Liquid cooling and air cooling combined heat dissipation radio frequency power supply box body structure

Abstract

The utility model provides a liquid cooling and air cooling combined heat dissipation radio frequency power supply box body structure, which belongs to the technical field of heat dissipation and comprises a box body, a liquid cooling plate assembly and an air cooling plate assembly, the liquid cooling plate assembly and the air cooling plate assembly are arranged in a cavity of the box body, and the liquid cooling plate assembly comprises a substrate and a liquid cooling pipeline laid on the upper surface of the substrate. The air cooling assembly comprises a fan embedded into the front end part of the substrate, and a first partition plate and a second partition plate which are fixed below the substrate and on the upper surface of the bottom plate of the box body; and a front cover plate and a rear cover plate of the box body are provided with heat dissipation holes matched with the fan. The cavity is divided into an upper cavity and a lower cavity through the substrate, the lower cavity is divided into a left cavity and a right cavity through the first partition plate, and the upper cavity, the left cavity and the right cavity form three gas flow channels through cooperation of the two fans and the heat dissipation holes, so that heat dissipation is completed. According to the utility model, liquid cooling and air cooling heat dissipation technologies are combined, heat of the radio frequency power supply power amplifier unit is greatly taken away by utilizing the efficient heat dissipation efficiency of liquid cooling, and the heat is taken away by utilizing the fan and an internal gas flow channel planned by the partition plate, so that the heat dissipation efficiency is improved.

Description

Technical Field

[0001] This utility model belongs to the field of heat dissipation technology, and in particular relates to a radio frequency power supply enclosure structure with liquid cooling and air cooling combination heat dissipation. Background Technology

[0002] Radio frequency (RF) power supplies generate a great deal of heat during operation, which can affect the lifespan of electronic devices. Therefore, thermal management of RF power supplies is a key technology for improving product reliability and lifespan, and a heat dissipation solution that can effectively solve the heat dissipation problem of RF power supplies and improve product reliability is needed. Utility Model Content

[0003] The purpose of this utility model is to provide a liquid-cooled and air-cooled combined heat dissipation radio frequency power supply enclosure structure, including an enclosure, an internal cavity, and a liquid cooling plate assembly and an air cooling assembly inside the cavity.

[0004] The liquid cooling plate assembly includes a substrate and liquid cooling pipes. The liquid cooling pipes are laid on the upper surface of the substrate and attached to the bottom surface of the heat source. The inlet and outlet of the liquid cooling pipes are fixed to the rear cover of the housing through connectors.

[0005] The substrate is fixed in the middle of the box, and the cavity is divided into an upper cavity and a lower cavity through the substrate. The air-cooling component includes a fan, which is embedded in a pre-set groove on the front end face of the substrate, and the front end face of the substrate is located in the middle of the fan.

[0006] Both the front and rear panels of the enclosure are equipped with heat dissipation holes, and the interiors of the upper and lower cavities form airflow channels through fans and heat dissipation holes.

[0007] Furthermore, the air-cooled assembly also includes a partition, which includes a first partition and a second partition. The first partition is fixed to the middle of the bottom surface of the substrate and is set perpendicular to the bottom plate. The lower cavity is divided into a left chamber and a right chamber through the first partition.

[0008] There are two fans, which are respectively embedded in the pre-set slots on the substrate located in the left and right chambers.

[0009] Furthermore, the second partition is attached and fixed to the upper surface of the bottom plate of the box body. The second partition and the first partition are fixed in a T-shape. The left and right ends of the second partition extend into the left chamber and the right chamber respectively, and its tail end is integrally fixed with an inclined plate that allows the gas to flow towards the bottom surface of the substrate.

[0010] Furthermore, a circuit board is fixed on the upper surface of the substrate, and both the circuit board and the upper surface of the substrate are provided with temperature sensors for detecting temperature.

[0011] Compared with the prior art, the beneficial effects of this utility model are mainly reflected in: combining liquid cooling and air cooling technologies, using the high efficiency of liquid cooling to remove a large amount of heat from the RF power amplifier unit, and using fans and partitions to plan internal gas flow channels and remove the heat from the internal circuit board of the RF power supply during operation through internal and external gas circulation, thereby improving the heat dissipation efficiency of the RF power supply. Attached Figure Description

[0012] Figure 1 This is a schematic diagram of the structure of a liquid-cooled and air-cooled combined heat dissipation radio frequency power supply enclosure according to the present invention.

[0013] Figure 2 for Figure 1 A schematic diagram of the explosion structure.

[0014] Figure 3 This is a schematic diagram of the air-cooled heat dissipation path of this utility model.

[0015] Figure 4 This is a schematic diagram of the water-cooling heat dissipation path of this utility model.

[0016] The components include: 1. Housing; 11. Front cover; 12. Rear cover; 13. Left cover; 14. Right cover; 15. Base plate; 21. Base plate; 22. Liquid cooling pipeline; 23. Liquid inlet; 24. Liquid outlet; 31. Fan; 32. First partition; 33. Second partition; 34. Heat dissipation holes; 4. Circuit board; 5. Chip; 6. Temperature sensor. Detailed Implementation

[0017] The following is a more detailed description of the liquid-cooled and air-cooled combined heat dissipation radio frequency power supply enclosure structure of the present invention, with reference to the schematic diagrams. The diagrams illustrate preferred embodiments of the present invention. It should be understood that those skilled in the art can modify the present invention described herein while still achieving the beneficial effects of the present invention. Therefore, the following description should be understood as being of general knowledge to those skilled in the art and is not intended to limit the present invention.

[0018] like Figure 1 and 2 As shown, a liquid-cooled and air-cooled combined heat dissipation RF power supply enclosure structure includes an enclosure 1, inside which a liquid-cooled plate assembly and an air-cooled assembly are arranged. This invention combines liquid cooling and air cooling technologies. The high efficiency of liquid cooling removes a significant amount of heat from the RF power supply's power amplifier unit, while a fan 31 and partitions are used to plan internal airflow channels and circulate the air internally and externally to remove heat from the internal circuit board 4 of the RF power supply during operation, thereby improving the RF power supply's heat dissipation efficiency.

[0019] Specifically, the liquid cooling plate assembly includes a substrate 21, liquid cooling pipes 22, and connectors. The substrate 21 is fixed to the four sides of the housing 1 via its four sides and is located on the upper surface of the housing 1. The substrate 21 has recessed grooves, and the liquid cooling pipes 22 are laid inside the grooves. The inlet 23 and outlet 24 at both ends of the pipes 22 are fixed to the rear cover plate 12 of the housing 1 via connectors, thus communicating with the outside. The liquid cooling pipes 22 are filled with a filling material, which can be water, mineral oil, fluorinated liquid, or silicone oil, depending on the specific requirements.

[0020] refer to Figure 4 This invention fixes a heat source to the upper surface of a liquid cooling pipe 22, thereby allowing a cooler liquid to carry away the higher heat generated by the heat source. The heat source includes a circuit board 4 and a chip 5 fixed to the upper surface of a substrate 21, wherein the circuit board 4 is located above the liquid cooling pipe 22.

[0021] The air-cooled assembly includes a fan 31 and a partition. The number and position of the fan 31 can be adjusted according to the power of the radio frequency power supply. In this invention, the number of the fan 31 and the number of the partition are both two.

[0022] Specifically, two partitions are fixed to the bottom of the base plate 21 in a "T" shape, perpendicular to each other. It should be noted that the cavity formed inside the housing 1 is divided into an upper cavity and a lower cavity by the base plate 21. The two partitions, a first partition 32 and a second partition 33, are both disposed inside the lower cavity. The first partition 32 is vertically fixed to the middle of the upper surface of the bottom plate 15 of the housing 1, parallel to the left cover plate 13 and the right side plate 14 of the housing. The lower cavity is divided into a left chamber and a right chamber by the first partition 32. The second partition 33 is attached to the upper surface of the bottom plate 15 of the housing 1, with its two ends extending into the left and right chambers respectively. An inclined plate extends integrally from the tail of the second partition 33, which guides the flowing gas to the bottom surface of the base plate 21.

[0023] There are two fans 31, both of which are fixed by pre-set slots on the end of the base plate 21 near the front cover plate 11. The two slots are located in the middle of the left chamber and the middle of the right chamber, respectively. When both fans 31 are fixed in the slots, the end face of the base plate 21 is located in the middle of the fans 31. Correspondingly, the front cover plate 11 and the rear cover plate 12 of the housing 1 are provided with mesh-like heat dissipation holes 34. Specifically, the front cover plate 11 has two heat dissipation holes, corresponding to the fans 31. The rear cover plate 12 has three heat dissipation holes, corresponding to the upper cavity, the left chamber, and the right chamber, respectively.

[0024] refer to Figure 3When the fan 31 is running, it drives the outside cold air to enter the housing 1 through the heat dissipation holes of the front cover 11. The fan 31, together with the substrate 21, blows the cold air into the upper cavity and the lower cavity respectively. The cold air blown into the upper cavity carries away the heat generated by the circuit board 4 and chip 5 on the upper surface of the substrate 21 and flows out through the heat dissipation holes of the rear cover 12, forming a gas flow channel.

[0025] The cold air blown down into the cavity is separated by the first partition 32 and blown into the left and right cavities respectively. It is first blown onto the bottom surface of the substrate 21 through the inclined plate of the second partition 33, taking away the heat on the substrate 21. Finally, it flows out from the heat dissipation holes of the rear cover plate 12, forming a gas flow channel.

[0026] Temperature sensor 6 is also provided on the upper surface of substrate 21 and circuit board 4 to detect temperature. It is connected to chip 5 for intelligent heat dissipation.

[0027] The above are merely preferred embodiments of this utility model and do not constitute any limitation on this utility model. Any equivalent substitutions or modifications made by those skilled in the art to the technical solutions and contents disclosed in this utility model without departing from the scope of the technical solutions of this utility model shall still fall within the protection scope of this utility model.

Claims

1. A liquid-cooled and air-cooled combined heat dissipation radio frequency power supply enclosure structure, characterized in that, The enclosure includes a housing, the interior of which is formed a cavity, and the cavity is equipped with a liquid cooling plate assembly and an air cooling assembly. The liquid cooling plate assembly includes a substrate and liquid cooling pipes. The liquid cooling pipes are laid on the upper surface of the substrate and attached to the bottom surface of the heat source. The inlet and outlet of the liquid cooling pipes are fixed to the rear cover of the housing through connectors. The base plate is fixed in the middle of the housing. The cavity is divided into an upper cavity and a lower cavity by the base plate. The air-cooling component includes a fan. The fan is embedded in a pre-set groove on the front end face of the base plate, and the front end face of the base plate is located in the middle of the fan. The front and rear panels of the housing are provided with heat dissipation holes, and the interiors of the upper and lower cavities are formed by a fan and heat dissipation holes to create airflow channels.

2. The RF power supply enclosure structure with liquid-cooled and air-cooled combined heat dissipation according to claim 1, characterized in that, The air-cooling assembly also includes a partition, which includes a first partition and a second partition. The first partition is fixed to the middle of the bottom surface of the substrate and is perpendicular to the bottom plate. The lower cavity is divided into a left chamber and a right chamber by the first partition. The number of fans is two, and the two fans are respectively embedded in the pre-set grooves of the substrate located in the left chamber and the right chamber.

3. The RF power supply enclosure structure with liquid-cooled and air-cooled combined heat dissipation according to claim 2, characterized in that, The second partition is attached and fixed to the upper surface of the bottom plate of the box body. The second partition and the first partition are fixed in a T-shape. The left and right ends of the second partition extend into the left chamber and the right chamber respectively, and its tail end is integrally fixed with an inclined plate that allows the gas to flow toward the bottom surface of the substrate.

4. The RF power supply enclosure structure with liquid-cooled and air-cooled combined heat dissipation according to claim 1, characterized in that, A circuit board is fixed on the upper surface of the substrate, and both the circuit board and the upper surface of the substrate are provided with temperature sensors for detecting temperature.

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