Bearing structure

Abstract

A bearing structure comprises a main body area and a peripheral area which are adjacent to each other, so that a plurality of substrate units are arranged in the main body area in an array manner, a plurality of electrical connection pads are arranged on each substrate unit, and at least two inspection pads are arranged in the peripheral area, so that when surface treatment layers are formed on the electrical connection pads and the inspection pads, the surface treatment layers are arranged on the surface treatment layers. Therefore, whether the surface treatment layer formed on the electrical connection pad reaches the target thickness or not can be judged by directly observing the mutual contact condition of the surface treatment layers formed on the two inspection pads.

Description

Technical Field

[0001] This application relates to a semiconductor structure, and more particularly to a carrier structure for carrying a semiconductor wafer. Background Technology

[0002] In the current structure of a packaging substrate or lead frame that electrically connects and supports a semiconductor wafer with bonding wires, an electronic pad is formed on the surface of the semiconductor wafer, and the packaging substrate has a corresponding bonding pad, or the lead frame has a corresponding lead. After the semiconductor wafer is placed on the die placement area of ​​the packaging substrate or the die placement seat of the lead frame, the electronic pad of the semiconductor wafer is electrically connected to the bonding pad of the packaging substrate or the lead frame by bonding wires (gold wires), so that the semiconductor wafer is electrically connected to the packaging substrate or the lead frame.

[0003] Meanwhile, in the packaging process where the packaging substrate serves as the chip carrier, a nickel / gold layer is typically electroplated onto the wire bonding pads of the packaging substrate before the wire bonding operation. This is to enhance the electrical coupling between the gold wire and the wire bonding pads and to prevent the wire bonding pads from oxidizing.

[0004] However, insufficient nickel / gold plating thickness on the wire bonding pads can cause malfunctions in the wire bonding production line or insufficient resistance to external oxidation. Therefore, current practices require random sampling of the packaging substrates and destructive testing (such as slicing) to confirm whether the nickel / gold layer thickness meets requirements. However, this testing method not only makes testing difficult but also leads to waste of manpower, resources, and time.

[0005] Therefore, overcoming the various problems of the existing technologies has become an urgent issue to be addressed. Utility Model Content

[0006] In view of the various deficiencies of the prior art, this application provides a support structure that defines an adjacent main body area and a peripheral area. The support structure includes: a plurality of substrate units disposed in the main body area, and each of the plurality of substrate units forms a plurality of electrical connection pads; and at least two inspection pads disposed in the peripheral area, wherein the spacing between the at least two inspection pads is smaller than the spacing between any two of the plurality of electrical connection pads.

[0007] The aforementioned support structure also includes a surface treatment layer formed on the plurality of electrical connection pads and the at least two inspection pads. The surface treatment layer is a nickel / gold layer.

[0008] In the aforementioned support structure, it is either a full-page or strip-shaped structure, and the multiple substrate units are arranged in an array.

[0009] In the aforementioned support structure, the substrate unit provides an electronic component, which is electrically connected to the plurality of electrical connection pads.

[0010] In the aforementioned support structure, each substrate unit has a cutting path that serves as a slitting process.

[0011] In the aforementioned load-bearing structure, the outer perimeter is connected to the main body and located on the periphery of the main body.

[0012] In the aforementioned load-bearing structure, the inspection pad is made of the same material as the electrical connection pad.

[0013] In the aforementioned support structure, the outer perimeter area is provided with multiple sets of inspection pads, each set of inspection pads contains two inspection pads, and the distance between the two inspection pads in each set is the same, or the distance between the two inspection pads in each set is different.

[0014] As can be seen from the above, the bearing structure of this application mainly involves setting at least two inspection pads in the outer area, and the distance between the two inspection pads is smaller than the distance between the two electrical connection pads in the main body area. This allows the surface treatment layer formed on the electrical connection pads and the inspection pads to be observed directly by visual inspection or microscopy to determine whether the surface treatment layer formed on the electrical connection pads has reached the target thickness, without the need for destructive testing. Attached Figure Description

[0015] Figure 1 This is a top view schematic diagram of the load-bearing structure of this application.

[0016] Figure 2A This is a partially enlarged top view and cross-sectional view of the first embodiment of the electrical connection pad of the load-bearing structure of this application.

[0017] Figure 2B This is a partially enlarged top view and cross-sectional schematic diagram of the first embodiment of the inspection pad for the load-bearing structure of this application.

[0018] Figure 3A This is a partially enlarged top view and cross-sectional view of a second embodiment of the electrical connection pad of the load-bearing structure of this application.

[0019] Figure 3B This is a partially enlarged top view and cross-sectional schematic diagram of the second embodiment of the inspection pad for the load-bearing structure of this application.

[0020] Explanation of reference numerals in the attached figures

[0021] 1. Load-bearing structure

[0022] 10 substrate units

[0023] 11 Electrical connection pads

[0024] 12 Inspection pads

[0025] 13 Surface treatment layer

[0026] A Main Area

[0027] B. Outer Zone

[0028] X, Y spacing. Detailed Implementation

[0029] The following specific embodiments illustrate the implementation of this application. Those skilled in the art can easily understand other advantages and effects of this application from the content disclosed in this specification.

[0030] It should be understood that the structures, proportions, sizes, etc., depicted in the accompanying drawings are merely for illustrative purposes to aid those skilled in the art in understanding and reading the content disclosed herein, and are not intended to limit the scope of this application. Therefore, they have no substantial technical significance. Any modifications to the structure, changes in proportions, or adjustments to size, without affecting the effectiveness and purpose of this application, should still fall within the scope of the technical content disclosed herein. Furthermore, the terms such as "above" and "a" used in this specification are merely for clarity of description and are not intended to limit the scope of this application. Changes or adjustments to their relative relationships, without substantially altering the technical content, should also be considered within the scope of this application's implementation.

[0031] Please see Figure 1 This is a top view schematic diagram of the load-bearing structure of this application. Figure 1 As shown, the load-bearing structure 1 is defined with adjacent main body area A and peripheral area B (the boundary between the two is as follows). Figure 1 (as shown by the dashed line), and the supporting structure 1 includes: a plurality of substrate units 10 disposed in the main body area A and a viewing pad 12 disposed in the peripheral area B.

[0032] In this embodiment, the supporting structure 1 is a full-page type (or a strip type), such as a substrate strip, and multiple substrate units 10 are arranged in an array.

[0033] The substrate unit 10 is a circuit structure with a core layer or a coreless circuit structure, which has a dielectric layer and a circuit layer bonded to the dielectric layer. In this embodiment, the main material forming the dielectric layer is a dielectric material such as polybenzoxazole (PBO), polyimide (PI), or prepreg (PP); the main material forming the circuit layer is copper, and it is fabricated, for example, using a redistribution layer (RDL) process.

[0034] Please refer to the following at the same time. Figure 2A The circuit layer includes a plurality of electrical connection pads 11 forming the surface of the substrate unit 10, wherein the spacing between two opposing electrical connection pads 11 is X, so that electronic components can be subsequently placed on each substrate unit 10 and electrically connected to the plurality of electrical connection pads 11. The electronic components are arranged on each substrate unit 10 in the required number, and can be active components, passive components, or combinations thereof. The active components are, for example, semiconductor wafers, and the passive components are, for example, resistors, capacitors, and inductors. In this embodiment, the electronic component is a semiconductor wafer, which can be electrically connected to the electrical connection pads 11 of the substrate unit 10 by wire bonding (through gold wires).

[0035] Furthermore, the main body region A has cutting paths between each of the substrate units 10 as part of the dicing process, and its structure can be fabricated according to the process and structure of the substrate unit 10. For example, the cutting paths can be formed by the dielectric layer, without forming a circuit layer.

[0036] In addition, the outer area B is connected to the main area A and is located on the periphery of the main area A, so that it can be removed together in the subsequent order cutting process.

[0037] The peripheral area B is provided with at least one set of inspection pads 12 (including two inspection pads 12). In the illustration of this embodiment, multiple sets of inspection pads 12 are provided. The spacing between the two inspection pads 12 in each set may be the same or different to meet the requirements of electrical connection pads 11 of the same or different specifications within the same substrate unit 10. In addition, the material of the inspection pads 12 may be the same as that of the electrical connection pads 11 (e.g., metallic copper), and they are manufactured in the same process.

[0038] Please refer to the following at the same time. Figure 2B The distance between two adjacent inspection pads is Y, and the distance Y between two adjacent inspection pads is less than the distance X between two adjacent electrical connection pads.

[0039] In addition, to prevent oxidation of the electrical connection pad 11 and to improve the bonding force between the electrical connection pad 11 and the electronic component (semiconductor wafer) (e.g., by connecting the electronic component and the electrical connection pad through gold wire or solder ball), a surface treatment layer 13 (e.g., a nickel / gold layer) is also formed on the outer surface of the electrical connection pad 11.

[0040] The surface treatment layer 13 can be formed by electroplating lines or by non-electroplated lines, and the surface treatment layer 13 simultaneously forms the outer surface of the electrical connection pad 11 and the inspection pad 12.

[0041] In one application example, when the distance X between two adjacent electrical connection pads 11 is 40 μm and the distance Y between two adjacent inspection pads 12 is 30 μm, the thickness of the surface treatment layer 13 to be formed on the electrical connection pads 11 is 15 μm.

[0042] In situation 1, please refer to Figure 2A and Figure 2B If the actual thickness of the surface treatment layer 13 formed on the electrical connection pad 11 is ≥15um (the actual thickness of the surface treatment layer 13 can be greater than the predetermined thickness, as long as bridging between adjacent electrical connection pads 11 is avoided), that is, the surface treatment layers 13 formed on adjacent electrical connection pads 11 may still be spaced about 10um apart. At this time, since the thickness of the surface treatment layer 13 formed on adjacent inspection pads 12 is also ≥15um, and the distance Y between the two adjacent inspection pads 12 is only 30um (less than the distance X between the two adjacent electrical connection pads, which is 40um), the surface treatment layers 13 formed on the two adjacent inspection pads 12 are in contact with each other.

[0043] For situation 2, please refer to Figure 3A and Figure 3B If the actual thickness of the surface treatment layer 13 formed on the electrical connection pad 11 is <15um (the actual thickness of the surface treatment layer 13 has not reached the predetermined thickness), then, since the thickness of the surface treatment layer 13 formed on the two adjacent inspection pads 12 is also <15um, it will be found that there are still gaps between the surface treatment layers 13 formed on the two adjacent inspection pads 12 and they do not contact each other.

[0044] Accordingly, by observing whether the surface treatment layer 13 on the electrical connection pad 11 of the substrate unit 10 in the main body area A of the support structure 1 is in contact or has a gap, it can be directly determined whether the thickness of the surface treatment layer 13 formed on the electrical connection pad 11 of the substrate unit 10 in the main body area A of the support structure 1 reaches the preset value.

[0045] Therefore, the carrier structure of this application mainly utilizes at least two inspection pads in the peripheral area, with the distance between the two inspection pads being smaller than the distance between the two electrical connection pads in the main body area. This allows for direct visual observation or microscopic examination of the mutual distance and contact between the surface treatment layers formed on the two inspection pads when the surface treatment layers are formed on the electrical connection pads and the inspection pads. This enables the determination of whether the surface treatment layer formed on the electrical connection pads has reached the target thickness, without the need for destructive testing, thereby saving manpower, material resources, and time costs. Furthermore, the carrier structure of this application can be manufactured using existing semiconductor packaging equipment, without the need to develop or purchase special equipment, thus reducing product manufacturing costs and demonstrating high technical feasibility.

[0046] The above embodiments are used to illustrate the principles and effects of this application, and are not intended to limit this application. Those skilled in the art can modify the above embodiments without departing from the spirit and scope of this application. Therefore, the scope of protection of this application should be as set forth in the claims.

Claims

1. A load bearing structure defining an adjacent central region and a peripheral region, characterised in that, The carrier structure comprises: a plurality of substrate units arranged in the main body region, each of the substrate units being formed with a plurality of electrically connecting pads; at least two inspection pads arranged in the peripheral region, wherein the distance between the at least two inspection pads is smaller than the distance between any two of the electrically connecting pads. The carrier structure further comprises a surface treatment layer formed on the plurality of electrically connecting pads and the at least two inspection pads.

2. The load bearing structure of claim 1, wherein, The surface treatment layer is a nickel / gold layer.

3. The load bearing structure of claim 2, wherein, The carrier structure is in a full-area or strip type, and the plurality of substrate units are arranged in an array manner.

4. The load bearing structure of claim 1, wherein, The substrate units are arranged with electronic components thereon, and the electronic components are electrically connected to the plurality of electrically connecting pads.

5. The load bearing structure of claim 1, wherein, Each of the substrate units has a cutting path as a singulation process.

6. The load bearing structure of claim 5, wherein, The peripheral region is connected to the main body region and arranged at the periphery of the main body region.

7. The load bearing structure of claim 1, wherein, The inspection pads are made of the same material as the electrically connecting pads.

8. The load bearing structure of claim 1, wherein, The peripheral region is provided with a plurality of groups of inspection pads, each group of inspection pads comprising two inspection pads, and the distance between the two inspection pads of each group is the same.

9. The load bearing structure of claim 1, wherein, The peripheral region is provided with a plurality of groups of inspection pads, each group of inspection pads comprising two inspection pads, and the distance between the two inspection pads of each group is different.

10. The load bearing structure of claim 1, wherein, ​

Images