution:

[0005] This utility model proposes a chip supply device, comprising:

[0006] The base and the turntable are connected to the base. The turntable is provided with multiple storage platforms, and each storage platform is provided with an adsorption structure for adsorbing the chip onto the storage platform.

[0007] Furthermore, the adsorption structure includes a plurality of adsorption holes arranged in a ring on the storage platform, and the outlet end of the adsorption holes extends to the back of the storage platform.

[0008] Furthermore, the turntable includes: a turntable body and at least two supports protruding outward from the circumference of the turntable body, the supports being arranged at intervals around the turntable body, and the storage platform being located at the end of the supports.

[0009] Furthermore, the included angles of any two adjacent supports are the same.

[0010] The beneficial effects of this utility model are:

[0011] Compared with the prior art, the chip supply device proposed in this utility model has multiple storage platforms on the turntable. After a large-scale transfer of chips of one color is completed, the turntable rotates to transport chips of the next color to the processing station for large-scale transfer, realizing rapid switching of chips of different colors and improving the efficiency of large-scale transfer.

[0012] This utility model also proposes a mass transfer device, including: a chip supply device, a loading device, and a laser as described above. The loading device is located below the storage platform, and the laser is located above the storage platform. Chips are placed on the chip supply device, and a substrate is placed on the loading device. The laser is used to emit a laser beam to the chips so that the chips on the chip supply device are detached and connected to the substrate.

[0013] Furthermore, the storage platform is provided with a light-transmitting hole, through which the laser beam emitted by the laser acts on the chip.

[0014] Furthermore, the mass transfer device also includes: a drive unit and a base, wherein the drive unit is mounted on the base, and the chip supply device and the loading device are both mounted on the drive unit.

[0015] Furthermore, the chip supply device and the loading device are symmetrically arranged along the horizontal direction of the base.

[0016] Furthermore, the driving device includes: a first moving module, a second moving module, and a third moving module. The second moving module and the third moving module are both mounted on the first moving module. The moving direction of the second moving module and the moving direction of the third moving module are both perpendicular to the moving direction of the first moving module. The chip supply device is mounted on the second moving module, and the feeding device is mounted on the third moving module.

[0017] Furthermore, the feeding device includes: an angle adjusting member and a platform connected to the driving end of the angle adjusting member, the angle adjusting member being connected to the third moving module, and the platform being used to place the substrate.

[0018] The beneficial effects of this utility model are:

[0019] Compared with the prior art, the mass transfer equipment proposed in this utility model places the substrate on the feeding device and chips of different colors on the storage platform of the chip supply device. After a chip of one color is mass transferred under the action of the laser, the turntable rotates to transport the chip of the next color to the processing station for mass transfer, realizing the rapid switching of chips of different colors and improving the efficiency of mass transfer.

[0020] The above description is only an overview of the technical solution of this utility model. In order to better understand the technical means of this utility model, it can be implemented according to the contents of the specification. In order to make the above and other objects, features and advantages of this utility model more obvious and easy to understand, the following are preferred embodiments, which are described in detail below. Attached Figure Description

[0021] Figure 1 This is a schematic diagram of the overall structure of a chip supply device according to an embodiment of the present invention;

[0022] Figure 2 This is a schematic diagram of the overall structure of the turntable in a chip supply device according to an embodiment of the present invention;

[0023] Figure 3 A bottom view of the turntable structure in a chip supply device according to an embodiment of this utility model;

[0024] Figure 4 This is a schematic diagram of the overall structure of a mass transfer device proposed in an embodiment of the present invention;

[0025] Figure 5 This is a schematic diagram of the overall structure of the feeding device in a mass transfer device according to an embodiment of the present invention.

[0026] Explanation of reference numerals in the attached figures:

[0027] 10. Chip supply device; 11. Base; 111. Mounting area; 12. Turntable; 121. Turntable body; 122. Support; 13. Storage platform; 131. Light-transmitting hole; 14. Adsorption structure; 141. Adsorption hole; 20. Feeding device; 21. Angle adjustment component; 22. Platform; 30. Drive device; 31. First moving module; 32. Second moving module; 33. Third moving module; 40. Base. Detailed Implementation

[0028] To make the objectives, technical solutions, and advantages of this utility model clearer, the present utility model will be further described in detail below with reference to the accompanying drawings and specific embodiments.

[0029] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those skilled in the art without creative effort are within the protection scope of the present utility model.

[0030] In the description of this utility model, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this utility model.

[0031] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of this utility model, "a plurality of" means two or more, unless otherwise explicitly specified.

[0032] In this utility model, unless otherwise explicitly specified and limited, the terms "installation," "connection," "joining," and "fixing," etc., should be interpreted broadly. For example, they can refer to a connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model according to the specific circumstances.

[0033] In this invention, unless otherwise explicitly specified and limited, "above" or "below" the second feature can include direct contact between the first and second features, or contact between the first and second features through another feature between them. Furthermore, "above," "over," and "on top" of the second feature includes the first feature directly above or diagonally above the second feature, or simply indicates that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature includes the first feature directly below or diagonally below the second feature, or simply indicates that the first feature is at a lower horizontal level than the second feature.

[0034] In the description of this specification, the references to terms such as "one embodiment," "some embodiments," "example," "specific example," or "some examples," etc., indicate that a specific feature, structure, material, or characteristic described in connection with that embodiment or example is included in at least one embodiment or example of the present invention. The illustrative expressions of the above terms in this specification should not be construed as necessarily referring to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples. In addition, those skilled in the art can combine and integrate the different embodiments or examples described in this specification.

[0035] Please see Figures 1 to 3 This utility model proposes a chip supply device 10, including: a base 11 and a turntable 12. The turntable 12 is connected to the base 11. The turntable 12 is provided with a plurality of storage platforms 13. Each storage platform 13 is provided with an adsorption structure 14, which is used to adsorb the chip onto the storage platform 13.

[0036] It should be noted that turntable 12 is controlled by the control system.

[0037] In this embodiment, preferably, the base 11 is a gantry structure, and an installation area 111 is provided inside the base 11. The turntable 12 is installed in the installation area 111, so that the chip supply device 10 has good structural stability and can operate stably.

[0038] In practical applications, chips of different colors are placed on different storage platforms 13 on the turntable 12. The adsorption structure 14 on each storage platform 13 adsorbs and fixes the chip on the storage platform 13, ensuring that the chip will not move or fall off during the rotation of the turntable 12. After a mass transfer of chips of one color is completed, the turntable 12 rotates to transport chips of the next color to the processing station for mass transfer. This process is repeated to transfer the chips placed on each storage platform 13 on the turntable 12 to the substrate.

[0039] The chip supply device 10 proposed in this embodiment has multiple storage platforms 13 on the turntable 12. After a large-scale transfer of chips of one color is completed, the turntable 12 rotates to transport chips of the next color to the processing station for large-scale transfer, realizing rapid switching of chips of different colors and improving the efficiency of large-scale transfer.

[0040] Please see Figure 3 The adsorption structure 14 includes a plurality of adsorption holes 141, which are arranged in a ring on the storage platform 13, and the outlet end of the adsorption holes 141 extends to the back of the storage platform 13.

[0041] Specifically, multiple adsorption holes 141 are arranged in a ring to evenly distribute the adsorption force, preventing chip displacement and drop. The adsorption holes 141 in the adsorption structure 14 adopt vacuum adsorption, and the multiple adsorption holes 141 are controlled by a vacuum pump (not shown in the figure). Since the air outlet of the adsorption holes 141 extends to the back of the storage platform 13, when chips need to be unloaded, there is no need for an unloading robot. The negative pressure can be released by controlling the vacuum pump, thereby reducing downtime. When chips need to be loaded, there is no need for a loading robot. The negative pressure can be created at the adsorption holes 141 by controlling the vacuum pump to adsorb the chips onto the storage platform 13, realizing rapid loading and unloading of chips without the need for an additional robot, reducing downtime and improving production efficiency.

[0042] Please see Figure 2 and Figure 3 The turntable 12 includes a turntable body 121 and at least two supports 122 protruding outward from the circumference of the turntable body 121. The supports 122 are arranged at intervals around the turntable body 121. The storage platform 13 is located at the end of the support 122. The stability and load-bearing capacity of the turntable 12 are improved by the above method, and the layout of the storage platform 13 is optimized so that it is more stable during rotation.

[0043] In this embodiment, the included angles of two adjacent supports 122 are the same, that is, the supports 122 are evenly distributed in the circumferential direction of the turntable body 121, which ensures that the load of the turntable 12 is balanced when rotating, improves the balance of the turntable 12, and makes the turntable 12 stable when rotating at high speed.

[0044] Compared with the prior art, the chip supply device 10 proposed in this utility model has multiple storage platforms 13 on the turntable 12. After a large-scale transfer of chips of one color is completed, the turntable 12 rotates to transport chips of the next color to the processing station for large-scale transfer, realizing rapid switching of chips of different colors and improving the efficiency of large-scale transfer.

[0045] Please see Figures 4 to 5 This utility model also proposes a mass transfer device, including: a chip supply device 10, a loading device 20 and a laser (not shown in the figure) as described above. The loading device 20 is located below the storage platform 13, and the laser is located above the storage platform 13. Chips are placed on the chip supply device 10, and a substrate is placed on the loading device 20. The laser is used to emit a laser beam to the chip so that the chip die on the chip supply device 10 is detached and connected to the substrate.

[0046] It should be noted that the chip supply device 10, the feeding device 20, and the laser are all controlled by the control system.

[0047] In practical applications, chips of different colors are placed on the storage platform 13 of the chip supply device 10. After the substrate is placed on the loading device 20, the turntable 12 rotates to align the storage platform 13 with the laser and the transfer mechanism. The laser works to make the laser beam act on the chip through the light-transmitting hole 131 on the storage platform 13, so that the dies on the chip are transferred to the substrate. When a chip of one color has completed a mass transfer, the turntable 12 rotates to transport the chip of the next color to the processing station for mass transfer. This realizes the rapid switching of chips of different colors, reduces the downtime caused by changing chips of different colors, and improves the mass transfer efficiency.

[0048] In the mass transfer device proposed in this embodiment, the substrate is placed on the feeding device 20, and chips of different colors are placed on the storage platform 13 of the chip supply device 10. After a chip of one color is mass transferred under the action of the laser, the turntable 12 rotates to transport the chip of the next color to the processing station for mass transfer, realizing the rapid switching of chips of different colors and improving the efficiency of mass transfer.

[0049] Please see Figures 2 to 3 The storage platform 13 is provided with a light-transmitting hole 131. The laser beam emitted by the laser passes through the light-transmitting hole 131 and acts on the chip, ensuring that the laser beam acts directly on the chip, avoiding energy loss, thereby improving the accuracy and quality of mass transfer.

[0050] Please see Figure 4 The mass transfer equipment also includes: a drive unit 30 and a base 40. The drive unit 30 is mounted on the base 40, and the chip supply device 10 and the feeding device 20 are both mounted on the drive unit 30.

[0051] Specifically, the drive device 30 is also controlled by the control system. First, chips of different colors or types are placed on the storage platform 13 in the loading device 20, and the substrate is placed on the loading device 20. Then, the drive device 30 drives the chip supply device 10 and the loading device 20 to move so that the loading device 20 is aligned with the storage platform 13 of the chip supply device 10, so that the chip is aligned with the target substrate, thereby improving the mass transfer quality of the chip die to the substrate.

[0052] Please see Figure 4 The chip supply device 10 and the feeding device 20 are symmetrically arranged along the horizontal direction of the base 40.

[0053] Specifically, the chip supply device 10 and the feeding device 20 are arranged horizontally and symmetrically along the X-axis of the base 40, which realizes the synchronous feeding of chips and substrates, improves the mass transfer efficiency, and makes the mass transfer equipment compact.

[0054] Please refer to it again. Figure 4The driving device 30 includes a first moving module 31, a second moving module 32, and a third moving module 33. The second moving module 32 and the third moving module 33 are both mounted on the first moving module 31. The moving direction of the second moving module 32 and the moving direction of the third moving module 33 are both perpendicular to the moving direction of the first moving module 31. The chip supply device 10 is mounted on the second moving module 32, and the feeding device 20 is mounted on the third moving module 33.

[0055] Specifically, firstly, the second moving module 32 and the third moving module 33 move in the Y-axis direction to align the chip placed on the chip supply device 10 with the substrate placed on the loading device 20 in the vertical direction. Then, the first moving module 31 moves in the X-axis direction to align the chip placed on the chip supply device 10 with the substrate placed on the loading device 20 in the horizontal direction. Through the cooperation of the first moving module 31, the second moving module 32 and the third moving module 33, the alignment of the chip and the target substrate in the horizontal and vertical directions is achieved, thereby improving the mass transfer quality of the chip die to the substrate.

[0056] It is understood that the first moving module 31, the second moving module 32, and the third moving module 33 can be belt-driven or screw-driven moving mechanisms, etc., as long as they can achieve the movement of the first moving module 31 along the X-axis and the movement of the second moving module 32 and the third moving module 33 along the Y-axis, respectively, all of which fall within the protection scope of this utility model. However, preferably, the first moving module 31, the second moving module 32, and the third moving module 33 are all linear motor sliding modules, which have high transmission speed and high transmission accuracy.

[0057] Please refer to it again. Figure 4 The feeding device 20 includes: an angle adjustment member 21 and a platform 22 connected to the driving end of the angle adjustment member 21. The angle adjustment member 21 is connected to the third moving module 33, and the platform 22 is used to place the substrate.

[0058] Specifically, after the chip and the target substrate are aligned in the horizontal and vertical directions, the angle adjustment member 21 adjusts the angle of the stage 22 so that the stage 22 and the storage stage 13 remain parallel, so that the chip and the target substrate are parallel, ensuring that the die of each chip is transferred to the substrate under the action of the laser.

[0059] Please refer to it again. Figures 4 to 4 The following is a brief description of the workflow of the mass transfer device proposed in this embodiment:

[0060] First, chips of different colors are placed on the storage platform 13 of the chip supply device 10, and the substrate is placed on the loading device 20. Then, the driving device 30 drives the chip supply device 10 and the loading device 20 to move so that the loading device 20 is aligned with the storage platform 13 of the chip supply device 10, so that the chip is aligned with the target substrate. Finally, under the action of the laser, the die of each chip is transferred to the substrate.

[0061] Compared with the prior art, the mass transfer equipment proposed in this utility model places the substrate on the feeding device 20 and chips of different colors on the storage platform 13 of the chip supply device 10. After a chip of one color is mass transferred under the action of the laser, the turntable 12 rotates to transport the chip of the next color to the processing station for mass transfer, realizing the rapid switching of chips of different colors and improving the efficiency of mass transfer.

[0062] The above description is merely a specific embodiment of this utility model, but the protection scope of this utility model is not limited thereto. Any person skilled in the art can easily conceive of various equivalent modifications or substitutions within the technical scope disclosed in this utility model, and these modifications or substitutions should all be covered within the protection scope of this utility model. Therefore, the protection scope of this utility model should be determined by the scope of the claims.

Claims

1. A mass transfer apparatus characterized by, The application relates to a chip supply device, a feeding device and a laser. The chip supply device comprises a base and a rotating disc connected to the base, a plurality of material storage tables are arranged on the rotating disc, each material storage table is provided with an adsorption structure for adsorbing a chip on the material storage table. The feeding device is arranged below the material storage table, the laser is arranged above the material storage table, the chip supply device is placed with a chip, the feeding device is placed with a substrate, and the laser is used for emitting a laser beam to the chip so that the die of the chip on the chip supply device is separated and connected with the substrate. The adsorption structure comprises a plurality of adsorption holes arranged in a ring shape on the material storage table, and the air outlet ends of the adsorption holes extend to the back surface of the material storage table.

2. The mass transfer apparatus of claim 1, wherein, The rotating disc comprises a rotating disc body and at least two supports outwardly protruding from the circumferential side of the rotating disc body, the supports are arranged at intervals in the circumferential direction of the rotating disc body, and the material storage table is located at the end of the support.

3. The mass transfer apparatus of claim 1, wherein, The included angles of two adjacent supports are the same.

4. The mass transfer apparatus of claim 3, wherein, The material storage table is provided with a light transmission hole, and the laser beam emitted by the laser passes through the light transmission hole and acts on the chip.

5. The mass transfer apparatus of claim 1, wherein, The mass transfer equipment further comprises a driving device and a base, the driving device is installed on the base, and the chip supply device and the feeding device are installed on the driving device.

6. The mass transfer apparatus of claim 1, wherein, The chip supply device and the feeding device are symmetrically arranged along the horizontal direction of the base.

7. The mass transfer apparatus of claim 6, wherein, The driving device comprises a first moving module, a second moving module and a third moving module, the second moving module and the third moving module are installed on the first moving module, the moving direction of the second moving module and the moving direction of the third moving module are perpendicular to the moving direction of the first moving module, the chip supply device is installed on the second moving module, and the feeding device is installed on the third moving module.

8. The mass transfer apparatus of claim 6, wherein, The feeding device comprises an angle adjusting member and a carrier connected to the driving end of the angle adjusting member, the angle adjusting member is connected to the third moving module, and the carrier is used for placing a substrate.

9. The mass transfer apparatus of claim 8, wherein, ​

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