Split type infrared temperature measuring device

Abstract

The utility model relates to a split type infrared temperature measuring device which comprises an infrared temperature measuring sensing auxiliary board module, an infrared temperature measuring sensing main board module and an MCU core board module, the infrared temperature measuring sensing auxiliary board module comprises a first infrared temperature measuring sensor, and the MCU core board module comprises a second infrared temperature measuring sensor. The infrared temperature measurement sensing main board module comprises a second infrared temperature measurement sensor and an MCU used for algorithm processing, the MCU core board module comprises an MCU used for algorithm output and display, and the infrared temperature measurement sensing auxiliary board module, the infrared temperature measurement sensing main board module and the MCU core board module are communicated and electrically connected through an IIC. And the first infrared temperature measurement sensor and the second infrared temperature measurement sensor are respectively arranged on the range hood and are over against the left cooking range and the right cooking range. The temperature measuring device adopts a split type design, is respectively arranged right above the left cooking range and the right cooking range and is vertical to a heat source, so that the temperature measuring precision is improved. When the infrared temperature measuring sensor is damaged, a single infrared temperature measuring sensor can be replaced.

Description

Technical Field

[0001] This utility model relates to the field of kitchen utensil manufacturing technology, and in particular to a split-type infrared temperature measuring device. Background Technology

[0002] As people's living standards continue to improve, they are paying more and more attention to their home environment and indoor air quality. In order to improve kitchen ventilation and remove cooking fumes and exhaust gases, range hoods have become an indispensable household appliance in the kitchen.

[0003] The range hood uses infrared temperature measurement of the burners on the stove to automatically control the on / off state and fan speed based on the cooking conditions. The accuracy of the infrared temperature measurement serves as feedback for the system, and it determines the stability and reliability of the range hood's on / off state and fan speed control. Therefore, infrared temperature measurement is particularly important in the entire system.

[0004] Currently, high-end kitchen appliances on the market include infrared temperature measuring range hoods and temperature measuring cooktops. Range hoods can obtain the temperature data inside the pot through infrared temperature measurement, and then use software algorithms to analyze the scene model to automatically control the range hood, such as automatic on / off and automatic switching of gears. Temperature measuring cooktops control the heat level by testing the temperature inside the pot, and perform automatic cooking functions.

[0005] Its main drawback is:

[0006] (1) This type of temperature measurement module is usually designed as a dual-probe structure, which is set in a plastic shell structure. If it is damaged, the entire module needs to be replaced, which increases the maintenance cost. (2) Due to the high integration of this type of design, the module is mostly installed in the middle or above the stove. When the infrared temperature probe is irradiated, it is not perpendicular to the heat source, which will also lead to inaccurate temperature measurement and affect the automatic control function of the product. Summary of the Invention

[0007] The purpose of this invention is to provide a split-type infrared temperature measurement device to solve the problems mentioned in the background art.

[0008] To solve the above-mentioned technical problems, this utility model is achieved through the following technical measures: a split-type infrared temperature measurement device, comprising an infrared temperature sensing sub-board module, an infrared temperature sensing main board module, and an MCU core board module. The infrared temperature sensing sub-board module includes a first infrared temperature sensor, the infrared temperature sensing main board module includes a second infrared temperature sensor and an MCU for algorithm processing, and the MCU core board module includes an MCU for algorithm output and display. The infrared temperature sensing sub-board module, the infrared temperature sensing main board module, and the MCU core board module communicate and are electrically connected via IIC. The first infrared temperature sensor and the second infrared temperature sensor are respectively installed on the range hood, facing the left and right burners.

[0009] Compared with existing technologies, the advantages of this invention are: the temperature measuring device adopts a split design, installed directly above the left and right burners respectively, perpendicular to the heat source, thus improving temperature measurement accuracy. If damaged, a single infrared temperature sensor can be replaced.

[0010] As an improvement of this utility model, the first infrared temperature sensor is provided with an infrared filter. The purpose of this design is to effectively improve the installation reliability of the filter, protect the downstream sensor, filter out other stray infrared light, ensure that the energy received by the sensor is useful infrared energy, and improve the overall reliability and stability of the sensor.

[0011] As an improvement of this invention, the peak wavelength of the filter is 5.5µm. The purpose of this design is that this wavelength band is well-suited for detecting flames, high-temperature objects, and smoke.

[0012] As an improvement to this invention, the first infrared temperature sensor is installed inside the plastic housing. The purpose of this design is to prevent oil and residual liquid from adhering to the sensor body, thus ensuring temperature measurement accuracy.

[0013] As an improvement of this utility model, a sensor cover is provided behind the first infrared temperature sensor. The purpose of this design is to protect the sensor from external forces and other complex environmental influences.

[0014] As an improvement to this invention, the second infrared temperature sensor has the same structure as the first infrared temperature sensor. The purpose of this design is to achieve an aesthetically pleasing and symmetrical appearance.

[0015] As an improvement of this utility model, a glue groove for placing an infrared filter is provided inside the plastic shell. The purpose of this design is that the glue groove is a concave cavity. After squeezing in glue and then placing the infrared filter, this embedded structure improves the bonding stability of the filter. Attached Figure Description

[0016] The accompanying drawings, which form part of this utility model, are used to provide a further understanding of this utility model. The illustrative embodiments of this utility model and their descriptions are used to explain this utility model and do not constitute an improper limitation of this utility model.

[0017] In the attached diagram:

[0018] Figure 1 This is a schematic diagram of the working process of the temperature measuring device described in this utility model.

[0019] Figure 2 This is a schematic diagram illustrating the working principle of the temperature measuring device described in this utility model.

[0020] Figure 3 This is a schematic diagram of the structure of the two infrared temperature sensors described in this utility model installed on the stove.

[0021] Figure 4 This is a schematic diagram illustrating the operation of the temperature measuring device described in this utility model.

[0022] Figure 5 This is a schematic diagram of the sensor after installation according to this utility model.

[0023] Explanation of reference numerals in the attached diagram: 1. Infrared temperature sensor sub-board module; 2. Infrared temperature sensor main board module; 3. MCU core board module; 4. Glue tray; 6. Second infrared temperature sensor; 7. Sensor cover plate; 8. First infrared temperature sensor; 9. Infrared filter; 10. Plastic shell; 11. Range hood; 12. Left burner; 13. Right burner. Detailed Implementation

[0024] The preferred embodiments of the present invention will be described below with reference to the accompanying drawings. It should be understood that the preferred embodiments described herein are for illustration and explanation only and are not intended to limit the present invention.

[0025] Example 1

[0026] Please refer to Figure 1 -5.

[0027] This embodiment provides a split-type infrared temperature measurement device, including an infrared temperature sensing sub-board module 1, an infrared temperature sensing main board module 2, and an MCU core board module 3. The infrared temperature sensing sub-board module 1 includes a first infrared temperature sensor 8. The infrared temperature sensing main board module 2 includes a second infrared temperature sensor 6 and an MCU for algorithm processing. The MCU core board module 3 includes an MCU for algorithm output and display. The infrared temperature sensing sub-board module 1, the infrared temperature sensing main board module 2, and the MCU core board module 3 communicate and are electrically connected via IIC. The first infrared temperature sensor 8 and the second infrared temperature sensor 6 are respectively installed on the range hood 11, facing the left burner 12 and the right burner 13.

[0028] In the embodiments of this utility model application, please refer to Figure 5 The first infrared temperature sensor 8 is equipped with an infrared filter 9. This effectively improves the installation reliability of the filter, protects the downstream sensor, and filters out other stray infrared light, ensuring that the energy received by the sensor is useful infrared energy, thereby improving the overall reliability and stability of the sensor.

[0029] Furthermore, the peak wavelength of the filter is 5.5µm. This wavelength is well-suited for detecting flames, high-temperature objects, and smoke.

[0030] Furthermore, the first infrared temperature sensor 8 is installed inside the plastic housing 10. This prevents oil and residual liquid from adhering to the sensor body and ensures accurate temperature measurement.

[0031] Furthermore, a sensor cover plate 7 is provided behind the first infrared temperature sensor 8 to protect the sensor from external forces and other complex environmental influences.

[0032] Furthermore, the second infrared temperature sensor 6 has the same structure as the first infrared temperature sensor 8, so that the overall appearance is aesthetically pleasing and symmetrical after installation.

[0033] Furthermore, the plastic shell 10 is provided with an adhesive groove 4 for placing the infrared filter 9. The adhesive groove 4 is a concave cavity. After the adhesive is squeezed in and the infrared filter 9 is placed in, this embedded structure improves the bonding stability of the filter.

[0034] In the embodiments of this utility model application, please refer to Figure 3 This temperature measuring device adopts a split modular design, installed directly above the stove, perpendicular to the heat source when irradiating the burner head, thus improving temperature measurement accuracy. The device uses a digital infrared temperature sensor connected via a two-wire communication method and consists of three modules, such as... Figure 1As shown, the infrared temperature sensing sub-board module 1 mainly consists of a first infrared temperature sensor 8. The infrared temperature sensing sub-board module 1 communicates with the infrared temperature sensing main board module 2 via IIC. The infrared temperature sensing main board module 2 contains a second infrared temperature sensor 6 and an MCU for algorithm processing. The MCU core board module 3 is connected to the infrared temperature sensing main board module 2 via communication. The MCU core board module 3 mainly performs algorithmic control output on the temperature data and can output corresponding temperature data.

[0035] In the embodiments of this utility model application, please refer to Figure 2 The diagram shows the detailed working principle of the temperature measuring device. The entire device includes an infrared temperature sensing sub-board module 1, an infrared temperature sensing main board module 2, and an MCU core board module 3. Infrared energy enters the thermopile through an infrared filter 9. The filter has a peak wavelength of 5.5µm, effectively filtering out ambient light interference. The infrared energy then enters the thermopile chip, which converts the infrared energy into a voltage signal and sends it to the subsequent ADC chip for sampling. The ADC chip converts the analog signal into a digital signal and sends it to the MCU in the infrared temperature sensing main board module 2 for temperature calculation. The MCU in the infrared temperature sensing main board module 2 summarizes the temperature data and sends it to the subsequent MCU core board module 3 for algorithm output and display. The entire power supply is provided externally by the MCU core board module 3 and connected in series to each sensor module.

[0036] In the embodiments of this utility model application, please refer to Figure 4 This is a schematic diagram of the operation of the temperature measuring device, which is related to... Figure 2 The working principle diagrams of the temperature measuring devices are essentially the same. The MCU core board module 3 is the display unit and algorithm control unit of the device, used to collect temperature data from the infrared temperature sensing main board module 2 and the infrared temperature sensing sub-board module 1 and display the current status of the device, including temperature and current electrical operating status output. The infrared temperature sensing main board module 2 and the MCU core board module 3 are connected by a wiring harness, and the power supply is provided by the MCU core board module 3. The infrared temperature sensing main board module 2 and the infrared temperature sensing sub-board module 1 are connected by a wiring harness. The infrared temperature sensing main board module 2 integrates an MCU, which summarizes the sensor temperature data from the infrared temperature sensing main board module 2 and the infrared temperature sensing sub-board module 1 and performs response algorithms.

[0037] The advantages of this invention are as follows: The temperature measuring device adopts a split design, installed directly above the left burner 12 and the right burner 13 respectively, perpendicular to the heat source, thus improving temperature measurement accuracy. In case of damage, a single infrared temperature sensor can be replaced. Furthermore, the infrared filter 9 of the sensor module is embedded, improving the stability of the infrared filter 9's adhesion.

[0038] In the description of this utility model, it should be noted that the terms "vertical", "up", "down", "horizontal", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this utility model.

[0039] In the description of this utility model, it should also be noted that, unless otherwise explicitly specified and limited, the terms "set," "install," "connect," and "link" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model according to the specific circumstances.

[0040] Finally, it should be noted that the above description is merely a preferred embodiment of this utility model and is not intended to limit the utility model. Although the utility model has been described in detail with reference to the foregoing embodiments, those skilled in the art can still modify the technical solutions described in the foregoing embodiments or make equivalent substitutions for some of the technical features. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of this utility model should be included within the protection scope of this utility model.

Claims

1. A split-type infrared temperature measuring device, characterized in that: The system includes an infrared temperature sensing sub-board module (1), an infrared temperature sensing main board module (2), and an MCU core board module (3). The infrared temperature sensing sub-board module (1) includes a first infrared temperature sensor (8). The infrared temperature sensing main board module (2) includes a second infrared temperature sensor (6) and an MCU for algorithm processing. The MCU core board module (3) includes an MCU for algorithm output and display. The infrared temperature sensing sub-board module (1), the infrared temperature sensing main board module (2), and the MCU core board module (3) communicate and are electrically connected through IIC. The first infrared temperature sensor (8) and the second infrared temperature sensor (6) are respectively installed on the range hood (11) and face the left burner (12) and the right burner (13).

2. The split-type infrared temperature measuring device according to claim 1, characterized in that: The first infrared temperature sensor (8) is equipped with an infrared filter (9).

3. The split-type infrared temperature measuring device according to claim 2, characterized in that: The peak wavelength of the filter is 5.5µm.

4. The split-type infrared temperature measuring device according to claim 1, characterized in that: The first infrared temperature sensor (8) is installed inside the plastic shell (10).

5. The split-type infrared temperature measuring device according to claim 1, characterized in that: A sensor cover plate (7) is provided behind the first infrared temperature sensor (8).

6. The split-type infrared temperature measuring device according to claim 1, characterized in that: The second infrared temperature sensor (6) has the same structure as the first infrared temperature sensor (8).

7. The split-type infrared temperature measuring device according to claim 4, characterized in that: The plastic shell part (10) is provided with a glue tank (4) for placing an infrared filter (9).

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