Lead frame die
By designing multi-length guide plates and positioning components in the lead frame mold, the problem of difficulty in detecting abnormalities in strip stamping is solved, improving yield and production efficiency, and ensuring stamping accuracy and stability.
Patent Information
- Application Number
- CN202520576323.9
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-03-31
- Publication Date
- 2026-02-27
- Estimated Expiration
- 2035-03-31
AI Technical Summary
In lead frame molds, the long strip structure of the material strip causes the guide plate to obstruct the view, making it impossible to detect stamping abnormalities in time, such as scrap or surface damage of the material strip, which affects the yield and production efficiency of lead frames.
Design a lead frame mold. The guide plate is composed of multiple plates of different lengths, with mounting holes and positioning holes. They are connected by fixing screws. The guide plate is located on both sides of the material strip for limiting, and is equipped with floating blocks and positioning components to ensure that the material strip is aligned with the mold station, so as to detect abnormalities in time and facilitate inspection.
It improves the yield and production efficiency of the lead frame, ensures that the strip is strictly aligned with the mold station during each step, detects abnormalities in time, prevents strip deformation, and improves stamping accuracy and stability.
Smart Images

Figure CN223946565U_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The utility model relates to punch die technical field, concretely is a lead frame die. BACKGROUND
[0002] The lead frame die is a core tool for manufacturing lead frames in semiconductor packaging, and its precision and reliability directly affect the electrical performance and production efficiency of chip packaging. Among them, the lead frame die guide plate is a key die assembly for manufacturing lead frames in semiconductor packaging, which plays a role in precise positioning and guiding stamping, etching or injection molding process to ensure the dimensional accuracy and functional integrity of the lead frame.
[0003] Generally, the lead frame die includes an upper die and a lower die, wherein the lower die is provided with a concave die plate, and the two sides of the concave die plate are provided with guide plates. A material belt is arranged between the two side guide plates and the concave die plate. The lead frame die is usually a multi-station progressive die, and each station completes different processing in turn. The material belt is subjected to traction and moves horizontally on the concave die plate. The upper die punches the material belt downward, and the lead frame is gradually formed.
[0004] However, since the material belt is in the form of a long strip, when the material belt is subjected to skip scrap or surface damage, the long strip-shaped body plate of the guide plate will block the line of sight, making it impossible for the operator to immediately discover the abnormal stamping.
[0005] Based on this, the utility model designs a lead frame die to solve the above problems. CONTENT OF THE UTILITY MODEL
[0006] To achieve the above purpose, the utility model provides the following technical scheme: the die includes an upper die and a lower die, the lower die is provided with a concave die plate, the concave die plate is provided with two groups of guide plates, the two groups of guide plates are arranged on the two sides of the concave die plate respectively, each group of guide plates is composed of a plurality of plate materials arranged separately in different lengths, one side of the guide plate is provided with a mounting hole, a fixing screw is arranged in the mounting hole, a positioning hole is arranged on the two sides of the concave die plate, the fixing screw is threadedly connected in the positioning hole, a material belt is arranged in the gap between the guide plate and the concave die plate, and the arrangement mode of the guide plate is adapted to the cutting shape of the material belt.
[0007] By adopting the above technical scheme, when the lead frame die is stamping the material belt, the material belt is subjected to traction and passes through the gap between the guide plate and the concave die plate. The guide plates are respectively located on the two sides of the material belt and limit the material belt left and right, ensuring that the material belt is strictly aligned with the die station at each step, preventing the material belt from deforming. When the material belt is subjected to skip scrap or surface damage, the operator can immediately discover the abnormal stamping through the interval between the guide plates. After discovering the abnormality, the operator can quickly remove the guide plates by disassembling the screws and check the material belt, thereby improving the yield rate and production efficiency of the lead frame.
[0008] Preferably, a clearance hole is arranged on the end of the guide plate away from the mounting hole, a floating block is arranged on the die plate and located directly below the clearance hole, the upper die is provided with a positioning assembly arranged directly above the floating block.
[0009] By using the above technical scheme, the floating block is located below the material belt to help the material belt positioning, and the material belt is lifted up after stamping to move away from the die plate, facilitating the movement of the material belt.
[0010] Preferably, the positioning assembly comprises a fixed plate, a stripper plate, a round wire spring and a positioning pin, a receiving groove is arranged on the fixed plate, the round wire spring is fixedly arranged in the receiving groove, the positioning pin is fixedly arranged on the round wire spring, the other end of the positioning pin extends out of the receiving groove, the stripper plate is fixedly arranged at the bottom of the fixed plate, and the center of the floating block is provided with a positioning groove.
[0011] By using the above technical scheme, when stamping, the stamping assembly moves downward to approach the material belt, the positioning pin enters the positioning groove, and the stripper plate presses the material belt to stabilize and position the material belt on the die plate, and the upper die continues to press down along the positioning groove to ensure the stamping precision of the die.
[0012] Preferably, a pin hole is arranged on the guide plate, and a pin is fixedly arranged on the die plate and inserted into the pin hole.
[0013] By using the above technical scheme, the guide plate can be more stably positioned on the die plate, reducing the impact of the material belt sliding on the guide plate and increasing the stability of the guide plate.
[0014] In summary, the lead frame die has the following beneficial technical effects: when the lead frame die stamps the material belt, the material belt is pulled to pass through the gap between the guide plate and the die plate, the guide plate is located on both sides of the material belt to position the material belt left and right, ensuring that the material belt is strictly aligned with the die station at each step, preventing the material belt from deforming, and when the material belt jumps scrap or the surface of the material belt is damaged, the operator can immediately find the stamping abnormality through the interval between the guide plates, and after finding the abnormality, the guide plate can be quickly removed by disassembling the screw to check the material belt. BRIEF DESCRIPTION OF DRAWINGS
[0015] In order to more clearly illustrate the technical scheme of the embodiments of the present application, the following will briefly introduce the drawings needed to be used in the embodiment description, obviously, the drawings in the following description are only some embodiments of the present application, and for those skilled in the art, other drawings can also be obtained from these drawings without creative labor.
[0016] Figure 1 It is a side structure schematic view of the lower die of the embodiment;
[0017] Figure 2 It is a arrangement structure schematic view of the guide plate on the die plate of the embodiment;
[0018] Figure 3 It is a structure schematic view of the guide plate of the embodiment;
[0019] Figure 4 It is a section structure schematic view of the guide plate and the positioning assembly of the embodiment.
[0020] In the drawings, the component list represented by each sign is as follows:
[0021] 1, lower die plate; 2, die plate; 3, guide plate; 4, material belt; 5, pin; 6, floating block; 7, positioning groove; 8, fixing screw; 9, positioning hole; 10, unloading plate; 11, fixed plate; 12, round wire spring; 13, positioning pin; 14, mounting hole; 15, bolt hole. DETAILED DESCRIPTION
[0022] The technical scheme in the embodiments of the present application will be described clearly and completely in combination with the drawings in the embodiments of the present application, obviously, the described embodiments are only some embodiments of the present application, rather than all the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without creative labor are within the protection scope of the present application.
[0023] The following will be described in combination with the drawings in the embodiments of the present application Figures 1-4 The present application will be further described in detail.
[0024] A lead frame die, the die comprises an upper die and a lower die 1, the lower die 1 is provided with a die plate 2, the die plate 2 is provided with two groups of guide plates 3, the two groups of guide plates 3 are arranged on the two sides of the die plate 2 respectively, each group of guide plates 3 is composed of a plurality of plate materials with different lengths and is arranged separately, one side of the guide plate 3 is provided with a mounting hole 14, the mounting hole 14 is provided with a fixing screw 8, the two sides of the die plate 2 are provided with positioning holes 9, the fixing screw 8 is screw-connected in the positioning hole 9, the gap between the guide plate 3 and the die plate 2 is provided with a material belt 4, and the arrangement mode of the guide plate 3 is adapted to the cutting shape of the material belt 4
[0025] In use, the guide plate 3 is placed on the concave die plate 2, the mounting hole 14 on the guide plate 3 is aligned with the positioning hole 9 on the concave die plate 2, the guide plate 3 is locked on the concave die plate 2 by screws, the guide plate 3 is arranged at intervals according to the specific die core on the concave die plate 2, the material belt 4 is inserted between the guide plate 3 and the concave die plate 2, and the guide plate 3 is located on both sides of the material belt 4, so that the left and right of the material belt 4 are limited, ensuring that the material belt 4 is strictly aligned with the die station during each sliding, and the material belt 4 continuously passes through the guide plate 3 during stamping, so that the stamping of the material belt 4 can be observed between the two guide plates 3, and abnormalities can be found in time when the material belt 4 jumps scrap or the surface of the material belt 4 is damaged.
[0026] The end of the guide plate 3 away from the mounting hole 14 is fixedly provided with a clearance hole, the concave die plate 2 is slidably provided with a floating block 6, the floating block 6 is located directly below the clearance hole, the upper die is provided with a positioning assembly, the positioning assembly is correspondingly arranged directly above the floating block 6, the positioning assembly comprises a fixed plate 11, a stripper plate 10, a round wire spring 12 and a positioning pin 13, the fixed plate 11 is provided with a containing groove, the round wire spring 12 is fixedly arranged in the containing groove, the positioning pin 13 is fixedly arranged on the round wire spring 12, and the other end of the positioning pin 13 extends out of the containing groove. The stripper plate 10 is fixedly arranged at the bottom of the fixed plate 11, and the center of the floating block 6 is provided with a positioning groove 7.
[0027] When the upper die is downwardly stamped, the positioning pin 13 is aligned with the positioning groove 7 and downwardly enters the positioning groove 7, the stripper plate 10 abuts against the material belt 4, the floating block 6 descends, the material belt 4 is stably limited on the concave die plate 2, the upper die continues to press downwardly along the positioning groove 7, the cooperation between the positioning pin 13 and the positioning groove 7 plays a guiding role, and the stamping accuracy of the die is improved, after stamping is completed, the upper die leaves the material belt 4, the positioning pin 13 leaves the positioning groove 7, the floating block 6 rises upwardly to lift the material belt 4, so that the material belt 4 is away from the concave die plate 2, and the material belt 4 can continue to slide to a next position after being lifted and pulled.
[0028] The guide plate 3 is provided with a latch hole 15, the concave die plate 2 is fixedly provided with a pin 5, the pin 5 is inserted into the latch hole 15, when the guide plate 3 is installed, the pin 5 passes through the latch hole 15, so that the guide plate 3 can be more stably limited on the concave die plate 2, and the guide plate 3 cannot rotate when the material belt 4 moves, further improving the stability of the guide plate 3.
[0029] The implementation principle of the embodiment is that when in use, the guide plate 3 is placed on the concave die plate 2, the mounting hole 14 on the guide plate 3 is aligned with the positioning hole 9 on the concave die plate 2, the pin 5 is inserted through the pin hole 15, and then the guide plate 3 is locked on the concave die plate 2 through a screw, the guide plate 3 is arranged at intervals according to the specific die core on the concave die plate 2, then the material belt 4 is inserted between the guide plate 3 and the concave die plate 2, and the guide plate 3 is located on both sides of the material belt 4, so that the left and right of the material belt 4 are limited, and it is ensured that the material belt 4 is strictly aligned with the die station during each sliding.
[0030] During stamping, the positioning pin 13 is aligned with the positioning groove 7 and is downwardly inserted into the positioning groove 7, the stripper plate 10 abuts against the material belt 4, the floating block 6 is lowered, the material belt 4 is stably limited on the concave die plate 2, the upper die continues to press downward along the positioning groove 7, after stamping is completed, the upper die is separated from the material belt 4, the positioning pin 13 is separated from the positioning groove 7, the floating block 6 is raised upward to lift the material belt 4, so that the material belt 4 is away from the concave die plate 2, and after the material belt 4 is lifted, the material belt 4 can continue to slide to the next position by traction, the material belt 4 continuously passes through the guide plate 3 during stamping, and the stamping condition of the material belt 4 can be observed between the two guide plates 3, so that the abnormality can be found in time when the material belt 4 is out of position or the surface of the material belt 4 is damaged.
[0031] In the description of the present application, it should be understood that the orientation or positional relationship indicated by the terms "coaxial", "bottom", "one end", "top", "middle", "the other end", "upper", "one side", "top", "inner", "front", "central", "both ends" and the like is based on the orientation or positional relationship shown in the drawings, and is only for the convenience of describing the present application and simplifying the description, and does not indicate or imply that the devices or elements referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as a limitation on the present application.
[0032] In the present application, unless otherwise clearly specified and limited, the terms "mounting", "setting", "connecting", "fixing", "screw connection" and the like should be understood in a broad sense, for example, can be fixed connection, can also be detachable connection, or integrated; can be mechanical connection, can also be electrical connection; can be directly connected, can also be indirectly connected through an intermediate medium, can be the communication or interaction relationship between two elements, unless otherwise clearly limited, the specific meaning of the above terms in the present application can be understood according to the specific circumstances by those skilled in the art.
[0033] Although the embodiments of the present application have been shown and described, it can be understood by those skilled in the art that various changes, modifications, replacements and variations can be made to these embodiments without departing from the principles and spirits of the present application, and the scope of the present application is defined by the appended claims and their equivalents.
Claims
1. A leadframe mold characterized by: The mold comprises an upper die and a lower die (1), the lower die (1) is provided with a concave die plate (2), the concave die plate (2) is provided with two groups of guide plates (3), the two groups of guide plates (3) are arranged on the two sides of the concave die plate (2) respectively, each group of guide plates (3) is composed of a plurality of plate materials with different lengths arranged in groups, one side of the guide plate (3) is provided with a mounting hole (14), the mounting hole (14) is provided with a fixing screw (8), the concave die plate (2) is provided with a positioning hole (9) on the two sides, the fixing screw (8) is threadedly connected in the positioning hole (9), the gap between the guide plate (3) and the concave die plate (2) is provided with a material belt (4), and the arrangement mode of the guide plate (3) is adapted to the cutting shape of the material belt (4).
2. A leadframe die according to claim 1, wherein: The end of the guide plate (3) away from the mounting hole (14) is fixedly provided with a clearance hole, the concave die plate (2) is slidably provided with a floating block (6), the floating block (6) is located directly below the clearance hole, and the upper die is provided with a positioning assembly.
3. A leadframe die according to claim 2, wherein: The positioning assembly comprises a fixed plate (11), a discharging plate (10), a round wire spring (12) and a positioning nail (13), the fixed plate (11) is provided with a containing groove, the containing groove is fixedly provided with a round wire spring (12), the round wire spring (12) is fixedly provided with a positioning nail (13), the other end of the positioning nail (13) extends out of the containing groove, the discharging plate (10) is fixedly arranged at the bottom of the fixed plate (11), the center of the floating block (6) is provided with a positioning groove (7), and when the fixed plate (11) is located on the concave die plate (2), the positioning nail (13) is located in the positioning groove (7).
4. The leadframe die of claim 1, wherein: The guide plate (3) is provided with a latch hole (15), the concave die plate (2) is fixedly provided with a pin (5), and the pin (5) is inserted into the latch hole (15).