Efficient and practical laminating device for electronic adhesive tape
By designing a high-efficiency bonding device for electronic applications, and employing technologies such as magnetic adsorption, elastic bonding layers, and vacuum degassing, the problems of low bonding efficiency, unevenness, and air bubble residue in existing devices have been solved, achieving efficient and uniform tape bonding and wide adaptability.
Patent Information
- Application Number
- CN202520725612.0
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-04-17
- Publication Date
- 2026-02-24
- Estimated Expiration
- 2035-04-17
AI Technical Summary
Existing tape bonding devices rely on manual operation or simple mechanical structures, resulting in low bonding efficiency, uneven bonding, and a tendency to leave air bubbles. They are also difficult to adapt to different sizes and types of tape.
A high-efficiency bonding device was designed, comprising a support platform, a pressing mechanism, a feeding assembly, a tension adjustment module, and an exhaust assembly. The device uses a magnetic adsorption device to fix the product, an elastic bonding layer and a lead screw drive assembly driven by a stepper motor to achieve uniform bonding, a guide wheel assembly and a cutting blade to precisely control the conveyor belt length, a tension wheel to adjust the belt tension, and an exhaust roller and a vacuum adsorption chamber to remove air bubbles.
It enables rapid fixing, uniform bonding, and efficient cutting of tape, ensuring bonding quality, adapting to different sizes and types of tape, and improving the applicability and bonding efficiency of the device.
Smart Images

Figure CN223935179U_ABST
Abstract
Description
Technical Field
[0001] This utility model belongs to the field of electronic manufacturing and automation equipment technology, specifically a practical device for efficient bonding of electronic tapes. Background Technology
[0002] When assembling some electronic products, tape is required for fixing and bonding, necessitating the use of appropriate tape bonding devices. These devices efficiently adhere electronic tapes to designated locations, achieving stable product assembly. However, existing tape bonding devices typically rely on manual operation or simple mechanical structures in practical applications, resulting in low bonding efficiency and issues such as uneven bonding or air bubble residue. This inconsistency in bonding quality affects the assembly effect and reliability of electronic products. Furthermore, the adjustment process for existing devices to accommodate different sizes and types of tape is complex, further limiting their applicability. Utility Model Content
[0003] This utility model provides a practical device for high-efficiency bonding of electronic tapes, aiming to solve the problems mentioned in the background art, such as low bonding efficiency, uneven bonding, and air bubble residue caused by the reliance on manual operation or simple mechanical structure in the actual use of existing tape bonding devices. At the same time, it proposes an improvement solution to address the technical shortcomings of existing devices in adapting to different sizes and types of tapes.
[0004] To solve the above problems, this utility model is implemented as follows: a practical device for efficient bonding of electronic tapes, comprising: a support platform fixedly installed on a base, the support platform being used to place the electronic product to be bonded; a pressing mechanism movably disposed on the base, the pressing mechanism being connected to the base via a slide rail and capable of moving linearly along the slide rail to approach or move away from the support platform; a feeding assembly fixedly installed on one side of the base, the feeding assembly being used to store and convey the tape; a tension adjustment module disposed between the feeding assembly and the pressing mechanism, the tension adjustment module being used to control the tension of the tape and ensure its smooth conveying; and an venting assembly disposed within the pressing mechanism, the venting assembly being used to expel air bubbles during the tape bonding process.
[0005] The support platform is equipped with positioning slots, which use magnetic adsorption devices to fix and position electronic products. The magnetic adsorption device includes a permanent magnet embedded within the support platform and a flexible protective layer covering the surface of the permanent magnet. The flexible protective layer is made of silicone, which prevents scratches on the surface of the electronic product and enhances adsorption stability. Removable limiting baffles are also provided around the support platform. These baffles are fixed to the support platform via threaded connections and can be flexibly adjusted according to the size of the electronic product to accommodate different specifications.
[0006] The pressing mechanism includes a pressing head and a driving unit. The pressing head is connected to the driving unit via a hinge, allowing it to swing within a certain angle range. An elastic bonding layer made of polyurethane material is provided at the bottom of the pressing head, providing good flexibility and wear resistance, and ensuring uniform pressure distribution during the pressing process. The driving unit includes a stepper motor and a lead screw drive assembly. The stepper motor is connected to the lead screw drive assembly via a coupling. The slider of the lead screw drive assembly is fixedly connected to the pressing head, and the forward and reverse rotation of the stepper motor drives the pressing head to move along a slide rail.
[0007] The feeding assembly includes a tape roll, a guide wheel assembly, and a cutting blade. The tape roll is mounted on the base via bearings and can rotate freely to release the tape. The guide wheel assembly includes multiple guide wheels, which are fixed to the base by brackets. The axis of each guide wheel is perpendicular to the conveying direction of the tape, guiding the tape along a predetermined path. The cutting blade is mounted at the end of the guide wheel assembly via a spring return mechanism. When the tape is conveyed to a specified length, the cutting blade is driven downward by an electromagnet to cut the tape.
[0008] The tension adjustment module includes a tension wheel and an adjustment screw. The tension wheel is mounted on one end of the adjustment screw via a bearing. The adjustment screw is fixed to the base via a threaded connection. Rotating the adjustment screw changes the position of the tension wheel, thereby adjusting the tension of the conveyor belt. The outer surface of the tension wheel is provided with an anti-slip coating made of polytetrafluoroethylene (PTFE), which effectively reduces the friction between the conveyor belt and the tension wheel, while improving the tensioning effect.
[0009] The venting assembly includes an venting roller and a vacuum adsorption chamber. The venting roller is mounted on the bottom of the pressing head via a rotating shaft. Both ends of the rotating shaft are connected to the pressing head via bearings, allowing the venting roller to rotate freely. The surface of the venting roller has multiple micropores that communicate with the vacuum adsorption chamber. A vacuum pump applies negative pressure to the vacuum adsorption chamber, thereby extracting air bubbles from between the tape and the electronic product during the tape lamination process. The surface of the venting roller also has an annular groove to accommodate excess tape edges, preventing tape misalignment during lamination.
[0010] Compared with existing technologies, the high-efficiency bonding device for electronic tapes provided by this utility model can quickly fix electronic products and prevent product displacement during the bonding process by setting a positioning groove and a magnetic adsorption device on the support platform; by setting an elastic bonding layer and a lead screw transmission assembly driven by a stepper motor in the pressing mechanism, it can achieve uniform bonding and improve bonding efficiency; by setting a guide wheel group and a cutting blade in the feeding assembly, it can accurately control the conveying length of the tape and achieve automatic cutting; by setting a tension wheel and an adjusting screw in the tension adjustment module, it can flexibly adjust the tension of the tape as needed; and by setting an exhaust roller and a vacuum adsorption chamber in the exhaust assembly, it can effectively remove air bubbles and ensure bonding quality.
[0011] Furthermore, each module of this invention adopts a modular design, facilitating disassembly and maintenance. Simultaneously, by adjusting the positions of the limiting baffle and tensioning wheel, it can accommodate different sizes and types of tape, significantly improving the applicability of the device. This invention solves the problems of low bonding efficiency, uneven bonding, and air bubble residue in existing technologies through the aforementioned specific technical means, possessing high practical value and promotional significance. Attached Figure Description
[0012] Figure 1 This is a schematic diagram of the overall structure of the present invention, showing the main components of the device and their layout, including a support platform, a pressing mechanism, a feeding assembly, a tension adjustment module, and an exhaust assembly.
[0013] Figure 2 This is a magnified view of a portion of the support platform, highlighting the structural details of the positioning groove, magnetic adsorption device, and detachable limiting baffle.
[0014] Figure 3 This is a schematic diagram of the pressing mechanism, showing the connection method and working principle of the pressing head, elastic bonding layer, stepper motor and lead screw drive assembly.
[0015] Figure 4This diagram illustrates the coordination between the feeding assembly and the tension adjustment module, detailing the arrangement and functional implementation of the tape roll, guide wheel assembly, cutting blade, and tension wheel.
[0016] Figure 5 This is a cross-sectional structural diagram of the exhaust assembly, showing the design features of the exhaust roller, micropores, annular grooves, and vacuum adsorption chamber, as well as the principle of bubble discharge.
[0017] The attached figures are labeled as follows:
[0018] 1. Supporting platform; 2. Positioning groove; 3. Magnetic adsorption device; 4. Limiting baffle; 5. Pressing mechanism; 6. Pressing head; 7. Elastic bonding layer; 8. Stepper motor; 9. Screw drive assembly; 10. Feeding assembly; 11. Belt roll; 12. Guide wheel assembly; 13. Cutting blade; 14. Tension adjustment module; 15. Tensioning wheel; 16. Adjusting screw; 17. Exhaust assembly; 18. Exhaust roller; 19. Vacuum adsorption chamber. Detailed Implementation
[0019] This utility model provides a practical device for efficient bonding of electronic tapes, the structure of which is as follows: Figure 1 As shown, the assembly includes a support platform 1, a pressing mechanism 5, a feeding assembly 10, a tension adjustment module 14, and an exhaust assembly 17. These components work together through a reasonable layout and connection to achieve efficient tape bonding.
[0020] The support platform 1 is the basic part of the device, and it is equipped with a positioning groove 2 for placing the electronic product to be bonded. A magnetic adsorption device 3 is embedded in the positioning groove 2. The magnetic adsorption device 3 consists of a permanent magnet and a flexible protective layer covering its surface. The flexible protective layer is made of silicone, which prevents scratches on the surface of the electronic product and enhances adsorption stability. Removable limiting baffles 4 are provided around the support platform 1, and the limiting baffles 4 are fixed to the support platform 1 by threaded connections. The limiting baffles 4 can be flexibly adjusted according to the size of the electronic product, thus adapting to products of different specifications. This design makes the support platform 1 more stable when fixing the product, preventing displacement during the bonding process.
[0021] The pressing mechanism 5 is movably mounted on the base and connected to the base via a slide rail, allowing it to move linearly along the slide rail to approach or move away from the support platform 1. The pressing mechanism 5 includes a pressing head 6 and a drive unit. The pressing head 6 is hinged to the drive unit, allowing it to swing within a certain angle range. An elastic bonding layer 7, made of polyurethane material, is located at the bottom of the pressing head 6, providing flexibility and wear resistance, and ensuring uniform pressure distribution during the pressing process. The drive unit includes a stepper motor 8 and a lead screw drive assembly 9. The stepper motor 8 is connected to the lead screw drive assembly 9 via a coupling, and the slider of the lead screw drive assembly 9 is fixedly connected to the pressing head 6. When the stepper motor 8 rotates forward or reverse, it drives the slider of the lead screw drive assembly 9 to move along the slide rail, thereby pushing the pressing head 6 closer to or away from the support platform 1. This structure ensures that the pressing head 6 can precisely control the pressure and position during the pressing process.
[0022] A feeding assembly 10 is fixedly mounted on one side of the base for storing and conveying the conveyor belt. The feeding assembly 10 includes a conveyor belt reel 11, a guide roller assembly 12, and a cutting blade 13. The conveyor belt reel 11 is mounted on the base via bearings and can rotate freely to release the conveyor belt. The guide roller assembly 12 includes multiple guide rollers, which are fixed to the base via brackets, and the axis of each guide roller is perpendicular to the conveying direction of the conveyor belt. The function of the guide roller assembly 12 is to guide the conveyor belt along a predetermined path, ensuring smooth conveying. The cutting blade 13 is mounted at the end of the guide roller assembly 12 via a spring return mechanism. When the conveyor belt reaches a specified length, the cutting blade 13 is driven downwards by an electromagnet to cut the conveyor belt. This design achieves automatic conveying and precise cutting of the conveyor belt, improving work efficiency.
[0023] The tension adjustment module 14 is located between the feeding assembly 10 and the pressing mechanism 5, and is used to control the tension of the conveyor belt and ensure its smooth conveying. The tension adjustment module 14 includes a tension wheel 15 and an adjusting screw 16. The tension wheel 15 is mounted on one end of the adjusting screw 16 via a bearing, and the adjusting screw 16 is fixed to the base via a threaded connection. Rotating the adjusting screw 16 changes the position of the tension wheel 15, thereby adjusting the tension of the conveyor belt. The outer surface of the tension wheel 15 is provided with an anti-slip coating made of polytetrafluoroethylene (PTFE), which reduces friction between the conveyor belt and the tension wheel 15, while improving the tensioning effect. This design ensures that the conveyor belt maintains appropriate tension during conveying, preventing slackness or breakage.
[0024] An air venting assembly 17 is disposed within the pressing mechanism 5 to remove air bubbles during the tape lamination process. The air venting assembly 17 includes an air venting roller 18 and a vacuum adsorption chamber 19. The air venting roller 18 is mounted on the bottom of the pressing head 6 via a rotating shaft, with both ends of the shaft connected to the pressing head 6 via bearings, allowing the air venting roller 18 to rotate freely. The surface of the air venting roller 18 has multiple micropores that communicate with the vacuum adsorption chamber 19. A vacuum pump applies negative pressure to the vacuum adsorption chamber 19, thereby extracting air bubbles from between the tape and the electronic product during the tape lamination process. The surface of the air venting roller 18 also has an annular groove to accommodate excess tape edges, preventing tape misalignment during lamination. This design effectively solves the problem of air bubble residue during lamination and improves lamination quality.
[0025] In actual operation, the electronic product to be bonded is first placed in the positioning groove 2 of the support platform 1 and fixed using the magnetic adsorption device 3 and the limiting baffle 4. Then, the feeding assembly 10 is activated, and the tape is released from the tape reel 11 and guided to the pressing mechanism 5 via the guide wheel assembly 12. During tape feeding, the tension of the tape is adjusted by the tension adjustment module 14 to ensure smooth feeding. When the tape reaches the specified length, the cutting blade 13 cuts the tape under the drive of an electromagnet. Next, the pressing mechanism 5 is activated, and the stepper motor 8 drives the slider of the lead screw transmission assembly 9 to move along the slide rail, pushing the pressing head 6 closer to the support platform 1. The elastic bonding layer 7 at the bottom of the pressing head 6 contacts the tape, applying pressure evenly to complete the bonding process. During this process, the exhaust roller 18 of the exhaust assembly 17 extracts air bubbles through the vacuum adsorption chamber 19 to ensure bonding quality.
[0026] Each module of this invention adopts a modular design, facilitating disassembly and maintenance. By adjusting the positions of the limiting baffle 4 and the tensioning wheel 15, it can accommodate different sizes and types of tapes, significantly improving the applicability of the device. This design not only solves the problems of low bonding efficiency, uneven bonding, and air bubble residue in existing technologies, but also has high practical value and promotional significance.
[0027] To enable those skilled in the art to fully understand and implement this utility model, the specific implementation principle of this utility model is further explained below in conjunction with a specific application scenario.
[0028] First, the electronic product to be bonded is placed in the positioning slot 2 of the support platform 1. During this process, the magnetic adsorption device 3 generates a magnetic field through its embedded permanent magnet. A flexible protective layer covers the surface of the permanent magnet to prevent scratches on the product surface and enhances adsorption stability. Then, according to the actual size of the electronic product, the positions of the limiting baffles 4 around the support platform 1 are adjusted to ensure a tight fit with the product edges. The limiting baffles 4 are fixed to the support platform 1 via threaded connections, ensuring that the product does not shift during the bonding process. This design achieves rapid and stable fixation of the electronic product.
[0029] The feeding assembly 10 is then activated, releasing the conveyor belt from the belt reel 11 and guiding it through the guide wheel assembly 12 to the pressing mechanism 5. Multiple guide wheels in the guide wheel assembly 12 are fixed to the base by brackets, with the axis of each guide wheel perpendicular to the conveyor belt direction, ensuring smooth movement of the belt along a predetermined path. When the belt reaches the designated length, the cutting blade 13 is driven downwards by an electromagnet to cut the belt. The spring return mechanism of the cutting blade 13 automatically resets after cutting, preparing for the next operation. This process achieves automatic conveying and precise cutting of the conveyor belt, significantly improving work efficiency.
[0030] During belt conveying, the tension adjustment module 14 adjusts the belt tension by rotating the adjusting screw 16 to change the position of the tensioning wheel 15. The anti-slip coating on the outer surface of the tensioning wheel 15 is made of polytetrafluoroethylene (PTFE), which reduces friction between the belt and the tensioning wheel 15 and improves tension. This design ensures that the belt maintains appropriate tension during conveying, preventing slackness or breakage.
[0031] Next, the pressing mechanism 5 is activated. The stepper motor 8 drives the slider of the lead screw transmission assembly 9 to move along the slide rail via a coupling, pushing the pressing head 6 closer to the support platform 1. The elastic bonding layer 7 at the bottom of the pressing head 6 is made of polyurethane material, which is flexible and wear-resistant, and can provide uniform pressure distribution during the bonding process. When the pressing head 6 contacts the tape, the elastic bonding layer 7 applies pressure evenly to complete the bonding process. During this process, the degassing roller 18 of the degassing assembly 17 applies negative pressure to the vacuum adsorption chamber 19 through a vacuum pump, extracting air bubbles from between the tape and the electronic product. The annular groove on the surface of the degassing roller 18 is used to accommodate excess tape edges, preventing the tape from shifting during the bonding process. This design effectively solves the problem of air bubble residue during the bonding process and improves the bonding quality.
[0032] Finally, by adjusting the positions of the limiting baffle 4 and the tensioning wheel 15, this device can adapt to different sizes and types of tape. This modular design not only facilitates disassembly and maintenance but also significantly improves the device's applicability. The entire bonding process is completed efficiently through the above steps, solving problems such as low bonding efficiency, uneven bonding, and air bubble residue in existing technologies, thus possessing high practical value and promotional significance.
[0033] All content not described in detail in this specification is prior art known to those skilled in the art, and the parameters of each electrical appliance model are not specifically limited; conventional equipment can be used. Electrical control components not mentioned in this technical solution are prior art and are therefore not shown in the figures, nor will they be described further here.
[0034] The above description is only a preferred embodiment of the present utility model and is not intended to limit the present utility model. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present utility model should be included within the protection scope of the present utility model.
Claims
1. A practical device for high-efficiency bonding of electronic tapes, characterized in that, include: The support platform (1) is fixedly installed on the base and is used to place the electronic products to be bonded; The pressing mechanism (5) is movably mounted on the base, connected to the base via a slide rail, and can move linearly along the slide rail to approach or move away from the bearing platform (1); A feeding assembly (10) is fixedly installed on one side of the base for storing and conveying tape; The tension adjustment module (14) is located between the feeding assembly (10) and the pressing mechanism (5) to control the tension of the tape and ensure its smooth delivery; An air venting assembly (17) is disposed within the pressing mechanism (5) for venting air bubbles during the tape bonding process.
2. The practical device for high-efficiency bonding of electronic tapes as described in claim 1, characterized in that, The bearing platform (1) is provided with a positioning groove (2), and a magnetic adsorption device (3) is embedded in the positioning groove (2). The magnetic adsorption device (3) includes a permanent magnet and a flexible protective layer covering the surface of the permanent magnet. The flexible protective layer is made of silicone material.
3. The practical device for high-efficiency bonding of electronic tapes as described in claim 1, characterized in that, Limiting baffles (4) are provided around the bearing platform (1), and the limiting baffles (4) are fixed to the bearing platform (1) by means of threaded connection.
4. The practical device for high-efficiency bonding of electronic tapes as described in claim 1, characterized in that, The pressing mechanism (5) includes a pressing head (6) and a driving unit. The pressing head (6) is connected to the driving unit by a hinge. An elastic bonding layer (7) is provided at the bottom of the pressing head (6). The elastic bonding layer (7) is made of polyurethane material.
5. The practical device for high-efficiency bonding of electronic tapes as described in claim 4, characterized in that, The drive unit includes a stepper motor (8) and a lead screw drive assembly (9). The stepper motor (8) is connected to the lead screw drive assembly (9) via a coupling. The slider of the lead screw drive assembly (9) is fixedly connected to the pressing head (6).
6. The practical device for high-efficiency bonding of electronic tapes as described in claim 1, characterized in that, The feeding assembly (10) includes a tape roll (11), a guide wheel assembly (12), and a cutting blade (13). The tape roll (11) is mounted on the base by a bearing. The guide wheel assembly (12) includes multiple guide wheels, the axis of which is perpendicular to the conveying direction of the tape. The cutting blade (13) is mounted at the end of the guide wheel assembly (12) by a spring reset mechanism.
7. The practical device for high-efficiency bonding of electronic tapes as described in claim 1, characterized in that, The tension adjustment module (14) includes a tension wheel (15) and an adjustment screw (16). The tension wheel (15) is mounted on one end of the adjustment screw (16) by a bearing. The adjustment screw (16) is fixed to the base by a threaded connection. The outer surface of the tension wheel (15) is provided with an anti-slip coating, which is made of polytetrafluoroethylene material.
8. The practical device for high-efficiency bonding of electronic tapes as described in claim 1, characterized in that, The exhaust assembly (17) includes an exhaust roller (18) and a vacuum adsorption chamber (19). The exhaust roller (18) is mounted on the bottom of the pressing head (6) via a rotating shaft. The surface of the exhaust roller (18) is provided with a plurality of micro-holes, which are connected to the vacuum adsorption chamber (19). The surface of the exhaust roller (18) is also provided with an annular groove.