Three-frequency microstrip combiner with power division network
By designing a tri-frequency microstrip combiner with a power splitter network, using a dielectric substrate and copper cladding, and setting low-frequency, medium-frequency, and high-frequency splitters, the problem of large size and high cost of existing combiners is solved, achieving miniaturization and low cost compatibility with 2G, 3G, and 4G networks.
Patent Information
- Application Number
- CN202520621608.X
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-04-03
- Publication Date
- 2026-02-24
- Estimated Expiration
- 2035-04-03
AI Technical Summary
Existing multi-frequency combiners use a metal cavity structure, which is bulky, inconvenient to install, and expensive, and is difficult to efficiently support 2G, 3G and 4G networks.
Design a tri-frequency microstrip combiner with a power splitter network. It uses a dielectric substrate and copper cladding to set low-frequency, medium-frequency and high-frequency splitters. Signal splitting is achieved through microstrip circuits. The tri-frequency combining technology is used to reduce the size and production cost of the combiner.
It achieves miniaturization and cost reduction of the combiner, while being highly compatible with 2G, 3G and 4G networks, with good performance, low VSWR, low insertion loss and high inter-frequency isolation.
Smart Images
Figure CN223941991U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to the field of electronic device technology, and in particular to a three-frequency microstrip combiner with a power divider network. Background Technology
[0002] A multi-frequency combiner is a passive device composed of multiple filters. Its main function is to combine signals from multiple sources into a single output signal in a distributed system, thereby reducing the number and complexity of cables in the system. The working principle of a multi-frequency combiner is to input two or more signal sources to different ports of the combiner, and then combine them into a single output port.
[0003] Multi-frequency combiners have wide applications in various fields such as wireless communication, satellite communication, broadcasting, radar, and antenna systems. In wireless communication systems, multi-frequency combiners can combine signals from different frequency bands and transmit or receive them through a single antenna, thereby achieving efficient utilization of spectrum resources. Furthermore, they can reduce the cost and complexity of radio communication systems, and accelerate the construction of communication networks.
[0004] In the existing technology, conventional multi-frequency combiners adopt a metal cavity structure, which is large in size, inconvenient to install, and expensive, and is difficult to efficiently support 2G, 3G and 4G networks. Utility Model Content
[0005] Therefore, the purpose of this utility model is to provide a three-frequency microstrip combiner with a power splitting network to overcome the shortcomings of the prior art.
[0006] This utility model provides a three-frequency microstrip combiner with a power splitter network, comprising:
[0007] A dielectric substrate, wherein a port is provided on the dielectric substrate;
[0008] A copper cladding layer is disposed on the lower surface of the dielectric substrate;
[0009] A microstrip circuit is disposed on the upper surface of the dielectric substrate and electrically connected to the port. The microstrip circuit includes a low-frequency branch, an intermediate-frequency branch, and a high-frequency branch. The high-frequency branch is connected to the port and the intermediate-frequency circuit, respectively, and the intermediate-frequency circuit is connected to the low-frequency circuit.
[0010] The signal is input to the high-frequency branch via the port, and then branched to the medium-frequency branch and the low-frequency branch via the high-frequency branch.
[0011] Compared with the prior art, the beneficial effects of this utility model are: by setting up a microstrip network composed of low-frequency branch, medium-frequency branch and high-frequency branch, it can meet the needs of tri-frequency combined antenna, and the tri-frequency combined makes the size of the combiner smaller, effectively reducing the cost of producing the combiner.
[0012] Furthermore, the frequency of the high-frequency branch is 3300MHz-3700MHz.
[0013] Furthermore, the high-frequency branch includes a first open-circuit stub, a second open-circuit stub, a third open-circuit stub, a first short-circuit stub, and a second short-circuit stub. The first open-circuit stub is connected to the first short-circuit stub, the second short-circuit stub, and the second open-circuit stub, respectively. One end of the second open-circuit stub is connected to the third open-circuit stub.
[0014] Furthermore, the frequency of the intermediate frequency branch is 1710MHz-2675MHz.
[0015] Furthermore, the intermediate frequency branch includes a fourth open-circuit stub, a fifth open-circuit stub, and a sixth open-circuit stub, wherein the fourth open-circuit stub is connected to the sixth open-circuit stub through the fifth open-circuit stub.
[0016] Furthermore, the frequency of the low-frequency branch is 806MHz-960MHz.
[0017] Furthermore, the low-frequency branch includes a seventh open-circuit stub, an eighth open-circuit stub, a ninth open-circuit stub, and a power divider network. The seventh open-circuit stub is disposed on the upper surface of the dielectric substrate, and the seventh open-circuit stub is sequentially connected to the eighth open-circuit stub, the ninth open-circuit stub, and the power divider network.
[0018] Furthermore, the ninth open branch is sequentially connected to the tenth open branch, the eleventh open branch, the twelfth open branch, and the thirteenth open branch. Attached Figure Description
[0019] Figure 1 This is a front view of the three-frequency microstrip combiner with a power splitter network in an embodiment of this utility model;
[0020] Figure 2 This is a schematic diagram of the back of the three-frequency microstrip combiner with a power splitter network in an embodiment of this utility model;
[0021] Figure 3 This is a schematic diagram of the working process of the three-frequency microstrip combiner with power splitting network in the embodiment of this utility model.
[0022] Explanation of key component symbols:
[0023] 1. Dielectric substrate; 11. Copper cladding layer; 10. Port;
[0024] 2. High-frequency branch; 20. High-frequency input port; 21. First short-circuit stub; 22. First open-circuit stub; 23. Second short-circuit stub; 24. Second open-circuit stub; 25. Third open-circuit stub;
[0025] 3. Intermediate frequency branch; 30. Intermediate frequency input port; 31. Fourth open-circuit branch; 32. Fifth open-circuit branch; 33. Sixth open-circuit branch;
[0026] 4. Low-frequency branch; 40. Low-frequency input port; 41. Tenth open branch; 42. Eleventh open branch; 43. Twelfth open branch; 44. Thirteenth open branch; 45. Seventh open branch; 46. Eighth open branch; 47. Ninth open branch; 48. Power divider network;
[0027] 51. First low-pass filter; 52. Second low-pass filter;
[0028] 61. First high-pass filter; 62. Second high-pass filter.
[0029] The following detailed description, in conjunction with the accompanying drawings, will further illustrate this utility model. Detailed Implementation
[0030] To facilitate understanding of this utility model, a more complete description will be given below with reference to the accompanying drawings. Several embodiments of this utility model are shown in the drawings. However, this utility model can be implemented in many different forms and is not limited to the embodiments described herein. Rather, these embodiments are provided so that the disclosure of this utility model will be more thorough and complete.
[0031] It should be noted that when a component is said to be "fixed to" another component, it can be directly on the other component or there may be an intervening component. When a component is said to be "connected to" another component, it can be directly connected to the other component or there may be an intervening component. The terms "vertical," "horizontal," "left," "right," and similar expressions used in this document are for illustrative purposes only.
[0032] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention pertains. The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. The term "and / or" as used herein includes any and all combinations of one or more of the associated listed items.
[0033] Please see Figures 1 to 2The diagram shows a three-frequency microstrip combiner with a power divider network in an embodiment of this utility model, comprising a dielectric substrate 1, a copper cladding layer 11, and a microstrip circuit.
[0034] The dielectric substrate 1 has a port 10, the copper cladding layer 11 is disposed on the lower surface of the dielectric substrate 1, and the microstrip circuit is disposed on the upper surface of the dielectric substrate 1 and electrically connected to the port 10. The microstrip circuit includes a low-frequency branch 4, an intermediate-frequency branch 3, and a high-frequency branch 2. The high-frequency branch 2 is connected to the port 10 and the intermediate-frequency circuit, respectively. The intermediate-frequency circuit is connected to the low-frequency circuit. The signal is input to the high-frequency branch 2 through the port 10 and then branched to the intermediate-frequency branch 3 and the low-frequency branch 4 through the high-frequency branch 2.
[0035] Furthermore, the frequency of the high-frequency branch 2 is 3300MHz-3700MHz, the frequency of the intermediate frequency branch 3 is 1710MHz-2675MHz, and the frequency of the low-frequency branch 4 is 806MHz-960MHz.
[0036] Specifically, in this embodiment, the high-frequency branch 2 includes a first open-circuit stub 22, a second open-circuit stub 24, a third open-circuit stub 25, a first short-circuit stub 21, and a second short-circuit stub 23. The first open-circuit stub 22 is connected to the first short-circuit stub 21, the second short-circuit stub 23, and the second open-circuit stub 24, respectively. One end of the second open-circuit stub 24 is connected to the third open-circuit stub 25. The intermediate-frequency branch 3 includes a fourth open-circuit stub 31, a fifth open-circuit stub 32, and a sixth open-circuit stub 33. The fourth open-circuit stub 31 is connected to the... The fifth open-circuit stub 32 is connected to the sixth open-circuit stub 33. The low-frequency branch 4 includes a seventh open-circuit stub 45, an eighth open-circuit stub 46, a ninth open-circuit stub 47, and a power divider network 48. The seventh open-circuit stub 45 is disposed on the upper surface of the dielectric substrate 1. The seventh open-circuit stub 45 is sequentially connected to the eighth open-circuit stub 46, the ninth open-circuit stub 47, and the power divider network 48. The ninth open-circuit stub 47 is sequentially connected to the tenth open-circuit stub 41, the eleventh open-circuit stub 42, the twelfth open-circuit stub 43, and the thirteenth open-circuit stub 44.
[0037] It should be noted that in specific implementation, the signal is input through port 10, and the high-frequency branch 2 is a separate channel. The high-frequency branch 2 includes a first open-circuit stub 22, a second open-circuit stub 24, a third open-circuit stub 25, a first short-circuit stub 21, and a second short-circuit stub 23. The mid- and low-frequency signals are first combined and then split. During the combination, the signal sequentially passes through the tenth open-circuit stub 41, the eleventh open-circuit stub 42, the twelfth open-circuit stub 43, and the thirteenth open-circuit stub 44, and then splits into the mid-frequency branch 3 and the low-frequency branch 4. In this embodiment, the power splitter network 48 is a quarter-wavelength impedance matching conversion section. The specific workflow is as follows: Figure 3 As shown, the signal is input to the first low-pass filter 51 and the first high-pass filter 61 through the ports respectively. After passing through the first low-pass filter 51, it is input to the second low-pass filter 52 and the second high-pass filter 62 respectively. The low-frequency power divider network of the second low-pass filter 52 is input to the low-frequency input port 40. The intermediate frequency power divider network of the second high-pass filter 62 is input to the intermediate frequency input port 30. The high-frequency power divider network of the first high-pass filter 61 is input to the high-frequency input port 20.
[0038] Furthermore, it's worth noting that the tri-band microstrip combiner with power-sharing network is 138mm long, 52mm wide, and 0.762mm thick, making it small and low-cost. Moreover, because it employs a separate 3.5G channel, with 2G and 1G channels combined and then split, it exhibits excellent performance. The combiner has a low VSWR, low insertion loss, and inter-frequency isolation <-25dB. It is highly compatible with 2G, 3G, and 4G networks.
[0039] In summary, the tri-frequency microstrip combiner with a power splitter network in the above embodiments of this utility model can meet the requirements of tri-frequency combining antennas by setting up a low-frequency splitter 4, an intermediate-frequency splitter 3 and a high-frequency splitter 2 to form a microstrip network. Furthermore, the tri-frequency combining makes the combiner smaller in size and effectively reduces the cost of producing the combiner.
[0040] In the description of this specification, the references to terms such as "one embodiment," "some embodiments," "example," "specific example," or "some examples," etc., indicate that a specific feature, structure, material, or characteristic described in connection with that embodiment or example is included in at least one embodiment or example of the present invention. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples.
[0041] The embodiments described above are merely illustrative of several implementations of this utility model, and while the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of this utility model patent. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of this utility model, and these all fall within the protection scope of this utility model. Therefore, the protection scope of this utility model patent should be determined by the appended claims.
Claims
1. A three-frequency microstrip combiner with a power divider network, characterized in that, include: A dielectric substrate, wherein a port is provided on the dielectric substrate; A copper cladding layer is disposed on the lower surface of the dielectric substrate; A microstrip circuit is disposed on the upper surface of the dielectric substrate and electrically connected to the port. The microstrip circuit includes a low-frequency branch, an intermediate-frequency branch, and a high-frequency branch. The high-frequency branch is connected to the port and the intermediate-frequency branch, respectively, and the intermediate-frequency branch is connected to the low-frequency branch. The signal is input to the high-frequency branch via the port, and then branched to the medium-frequency branch and the low-frequency branch via the high-frequency branch.
2. The three-frequency microstrip combiner with power splitter network according to claim 1, characterized in that, The frequency of the high-frequency branch is 3300MHz-3700MHz.
3. The three-frequency microstrip combiner with power splitter network according to claim 2, characterized in that, The high-frequency branch includes a first open-circuit stub, a second open-circuit stub, a third open-circuit stub, a first short-circuit stub, and a second short-circuit stub. The first open-circuit stub is connected to the first short-circuit stub, the second short-circuit stub, and the second open-circuit stub, respectively. One end of the second open-circuit stub is connected to the third open-circuit stub.
4. The three-frequency microstrip combiner with power splitter network according to claim 1, characterized in that, The frequency of the intermediate frequency branch is 1710MHz-2675MHz.
5. The three-frequency microstrip combiner with power splitter network according to claim 4, characterized in that, The intermediate frequency branch includes a fourth open branch, a fifth open branch, and a sixth open branch, with the fourth open branch connected to the sixth open branch through the fifth open branch.
6. The three-frequency microstrip combiner with power splitter network according to claim 1, characterized in that, The frequency of the low-frequency branch is 806MHz-960MHz.
7. The three-frequency microstrip combiner with power splitter network according to claim 6, characterized in that, The low-frequency branch includes a seventh open-circuit stub, an eighth open-circuit stub, a ninth open-circuit stub, and a power divider network. The seventh open-circuit stub is disposed on the upper surface of the dielectric substrate and is sequentially connected to the eighth open-circuit stub, the ninth open-circuit stub, and the power divider network.
8. The three-frequency microstrip combiner with power splitter network according to claim 7, characterized in that, The ninth open branch is connected in sequence to the tenth open branch, the eleventh open branch, the twelfth open branch, and the thirteenth open branch.