5G Red Cap module with built-in SIM card
The 5G Red Cap module with a built-in SIM card solves the connection problem of wired networks in mobile environments, achieving stable wireless network connection and SIM card protection, and improving the flexibility and reliability of the system.
Patent Information
- Application Number
- CN202520501558.1
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-03-20
- Publication Date
- 2026-02-24
- Estimated Expiration
- 2035-03-20
AI Technical Summary
Wired networks may face issues such as loss of network connectivity or the need for rewiring after leaving the server rack, limiting flexibility and convenience.
Design a 5G Red Cap module with a built-in SIM card. By integrating a 5G communication module, a SIM module, and an RF circuit, wireless network connectivity is achieved. TVS diodes, capacitors, inductors, and other components in the RF circuit protect the SIM card and the circuit, while an antenna enables signal transmission.
It achieves stable connection in wireless network environment, protects SIM card from electrostatic discharge and power surge damage, extends device life, and improves system stability and reliability.
Smart Images

Figure CN223942841U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to the field of communication technology, and in particular to a 5G Red Cap module with a built-in SIM card. Background Technology
[0002] 5G Red Cap (reduced-capability, Red Cap) is a lightweight 5G terminal. 5G Red Cap inherits many excellent features of 5G NR, such as high bandwidth, low latency, high reliability, service guarantee, data not leaving the factory, low power consumption, strong coverage and many other advantages. It can be introduced as needed for different application scenarios.
[0003] With the rapid development of cloud product applications, information technology has deeply penetrated all aspects of society. People increasingly rely on the network for communication in their daily work and life, resulting in a continuous increase in network data volume. Typically, general-purpose servers use wired networks for communication connections and data transmission. However, once outside the server rack, problems may arise such as the lack of available network connections or the need for large-scale rewiring and replacement of network cables. Utility Model Content
[0004] The main purpose of this invention is to propose a 5G Red Cap module with a built-in SIM card, which aims to solve the limitations of wired network applications.
[0005] To achieve the above objectives, this utility model proposes a 5G Red Cap module with a built-in SIM card, comprising an M.2 standard gold finger, a 5G communication module, a SIM module, and an RF circuit. The 5G communication module is connected to the gold finger, the SIM module, and the RF circuit. The 5G communication module is used to provide 5G communication connectivity. The gold finger is used to acquire the PCIe signal transmitted by the transmitter of the 5G communication module. The SIM module is used to enable the 5G communication module to connect to the network by providing authentication information.
[0006] In one embodiment, the RF circuit includes a first resistor, a MOSFET, an LED, and a second resistor. One end of the first resistor is connected to a digital signal, the other end of the first resistor is connected to the gate of the MOSFET, the drain of the MOSFET is connected to the LED, the source of the MOSFET is grounded, the LED is connected to one end of the second resistor, and the other end of the second resistor is connected to a power supply voltage.
[0007] In one embodiment, the SIM module includes a SIM card and a card slot, the card slot being connected to the 5G module, and the SIM card being inserted into the card slot.
[0008] In one embodiment, the SIM module further includes a plurality of first TVS diodes, which are connected to the SIM card.
[0009] In one embodiment, the RF circuit includes a first capacitor, a second capacitor, a third capacitor, and a fourth capacitor. The first capacitor and the second capacitor are connected in series, and the third capacitor and the fourth capacitor are connected in parallel. One end of the first capacitor is connected to the gold finger, and the other end of the first capacitor is connected to one end of the second capacitor and one end of the third capacitor, respectively. The other end of the second capacitor is connected to one end of the fourth capacitor.
[0010] In one embodiment, the RF circuit further includes an inductor connected in parallel with the third capacitor and the fourth capacitor, respectively.
[0011] In one embodiment, the RF circuit further includes a second TVS diode connected in parallel with the inductor.
[0012] In one embodiment, the RF circuit further includes an antenna, the gold finger is provided with an antenna interface, and the antenna is connected to the antenna interface.
[0013] In one embodiment, the output structure of the antenna is an antenna clip.
[0014] This invention enables wireless network applications by connecting a 5G communication module to a gold finger, a SIM module, and an RF circuit. The 5G communication module provides 5G network connectivity through the RF circuit, the gold finger receives the PCIE signal transmitted by the transmitter of the 5G communication module, and the SIM module enables the 5G communication module to connect to the network by providing authentication information. Attached Figure Description
[0015] To more clearly illustrate the technical solutions in the embodiments of this utility model or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on the structures shown in these drawings without creative effort.
[0016] Figure 1 This is a schematic diagram of a 5G Red Cap module.
[0017] Figure 2 This is the circuit diagram for the gold finger.
[0018] Figure 3 This is a circuit diagram for a 5G communication module.
[0019] Figure 4This is an RF circuit diagram;
[0020] Figure 5 This is an RF circuit diagram;
[0021] Figure 6 This is the circuit diagram for the SIM module.
[0022] Explanation of icon numbers:
[0023] 1-Gold finger, 2-5G communication module, 3-SIM module, 4-RF circuit, R43-first resistor, Q1-MOS transistor, R26-second resistor, C12-first capacitor, C13-second capacitor, C14-third capacitor, C15-fourth capacitor, WL1-inductor, D1-second TVS diode, ANT1-antenna.
[0024] The realization of the purpose, functional features and advantages of this utility model will be further explained in conjunction with the embodiments and with reference to the accompanying drawings. Detailed Implementation
[0025] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.
[0026] It should be noted that if the embodiments of this utility model involve directional indicators (such as up, down, left, right, front, back, etc.), the directional indicators are only used to explain the relative positional relationship and movement of the components in a certain specific posture (as shown in the figure). If the specific posture changes, the directional indicators will also change accordingly.
[0027] Furthermore, if the embodiments of this utility model involve descriptions such as "first" or "second," these descriptions are for descriptive purposes only and should not be construed as indicating or implying their relative importance or implicitly specifying the number of technical features indicated. Therefore, features defined with "first" or "second" may explicitly or implicitly include at least one of those features. Additionally, if the word "and / or" appears throughout the text, it means including three parallel solutions; for example, "A and / or B" includes solution A, solution B, or a solution that simultaneously satisfies A and B. Furthermore, the technical solutions of the various embodiments can be combined with each other, but this must be based on the ability of those skilled in the art to implement them. When the combination of technical solutions is contradictory or impossible to implement, it should be considered that such a combination of technical solutions does not exist and is not within the scope of protection claimed by this utility model.
[0028] This utility model proposes a 5G Red Cap module with a built-in SIM card.
[0029] In the embodiments of this utility model, such as Figure 1 , Figure 2 , Figure 3 As shown, the 5G Red Cap module with a built-in SIM card includes an M.2 specification gold finger 1, a 5G communication module 2, a SIM module 3, and an RF circuit 4. The 5G communication module 2 is connected to the gold finger 1, the SIM module 3, and the RF circuit 4. The 5G communication module 2 is used to provide 5G network connectivity through the RF circuit 4. The gold finger 1 is used to acquire the PCIE signal transmitted by the transmitter of the 5G communication module 2. The SIM module 3 is used to enable the 5G communication module 2 to connect to the network by providing authentication information.
[0030] This invention enables wireless network applications by connecting the 5G communication module 2 to the gold finger 1, SIM module 3, and RF circuit 4 respectively.
[0031] Specifically, the RF circuit 4 includes a first resistor R43, a MOSFET Q1, an LED, and a second resistor R26. One end of the first resistor R43 is connected to a digital signal, and the other end of the first resistor R43 is connected to the gate of the MOSFET Q1. The drain of the MOSFET Q1 is connected to the LED, and the source of the MOSFET Q1 is grounded. The LED is connected to one end of the second resistor R26, and the other end of the second resistor R26 is connected to the power supply voltage.
[0032] The first resistor R43 is connected to the ET_STATUS signal, which indicates the network connection status (e.g., whether there is a valid network connection, or whether the connection is normal). MOSFET Q1 is used to control the power supply switching or current regulation. LEDs are used to indicate the operating status of RF circuit 4. For example, a green LED may indicate a normal network connection, while a red or yellow LED indicates a network connection problem. The LEDs are connected to the NET_STATUS signal via a simple circuit to display the device's connection status.
[0033] The SIM module 3 includes a SIM card and a card slot, the card slot being connected to the 5G module, and the SIM card being inserted into the card slot. Figure 4 As shown, the SIM module 3 also includes a plurality of first TVS diodes, which are connected to the SIM card.
[0034] The main function of connecting the first TVS diode in the SIM card circuit is to protect the SIM card from damage caused by transient voltages (such as electrostatic discharge (ESD) and power surges).
[0035] Electrostatic discharge (ESD) is a common electrical phenomenon that can occur during the use of electronic devices, especially in environments with low humidity or high static electricity buildup. When a SIM card is inserted or removed, or comes into contact with an external device, a high-voltage transient current may be generated. Without effective protection, this current can burn out the electronic components inside the SIM card. A first-generation TVS diode can respond to an applied voltage instantaneously (typically on the nanosecond scale) and clamp it to a safe voltage range, thus protecting the SIM card from damage.
[0036] Power surges refer to high-voltage transient signals caused by power fluctuations or changes in mains voltage (such as power switches or lightning). The first TVS diode can effectively absorb these transient voltages, preventing them from entering sensitive circuits (such as SIM cards) and ensuring safe circuit operation. The first TVS diode can also effectively suppress high-voltage pulses that may damage the internal circuitry of the SIM card, reducing potential faults caused by voltage transients and thus improving the stability and reliability of the entire system.
[0037] The first TVS diode has a fast response speed and can suppress the effects of external high-frequency noise or electromagnetic interference (EMI), protecting the SIM card from high-frequency interference and maintaining the stability of the communication signal. The first TVS diode not only protects the SIM card from short-term voltage surges but also reduces long-term circuit damage caused by abnormal voltage, thereby extending the device's lifespan.
[0038] The working principle of the first TVS diode is that when the voltage across its terminals exceeds a certain threshold, the diode will quickly conduct, conducting the instantaneous high voltage to ground through itself, thereby preventing the voltage from propagating further to sensitive circuits. After the voltage returns to normal, the first TVS diode will immediately stop conducting, and the circuit will return to normal operation.
[0039] RF circuit 4 (radio frequency circuit) is a circuit that operates in the frequency range of several kilohertz (kHz) to several hundred gigahertz (GHz) and is commonly used in wireless communication, broadcasting, and other fields. RF circuits are mainly used to process and transmit high-frequency signals. Radio communication, Wi-Fi, Bluetooth, GPS, and mobile communication all require RF circuit 4 to transmit and receive signals. In RF circuit 4, modulation transmits information by changing certain characteristics of the carrier signal (such as frequency, amplitude, or phase). The RF circuit is responsible for modulating the information signal to make it suitable for transmission over a wireless channel. RF circuit 4 is also responsible for demodulating the received modulated signal to recover the original signal content. The matching section of antenna ANT1 in the RF circuit ensures that the RF signal can be transmitted or received efficiently.
[0040] like Figure 5 As shown, the RF circuit 4 includes a first capacitor C12, a second capacitor C13, a third capacitor C14, and a fourth capacitor C15. The first capacitor C12 and the second capacitor C13 are connected in series, and the third capacitor C14 and the fourth capacitor C15 are connected in parallel. One end of the first capacitor C12 is connected to the gold finger 1, and the other end of the first capacitor C12 is connected to one end of the second capacitor C13 and one end of the third capacitor C14, respectively. The other end of the second capacitor C13 is connected to one end of the fourth capacitor C15.
[0041] When the first capacitor C12 and the second capacitor C13 are connected in series, the total capacitance of the series capacitors will be smaller than the value of a single capacitor. If multiple capacitors are connected, the total capacitance will decrease. This is because the equivalent capacitance of a series capacitor is smaller than the capacitance value of any single capacitor. Series capacitors can improve the voltage withstand capability of RF circuit 4 and are used in circuits requiring high voltage withstand, especially in high-voltage filtering and power supply circuits. In series-connected capacitors, charge is distributed across each capacitor, so the voltage across each capacitor will be different, depending on its capacitance value.
[0042] The third capacitor C14 and the fourth capacitor C15 are connected in parallel. The total capacitance of the parallel capacitors is the sum of the individual capacitances. Therefore, increasing the number of parallel capacitors increases the total capacitance of RF circuit 4. Because the total capacitance increases, RF circuit 4 can store more charge. Especially in power supply circuits that require smooth current and stable voltage, providing a larger total capacitance can effectively store more electrical energy. Parallel capacitors can also reduce the total impedance in RF circuit 4. Particularly in AC circuits, parallel capacitors can improve the transmission capability of AC signals and are commonly used in applications such as filtering and decoupling.
[0043] The RF circuit 4 also includes an inductor WL1, which is connected in parallel with the third capacitor C14 and the fourth capacitor C15. Inductor WL1 is used for filtering, matching, and energy storage in the RF circuit 4. Inductor WL1 has impedance to high-frequency signals, effectively filtering out unwanted frequencies. It has lower impedance to low-frequency signals but higher impedance to high-frequency signals, thus filtering out high-frequency noise or unwanted signal components.
[0044] The RF circuit 4 also includes a second TVS diode D1, which is connected in parallel with the inductor WL1. The second TVS diode D1 is primarily used to protect the circuit from transient high-voltage surges, such as lightning strikes, power surges, or electrostatic discharge (ESD). When a transient overvoltage reaches the RF circuit 4, the second TVS diode D1 quickly conducts, diverting the excessive voltage or current to ground, thus protecting sensitive components in the circuit from damage. Its response time is extremely short, absorbing and dissipating high-voltage pulses within nanoseconds. In the RF circuit 4, the second TVS diode D1 is commonly used to protect input and output ports from ESD damage. Electrostatic discharge can originate from operators, the external environment, etc. The second TVS diode D1 conducts during electrostatic discharge, rapidly releasing excess charge. The input and output ports in the RF circuit 4 are typically connected to external devices or the antenna ANT1, making them susceptible to external transient voltage surges. The second TVS diode D1 provides protection at these interfaces.
[0045] The RF circuit 4 also includes an antenna ANT1, and the gold finger 11 is provided with an antenna interface, with the antenna connected to the antenna interface. The RF circuit 4 also includes an antenna ANT1, and the gold finger 11 is provided with an antenna interface, with the antenna ANT1 connected to the antenna interface. The output structure of the antenna is an antenna clip.
[0046] Antenna ANT1 is a key component in the radio frequency circuit used for signal transmission and reception. The function of antenna ANT1 is to transmit electrical signals from the circuit to the air via electromagnetic waves, or to convert electromagnetic waves in the air into electrical signals for use by the circuit. In transmit mode, antenna ANT1 converts the electrical signals in RF circuit 4 into electromagnetic waves, which are then propagated through the air to distant locations. In receive mode, antenna ANT1 receives electromagnetic waves propagating from the air and converts them into electrical signals for processing by the circuit.
[0047] Based on the aforementioned antenna ANT1, the RF circuit also includes antenna ANT2, and antenna ANT2 is a main transceiver antenna ANT2 RF link.
[0048] It should be noted that the 5G communication module 2 described in this utility model is existing technology. The improvement of this utility model does not lie in the technology of this module itself. The 5G communication module 2 is a 5G Red Cap (reduce d-capability, Red Cap), a lightweight 5G terminal that uses a chip of model MT5710-CN. Compared with traditional 5G terminals, the complexity of the 5G Red Cap terminal can be reduced by about 60% after reduction, which greatly reduces the complexity of the terminal. Secondly, the various capabilities and characteristics of 5G Red Cap ensure that it can be smoothly upgraded and introduced based on the existing 5G network. 5G Red Cap continues the various excellent characteristics of 5G NR, such as large bandwidth, low latency, high reliability, service guarantee, data not leaving the factory, low power consumption, strong coverage and many other advantages, and can be introduced as needed for different application scenarios.
[0049] The above description is only an optional embodiment of the present utility model and does not limit the patent scope of the present utility model. All equivalent structural transformations made under the inventive concept of the present utility model using the contents of the present utility model specification and drawings, or direct / indirect applications in other related technical fields, are included within the patent protection scope of the present utility model.
Claims
1. A 5G Red Cap module with a built-in SIM card, characterized in that, The device includes an M.2 standard gold finger, a 5G communication module, a SIM module, and an RF circuit. The 5G communication module is connected to the gold finger, the SIM module, and the RF circuit. The 5G communication module is used to provide 5G communication connectivity. The gold finger is used to acquire the PCIE signal transmitted by the transmitter of the 5G communication module. The SIM module is used to enable the 5G communication module to connect to the network by providing authentication information.
2. The 5G Red Cap module as described in claim 1, characterized in that, The RF circuit includes a first resistor, a MOSFET, an LED, and a second resistor. One end of the first resistor is connected to a digital signal, and the other end of the first resistor is connected to the gate of the MOSFET. The drain of the MOSFET is connected to the LED, and the source of the MOSFET is grounded. The LED is connected to one end of the second resistor, and the other end of the second resistor is connected to the power supply voltage.
3. The 5G Red Cap module as described in claim 1, characterized in that, The SIM module includes a SIM card and a card slot, the card slot is connected to the 5G communication module, and the SIM card is inserted into the card slot.
4. The 5G Red Cap module as described in claim 3, characterized in that, The SIM module also includes a plurality of first TVS diodes, which are connected to the SIM card.
5. The 5G Red Cap module as described in claim 4, characterized in that, The RF circuit includes a first capacitor, a second capacitor, a third capacitor, and a fourth capacitor. The first capacitor and the second capacitor are connected in series, and the third capacitor and the fourth capacitor are connected in parallel. One end of the first capacitor is connected to the gold finger, and the other end of the first capacitor is connected to one end of the second capacitor and one end of the third capacitor, respectively. The other end of the second capacitor is connected to one end of the fourth capacitor.
6. The 5G Red Cap module as described in claim 5, characterized in that, The RF circuit also includes an inductor, which is connected in parallel with the third capacitor and the fourth capacitor, respectively.
7. The 5G Red Cap module as described in claim 6, characterized in that, The RF circuit also includes a second TVS diode, which is connected in parallel with the inductor.
8. The 5G Red Cap module as described in claim 7, characterized in that, The RF circuit also includes an antenna, and the gold finger is provided with an antenna interface, and the antenna is connected to the antenna interface.
9. The 5G Red Cap module as described in claim 8, characterized in that, The output structure of the antenna is an antenna clip.