Barrier jig
By designing a barrier fixture, using aluminum sheets to cover the PCB board and setting retention holes, the problem of POFV hole resin being etched and sinking during plasma etching was solved, achieving good electroplating results for high-grade PCB boards.
Patent Information
- Application Number
- CN202520154805.5
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-01-23
- Publication Date
- 2026-02-24
- Estimated Expiration
- 2035-01-23
AI Technical Summary
During PCB manufacturing, the resin in the POFV holes is etched and sunken during plasma etching, leading to poor soldering after electroplating, especially in high-grade materials.
Design a barrier fixture that covers both sides of the PCB board and provides placement holes on the barrier to expose the working holes and prevent the resin in non-working areas from being etched. Use a material that does not participate in the plasma etching reaction, such as aluminum sheet, as the barrier sheet and fix it with locking components to ensure that the working holes are fully exposed.
It effectively prevents the resin on the surface of the POFV hole from being eroded, prevents sinking, ensures good soldering after electroplating, and is suitable for PCB boards made of high-grade materials.
Smart Images
Figure CN223942920U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to a barrier fixture, belonging to the field of PCB board manufacturing technology. Background Technology
[0002] As PCB design requirements for product quality become increasingly stringent and wiring becomes denser, many products now utilize POFV (plate over filled via).
[0003] In actual processing, after the resin plugging process, the POFV holes are unprotected. When they are then subjected to through-hole plasma etching, the resin on the surface will be eroded and sink, especially for some high-grade materials, where the erosion is greater. Ultimately, the lower limit of the copper surface of the POFV hole will be scrapped after electroplating, which will lead to poor soldering during assembly. Utility Model Content
[0004] The purpose of this invention is to overcome the shortcomings of the prior art and provide a barrier fixture that can shield the PCB board, thereby preventing the resin on the surface of the POFV hole from being eroded and causing it to sink.
[0005] To achieve the above objectives, this utility model employs the following technical solution:
[0006] This utility model provides a barrier fixture, comprising:
[0007] Barrier sections covering both sides of the product;
[0008] The barrier portion has a retention hole; the retention hole is used to communicate with the working hole on the product to form a through hole. This utility model provides space for Plasma operations on the working hole through the retention hole, while also providing shielding for the POFV hole to prevent the resin on the surface of the POFV hole from being eroded and causing it to sink.
[0009] Furthermore, the barrier portion includes two barrier sheets for covering both sides of the product, and each of the two barrier sheets has the retention hole.
[0010] Furthermore, the positions of the retention holes correspond one-to-one with the working holes provided on the workpiece, and the diameter of the retention holes is larger than the diameter of the working holes. This can compensate for errors caused during processing, thereby ensuring that the working holes can be fully exposed through the retention holes.
[0011] Furthermore, the size of the barrier sheet is larger than the size of the article. The barrier sheet can completely cover the article and is easy to fix.
[0012] Furthermore, the barrier sheet is made of aluminum. The barrier sheet is a metal that does not participate in the plasma etching reaction. Therefore, it does not experience wear and tear during plasma processing, allowing the barrier sheet to be used for a long time.
[0013] Furthermore, the edge of the barrier extends outward by at least 1 cm relative to the edge of the article. The 1 cm width completely covers the article while leaving an area for installing the locking element.
[0014] Furthermore, the two barrier plates are detachably secured by a locking member. The locking member can lock the two barrier plates in place, thereby stably clamping the article.
[0015] Furthermore, the edge of the barrier is provided with a mounting hole for mounting the locking element.
[0016] Furthermore, a closure portion is provided around the two barrier pieces, and the closure portion is detachably fixed to the two barrier pieces and surrounds them to form a receiving cavity capable of accommodating the product. The barrier pieces and the closure portion can form a box-like structure, and the product can be placed and removed by snapping the barrier pieces.
[0017] Furthermore, the article is provided with a non-operating hole, which is covered by the barrier sheet.
[0018] Compared with the prior art, the beneficial effects achieved by this utility model are as follows:
[0019] This invention provides a barrier fixture that, by providing barrier portions to cover both sides of a workpiece, and by providing insertion holes on the barrier portions to expose the working space, allows for plasma processing of the work holes on the workpiece while simultaneously shielding and covering the non-working areas. This invention effectively provides shielding protection for non-working areas, preventing the resin on the surface of these areas from being eroded and causing sagging. Attached Figure Description
[0020] Figure 1 This is a schematic diagram of the structure of a barrier fixture provided in Embodiment 1 of this utility model;
[0021] Figure 2 This is a cross-sectional view of a barrier fixture provided in Embodiment 1 of this utility model;
[0022] Figure 3 This is a cross-sectional view of a barrier fixture provided in Embodiment 2 of this utility model;
[0023] In the diagram: 1. Barrier plate; 11. Insertion hole; 12. Mounting hole; 2. PCB board; 21. Working hole; 22. Non-working hole; 3. Enclosure. Detailed Implementation
[0024] The present invention will be further described below with reference to the accompanying drawings. The following embodiments are only used to more clearly illustrate the technical solution of the present invention, and should not be used to limit the scope of protection of the present invention.
[0025] In the description of this utility model, it should be understood that the terms "center," "longitudinal," "lateral," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," and "outer," etc., indicating orientation or positional relationships, are based on the orientation or positional relationships shown in the accompanying drawings and are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this utility model. Furthermore, the terms "first," "second," etc., are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of indicated technical features. Thus, features defined with "first," "second," etc., may explicitly or implicitly include one or more of that feature. In the description of this utility model, unless otherwise stated, "a plurality of" means two or more.
[0026] In the description of this utility model, it should be noted that, unless otherwise explicitly specified and limited, the terms "installation," "connection," and "joining" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model based on the specific circumstances. Example
[0027] This embodiment describes a barrier fixture, including barrier portions covering both sides of a workpiece. In this embodiment, the workpiece is a PCB board 2. The PCB board 2 has working holes 21, and the barrier portions have corresponding placement holes 11. The working holes 21 and placement holes 11 are connected to each other to form through holes. The PCB board 2 also has non-working holes 22, which are covered by the barrier portions. These non-working holes 22 are POFV holes (resin plug holes). During plasma etching, the barrier portions can provide shielding protection for the non-working holes 22, preventing the resin on the surface of the non-working holes 22 from being etched and causing sagging.
[0028] Specifically, such as Figure 1 and Figure 2As shown, the barrier section includes two opposing barrier plates 1, each with a placement hole 11. The size of the barrier plate 1 is larger than that of the PCB board 2. This ensures that the barrier plate 1 can completely cover both sides of the PCB board and facilitates the fixing of the two barrier plates 1.
[0029] For example, the edge of the barrier 1 extends outward by at least 1 cm relative to the edge of the PCB board 2.
[0030] Furthermore, the 1 cm wide edge area of the aforementioned barrier plate 1 can be provided with a mounting hole 12, and the mounting hole 12 is used to install a locking element.
[0031] For example, the number of mounting holes 12 is 2 to 3, and the operator can process them according to specific needs. In this embodiment, the locking component can be a bolt kit. In other embodiments, a locking device such as a latch that can fix the two barrier plates 1 can be used, as long as it can ensure that the two barrier plates 1 can be opened and closed.
[0032] Furthermore, in this embodiment, the retention hole 11 corresponds one-to-one with the working hole 21. Considering the problem of hole misalignment, the diameter of the retention hole 11 is larger than the diameter of the working hole 21, which can compensate for the error generated during the processing, thereby ensuring that the working hole 21 can be fully exposed through the retention hole 11.
[0033] In this embodiment, the material of the barrier sheet 1 is a material that does not participate in the plasma etching reaction. Specifically, aluminum sheet can be used. It should be noted that in other embodiments, the barrier sheet 1 can be made of other materials, such as metal materials, as long as they do not participate in the above-mentioned plasma etching reaction.
[0034] The processing device provided in this embodiment involves the following steps in its application process:
[0035] First, drill POFV holes on PCB board 2, then perform hole plugging to form non-operational holes 22, and then drill operational holes 21 that do not need to be plugged.
[0036] After both non-working holes 22 and working holes 21 are machined, prepare the barrier fixture simultaneously, sandwich the PCB board 2 with the fixture, and then fix it.
[0037] Because the plasma treatment machine is a gas flow type, it requires two-sided isolation. Distinguish between the holes on PCB 2 that require plasma treatment and those that do not. After confirming the coordinates of all holes requiring plasma treatment, set the drilling program for the drilling fixture; then drill the holes on the fixture. Two isolation sheets 1 are grouped together and secured with locking devices. At this point, the isolation fixture is essentially complete.
[0038] Next, open the barrier fixture, and according to the hole position of the barrier plate 1, place the PCB board 2 into the barrier fixture in the corresponding direction. Then close the fixture and fix it before placing it into the plasma machine. Place the remaining products in the same order.
[0039] Then, once the production conditions are confirmed, the operation can proceed.
[0040] The entire operation is now complete. The holes that need to be drilled for plasma have been prepared with sufficient space to allow for gas flow, allowing for normal operation.
[0041] POFV pore areas that do not require plasma treatment are covered by a fixture; during the plasma treatment process, the resin does not participate in the plasma reaction, so it will not be eroded, and there will be no sinking problem caused by plasma erosion. Example
[0042] like Figure 3 As shown, the difference between this embodiment and embodiment 1 is that in this embodiment, a sealing part 3 is provided around the two barrier pieces 1. The sealing part 3 is detachably fixed to the two barrier pieces 1 and surrounds them to form a cavity that can accommodate the PCB board 2. That is, the barrier fixture is made into a box with the four sides closed. In addition, the thickness of the barrier piece 1 and the sealing part 3 in this embodiment is thicker than the thickness of the barrier piece 1 in embodiment 1, so that it has a longer service life. Example
[0043] The difference between this embodiment and Embodiment 1 is that the barrier portion in this embodiment uses a dry film to protect the POFV pores, that is, the barrier portion is a dry film.
[0044] Its application process is as follows:
[0045] First, the PCB board 2 is horizontally cleaned to remove surface oxidation and dust;
[0046] Then, the film is pressed onto the entire board surface using the film pressing line.
[0047] Pattern Exposure: Expose the POFV aperture areas that need to be plasma-treated without light exposure, and expose the POFV aperture areas that do not need to be plasma-treated.
[0048] Development: Through the chemical reaction of the developing solution, the unpolymerized dry film (the pores that require plasma) is developed to form the retention pores 11;
[0049] Plasma operation: Place the remaining PCB boards into the Plasma machine in the same order, and then proceed with the operation after confirming the production conditions.
[0050] Remove adhesive: Peel off the dry film from the entire board surface.
[0051] The entire operation is now complete. The holes that require plasma coating do not have dry film protection, so gas flow is not affected and the operation can proceed normally.
[0052] POFV pore areas that do not require plasma treatment are covered by a dry film; during the plasma treatment process, the resin does not participate in the plasma reaction, so it will not be eroded, and there will be no sinking problem caused by plasma erosion.
[0053] The above description is only a preferred embodiment of the present utility model. It should be noted that for those skilled in the art, several improvements and modifications can be made without departing from the technical principles of the present utility model, and these improvements and modifications should also be considered within the protection scope of the present utility model.
Claims
1. A barrier fixture, characterized in that, include: Barrier sections covering both sides of the product; The barrier portion is provided with a placement hole; The retention hole is used to communicate with the working hole on the product and form a through hole.
2. The barrier fixture according to claim 1, characterized in that, The barrier portion includes two barrier sheets for covering both sides of the product, and each of the two barrier sheets has the retention hole.
3. The barrier fixture according to claim 1, characterized in that, The position of the retention hole corresponds one-to-one with the working hole provided on the product, and the diameter of the retention hole is larger than the diameter of the working hole.
4. The barrier fixture according to claim 2, characterized in that: The size of the barrier sheet is larger than the size of the product.
5. The barrier fixture according to claim 4, characterized in that: The barrier sheet is made of aluminum.
6. The barrier fixture according to claim 2, characterized in that: The edge of the barrier extends outward at least 1 cm relative to the edge of the article.
7. The barrier fixture according to claim 2, characterized in that: The two barrier plates are detachably secured by locking elements.
8. The barrier fixture according to claim 7, characterized in that: The edge of the barrier plate has a mounting hole for mounting the locking element.
9. The barrier fixture according to claim 2, characterized in that: The two barrier sheets are surrounded by a closure portion, which is detachably fixed to the two barrier sheets and encloses them to form a receiving cavity capable of accommodating the product.
10. The barrier fixture according to claim 1, characterized in that: The product is provided with a non-operating hole, which is covered by the barrier portion.