Stirring device for electroplating bath

By installing a vent valve and vent pipe at the bottom of the electroplating tank, the problems of uneven stirring of the electroplating solution and siphoning phenomenon are solved, achieving uniform mixing of the electroplating solution and protection of the equipment.

CN223936651UActive Publication Date: 2026-02-24JIANG XI XU SHENG DIAN ZI GU FEN YOU XIAN GONG SI
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Patent Information

Application Number
CN202520561031.8
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2025-03-27
Publication Date
2026-02-24
Estimated Expiration
2035-03-27

AI Technical Summary

Technical Problem

The uneven stirring of the electroplating solution in the existing electroplating tank leads to uneven concentration, which affects the uniformity of the coating thickness. Furthermore, when the gas source is turned off, a siphon phenomenon can easily occur, causing equipment damage.

Method used

An electroplating tank stirring device was designed, including a gas supply pipe, a connecting pipe, a gas outlet pipe, and a control device. The gas outlet pipe is laid at the bottom of the electroplating tank and is equipped with a vent valve and a vent pipe. When the gas source is closed, the vent valve opens to connect with the atmosphere. The vent hole is tilted at an angle of 45-60° to ensure the uniform mixing of the electroplating solution and prevent siphoning.

Benefits of technology

It effectively prevents siphoning, avoids damage to the gas source equipment, and improves the mixing uniformity and stirring efficiency of the electroplating solution.

✦ Generated by Eureka AI based on patent content.

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    Figure CN223936651U_ABST
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Abstract

The utility model discloses an electroplating bath stirring device which comprises an air delivery pipe connected with an air source supply device, a connecting pipe connected with the air delivery pipe, an air outlet pipe connected with the connecting pipe and a control device, an air filter is arranged on the air delivery pipe, the air outlet pipe is laid at the bottom of an electroplating bath, and the air filter is arranged on the air outlet pipe. A plurality of air outlet holes are formed in the air outlet pipe, a flow regulating valve is arranged on the connecting pipe, a vent pipe is connected to the position, higher than the liquid level of the electroplating liquid, of the connecting pipe, a vent valve is arranged on the vent pipe, and the vent valve is electrically connected with the control device. When the air source is closed, the control device controls the vent valve to be opened. The electroplating bath stirring device provided by the utility model can effectively prevent siphonage when an air source is closed.
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Description

Technical Field

[0001] This utility model relates to the field of electroplating equipment technology, specifically to an electroplating tank stirring device. Background Technology

[0002] In the circuit board electroplating process, the circuit board to be electroplated is first fixed on an electroplating rack, and then the electroplating rack is placed in the electroplating tank for electroplating. If the electroplating solution in the electroplating tank is not stirred evenly, uneven concentration can easily occur, which will lead to poor electroplating effect and affect the uniformity of the plating thickness.

[0003] In existing technologies, an air agitator is typically used to stir the electroplating solution. The air vent of the agitator is located inside the electroplating tank and below the electroplating solution. When the agitator stops working, the air supply is shut off, and the electroplating solution in the electroplating tank will flow back into the air supply equipment due to siphoning, causing damage to the air supply equipment.

[0004] Therefore, it is necessary to provide a new stirring device to solve the above-mentioned technical problems. Utility Model Content

[0005] The technical problem to be solved by this utility model is to provide an electroplating tank stirring device that can effectively prevent siphoning when the gas source is shut off.

[0006] The technical solution of this utility model is as follows:

[0007] An electroplating tank stirring device includes an air supply pipe connected to an air source supply device, a connecting pipe connected to the air supply pipe, an air outlet pipe connected to the connecting pipe, and a control device. The air supply pipe is equipped with an air filter. The air outlet pipe is laid at the bottom of the electroplating tank and has several air outlet holes. The connecting pipe is equipped with a flow regulating valve, and a vent pipe is connected to the connecting pipe at a position above the electroplating solution level. The vent pipe is equipped with a vent valve, which is electrically connected to the control device. When the air source is shut off, the control device controls the vent valve to open, and the vent pipe is connected to the atmosphere.

[0008] Furthermore, the vent pipe includes multiple branch pipes arranged in parallel, and each branch pipe has two vent holes.

[0009] Furthermore, the airflow direction of the vent is inclined, with an angle of 45-60° with the inclination of the bottom surface of the electroplating tank, and the airflow direction of the two rows of vents on each branch pipe is located in the first quadrant and the second quadrant, respectively.

[0010] Compared with the prior art, the electroplating tank stirring device provided by this utility model has the following advantages:

[0011] I. The electroplating tank stirring device provided by this utility model has a vent pipe installed above the liquid surface of the connecting pipe, and a vent valve installed on the vent pipe. When the gas source is closed, the control device controls the vent valve to open, so that the connecting pipe is connected to the atmosphere, which can effectively prevent siphoning and avoid damage to the gas source equipment.

[0012] II. The electroplating tank stirring device provided by this utility model includes multiple parallel branch pipes, each with two rows of air holes, which can improve stirring efficiency. In particular, when the airflow direction of the two rows of air holes on each branch pipe is located in the first quadrant and the second quadrant respectively, and the inclination angle with the bottom surface of the electroplating tank is 45-60°, the mixing uniformity of the electroplating solution can be fully guaranteed. Attached Figure Description

[0013] To more clearly illustrate the technical solutions in the embodiments of this utility model, the drawings used in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0014] Figure 1 This is a schematic diagram of the electroplating tank stirring device of this utility model;

[0015] Figure 2 yes Figure 1 A schematic diagram showing the distribution of the vent pipes in the electroplating tank stirring device;

[0016] Figure 3 yes Figure 2 The diagram shows the structure of the branch pipe in the air outlet pipe. Detailed Implementation

[0017] To enable those skilled in the art to better understand the technical solutions in the embodiments of this utility model, and to make the above-mentioned objectives, features and advantages of this utility model more apparent and understandable, the specific embodiments of this utility model will be further described below in conjunction with the accompanying drawings.

[0018] It should be noted that the descriptions of these embodiments are for the purpose of aiding understanding of the present invention, but do not constitute a limitation thereof. Furthermore, the technical features involved in the various embodiments of the present invention described below can be combined with each other as long as they do not conflict with each other.

[0019] Please refer to the following: Figures 1 to 3 ,in Figure 1 This is a schematic diagram of the electroplating tank stirring device of this utility model. Figure 2 yes Figure 1 A schematic diagram showing the distribution of the vent pipes in the electroplating tank stirring device; Figure 3 yes Figure 2 The diagram shows the structure of the branch pipe in the air outlet pipe. The electroplating tank stirring device of this invention includes an air supply pipe 2 connected to an air source supply device 1, a connecting pipe 3 connected to the air supply pipe 2, an air outlet pipe 4 connected to the connecting pipe 3, and a control device (not shown). The connecting pipe 3 connects the air supply pipe 2 and the air outlet pipe 4. The air outlet pipe 4 is located at the bottom of the electroplating tank 10 and has an air outlet hole. By supplying air into the electroplating tank, the airflow is used to stir the electroplating solution. In this invention, the air source supply device 1 is a compressed air supply device, including a compressed air storage tank.

[0020] An air filter 5 is installed on the air supply pipe 2 to filter the compressed air entering the electroplating tank, removing moisture and impurities, so that the airflow entering the electroplating solution does not change the concentration and quality of the electroplating solution.

[0021] Air supply pipe 2 serves as the main pipe. Corresponding connecting pipes 3 are installed according to the number of electroplating tanks, ensuring that each electroplating tank corresponds to at least one connecting pipe. Each connecting pipe 3 is equipped with a flow regulating valve 6 to adjust the air flow rate for the corresponding electroplating tank. The specific flow rate can be determined based on parameters such as the electroplating solution level and the size of the electroplating tank.

[0022] In this invention, a vent pipe 7 is connected to the connecting pipe 3 above the surface of the electroplating solution. A vent valve 8 is installed on the vent pipe 7 and is electrically connected to the control device. During electroplating solution stirring, compressed air is delivered to the outlet pipe via the connecting pipe, at which point the vent valve is closed. When the air source equipment is shut off, the control device opens the vent valve 8, connecting the vent pipe 7 to the atmosphere. This prevents siphoning and avoids damage to the air source equipment.

[0023] In this embodiment, the vent pipe 4 includes multiple parallel branch pipes 41, each branch pipe having two rows of vent holes 42 to increase the flow rate of the stirring airflow and improve stirring efficiency. Preferably, the airflow direction of the vent holes 42 is inclined, with an angle of 45-60° to the inclination of the bottom surface of the electroplating tank, and the airflow directions of the two rows of vent holes on each branch pipe are located in the first quadrant and the second quadrant, respectively. That is, the airflow directions of the two rows of vent holes are different, spraying the airflow from different directions, which can increase the fluidity of the electroplating solution, thereby improving its mixing uniformity.

[0024] Compared with the prior art, the electroplating tank stirring device provided by this utility model has the following advantages:

[0025] I. The electroplating tank stirring device provided by this utility model has a vent pipe installed above the liquid surface of the connecting pipe, and a vent valve installed on the vent pipe. When the gas source is closed, the control device controls the vent valve to open, so that the connecting pipe is connected to the atmosphere, which can effectively prevent siphoning and avoid damage to the gas source equipment.

[0026] II. The electroplating tank stirring device provided by this utility model includes multiple parallel branch pipes, each with two rows of air holes, which can improve stirring efficiency. In particular, when the airflow direction of the two rows of air holes on each branch pipe is located in the first quadrant and the second quadrant respectively, and the inclination angle with the bottom surface of the electroplating tank is 45-60°, the mixing uniformity of the electroplating solution can be fully guaranteed.

[0027] The embodiments of this utility model have been described in detail above with reference to the accompanying drawings, but this utility model is not limited to the described embodiments. For those skilled in the art, various changes, modifications, substitutions, and variations made to these embodiments without departing from the principles and spirit of this utility model still fall within the protection scope of this utility model.

Claims

1. A stirring device for an electroplating tank, characterized in that, The device includes an air supply pipe connected to an air source supply device, a connecting pipe connected to the air supply pipe, an air outlet pipe connected to the connecting pipe, and a control device. The air supply pipe is equipped with an air filter. The air outlet pipe is laid at the bottom of the electroplating tank and has several air outlet holes. The connecting pipe is equipped with a flow regulating valve, and a vent pipe is connected to the connecting pipe at a position higher than the surface of the electroplating solution. The vent pipe is equipped with a vent valve, and the vent valve is electrically connected to the control device. When the air source is turned off, the control device controls the vent valve to open, and the vent pipe is connected to the atmosphere.

2. The electroplating tank stirring device according to claim 1, characterized in that, The vent pipe includes multiple branch pipes arranged in parallel, and each branch pipe has two rows of vent holes.

3. The electroplating tank stirring device according to claim 2, characterized in that, The airflow direction of the vent is inclined, with an angle of 45-60° with the inclination of the bottom surface of the electroplating tank, and the airflow direction of the two rows of vents on each branch pipe is located in the first quadrant and the second quadrant, respectively.