Simple TEM cell for chip sensitivity test

Abstract

The utility model provides a simple TEM cell used for a chip sensitivity test. The simple TEM cell comprises a cell body and a stabilizing member. A PCB bottom plate is arranged at the bottom of the small chamber body, and the two ends of the PCB bottom plate extend out of the small chamber body; a test window is formed in the center of the top wall of the small chamber body, and a test cover plate covers the test window; the two ends of the cell body are pyramid-shaped and form SMA ports respectively. The stabilizing component comprises a hard foam plate and two PCB vertical plates, the two PCB vertical plates are correspondingly connected to the two ends of the PCB bottom plate respectively, and the centers of the two PCB vertical plates are correspondingly connected with the two SMA ports respectively; the hard foam plates are arranged in the small chamber body and used for supporting the two opposite side inner walls of the small chamber body. According to the simple TEM cell for the chip sensitivity test provided by the utility model, the structural stability of the cell body can be improved, and the overall structural stability and the test performance stability can be improved.

Description

TECHNICAL FIELD

[0001] The utility model belongs to chip sensitivity test technical field, concretely relates to a simple TEM chamber for chip sensitivity test. BACKGROUND

[0002] With electromagnetic compatibility problem in domestic power electronics field gradually gets attention, power electronics laboratory is equipped with relevant test equipment also gradually appears particularly important, and TEM chamber (Transverse Electromagnetic Transmission Cell, transverse electromagnetic wave chamber) as a kind of both can test integrated circuit's radiation emission, and can be used for testing integrated circuit's immunity, and simple to use, test cost low equipment has been widely concerned.

[0003] At present, the TEM chamber of industrial preparation is still high in cost, and is not suitable for small laboratory use, and the TEM chamber made by experimental personnel is usually directly welded in the way of copper plate splicing, and the performance stability and structural stability cannot be guaranteed, and improvement is urgently needed. UTILITY MODEL CONTENT

[0004] The utility model embodiment provides a simple TEM chamber for chip sensitivity test, to improve the performance stability and structural stability of TEM chamber.

[0005] To achieve the above object, the technical scheme adopted by the utility model is: provide a simple TEM chamber for chip sensitivity test, including chamber body and stable component, the bottom of chamber body is equipped with PCB (Printed Circuit Board, printed circuit board) bottom plate, and the both ends of PCB bottom plate stretch out chamber body, the top wall center of chamber body is equipped with test window, and the test window is equipped with test cover plate, the both ends of chamber body are pyramid and form SMA (SubMiniature version A connector, radio frequency connector) port respectively, and the stable component includes hard foam board and two PCB vertical boards, two PCB vertical boards are connected to the both ends of PCB bottom plate respectively, and the center of two PCB vertical boards is connected to two SMA ports respectively, and the hard foam board is arranged in the chamber body and is used to support the two opposite side inner walls of chamber body.

[0006] In a possible implementation mode, the inner conductor plate is arranged in the chamber body, the inner conductor plate is pressed against the top surface of the hard foam board, and the both ends of the inner conductor plate are connected to the two SMA ports respectively.

[0007] In some embodiments, the small chamber body comprises two side plates, four inclined plates, and a top plate; the two ends of the side plates are formed into pointed cone portions, and the upper and lower sides of the pointed cone portions at the same end of the two side plates are respectively connected and fixed with one of the inclined plates to form a pyramid shape; the part of the side plate between the two pointed cone portions is formed into a rectangular section, and the rectangular sections of the two side plates are respectively abutted against the two sides of the hard foam plate and connected with the PCB bottom plate; the top plate is overlapped on the top end of the two rectangular sections, and the top plate is butted with the inclined plate above the pointed cone portion.

[0008] For example, a through hole is formed in the center of the PCB vertical plate, and the SMA port is welded and fixed with the PCB vertical plate along the boundary of the through hole.

[0009] For example, the side of the PCB vertical plate away from the small chamber body is welded with an SMA seat plate, and the SMA seat plate is aligned with the through hole.

[0010] In a possible implementation, the inclined plate below the pointed cone portion is a rectangular PCB double-sided copper-plated inclined plate, and the PCB double-sided copper-plated inclined plate forms a triangular support structure with the PCB vertical plate and the PCB bottom plate; wherein the upper surface of the PCB double-sided copper-plated inclined plate is provided with a positioning auxiliary line, and the pointed cone portion is welded and fixed with the PCB double-sided copper-plated inclined plate along the positioning auxiliary line.

[0011] In some embodiments, the two side plates and the inner conductor plate are copper plates, the inclined plate above the pointed cone portion, the top plate, and the test cover plate are all double-sided copper-plated PCB plates.

[0012] In some embodiments, the edge of the test window is wrapped with a copper foil tape, and the edge of the test cover plate is overlapped on the copper foil tape.

[0013] The simple TEM small chamber for chip sensitivity test has the following advantages: compared with the prior art, the simple TEM small chamber for chip sensitivity test of the utility model uses a PCB bottom plate as the bottom, and uses the two ends of the PCB bottom plate extending out of the small chamber body to connect the PCB vertical plates as stable components; the two ends of the small chamber body are set as pyramid shapes, and the pointed tips of the pyramid shapes are used as SMA ports, which can not only improve the structural stability of the small chamber body itself, but also can fix and connect the two SMA ports with the centers of the two PCB vertical plates, thereby improving the overall structural stability and avoiding the rotation or shaking of the small chamber body when the SMA connectors are installed on the SMA ports, thereby facilitating the test operation; the hard foam plate is arranged inside the small chamber body to abut and support the two opposite inner walls of the small chamber body, thereby further improving the structural stability of the small chamber body; the small chamber body is completely closed except for the test window formed in the center of the top wall, so that the test cover plate on the test window cover can ensure the airtightness of the small chamber body, thereby improving the electromagnetic shielding effect of the small chamber body and further improving the test performance stability. BRIEF DESCRIPTION OF DRAWINGS

[0014] Figure 1 A perspective structure schematic view of the simple TEM chamber for chip sensitivity test provided by the embodiment of the utility model;

[0015] Figure 2 A section structure schematic view of the simple TEM chamber for chip sensitivity test provided by the embodiment of the utility model;

[0016] Figure 3 An explosion structure schematic view of the simple TEM chamber for chip sensitivity test provided by the embodiment of the utility model.

[0017] In the drawing: 10, chamber body; 100, test window; 11, PCB bottom plate; 12, test cover plate; 13, SMA port; 14, side plate; 141, sharp cone part; 142, rectangular section; 15, inclined plane plate; 151, positioning auxiliary line; 16, top plate; 17, copper foil tape; 20, hard foam plate; 30, PCB vertical plate; 31, through hole; 40, inner conductor plate; 50, SMA seat plate. DETAILED DESCRIPTION

[0018] In order to make the technical problems, technical schemes and beneficial effects to be solved by the utility model clearer and more apparent, the utility model will be further described in detail below in combination with the drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the utility model, and are not used to limit the utility model.

[0019] It should be noted that when an element is referred to as being "disposed on" or "connected to" another element, it can be directly on the other element or indirectly on the other element. It should be understood that the terms "length", "width", "upper", "lower", "front", "back", "top", "bottom", "inner", "outer", and the like indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings, and are only used to facilitate the description of the present application and simplify the description, and therefore cannot be understood as indicating or implying that the device or element referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as limiting the present application. The terms "first", "second" are only used for descriptive purposes, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features limited by "first", "second" can explicitly or implicitly include one or several of the features. In the description of the present application, the meaning of "a plurality of", "several" is two or more than two, unless otherwise explicitly specified.

[0020] Please see Figures 1 to 3The utility model provides a simple TEM chamber for chip sensitivity test, which comprises a chamber body 10 and a stabilizing component. The bottom of the chamber body 10 is provided with a PCB bottom plate 11, and the two ends of the PCB bottom plate 11 extend out of the chamber body 10. A test window 100 is formed in the center of the top wall of the chamber body 10, and a test cover plate 12 is arranged on the test window 100. The two ends of the chamber body 10 are in the shape of a pyramid and form SMA ports 13 respectively. The stabilizing component comprises a hard foam plate 20 and two PCB vertical plates 30. The two PCB vertical plates 30 are connected to the two ends of the PCB bottom plate 11 respectively, and the centers of the two PCB vertical plates 30 are connected to the two SMA ports 13 respectively. The hard foam plate 20 is arranged inside the chamber body 10 and is used to support the two opposite inner walls of the chamber body 10.

[0021] It should be understood that the two ends of the chamber body 10 in the embodiment are in the shape of a pyramid, and the two ends of the PCB bottom plate 11 extending out of the chamber body 10 are located directly below the pyramid-shaped structures at the two ends of the chamber body 10. On this basis, the PCB vertical plates 30 fixed at the two ends of the PCB bottom plate 11 and the SMA ports 13 formed by the pointed tips of the pyramid-shaped structures are in abutment. Thus, the pyramid-shaped end of the chamber body 10, the end of the PCB bottom plate 11 extending out of the chamber body 10, and the PCB vertical plates 30 form a triangular three-dimensional structure, thereby improving the stability of the overall structure.

[0022] In the embodiment, the hard foam plate 20 arranged inside the chamber body 10 supports the two side walls of the chamber body 10, thereby providing stable support for the chamber body 10 in the width direction. Thus, the stability of the chamber body 10 itself and the overall structure can be improved by arranging the stabilizing component.

[0023] In the embodiment, the chamber body 10 forms a completely sealed space after the test window 100 is covered by the test cover plate 12, thereby improving the electromagnetic shielding effect. On this basis, the high stability of the chamber body 10 can prevent the chamber body 10 from deforming and separating during the test, thereby ensuring the stability of the test performance.

[0024] On the basis described above, the SMA ports 13 are formed by the pointed tips of the pyramid-shaped chamber body 10. The stability of the pyramid-shaped structure can improve the stability of installing the SMA connector to the SMA port 13 during the test, thereby preventing the SMA port 13 from deforming or shaking during the wiring process and affecting the stability of the final test performance.

[0025] Compared with the prior art, the simple TEM cell for chip sensitivity test provided in the embodiment has the following advantages. The cell body 10 is made of a PCB bottom plate 11 as the bottom, and the two ends of the cell body 10 are connected with the PCB vertical plates 30 as the stabilizing members. The two ends of the cell body 10 are provided in the shape of a pyramid, and the tip of the pyramid is used as the SMA port 13. The structure stability of the cell body 10 is improved, and the two SMA ports 13 are fixedly connected with the centers of the two PCB vertical plates 30, so that the overall structure stability is improved, and the rotation or shaking of the cell body 10 caused by the installation of the SMA connector is avoided, thereby facilitating the test operation. The hard foam plate 20 is arranged in the cell body 10 to abut and support the two opposite inner walls of the cell body 10, so that the structure stability of the cell body 10 is further improved. The cell body 10 is completely closed except the test window 100 provided in the center of the top wall, so that the airtightness of the cell body 10 is ensured by covering the test cover plate 12 on the test window 100, so that the electromagnetic shielding effect of the cell body 10 is improved, and the test performance stability is improved.

[0026] In some embodiments, referring to Figure 2 The inner conductor plate 40 is arranged in the cell body 10 and abuts against the top surface of the hard foam plate 20, and the two ends of the inner conductor plate 40 are respectively connected with the two SMA ports 13.

[0027] The two ends of the inner conductor plate 40 are respectively connected with the two SMA ports 13, so that the wires connected with the two SMA ports 13 are conducted for chip sensitivity test. The hard foam plate 20 provides support force for the inner conductor plate 40, which can avoid the middle part of the inner conductor plate 40 from being suspended and deformed downward, and can avoid the inner conductor plate 40 from being rotated due to the torque borne by the inner conductor plate 40 during the installation of the SMA connector, so that the convenience and stability of the connection operation are improved, and the risk of breakage or damage of the inner conductor plate 40 and the SMA port 13 due to relative rotation is avoided.

[0028] As a specific embodiment of the cell body 10, please refer to Figure 2 and Figure 3The chamber body 10 comprises two side plates 14, four inclined plates 15, and a top plate 16; the two ends of the side plate 14 are formed into pointed cone portions 141, and the upper and lower sides of the pointed cone portions 141 at the same end of the two side plates 14 are respectively connected and fixed with one of the inclined plates 15 to form a pyramid shape; the part of the side plate 14 between the two pointed cone portions 141 is formed into a rectangular section 142, and the rectangular sections 142 of the two side plates 14 are respectively abutted against the two sides of the hard foam plate 20 and connected with the PCB bottom plate 11; the top plate 16 is overlapped on the top end of the two rectangular sections 142, and the top plate 16 is butted against the inclined plate 15 above the pointed cone portion 141.

[0029] Since the two ends of the chamber body 10 are in the shape of a pyramid, specifically a quadrangular pyramid, the pointed cone portions 141 at the two ends of the side plate 14 are respectively formed into an angle with the two ends of the rectangular section 142, that is, the pointed cone portions 141 are bent relative to the rectangular section 142, and on this basis, the upper and lower inclined plates 15 are respectively overlapped and fixed with the upper and lower boundaries of the pointed cone portions 141, so that the two inclined plates 15 and the two pointed cone portions 141 respectively serve as the four cone surfaces of the pyramid-shaped structure, which not only has good structural stability, but also facilitates the assembly and welding work; the overall structure of the side plate 14 with the rectangular section 142 and the two pointed cone portions 141 can reduce the joints, which not only reduces the splicing difficulty of the chamber body 10, but also helps to improve the shielding effect of the chamber body 10.

[0030] It should be noted that, as shown in Figure 2 and Figure 3 , the center of the PCB vertical plate 30 is provided with a through hole 31, and the SMA port 13 is welded and fixed with the PCB vertical plate 30 along the boundary of the through hole 31. The through hole 31 is provided for the installation of the SMA connector, and on the other hand, it can be used as a positioning hole for the welding and fixing of the inclined plate 15 and the side plate 14 with the PCB vertical plate 30, thereby reducing the manufacturing difficulty.

[0031] In order to facilitate the connection of the SMA connector with the SMA port 13 and improve the connection reliability, as shown in Figure 2 , in the embodiment, the side of the PCB vertical plate 30 away from the chamber body 10 is welded with an SMA seat plate 50, and the SMA seat plate 50 is aligned with the through hole 31.

[0032] In some possible implementation manners, as shown in Figure 1 and Figure 3The inclined plate 15 located below the pointed cone 141 is a rectangular double-sided copper-plated PCB inclined plate. The double-sided copper-plated PCB inclined plate, together with the PCB vertical plate 30 and the PCB base plate 11, forms a triangular support structure. The upper surface of the double-sided copper-plated PCB inclined plate has a positioning auxiliary line 151. The pointed cone 141 is welded and fixed to the double-sided copper-plated PCB inclined plate along the positioning auxiliary line 151. The rectangular structure of the double-sided copper-plated PCB inclined plate increases its connection area with the PCB vertical plate 30, thereby improving connection stability. Because there is a bending angle between the pointed cone 141 and the rectangular segment 142 of the side plate 14, the pointed cone 141 is not connected to the edge of the double-sided copper-plated PCB inclined plate. To improve manufacturing convenience, the positioning auxiliary line 151 should be set on the double-sided copper-plated PCB inclined plate before welding. During welding, simply aligning the lower boundary of the pointed cone 141 with the positioning auxiliary line 151 ensures welding position accuracy and reduces welding positioning difficulty.

[0033] Specifically, in this embodiment, both side plates 14 and the inner conductor plate 40 are made of copper. The inclined plate 15, top plate 16, and test cover plate 12 located above the cone portion 141 are all double-sided copper-plated PCBs. The use of pure copper plates for the side plates 14 is beneficial for improving the electromagnetic shielding effect, while the use of copper plates for the inner conductor plate 40 is intended to ensure conductivity, thereby improving the stability of the test performance. The inclined plate 15, top plate 16, and test cover plate 12 are all made of double-sided copper-plated rigid PCBs, which not only saves costs but also provides high structural rigidity, which is beneficial for improving the overall structural stability. On this basis, the electromagnetic shielding effect is ensured by plating copper on both sides of the rigid PCB, thereby improving the stability of the test performance.

[0034] In some embodiments, please refer to Figure 1 and Figure 3 The edge of the aforementioned test window 100 is covered with a copper foil strip 17, and the edge of the test cover plate 12 overlaps with the copper foil strip 17. By setting the copper foil strip 17, the tightness of the fit and conductivity between the test cover plate 12 and the edge of the test window 100 can be improved, thereby ensuring the airtightness of the chamber body 10 after the test cover plate 12 is sealed, which is beneficial to improving the electromagnetic shielding effect and thus improving the stability of test performance.

[0035] Combination Figures 1 to 3 Understandably, the fabrication process of the simplified TEM chamber for chip sensitivity testing provided in this embodiment is as follows:

[0036] First, prepare the materials: including PCB base plate 11, four double-sided copper PCB plates as bevel plate 15 (two of which are rectangular), a double-sided copper PCB plate with a test window 100 as top plate 16, a double-sided copper PCB plate as test cover plate 12, two double-sided copper PCB vertical plates 30 (with a through hole 31 in the center), two copper side plates 14, a copper inner conductor plate 40, and a hard foam plate 20, two SMA seat plates 50.

[0037] Then start the assembly and welding: place the PCB base plate 11 on the workbench, then vertically weld the two PCB vertical plates 30 at both ends of the PCB base plate 11, and weld the two SMA seat plates 50 on the side walls of the two PCB vertical plates 30 respectively, corresponding to the through holes 31 of the two PCB vertical plates 30; then weld the two rectangular bevel plates 15 with the two PCB vertical plates 30 respectively, align one end of the bevel plate 15 with the lower edge of the through hole 31, and weld the other end obliquely downward on the PCB base plate 11; then place the hard foam plate 20 on the PCB base plate 11 with both ends abutting the lower ends of the two welded bevel plates 15; then place the two side plates 14 on both sides of the hard foam plate 20 (the side plates 14 are welded and positioned by the hard foam plate 20, which not only facilitates operation but also avoids deformation of the side plates 14 during welding), align the two pointed parts 141 of the side plates 14 with the auxiliary positioning lines on the bevel plates 15, then weld the rectangular sections 142 of the side plates 14 with the PCB base plate 11, the pointed parts 141 with the bevel plates 15, and the pointed tips of the pointed parts 141 with the PCB vertical plates 30; then place the inner conductor plate 40 behind the hard foam plate 20 and weld both ends with the center shafts of the two SMA ports 13 (the ports are female ports with a central shaft inside, and the SMA connectors that are pre-connected are male ports with a central shaft inside); then place the top plate 16 above the rectangular sections 142 of the two side plates 14, weld the two side edges of the top plate 16 with the upper boundaries of the two rectangular sections 142, and then cover the test window 100 with the test cover plate 12 after wrapping the copper foil tape 17 along the boundary of the test window 100; finally, place the remaining two bevel plates 15 on the pointed parts 141 on both sides of the top plate 16, weld one end of the bevel plate 15 with the edge of the top plate 16, and weld the other end with the PCB vertical plate 30, while welding the upper boundary of the pointed part 141 with the bevel plate 15, thus forming a completely enclosed TEM cell that can be easily opened to expose the test window 100.

[0038] When performing chip sensitivity testing, connect the SMA connectors at the ends of the test lines to the corresponding SMA ports 13, then place the chip to be tested on the test cover plate 12, and then cover the test window 100 with the test cover plate 12.

[0039] The above merely describes preferred embodiments of the present application and is not intended to limit the present application, and any modification, equivalent replacement, and improvement within the spirit and principle of the present application shall be included in the protection scope of the present application.

Claims

1. A simple TEM cell for chip sensitivity testing, characterized in that, The chamber body and the stabilizing member; the bottom of the chamber body is provided with a PCB bottom plate, the two ends of the PCB bottom plate extend out of the chamber body; the center of the top wall of the chamber body is provided with a test window, and the test window is covered with a test cover plate; the two ends of the chamber body are pyramidal and form SMA ports respectively; The stabilizing member includes a hard foam plate and two PCB vertical plates, the two PCB vertical plates are respectively connected to the two ends of the PCB bottom plate, and the centers of the two PCB vertical plates are respectively connected to the two SMA ports; the hard foam plate is arranged inside the chamber body and is used for supporting the two opposite inner walls of the chamber body.

2. The simple TEM cell for chip sensitivity testing of claim 1, wherein, The chamber body is provided with an inner conductor plate, the inner conductor plate is pressed against the top surface of the hard foam plate, and the two ends of the inner conductor plate are respectively connected to the two SMA ports.

3. The simple TEM cell for chip sensitivity testing of claim 2, wherein, The chamber body includes two side plates, four inclined surface plates, and a top plate; the two ends of the side plate are formed into sharp cone portions, and the upper and lower sides of the sharp cone portions at the same end of the two side plates are respectively connected and fixed to one of the inclined surface plates to form the pyramid shape; the part of the side plate between the two sharp cone portions is formed into a rectangular section, the rectangular sections of the two side plates are respectively abutted on the two sides of the hard foam plate and connected to the PCB bottom plate; the top plate is overlapped on the top ends of the two rectangular sections, and the top plate is butted with the inclined surface plate above the sharp cone portion.

4. The simple TEM cell for chip sensitivity testing of claim 3, wherein, The center of the PCB vertical plate is provided with a through hole, and the SMA port is welded and fixed to the PCB vertical plate along the boundary of the through hole.

5. The simple TEM cell for chip sensitivity testing of claim 4, wherein, The side of the PCB vertical plate away from the chamber body is welded with an SMA seat plate, and the SMA seat plate is aligned with the through hole.

6. The simple TEM cell for chip sensitivity testing of claim 4, wherein, The inclined surface plate below the sharp cone portion is a rectangular PCB double-sided copper plated inclined plate, and the PCB double-sided copper plated inclined plate forms a triangular support structure with the PCB vertical plate and the PCB bottom plate; wherein the upper surface of the PCB double-sided copper plated inclined plate is provided with a positioning auxiliary line, and the sharp cone portion is welded and fixed to the PCB double-sided copper plated inclined plate along the positioning auxiliary line.

7. The simple TEM cell for chip sensitivity testing of claim 3, wherein, The two side plates and the inner conductor plate are copper plates, the inclined surface plate above the sharp cone portion, the top plate, and the test cover plate are double-sided copper plated PCB plates.

8. The simple TEM cell for chip sensitivity testing according to any one of claims 1 to 7, characterized in that, The edge of the test window is wrapped with a copper foil tape, and the edge of the test cover plate is overlapped on the copper foil tape.

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