Jig for detecting etching uniformity of PCB (Printed Circuit Board)

Abstract

The utility model provides a jig for detecting PCB etching uniformity, and belongs to the technical field of PCBs. The jig for detecting the etching uniformity of the PCB comprises a jig body and a plurality of clamping modules, the clamping modules are arranged on the jig body, the clamping modules are used for limiting a test piece in the jig body, and the jig for detecting the etching uniformity of the PCB is used for detecting the etching uniformity of the PCB through a weighing method. The precision of a weighing balance can reach 0.1 mg, the precision is high, and a traditional copper thickness measuring method is influenced by the precision of a copper thickness measuring instrument and the operation of measuring personnel, the data error is large, and the reference is low; the weighing method mainly focuses on the weight change of a sample, the sensitivity to the roughness of copper on the surface of the sample, an oxide layer and other factors is relatively low, and a copper thickness measuring instrument generally adopts an optical or electrical principle measuring instrument and is possibly influenced by the surface state of the sample, so that the measuring result has deviation, namely is not influenced by the surface state.

Description

Technical Field

[0001] This utility model relates to the field of PCB technology, specifically to a fixture for detecting the uniformity of PCB etching. Background Technology

[0002] Etching is a critical process in PCB manufacturing. However, during etching, various factors such as the concentration of the etching solution, temperature, spray pressure, and etching time can easily lead to uneven copper thickness etching, affecting line width accuracy and electrical performance. For example, uneven etching may result in some areas of the circuit having insufficient copper thickness, leading to increased resistance and affecting signal transmission; while other areas may have excessively thick copper, potentially reducing the spacing between lines and increasing the risk of short circuits. Traditional methods for testing copper thickness etching uniformity mainly involve etching a copper-clad laminate and then using a copper thickness measuring instrument to measure a large amount of copper thickness data to obtain copper thickness distribution data and calculate etching uniformity. However, this method can be affected by factors such as the accuracy of the copper thickness measuring instrument, the selection of measurement points, and the operator's operation, leading to significant errors in the measurement results.

[0003] In existing technologies, measuring instruments are used to measure the width of the etched lines as a method to detect the uniformity of PCB etching. For example, publication number CN110719697A uses AOI (Automated Optical Inspection) to measure the width of the etched lines to determine the uniformity of etching. However, this method still has the following drawbacks in practical use:

[0004] 1. The testing process is lengthy and costly. The test board needs to complete a series of processes, including pretreatment, film application, exposure, development, etching, and film removal, before measurements can begin.

[0005] 2. Test results may be affected by other factors such as exposure uniformity, development uniformity, and the accuracy of measurement equipment, resulting in inaccurate final etching uniformity data.

[0006] In summary, to more accurately and effectively evaluate PCB etching uniformity, a fixture is designed for PCB etching uniformity detection. Utility Model Content

[0007] In view of this, the problem to be solved by this utility model is to provide a fixture for detecting the uniformity of PCB etching.

[0008] To solve the above-mentioned technical problems, the technical solution adopted by this utility model is: a fixture for detecting the uniformity of PCB etching, including a fixture body and a clamping module. The clamping module is disposed on the fixture body, and a plurality of clamping modules are disposed thereon. The clamping modules are disposed to limit the test piece within the fixture body.

[0009] In one embodiment of this application, the fixture body is a copper-clad substrate, and the thickness of the fixture body is 1.0-1.5 mm.

[0010] In one embodiment of this application, a through hole is provided on the fixture body, and the clamping module is disposed in the through hole.

[0011] In one embodiment of this application, the clamping module includes a first limiting block and a second limiting block, both of which are fixed within the through hole and are offset from each other.

[0012] In one embodiment of this application, a test piece is disposed between the first limiting block and the second limiting block, and the size of the test piece is the same as the size of the through hole.

[0013] In one embodiment of this application, the test piece includes a single-sided copper-clad laminate, a copper foil, and a core board, wherein the copper foil is disposed on top of the single-sided copper-clad laminate, and the core board is disposed below the single-sided copper-clad laminate.

[0014] The advantages and positive effects of this utility model are:

[0015] (1) By weighing, the accuracy of the weighing balance can reach 0.1mg, which is highly accurate. The traditional method of measuring copper thickness is affected by the accuracy of the copper thickness measuring instrument and the operation of the measuring personnel, resulting in large data errors and low reference value.

[0016] (2) The jig body 110 is simple to manufacture. It only requires the edge trimming machine to mill out the required shape according to the design. The jig body 110 can be reused, which means it is simple to manufacture.

[0017] (3) It can be applied to the etching uniformity detection of pre-processing lines with small etching amount, thinning copper lines and differential etching lines with medium etching amount, and DES (Developing-Etching-Stripping) lines with large etching amount, that is, it has a wide range of applications.

[0018] (4) The weighing method mainly focuses on the weight change of the sample and is relatively less sensitive to factors such as the roughness of the copper surface and the oxide layer. Copper thickness measuring instruments generally use optical or electrical principles, which may be affected by the surface condition of the sample, resulting in deviations in the measurement results. Attached Figure Description

[0019] The accompanying drawings are provided to further illustrate the present invention and form part of the specification. They are used together with the embodiments of the present invention to explain the present invention, but do not constitute a limitation thereof. In the drawings:

[0020] Figure 1 This is an overall structural diagram of a fixture for detecting the uniformity of PCB etching according to this utility model;

[0021] Figure 2 This is a diagram showing the relationship between the fixture body and the clamping module of this utility model;

[0022] Figure 3 This is a cross-sectional view of the fixture body of this utility model;

[0023] Figure 4 This is a three-dimensional structural diagram of the test piece of this utility model.

[0024] In the figure: 110, fixture body; 120, through hole; 130, clamping module; 131, first limiting block; 132, second limiting block; 140, test piece; 141, single-sided copper clad laminate; 142, copper foil; 143, core board. Detailed Implementation

[0025] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0026] It should be noted that when a component is described as "fixed to" another component, it can be directly on the other component or may have a component in between. When a component is considered "connected to" another component, it can be directly connected to the other component or may have a component in between. When a component is considered "set on" another component, it can be directly set on the other component or may have a component in between. The terms "vertical," "horizontal," "left," "right," and similar expressions used in this document are for illustrative purposes only.

[0027] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention pertains. The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. The term "and / or" as used herein includes any and all combinations of one or more of the associated listed items.

[0028] Please see Figures 1-4This application provides a technical solution: a fixture for detecting the uniformity of PCB etching, including a fixture body 110 and clamping modules 130. The clamping modules 130 are disposed on the fixture body 110, and several clamping modules 130 are provided. The clamping modules 130 are used to limit the test piece 140 within the fixture body 110. The fixture body 110 is a copper-clad substrate with a thickness of 1.0-1.5mm. Through holes 120 are formed on the fixture body 110, and the clamping modules 130 are disposed within the through holes 120. A 9-grid pattern is directly applied to the copper-clad substrate of the fixture body 110 using an edge-removing machine. The pattern involves milling out nine clamping modules 130. Each clamping module 130 includes a first limiting block 131 and a second limiting block 132. Both the first limiting block 131 and the second limiting block 132 are fixed within the through hole 120. The first limiting block 131 and the second limiting block 132 are staggered. A test piece 140 is clamped between the first limiting block 131 and the second limiting block 132. The size of the test piece 140 is the same as the size of the through hole 120. The test piece 140 includes a single-sided copper-clad laminate 141, a copper foil 142, and a core board 143. The copper foil 142 is disposed on top of the single-sided copper-clad laminate 141, and the core board 143 is disposed below the single-sided copper-clad laminate 141.

[0029] The working principle and process of this utility model are as follows: In use, a test piece 140 for etching is prepared. The test piece 140 is dried, and its mass before etching is measured using a balance method, accurate to 0.1 mg. The test piece 140 is slightly bent and inserted between the first limiting block 131 and the second limiting block 132, thus fixing and restricting the test piece 140 within the fixture body 110, with the copper surface of the test piece 140 facing upwards. After the fixture body 110 passes through the etching equipment, the test piece 140 is removed from the fixture. After the main body 110 is removed, dried, and weighed, the mass of the etched test piece 140 is recorded. The difference in mass of the test piece 140 before and after etching can be used to calculate the etching amount and uniformity of the sprayed material on the etching equipment. Similarly, the fixture main body 110, which holds the test piece 140, is flipped so that the copper side of the test piece 140 faces down. After passing through the etching equipment, the test piece 140 is removed from the fixture main body 110, dried, and weighed. The mass of the etched test piece is recorded. The difference in mass of the test piece before and after etching can be used to calculate the etching amount and uniformity of the sprayed material on the etching equipment. The etching amount and etching uniformity of the sprayed etching equipment are calculated. The fixture used to detect the PCB etching uniformity uses a weighing method, and the accuracy of the weighing balance can reach 0.1mg, which is highly accurate. Traditional copper thickness measurement methods are affected by the accuracy of the copper thickness measuring instrument and the operation of the measuring personnel, resulting in large data errors and low reference value. The fixture body 110 is simple to manufacture, requiring only the edge trimming machine to mill out the required pattern according to the design. Moreover, the fixture body 110 is reusable, which means it is simple to manufacture. It can be applied to the etching uniformity detection of pre-processing lines with small etching amounts, thinning copper lines and differential etching lines with medium etching amounts, and DES (Developing-Etching-Stripping) lines with large etching amounts, which means it has a wide range of applications. The weighing method mainly focuses on the weight change of the sample and has relatively low sensitivity to factors such as the roughness of the copper surface and the oxide layer. Copper thickness measuring instruments generally use optical or electrical principles and may be affected by the surface condition of the sample, which may lead to deviations in the measurement results. In other words, it is not affected by the surface condition.

[0030] The embodiments of this utility model have been described in detail above, but the content described is only a preferred embodiment of this utility model and should not be considered as limiting the scope of implementation of this utility model. All equivalent changes and improvements made within the scope of this utility model should still fall within the scope of this patent.

Claims

1. A fixture for detecting the uniformity of PCB etching, characterized in that, It includes a fixture body (110) and a clamping module (130). The clamping module (130) is disposed on the fixture body (110). There are several clamping modules (130). The clamping modules (130) are used to limit the test piece (140) within the fixture body (110).

2. The fixture for detecting PCB etching uniformity according to claim 1, characterized in that, The fixture body (110) is a copper-clad substrate, and the thickness of the fixture body (110) is 1.0-1.5mm.

3. The fixture for detecting PCB etching uniformity according to claim 1, characterized in that, The fixture body (110) has a through hole (120), and the clamping module (130) is disposed in the through hole (120).

4. A fixture for detecting PCB etching uniformity according to claim 3, characterized in that, The clamping module (130) includes a first limiting block (131) and a second limiting block (132). The first limiting block (131) and the second limiting block (132) are both fixed in the through hole (120) and are offset from each other.

5. A fixture for detecting PCB etching uniformity according to claim 4, characterized in that, A test piece (140) is engaged between the first limiting block (131) and the second limiting block (132), and the size of the test piece (140) is the same as the size of the through hole (120).

6. A fixture for detecting PCB etching uniformity according to claim 5, characterized in that, The test piece (140) includes a single-sided copper clad laminate (141), a copper foil (142), and a core board (143). The copper foil (142) is disposed on the top of the single-sided copper clad laminate (141), and the core board (143) is disposed on the bottom of the single-sided copper clad laminate (141).

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