Packaging structure and terminal equipment

Abstract

The packaging structure comprises a first circuit board, a cover body, an electronic component and an adhesive layer, the electronic component is located in an accommodating cavity formed by the cover body and the first circuit board, and the adhesive layer is used for bonding the first circuit board, the electronic component and the cover body; or the packaging structure comprises a first circuit board, an elevated plate, a second circuit board, an electronic element and an adhesive layer, the electronic element is located in a containing cavity formed by the first circuit board, the elevated plate and the second circuit board, and the first circuit board, the first circuit board, the elevated plate, the second circuit board and the second electronic element are bonded through the adhesive layer. A plurality of openings are formed in the cover body, or a plurality of opening areas are arranged on the elevated plate, and each opening area comprises an opening. The utility model further provides terminal equipment. According to the packaging structure, electromagnetic radiation of the packaging structure can be reduced as much as possible on the premise of being beneficial to achieving glue filling uniformity, that is, the packaging structure can have good connection reliability and an electromagnetic shielding effect at the same time.

Description

Technical Field

[0001] This application relates to the field of packaging technology, and in particular to a packaging structure and a terminal device. Background Technology

[0002] The terminal device includes a packaging structure, which comprises a circuit board, a chip, a shock absorber, and an adhesive layer. The chip and circuit board are electrically connected. The shock absorber is positioned around the chip to protect it. The adhesive layer fills the space between the circuit board and the shock absorber for bonding. A potting port needs to be formed on the shock absorber to facilitate potting. Electromagnetic waves generated by the chip during operation can leak from the potting port and interfere with other components in the terminal device. Reducing the size of the potting port can easily lead to uneven potting, affecting the connection reliability of the packaging structure. Utility Model Content

[0003] Therefore, it is necessary to provide a packaging structure that combines good connection reliability and electromagnetic shielding effect.

[0004] In a first aspect, this application provides a packaging structure, which includes a first circuit board, a cover, electronic components, and an adhesive layer. The cover is disposed on the first circuit board and includes a top plate and multiple side plates. The multiple side plates surround the top plate and connect the top plate and the first circuit board. The first circuit board, the top plate, and the multiple side plates form a receiving cavity. The electronic components are disposed on the first circuit board and located in the receiving cavity. The adhesive layer fills the receiving cavity and bonds the first circuit board, the cover, and the electronic components. The cover has multiple openings that communicate with the receiving cavity. The multiple openings are all located on the same side plate or all on the top plate.

[0005] In the above structure, the encapsulation structure provided in this application embodiment, by setting multiple openings on the same side of the cover, can minimize the electromagnetic radiation of the encapsulation structure while facilitating the uniformity of potting. That is, the encapsulation structure can simultaneously have good connection reliability and electromagnetic shielding effect.

[0006] In some possible embodiments of this application, the maximum size of two adjacent openings is greater than the distance between the two adjacent openings.

[0007] In the above structure, the electromagnetic shielding effect of the encapsulation structure can be improved while facilitating the potting process so that the adhesive can fully fill the cavity.

[0008] In some possible embodiments of this application, a plurality of openings are arranged along a first direction, wherein the direction of the maximum size of each opening is the first direction.

[0009] The above structure can prevent the glue from leaking from other areas due to gravity during the potting process. In addition, it can facilitate the glue to flow fully in the receiving cavity to fill the entire receiving cavity. The glue layer formed after the glue cures can fully bond the first circuit board, the cover and electronic components to improve the connection reliability of the packaging structure.

[0010] In some possible embodiments of this application, the cover and the first circuit board are stacked along the second direction, and the size of each opening along the second direction is equal to the distance between the top plate and the first circuit board.

[0011] In the above structure, each opening extends through the side plate along the second direction, which, on the basis of good connection reliability and electromagnetic shielding effect, further helps to reduce the thickness of the packaging structure.

[0012] Secondly, embodiments of this application provide a packaging structure, which includes a first circuit board, a support plate, a second circuit board, electronic components, and an adhesive layer. The support plate is located between the first circuit board and the second circuit board and is electrically connected to the first circuit board and the second circuit board. The first circuit board, the support plate, and the second circuit board surround and form a receiving cavity. The electronic components are disposed on the first circuit board and located in the receiving cavity. The adhesive layer fills the receiving cavity and bonds the first circuit board, the support plate, the second circuit board, and the electronic components. The support plate includes multiple opening areas, and multiple openings are formed on the support plate. The multiple openings communicate with the receiving cavity and are formed on the same side of the support plate. Each opening area includes at least one opening.

[0013] In the above structure, the encapsulation structure provided in this application embodiment, by setting multiple opening areas on the same side of the raised plate, with each opening area having at least one opening, can minimize the electromagnetic radiation of the encapsulation structure while facilitating the uniformity of potting. That is, the encapsulation structure can simultaneously have good connection reliability and electromagnetic shielding effect.

[0014] In some possible embodiments of this application, the maximum size of two adjacent opening regions is greater than the distance between the two adjacent opening regions.

[0015] In the above structure, the electromagnetic shielding effect of the encapsulation structure can be improved while facilitating the potting process so that the adhesive can fully fill the cavity.

[0016] In some possible embodiments of this application, the first circuit board includes a first ground wire, the second circuit board includes a second ground wire, and the raised board includes a plurality of third ground wires. The plurality of third ground wires connect the first ground wire and the second ground wire, and an opening area is formed between two adjacent third ground wires.

[0017] In the above structure, the first ground wire, the second ground wire, and the third ground wire are equivalent to forming a Faraday cage, which serves as electromagnetic shielding.

[0018] In some possible embodiments of this application, the first circuit board further includes a first signal line, the second circuit board further includes a second signal line, and the raised board further includes a third signal line; the third signal line is located in the opening area and is electrically connected to the first signal line and the second signal line.

[0019] In the above structure, the second signal line on the second circuit board can be electrically connected to other electronic components, which helps to increase the packaging density of the packaging structure.

[0020] In some possible implementations of this application, each opening region is provided with one opening.

[0021] In the above structure, each opening area includes an opening, which can reduce the risk of electromagnetic leakage of the packaging structure and improve the electromagnetic shielding effect of the packaging structure while meeting the potting requirements.

[0022] Thirdly, embodiments of this application provide a terminal device, which includes a packaging structure. Attached Figure Description

[0023] Figure 1 This is a schematic diagram of the structure of a terminal device provided in some embodiments of this application.

[0024] Figure 2 This is a schematic diagram of the packaging structure provided in some embodiments of this application.

[0025] Figure 3 This is a top view schematic diagram of the packaging structure provided in some embodiments of this application.

[0026] Figure 4 This is a side view schematic diagram of the packaging structure provided in some embodiments of this application.

[0027] Figure 5 This is a schematic diagram of the packaging structure provided for other embodiments of this application.

[0028] Figure 6 This is a top view schematic diagram of the packaging structure provided for other embodiments of this application.

[0029] Figure 7 This is a side view schematic diagram of the packaging structure provided for other embodiments of this application.

[0030] Figure 8A This is a schematic diagram of electromagnetic field excitation formed between multiple openings arranged in a "I" shape, provided as an embodiment of this application.

[0031] Figure 8B This is a schematic diagram of electromagnetic field excitation formed between multiple openings arranged in an array, provided as an embodiment of this application.

[0032] Figure 9A This is a schematic diagram of a packaging structure with multiple openings on the cover, provided in an embodiment of this application.

[0033] Figure 9B This is a schematic diagram of a packaging structure with an opening in the cover, provided in an embodiment of this application.

[0034] Figure 10A For testing Figure 9A Simulation test diagram of the magnetic field in the region outside the cover and 1 mm away from the cover along the second direction.

[0035] Figure 10B For testing Figure 9B Simulation test diagram of the magnetic field in the region outside the cover and 1 mm away from the cover along the second direction.

[0036] Figure 11A For testing Figure 9A Simulation test diagram of the magnetic field in the region outside the cover and 3mm away from the cover along the second direction.

[0037] Figure 11B For testing Figure 9B Simulation test diagram of the magnetic field in the region outside the cover and 3mm away from the cover along the second direction.

[0038] Figure 12A For testing Figure 9A Simulation test diagram of the electric field in the region outside the cover and 1 mm away from the cover along the second direction.

[0039] Figure 12B For testing Figure 9B Simulation test diagram of the electric field in the region outside the cover and 1 mm away from the cover along the second direction.

[0040] Figure 13A For testing Figure 9A Simulation test diagram of the electric field in the region outside the cover and 3mm away from the cover along the second direction.

[0041] Figure 13B For testing Figure 9B Simulation test diagram of the electric field in the region outside the cover and 3mm away from the cover along the second direction.

[0042] Figure 14 This is a top view schematic diagram of the packaging structure provided for some embodiments of this application.

[0043] Figure 15 This is a side view schematic diagram of the packaging structure provided for some embodiments of this application.

[0044] Figure 16A schematic diagram of the packaging structure provided for some embodiments of this application.

[0045] Explanation of main component symbols

[0046]

[0047] Detailed Implementation

[0048] To better understand the above-mentioned objectives, features, and advantages of this application, the application will be described in detail below with reference to the accompanying drawings and specific embodiments. It should be noted that, unless otherwise specified, the embodiments and features described in this application can be combined with each other. Many specific details are set forth in the following description to provide a thorough understanding of this application; the described embodiments are merely some, not all, of the embodiments described in this application.

[0049] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs. The terminology used in this specification is for the purpose of describing particular embodiments only and is not intended to be limiting of this application. The term "and / or" as used herein includes all and any combination of one or more of the associated listed items.

[0050] In the various embodiments of this application, for ease of description and not limitation, the term "connection" used in the patent application specification and claims is not limited to physical or mechanical connections, whether direct or indirect. Terms such as "upper," "lower," "above," "below," "left," and "right" are used only to indicate relative positional relationships; when the absolute position of the described object changes, the relative positional relationship also changes accordingly.

[0051] Please see Figure 1 , Figure 1 This is a schematic diagram of the structure of a terminal device 200 provided in some embodiments of this application. Figure 1 In the illustrated embodiment, the terminal device 200 is a mobile phone. In other embodiments, the terminal device 200 can also be a chassis, cabinet, tablet computer, personal digital assistant (PDA), in-vehicle computer, television, smart wearable device, etc. The terminal device 200 is a product that requires electromagnetic shielding effectiveness.

[0052] Terminal device 200 may include a housing 210 and an encapsulation structure 100, the encapsulation structure 100 being located within the housing 210. Housing 210 includes a battery cover and a display screen. In other embodiments, the specific name of housing 210 is related to the specific name of terminal device 200.

[0053] Please see Figure 2 , Figure 3 and Figure 4 , Figure 2 This is a schematic diagram of the packaging structure 100 provided in some embodiments of this application. Figure 3 This is a top view of the packaging structure 100 provided in some embodiments of this application. Figure 4 This is a side view of the packaging structure 100 provided in some embodiments of this application.

[0054] The encapsulation structure 100 may include a first circuit board 10, a housing 20, an electronic component 70, and an adhesive layer 80. The housing 20 is disposed on the first circuit board 10 and forms a receiving cavity 30 with the first circuit board 10. The electronic component 70 is disposed on the first circuit board 10 and located in the receiving cavity 30. The adhesive layer 80 fills the receiving cavity 30 and bonds the first circuit board 10, the housing 20, and the electronic component 70. The encapsulation structure 100 can be used to replace electromagnetic shielding methods such as surface mount devices, shielding coatings, or shielding films.

[0055] An opening 231 is provided on one side of the cover 20, through which glue can be poured into the receiving cavity 30 using a glue-pouring head 232. The glue-pouring head 232 is removed after glue pouring. During the glue pouring process, glue is injected into the receiving cavity 30 through the opening 231. With the side of the cover 20 with the opening 231 facing upwards in the direction of gravity, the glue flows and fills the receiving cavity 30 under the action of gravity. After the glue cures, it forms an adhesive layer 80 that bonds the first circuit board 10, the electronic component 70, and the cover 20.

[0056] To ensure the adhesive fully fills the receiving cavity 30, the opening 231 needs to be as large as possible. For example, if the structure of the cover 20 is a cuboid, and the opening 231 is located on the longer side plate 23 of the cover 20, a larger opening 231 increases the risk of electromagnetic leakage from the encapsulation structure 100. For instance, when the electronic component 70 is a strong interference source, it can easily generate electromagnetic interference to components outside the cover 20 during operation.

[0057] Please see Figure 5 , Figure 6 and Figure 7 , Figure 5 This is a schematic diagram of the packaging structure 100a provided in some other embodiments of this application. Figure 6 This is a top view schematic diagram of the packaging structure 100a provided in other embodiments of this application. Figure 7 This is a side view of the encapsulation structure 100a provided in some other embodiments of this application. The encapsulation structure 100a provided in this embodiment, in addition to enabling good potting, also has good electromagnetic shielding effect.

[0058] The encapsulation structure 100a may include a first circuit board 10, a cover 20, electronic components 70, and an adhesive layer 80. Figure 5 Not shown, please refer to Figure 6 and Figure 7 A cover 20 is disposed on the first circuit board 10 and forms a receiving cavity 30 with the first circuit board 10. An electronic component 70 is disposed on the first circuit board 10 and located in the receiving cavity 30. An adhesive layer 80 fills the receiving cavity 30 and bonds the first circuit board 10, the cover 20, and the electronic component 70. Both the electronic component 70 and the cover 20 are electrically connected to the first circuit board 10.

[0059] The first circuit board 10 can be a printed circuit board (PCB), which may include a rigid PCB, a flexible PCB (FPC), or a rigid-flex PCB. When the first circuit board 10 is a flexible PCB or a rigid-flex PCB, if the strength of the first circuit board 10 is insufficient, a reinforcing plate can be additionally provided on the surface of the first circuit board 10 to enhance its rigidity. If the first circuit board 10 is a rigid PCB and its strength is sufficient, a reinforcing plate for enhancing strength is not required.

[0060] The first circuit board 10 may include a first circuit layer 13 and a first substrate layer 11. The first circuit layer 13 is embedded in the first substrate layer 11, and the portion of the first circuit layer 13 used for electrical connection with other components is exposed in the first substrate layer 11. The first circuit layer 13 includes a first ground line 132 and a first signal line 131.

[0061] Electronic component 70 can be an active device or a passive device. Active devices may include, but are not limited to, chips, while passive devices may include, but are not limited to, capacitors and resistors. Electronic component 70 is electrically connected to the first signal line 131. The number of electronic components 70 can be one or more.

[0062] The cover 20 is made of metal, such as copper, aluminum, silver, stainless steel, etc. Metal has both good electrical conductivity and rigidity, which can improve the impact resistance of the cover 20.

[0063] The enclosure 20 includes a top plate 21 and multiple side plates 23, with the side plates 23 surrounding the top plate 21. The top plate 21 is located on the side of the side plates 23 opposite to the first circuit board 10, and the side plates 23 connect the first circuit board 10 and the top plate 21. The first circuit board 10, the side plates 23, and the top plate 21 form a receiving cavity 30. The side plates 23 and the first circuit board 10 can be electrically connected to a first ground wire 132 by soldering. The first ground wire 132 includes a large-area conductive layer to reduce electromagnetic leakage.

[0064] On the one hand, the enclosure 20 can act as a shock absorber, preventing damage to the electronic components 70 during drops or impacts to the terminal equipment 200. After the encapsulation structure 100a has undergone drop, roller, and ferrofluid tests, the electronic components 70 can still function normally. On the other hand, the enclosure 20 can also act as an electromagnetic shield. For example, when the electronic components 70 are a strong source of interference, the enclosure 20 can reduce electromagnetic leakage to prevent the electromagnetic fields generated by the electronic components 70 from affecting other components in the terminal equipment 200. Alternatively, the shield can reduce electromagnetic interference generated by the electronic components 70 inside the enclosure 20.

[0065] The cover 20 has multiple openings 231a, all of which communicate with the receiving cavity 30. The multiple openings 231a include two or more openings 231a. The multiple openings 231a can be arranged in a straight line or in an array (i.e., multiple rows and columns). The shape of the openings 231a can be square, circular, semi-circular, or other regular shapes; manufacturing regular-shaped openings 231a is less costly.

[0066] Adhesive can be poured into the receiving cavity 30 through multiple openings 231a using a dispensing head 232. With the side of the cover 20 containing the multiple openings 231a facing upwards in the direction of gravity, the adhesive flows under the influence of gravity, filling the receiving cavity 30. After curing, an adhesive layer 80 is formed, bonding the first circuit board 10, electronic components 70, and cover 20. Because the adhesive has a certain degree of viscosity before curing, the multiple openings 231a are all located on the same side plate 23 or on the top plate 21. This prevents the adhesive from leaking from other areas due to gravity during the dispensing process and also facilitates the sufficient flow of the adhesive within the receiving cavity 30 to fill the entire cavity. The adhesive layer 80 formed after curing can effectively bond the first circuit board 10, cover 20, and electronic components 70, thereby improving the connection reliability of the packaging structure 100a. The size of each opening 231a is kept as small as possible while still meeting the dispensing requirements to minimize the possibility of electromagnetic leakage.

[0067] The adhesive layer 80 can be made of epoxy resin, silicone resin, etc. The adhesive layer 80 fills the receiving cavity 30, that is, fills the gap between the first circuit board 10, the cover 20 and the electronic component 70. The adhesive layer 80 can fix the electronic component 70 and improve the impact resistance of the packaging structure 100a. In addition, it can also protect the electronic component 70 from the influence of moisture, dust and other impurities.

[0068] When the thickness of the encapsulation structure 100a (along the direction in which the cover 20 and the first circuit board 10 are stacked) is relatively thin, for the thinner encapsulation structure 100a, the opening 231a is provided on the side plate 23. After the potting step, this facilitates the flow of adhesive in the receiving cavity 30 due to gravity, thereby fully filling the gaps in the receiving cavity 30. If the thickness of the encapsulation structure 100a is relatively thick, the opening 231a can be provided on the top plate 21.

[0069] Please see Figure 8A and Figure 8B , Figure 8A This is a schematic diagram of electromagnetic field excitation formed between a plurality of openings 231a arranged in a "I" shape, provided in an embodiment of this application. Figure 8B This is a schematic diagram of electromagnetic field excitation formed between a plurality of openings 231a arranged in an array, provided in an embodiment of this application.

[0070] The cover 20 and the first ground wire 132 in the first circuit board 10 are equivalent to forming a Faraday cage. Multiple openings 231a are formed on the cover 20. Taking the multiple openings 231a on the side plate 23 as an example, adjacent openings 231a are connected by the side plate 23. Figure 2 The embodiment shown is equivalent to reducing the size of the entire opening 231a. Furthermore, in this embodiment, when the electronic component 70 operates, the multiple openings 231a are excited by the electromagnetic field generated by the electronic component 70 located within the housing 20, and induced currents are generated between adjacent openings 231a. The induced currents of the side plates 23 located between adjacent openings 231a are in opposite directions, and at least part of their magnetic moments can cancel each other out, effectively mitigating electromagnetic radiation leakage from the electronic component 70 and thus improving the electromagnetic shielding effect of the packaging structure 100a. The closer the sizes of two adjacent openings 231a are, the closer the magnitudes of the induced currents are, which is more conducive to the mutual cancellation of magnetic moments, further improving the electromagnetic shielding effect of the packaging structure 100a. When the multiple openings 231a are arranged in an array, one opening 231a can simultaneously cancel out the magnetic moments between it and another opening 231a in the same row and column, further improving the electromagnetic shielding effect of the packaging structure 100a.

[0071] In some embodiments, the maximum size of two adjacent openings 231a is greater than the distance between the two adjacent openings 231a. This facilitates the potting process, ensuring the adhesive fully fills the receiving cavity 30, while improving the electromagnetic shielding effect of the encapsulation structure 100a. In other words, the encapsulation structure 100a provided in this embodiment combines good connection reliability with excellent electromagnetic shielding.

[0072] Please refer to it again. Figure 6 and Figure 7In one specific embodiment, multiple openings 231a are defined and arranged along a first direction L1, and the cover 20 and the first circuit board 10 are stacked along a second direction L2. The multiple openings 231a are arranged along the first direction L1, and the direction of the maximum size of each opening 231a is the first direction L1. This arrangement, while ensuring good connection reliability and electromagnetic shielding effect, helps to reduce the thickness of the packaging structure 100a along the second direction L2.

[0073] The size of each opening 231a along the second direction L2 is equal to the distance between the top plate 21 and the first circuit board 10, which is equivalent to each opening 231a penetrating the side plate 23 along the second direction L2. On the basis of the packaging structure 100a having both good connection reliability and electromagnetic shielding effect, it is further beneficial to reduce the thickness of the packaging structure 100a along the second direction L2.

[0074] The maximum size of the opening 231a is D1, and the distance between two adjacent openings 231a is D2. The distance between two adjacent openings 231a is along the first direction L1. The direction of the maximum size of the opening 231a is related to the shape of the opening 231a. In this embodiment, the shape of the opening 231a is rectangular, and the length direction of the rectangle is along the first direction L1. Therefore, the maximum size of the opening 231a is along the first direction L1.

[0075] In this embodiment, the cover 20 has three openings 231a, which are located on the same side plate 23. All three openings 231a are identical in size and are rectangular. The side plate 23 has a length of 7mm along the first direction L1 and a height of 1mm along the second direction L2, which is perpendicular to the first direction L1. Each opening 231a has a length of 1.5mm along the first direction L1 (i.e., D1 = 1.5mm), and the distance between two adjacent openings 231a is 1.25mm (i.e., D2 = 1.25mm), meaning D1 > D2.

[0076] According to Parbenezer's theory, the shielding effectiveness S of the enclosure 20 satisfies the following formula:

[0077] S≈100-20logl-20logF+20log(1+2.3logl / h))+30d / l

[0078] Where S is in dB; F is the frequency of the electromagnetic wave emitted by electronic component 70 in MHz; l is the maximum size of opening 231a in mm; and h is the height of opening 231a in mm. Taking the frequency of the electromagnetic wave emitted by electronic component 70 as 900MHz as an example, when there is one opening 231a in the cover 20 and the length of opening 231a along the first direction L1 is 7mm (e.g.) Figure 4As shown), the shielding effectiveness S calculated according to the above formula is approximately 33dB; when the enclosure 20 has three openings 231a, and the length of each opening 231a along the first direction L1 is 1.5mm (as shown), Figure 7 As shown in the figure, the shielding effectiveness S calculated according to the above formula is approximately 40 dB. Under the premise that the potting process can be well achieved, the shielding effectiveness of the cover 20 with multiple openings 231a on the same side plate 23 is better than that of the cover 20 with only one opening 231a on the same side plate 23.

[0079] Please see Figures 9A to 13B , Figure 9A This is a schematic diagram of the encapsulation structure 100a with multiple openings 231a on the cover 20 provided in this embodiment of the application. Figure 9B A schematic diagram of the encapsulation structure 100a with an opening 231a on the cover 20 provided in this embodiment of the application; Figure 10A For testing Figure 9A Simulation test diagram of the magnetic field in the region outside the cover 20 and at a distance of 1 mm from the cover 20 along the second direction L2. Figure 10B For testing Figure 9B Simulation test diagram of the magnetic field in the region outside the cover 20 and at a distance of 1 mm from the cover 20 along the second direction L2; Figure 11A For testing Figure 9A Simulation test diagram of the magnetic field in the region outside the cover 20 and at a distance of 3mm from the cover 20 along the second direction L2. Figure 11B For testing Figure 9B Simulation test diagram of the magnetic field in the region outside the cover 20 and at a distance of 3mm from the cover 20 along the second direction L2; Figure 12A For testing Figure 9A The simulation test diagram shows the electric field in the region outside the cover 20 and 1 mm away from the cover 20 along the second direction L2. Figure 12B For testing Figure 9B Simulation test diagram of the electric field in the region outside the cover 20 and 1 mm away from the cover 20 along the second direction L2; Figure 13A For testing Figure 9A Simulation test diagram of the electric field in the region outside the cover 20 and 3 mm away from the cover 20 along the second direction L2. Figure 13B For testing Figure 9B Simulation test diagram of the electric field in the region outside the cover 20 and 3 mm away from the cover 20 along the second direction L2.

[0080] The dB value indicates the degree of attenuation of electromagnetic waves by the enclosure 20. A larger absolute dB value indicates stronger attenuation and better shielding effectiveness. Conversely, a smaller absolute dB value indicates weaker attenuation and poorer shielding effectiveness. Please refer to the relevant documentation for further details. Figures 10A to 13BAs can be seen from the test structure, Figure 10A , Figure 11A , Figure 12A and Figure 13A The absolute values ​​of both the maximum and minimum values ​​are greater than Figure 10B , Figure 11B , Figure 12B and Figure 13B The numerical range indicates that the shielding performance of the cover 20 with multiple openings 231a is better than that of the cover 20 with a single opening 231a.

[0081] Please see Figure 14 , Figure 15 and Figure 16 , Figure 14 A top view schematic diagram of the packaging structure 100b provided in some embodiments of this application. Figure 15 A side view schematic diagram of the packaging structure 100b provided in some embodiments of this application. Figure 16 A schematic diagram of the packaging structure 100b provided for some embodiments of this application.

[0082] Unlike the previous embodiment, this embodiment uses a raised platform 40 and a second circuit board 50 instead of the cover 20 in the previous embodiment. It should be noted that... Figure 14 The second circuit board 50 is not shown. A support plate 40 is located between the first circuit board 10 and the second circuit board 50, and is electrically connected to both. The first circuit board 10, the support plate 40, and the second circuit board 50 generally form a "sandwich" structure. The first circuit board 10, the support plate 40, and the second circuit board 50 are stacked along a second direction L2. The first circuit board 10, the support plate 40, and the second circuit board 50 enclose a receiving cavity 30.

[0083] The second circuit board 50 includes a second substrate layer 51 and a second circuit layer 52. The second circuit layer 52 is embedded in the second substrate layer 51 and includes a second ground line 522 and a second signal line 521.

[0084] The raised board 40 is annular and surrounds the electronic component 70. The raised board 40 can be considered a circuit board used for electrical connection. The raised board 40 includes a third substrate layer 41 and a third wiring layer 42, with the third wiring layer 42 embedded in the third substrate layer 41. The third wiring layer 42 includes a third ground line 422 and a third signal line 421. In this embodiment, both the third ground line 422 and the third signal line 421 extend along the second direction L2, and there is a gap between them.

[0085] The third signal line 421 is electrically connected to the first signal line 131 and the second signal line 521, and is used for signal transmission between the first circuit board 10 and the second circuit board 50. The third ground line 422 is electrically connected to the first ground line 132 and the second ground line 522. The first ground line 132, the second ground line 522, and the third ground line 422 form a Faraday cage, which serves as electromagnetic shielding. The second ground line 522 includes a large-area conductive layer to reduce electromagnetic leakage.

[0086] The raised plate 40 has an opening 44 that communicates with the receiving cavity 30. The opening 44 does not have a third substrate layer 41 or a third circuit layer 42, allowing for potting of adhesive towards the receiving cavity 30. The area between two adjacent third ground lines 422 forms an opening region 43 for electromagnetic leakage. This opening region 43 includes the opening 44 and may also include a third substrate layer 41 and a third signal line 421 located between the two adjacent third ground lines 422. The third signal line 421 is located within the opening region 43.

[0087] The opening area 43 includes multiple opening areas 43 located on the same side of the raised plate 40, and each opening area 43 includes at least one opening 44. To reduce the risk of electromagnetic leakage of the encapsulation structure 100b, the number of openings 44 in each opening area 43 should be reduced. For example, each opening area 43 can be provided with one opening 44, thereby improving the electromagnetic shielding effect of the encapsulation structure 100b while still meeting the potting requirements.

[0088] In this embodiment, the maximum size of the opening area 43 is defined as D1, and the distance between two adjacent opening areas 43 is defined as D2. D1 > D2, that is, the maximum size of two adjacent opening areas 43 is greater than the distance between two adjacent opening areas 43. This allows the electromagnetic shielding effect of the encapsulation structure 100b to be improved while facilitating the potting step so that the glue can fully fill the receiving cavity 30.

[0089] The second circuit board 50 includes a second signal line 521, on which other electronic components can be electrically connected as needed. This helps to increase the packaging density of the package structure 100b without the need for an additional circuit board for electrical connection.

[0090] The encapsulation structure 100a (or encapsulation structure 100b) provided in this application embodiment, by providing multiple openings 231a on the same side of the cover 20, or multiple opening areas 43 on the same side of the raised plate 40, can minimize the electromagnetic radiation of the encapsulation structure 100a (or encapsulation structure 100b) while facilitating the uniformity of potting. That is, the encapsulation structure 100a (or encapsulation structure 100b) can simultaneously have good connection reliability and electromagnetic shielding effect.

[0091] The above embodiments are only used to illustrate the technical solutions of this application and are not intended to limit it. Although this application has been described in detail with reference to the above preferred embodiments, those skilled in the art should understand that modifications or equivalent substitutions to the technical solutions of this application should not depart from the spirit and scope of the technical solutions of this application.

Claims

1. A package structure, characterized by, The application relates to a packaging structure of a terminal device. The packaging structure comprises: a first circuit board; a cover arranged on the first circuit board, the cover comprising a top plate and a plurality of side plates, the plurality of side plates surrounding the top plate, the plurality of side plates connecting the top plate and the first circuit board, the first circuit board, the top plate and the plurality of side plates forming a receiving cavity; an electronic component arranged on the first circuit board and located in the receiving cavity; and an adhesive layer filled in the receiving cavity and bonding the first circuit board, the cover and the electronic component; wherein a plurality of openings are formed in the cover and communicate with the receiving cavity, the plurality of openings are formed in the same side plate or the top plate.

2. The package structure of claim 1, wherein, The maximum size of two adjacent openings is greater than the distance between the two adjacent openings.

3. The package structure of any one of claims 1-2, wherein, The plurality of openings are arranged in a first direction, and the maximum size of each opening is in the first direction.

4. The package structure of claim 3, wherein, The cover and the first circuit board are arranged in a second direction, and the size of each opening in the second direction is equal to the distance between the top plate and the first circuit board.

5. A package structure, characterized by, The packaging structure comprises: a first circuit board; a height-increasing plate; a second circuit board, the height-increasing plate being located between the first circuit board and the second circuit board and electrically connecting the first circuit board and the second circuit board, the first circuit board, the height-increasing plate and the second circuit board forming a receiving cavity; an electronic component arranged on the first circuit board and located in the receiving cavity; and an adhesive layer filled in the receiving cavity and bonding the first circuit board, the height-increasing plate, the second circuit board and the electronic component; wherein the height-increasing plate comprises a plurality of opening regions, a plurality of openings are formed in the height-increasing plate and communicate with the receiving cavity, the plurality of openings are formed on the same side of the height-increasing plate, and each opening region comprises at least one opening. The maximum size of two adjacent opening regions is greater than the distance between the two adjacent opening regions.

6. The package structure of claim 5, wherein, The first circuit board comprises a first ground wire, the second circuit board comprises a second ground wire, the height-increasing plate comprises a plurality of third ground wires, the plurality of third ground wires connecting the first ground wire and the second ground wire, and two adjacent third ground wires form an opening region.

7. The package structure of claim 5, wherein, The first circuit board further comprises a first signal wire, the second circuit board further comprises a second signal wire, and the height-increasing plate further comprises a third signal wire; the third signal wire is located in the opening region and electrically connects the first signal wire and the second signal wire.

8. The package structure of claim 7, wherein, Each opening region is provided with one opening.

9. The package structure of any one of claims 5-8, wherein, The terminal device comprises the packaging structure of any one of claims 1-9.

10. A terminal device, comprising: ​

Images