Packaging structure and electronic equipment

Abstract

The utility model discloses a packaging structure and an electronic device, the disclosed packaging structure comprises a circuit board, a plurality of first heating devices, a plastic packaging part and a heat dissipation film layer, part of the plurality of first heating devices are arranged on a first side of the circuit board, and part of the plurality of first heating devices are arranged on a second side of the circuit board. One part of the first heating devices are arranged on the first side of the circuit board, the other part of the first heating devices are arranged on the second side of the circuit board, the first side of the circuit board is opposite to the second side of the circuit board, and the first heating devices located on the two sides of the circuit board are plastically packaged through the plastic packaging parts; the heat dissipation film layer is arranged on the side, away from the circuit board, of the plastic package part on each side, and the first heating devices are exposed on the surfaces of the corresponding plastic package parts and make contact with the heat dissipation film layer on the corresponding side. According to the scheme, the problem that the heat dissipation effect of a packaging structure in the related technology is poor can be solved.

Description

Technical Field

[0001] This utility model relates to the field of electronic equipment technology, and in particular to a packaging structure and an electronic device. Background Technology

[0002] With the development of System-in-Package (SIP) technology, multiple electronic functions or components are packaged in the same package. While this achieves high integration and miniaturization, it also raises serious heat dissipation issues. Existing SIP packages generate more heat internally, but the heat dissipation area is limited, leading to enhanced thermal coupling and poor heat dissipation performance. Utility Model Content

[0003] This utility model discloses a packaging structure and an electronic device to solve the problem of poor heat dissipation in packaging structures in related technologies.

[0004] To solve the above-mentioned technical problems, this utility model is implemented as follows:

[0005] In a first aspect, this application discloses a packaging structure, which includes a circuit board, a plurality of first heating devices, a molding compound, and a heat dissipation film layer. A portion of the plurality of first heating devices is disposed on a first side of the circuit board, and another portion is disposed on a second side of the circuit board. The first side and the second side of the circuit board are opposite to each other. The first heating devices located on both sides of the circuit board are all encapsulated by the molding compound. Each side of the molding compound facing away from the circuit board has the heat dissipation film layer. The first heating devices are all exposed on the surface of the corresponding molding compound and are in contact with the heat dissipation film layer on the corresponding side.

[0006] Secondly, this application also discloses an electronic device, which includes the packaging structure described in the first aspect.

[0007] The technical solution adopted in this utility model can achieve the following technical effects:

[0008] The packaging structure disclosed in this application distributes a portion of the multiple first heating devices on the first side of the circuit board and another portion on the second side, thereby reducing the distance between the multiple first heating devices and improving heat dissipation. By providing a heat dissipation film layer on the side of the molding portion facing away from the circuit board on both sides, at least a portion of the heat generated by the first heating devices on both sides of the circuit board can be dissipated through the heat dissipation film layer on the corresponding side, thus improving the heat dissipation capacity of the packaging structure. Attached Figure Description

[0009] Figure 1 This is a schematic diagram of the first packaging structure disclosed in the embodiments of this utility model;

[0010] Figure 2 This is a schematic diagram of the second packaging structure disclosed in the embodiments of this utility model.

[0011] Explanation of reference numerals in the attached figures:

[0012] 100 - Circuit board, 200 - First heating element, 300 - Plastic encapsulation, 400 - Heat dissipation film, 500 - First heat dissipation column, 600 - Second heating element, 700 - Second heat dissipation column, 800 - Passive device. Detailed Implementation

[0013] To make the objectives, technical solutions, and advantages of this utility model clearer, the technical solutions of this utility model will be clearly and completely described below in conjunction with specific embodiments and corresponding drawings. Obviously, the described embodiments are only a part of the embodiments of this utility model, and not all of them. Based on the embodiments of this utility model, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this utility model.

[0014] The technical solutions disclosed in the various embodiments of this utility model are described in detail below with reference to the accompanying drawings.

[0015] Please refer to Figure 1 and Figure 2 This utility model discloses a packaging structure, which includes a circuit board 100, a plurality of first heat-generating devices 200, a plastic encapsulation part 300 and a heat dissipation film layer 400.

[0016] The first heating device 200 can be a chip, diode, transistor, or other heating device. This application embodiment does not impose specific restrictions on the type of the first heating device 200.

[0017] Some of the multiple first heating elements 200 are disposed on the first side of the circuit board 100, while others are disposed on the second side of the circuit board 100. The first heating elements 200 are electrically connected to the circuit board 100 to enable signal interaction. The first heating elements 200 can be clipped onto the circuit board 100. The first heating elements 200 can be disposed on the circuit board 100 using a surface mount technology.

[0018] The first side and the second side of the circuit board 100 are opposite to each other. The first heating devices 200 located on both sides of the circuit board 100 are encapsulated by the molding portion 300. Each side of the molding portion 300 facing away from the circuit board 100 is provided with a heat dissipation film layer 400. The first heating devices 200 are exposed on the surface of the corresponding molding portion 300 and are in contact with the heat dissipation film layer 400 on the corresponding side. At least part of the heat generated by the first heating device 200 can be transferred to the heat dissipation film layer 400 for heat dissipation.

[0019] It should be noted that the first heating element 200 being exposed on the surface of the encapsulation portion 300 can be achieved by the encapsulation portion 300 being positioned lower than or flush with the height of the first heating element 200 during encapsulation, so that the first heating element 200 is exposed on the surface of the encapsulation portion 300. Alternatively, the first heating element 200 can be exposed on the surface of the encapsulation portion 300 by first encapsulating the entire first heating element 200, and then grinding the encapsulation portion 300 to expose the first heating element 200. The heat dissipation film layer 400 can be formed by a sputtering deposition process. Sputtering deposition is a technique that uses ions to bombard the surface of a target material, causing atoms or molecules of the target material to be ejected and deposited on the substrate surface to form a thin film.

[0020] The packaging structure disclosed in this application distributes a portion of the multiple first heating devices 200 on the first side of the circuit board 100 and another portion on the second side of the circuit board 100, thereby reducing the distance between the multiple first heating devices 200 and improving heat dissipation. By providing a heat dissipation film layer 400 on the side of the molding portion 300 facing away from the circuit board 100 on both sides, at least a portion of the heat generated by the first heating devices 200 on both sides of the circuit board 100 can be dissipated through the heat dissipation film layer 400 on the corresponding side, thereby improving the heat dissipation capacity of the packaging structure.

[0021] To further improve the heat dissipation capability of the packaging structure, the packaging structure may optionally include a first heat sink 500. The first heat sink 500 can be encapsulated within the molding compound 300, and a first end of the first heat sink 500 can be connected to the circuit board 100, while a second end can be connected to the heat dissipation film layer 400. At least a portion of the heat generated by the circuit board 100 can be transferred to the heat dissipation film layer 400 through the first heat sink 500, thereby improving the heat dissipation capability of the circuit board 100 and further enhancing the heat dissipation capability of the packaging structure.

[0022] Optionally, there can be multiple first heat sinks 500, and each of the multiple first heat sinks 500 can be connected between the circuit board 100 and the heat dissipation film layer 400. In this way, more heat can be transferred to the heat dissipation film layer 400 through the multiple first heat sinks 500, thereby further improving the heat dissipation capacity of the packaging structure.

[0023] In one optional embodiment, at least some of the first heating devices 200 may have different thicknesses. At the connection between two adjacent first heating devices 200 with different thicknesses on the same side of the circuit board 100, the heat dissipation film layer 400 may form a stepped structure, thereby enabling the packaging structure to accommodate first heating devices 200 with different thicknesses.

[0024] Some components in the package structure generate relatively little heat and are relatively delicate, requiring good protection. To provide better protection for these delicate components with low heat generation, the package structure may optionally include a second heating element 600. The second heating element 600 can also be a delicate component with low heat generation. The second heating element 600 can be encapsulated within the molding compound 300. The first end of the second heating element 600 can be connected to the circuit board 100, and the second end of the second heating element 600 can be encapsulated within the molding compound 300.

[0025] The packaging structure disclosed in this application provides better protection for the second heating device 600 by providing a second heating device 600, which is entirely encapsulated within the plastic encapsulation portion 300.

[0026] Optionally, the packaging structure may further include a second heat sink 700, which can be encapsulated within the molding compound 300. The first end of the second heat sink 700 can be connected to the circuit board 100, and the second end of the second heat sink 700 can be encapsulated within the molding compound 300. Heat from the circuit board 100 can be transferred to the second heat sink 700, thereby effectively increasing the heat dissipation area of ​​the circuit board 100 and thus improving its heat dissipation capacity.

[0027] Optionally, the thickness of the first heating device 200 can be greater than the thickness of the second heating device 600, the plastic encapsulation portion 300 at the corresponding position of the second heating device 600 can be flush with the surface of the first heating device 200 away from the circuit board 100, and the heat dissipation film layer 400 can be a planar structure, thereby making the shape of the encapsulation structure relatively regular.

[0028] Specifically, the first heat-generating device 200 can be an active device, and the package structure can also include a passive device 800. The passive device 800 can be encapsulated within the molding compound 300 and connected to the circuit board 100. Since the heat generated by the passive device 800 is relatively small, its temperature impact on the package structure is small (negligible). Therefore, the passive device 800 can be encapsulated within the molding compound 300. The passive device 800 can include resistors, inductors, and capacitors, etc.

[0029] It should be noted that when the packaging structure includes a second heating device 600, the second heating device 600 can also be an active device.

[0030] Optionally, the heat dissipation film layer 400 may include a seed layer and a heat dissipation layer, with the seed layer disposed between the heat dissipation layer and the molding compound 300. The seed layer may be a film layer formed by depositing metals such as Ti (titanium) / Ni (nickel), and the heat dissipation layer may be a film layer formed by depositing metals such as Ag (silver), Au (gold), Cu (copper), or SUS (stainless steel). The seed layer can have good adhesion to the molding compound 300, and the heat dissipation layer is connected to the molding compound 300 through the seed layer, which can improve the stability of the heat dissipation layer setting.

[0031] This application also discloses an electronic device, which includes the packaging structure disclosed in the above embodiments. The electronic device disclosed in this application, by setting the packaging structure disclosed in the above embodiments, allows some of the multiple first heating devices 200 to be disposed on the first side of the circuit board 100, and another portion of the first heating devices 200 to be disposed on the second side of the circuit board 100. This distributes the multiple first heating devices 200 on both sides of the circuit board 100, thereby reducing the distance between the multiple first heating devices 200 and improving heat dissipation capacity. By providing a heat dissipation film layer 400 on the side of the molding portion 300 on both sides of the circuit board 100 facing away from the circuit board 100, at least part of the heat generated by the first heating devices 200 on both sides of the circuit board 100 can be dissipated through the heat dissipation film layer 400 on the corresponding side, thereby improving the heat dissipation capacity of the packaging structure.

[0032] Specifically, the electronic device can be a mobile phone, tablet, computer, game console, etc. This application embodiment does not specifically limit the type of electronic device.

[0033] The above embodiments of this utility model mainly describe the differences between the various embodiments. As long as the different optimization features between the various embodiments are not contradictory, they can be combined to form a better embodiment. For the sake of brevity, they will not be described in detail here.

[0034] The embodiments of the present invention have been described above with reference to the accompanying drawings. However, the present invention is not limited to the specific embodiments described above. The specific embodiments described above are merely illustrative and not restrictive. Those skilled in the art can make many other forms under the guidance of the present invention without departing from the spirit and scope of the claims, and all of these forms are within the protection scope of the present invention.

Claims

1. A packaging structure, characterized in that, The device includes a circuit board (100), a plurality of first heating devices (200), a molding compound (300), and a heat dissipation film (400). Some of the first heating devices (200) are located on the first side of the circuit board (100), and the other part of the first heating devices (200) are located on the second side of the circuit board (100). The first side and the second side of the circuit board (100) are opposite to each other. The first heating devices (200) located on both sides of the circuit board (100) are all molded by the molding compound (300). The heat dissipation film (400) is provided on the side of the molding compound (300) facing away from the circuit board (100). The first heating devices (200) are exposed on the surface of the corresponding molding compound (300) and are in contact with the heat dissipation film (400) on the corresponding side.

2. The packaging structure according to claim 1, characterized in that, The encapsulation structure further includes a first heat sink (500), which is encapsulated in the encapsulation portion (300), and a first end of the first heat sink (500) is connected to the circuit board (100), and a second end of the first heat sink (500) is connected to the heat dissipation film layer (400).

3. The packaging structure according to claim 2, characterized in that, There are multiple first heat sinks (500), and all of the multiple first heat sinks (500) are connected between the circuit board (100) and the heat dissipation film layer (400).

4. The packaging structure according to claim 1, characterized in that, At least some of the first heating devices (200) have different thicknesses, and at the connection between two adjacent first heating devices (200) with different thicknesses on the same side of the circuit board (100), the heat dissipation film layer (400) forms a stepped structure.

5. The packaging structure according to claim 1, characterized in that, The encapsulation structure further includes a second heating device (600), which is encapsulated in the plastic encapsulation portion (300). The first end of the second heating device (600) is connected to the circuit board (100), and the second end of the second heating device (600) is covered in the plastic encapsulation portion (300).

6. The packaging structure according to claim 5, characterized in that, The encapsulation structure further includes a second heat sink (700), which is encapsulated within the plastic encapsulation portion (300). The first end of the second heat sink (700) is connected to the circuit board (100), and the second end of the second heat sink (700) is covered within the plastic encapsulation portion (300).

7. The packaging structure according to claim 6, characterized in that, The thickness of the first heating device (200) is greater than the thickness of the second heating device (600). The encapsulation portion (300) at the corresponding position of the second heating device (600) is flush with the surface of the first heating device (200) away from the circuit board (100). The heat dissipation film layer (400) has a planar structure.

8. The packaging structure according to claim 1, characterized in that, The first heating device (200) is an active device, and the packaging structure also includes a passive device (800). The passive device (800) is encapsulated in the plastic encapsulation part (300) and connected to the circuit board (100).

9. The packaging structure according to claim 1, characterized in that, The heat dissipation film layer (400) includes a seed layer and a heat dissipation layer, wherein the seed layer is disposed between the heat dissipation layer and the encapsulation portion (300).

10. An electronic device, characterized in that, Includes the packaging structure described in any one of claims 1 to 9.

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