Semiconductor chip processing and testing device
By designing a semiconductor chip processing and testing device with a turntable and transverse stage structure, the problem of multi-station vibration affecting testing stability was solved, and synchronous operation of chip testing and pick-up/placement was realized, improving testing efficiency and accuracy.
Patent Information
- Application Number
- CN202423291621.8
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-12-30
- Publication Date
- 2026-02-27
- Estimated Expiration
- 2034-12-30
AI Technical Summary
When existing semiconductor chip testing equipment operates at multiple stations, vibrations at the pick-and-place stations affect the stability of the testing stations, leading to inaccurate testing and potential chip damage.
A semiconductor chip processing and testing device was designed, which adopts a turntable and transverse stage structure, combined with limit telescopic device and test probe, to realize synchronous operation of dual stations. The turntable position is stabilized by limit holes and limit telescopic device to reduce the impact of vibration and ensure that chip testing and pick-up and drop-off are carried out simultaneously.
It improves the testing efficiency and accuracy of semiconductor chips, reduces the risk of chip damage, and achieves stable and synchronized operation of chip testing and pick-up/placement.
Smart Images
Figure CN223955737U_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The utility model belongs to the technical field of semiconductor chip testing, and particularly relates to a semiconductor chip processing test device. BACKGROUND
[0002] After production and processing, semiconductor chips generally need to be tested to complete quality detection work, and existing test devices often only have one test station, and the test efficiency is low, and when multiple test stations are provided, vibration generated by the operation personnel when taking and placing the semiconductor chips at the test station can affect the stability of the semiconductor chips at the test station, which not only affects the accuracy of the test, but also can easily cause short circuit of the probes of the semiconductor chips or the test probe, resulting in inaccurate test or chip damage.
[0003] Therefore, it is necessary to design a test device which facilitates simultaneous testing and taking and placing of semiconductor chips. UTILITY MODEL CONTENTS
[0004] In order to solve the above problems existing in the prior art, the present scheme provides a semiconductor chip processing test device.
[0005] The technical scheme adopted by the utility model is as follows:
[0006] A semiconductor chip processing test device: comprising a test table, a turntable, a test probe and a vertical telescoping device; the turntable is rotatably arranged above the tabletop of the test table and is driven by a rotary motor; test stations and taking and placing stations are arranged on opposite sides of the turntable, two horizontal moving tables arranged on the turntable can rotate between the test stations and the taking and placing stations, and the horizontal moving tables can move horizontally under the control of a horizontal moving module; semiconductor chips can be installed on the horizontal moving tables through a chip fixture; the test probe is arranged above the turntable and is controlled to ascend and descend by the vertical telescoping device, and the test probe can electrically contact the semiconductor chips at the test stations and test them;
[0007] A limiting hole is arranged at the edge of the turntable, and a limiting telescoping device is fixed on the test table, and the telescoping end of the limiting telescoping device is inserted into the limiting hole when it is extended, so as to limit the rotation of the turntable.
[0008] As an alternative or supplement to the above scheme: the rotary motor is arranged below the tabletop of the test table, and the rotary motor is in transmission connection with the turntable through a speed reducer; the speed reducer is fixed below the tabletop of the test table.
[0009] As an alternative or supplement to the above scheme: a connecting seat is arranged at the output end of the speed reducer, the turntable is composed of two semicircular plates, and the two horizontal moving tables are located on different semicircular plates; the two semicircular plates are connected with the connecting seat respectively and are fixed by bolts.
[0010] As an alternative or supplement to the above scheme: the rotating disc is higher than the table top of the test table, and an arc-shaped cover is arranged between the front side edge of the rotating disc and the table top of the test table.
[0011] As an alternative or supplement to the above scheme: the limiting telescopic device is arranged in the gap between the two arc-shaped covers; a limiting hole is arranged on each of the opposite sides of the rotating disc; and a limiting telescopic device is arranged on each of the left and right sides of the test table.
[0012] As an alternative or supplement to the above scheme: a probe mounting rack is arranged between the test probe and the telescopic end of the vertical telescopic device; the rear end of the probe mounting rack is connected with the vertical telescopic device, and the test probe is mounted at the front end of the probe mounting rack.
[0013] As an alternative or supplement to the above scheme: a plurality of jig mounting positions are arranged on the horizontal moving table, the arrangement direction of the plurality of jig mounting positions is the same as the moving direction of the horizontal moving table, a plurality of alignment holes are arranged at each of the jig mounting positions, and the alignment protrusions at the bottom of the chip jigs are inserted into the alignment holes to realize the mounting of the chip jigs.
[0014] As an alternative or supplement to the above scheme: the chip jigs are used for placing a plurality of semiconductor chips; and the arrangement direction of the semiconductor chips on each chip jig is the same as the moving direction of the horizontal moving table.
[0015] As an alternative or supplement to the above scheme: the moving directions of the two horizontal moving tables are parallel to each other and perpendicular to the radial direction of the rotating disc.
[0016] The beneficial effects of the present application are as follows: through the cooperation of the limiting telescopic device and the limiting hole, the position of the rotating disc is effectively stabilized during the chip testing and the chip picking and placing, the chip testing and the chip picking and placing are simultaneously facilitated, double-station synchronous operation is realized, and the testing efficiency of the chips is improved. BRIEF DESCRIPTION OF DRAWINGS
[0017] In order to more clearly illustrate the technical solutions in the embodiments of the present application or the prior art, the drawings needed to be used in the embodiments or the prior art description will be briefly introduced.
[0018] Figure 1 is a perspective view of a semiconductor chip processing and testing device in the present application;
[0019] Figure 2 is a side view of a semiconductor chip processing and testing device in the present application;
[0020] Figure 3 is a cooperation structure diagram of the rotating disc, the horizontal moving table, the rotating motor and the test probe;
[0021] Figure 4 isFigure 3 Left side view;
[0022] In the diagram: 1-Display screen; 2-Vertical telescopic device; 3-Test platform; 4-Limit telescopic device; 5-Rotary motor; 6-Arc-shaped cover; 7-Turntable; 8-Horizontal movement stage; 9-Test probe; 10-Button; 11-Horizontal movement module; 12-Reducer; 13-Chip fixture; 14-Horizontal movement base; 15-Limit hole; 16-Probe mounting bracket. Detailed Implementation
[0023] The technical solutions in this embodiment will be clearly and completely described below with reference to the accompanying drawings. The described embodiments are only a part of the embodiments, not all of them. All other embodiments obtained by those skilled in the art based on the embodiments in this solution without creative effort are within the protection scope of this solution.
[0024] like Figures 1 to 4 As shown, this embodiment designs a semiconductor chip processing and testing device, including components such as a test stage 3, a turntable 7, a test probe 9, and a vertical telescopic device 2.
[0025] The turntable 7 is rotatably mounted above the test platform 3 and is driven by a rotary motor 5. Specifically, the rotary motor 5 is located below the test platform 3 and is connected to the turntable 7 via a reducer 12. The reducer 12 is fixed below the test platform 3. Thus, the rotary motor 5 controls the turntable 7 to rotate between the testing station and the pick-and-place station.
[0026] Test stations and pick-and-place stations are set on opposite sides of turntable 7. Two transverse stages 8 on turntable 7 can rotate between the test stations and the pick-and-place stations to facilitate the pick-and-place of semiconductor chips at the pick-and-place stations and the testing of semiconductor chips at the test stations.
[0027] The bottom of the transverse stage 8 is connected to the transverse module 11 via the transverse base 14. The transverse stage 8 can move laterally under the control of the transverse module 11. When there are multiple semiconductor chips on the transverse stage 8, the semiconductor chips can be moved laterally, making it convenient for the test probe 9 to test different semiconductor chips. The movement directions of the two transverse stages 8 are parallel to each other and perpendicular to the radial direction of the turntable 7.
[0028] The semiconductor chip can be mounted on the horizontal moving table 8 through the chip fixture 13; specifically, a plurality of fixture mounting positions can be arranged on the horizontal moving table 8, the arrangement direction of the plurality of fixture mounting positions is the same as the moving direction of the horizontal moving table 8, a plurality of alignment holes are arranged at each fixture mounting position, the alignment protrusions at the bottom of the chip fixture 13 are inserted into the alignment holes to realize the mounting of the chip fixture 13. When the horizontal moving table 8 moves horizontally, the chip fixture 13 also moves with the horizontal moving table 8. The chip fixture 13 can be used for placing a plurality of semiconductor chips; the arrangement direction of the semiconductor chips on each chip fixture 13 is the same as the moving direction of the horizontal moving table 8.
[0029] The test probe 9 is arranged above the rotating disc 7 and is controlled to move up and down by the vertical telescopic device 2. The vertical telescopic device 2 can be a pneumatic cylinder, a hydraulic cylinder or an electric cylinder. When the telescopic end of the vertical telescopic device 2 telescopes, the test probe 9 can be controlled to move up and down above the rotating disc 7, so that when the test probe 9 contacts the semiconductor chip, each probe of the test probe 9 is in electrical contact with each pin on the semiconductor chip, thereby realizing the electrical contact between the test probe 9 and the semiconductor chip at the test station. The test probe 9 is connected to the PLC controller or industrial computer for test control, so as to perform corresponding performance test on the semiconductor chip.
[0030] A display is fixed above the rear part of the test table 3. The display is in communication connection with the PLC controller or industrial computer, so as to display the test results by using the display.
[0031] A limiting hole 15 is arranged at the edge of the rotating disc 7, and a limiting telescopic device 4 is fixed on the test table 3. When the telescopic end of the limiting telescopic device 4 extends, it is inserted into the limiting hole 15 to limit the rotation of the rotating disc 7. When the operator performs the taking and placing operation of the semiconductor chip and the chip fixture 13 at the taking and placing station, since the rotating disc 7 is limited, the influence of the taking and placing operation on the position of the rotating disc 7 can be effectively reduced, the stability of the position of the rotating disc 7 is realized, and the stability of the semiconductor chip at the test station is further ensured, so that the chip test and the chip taking and placing operation can be performed simultaneously, the double-station synchronous operation is realized, and the test efficiency of the chip is improved.
[0032] A connecting seat is arranged at the output end of the speed reducer 12, and the rotating disc 7 is composed of two semicircular discs. The two semicircular discs are connected to the connecting seat respectively and are fixed by bolts. Since the two semicircular discs of the rotating disc 7 are independent of each other and the two horizontal moving tables 8 are located on different semicircular discs, the vibration transmission between the taking and placing station and the test station can be further reduced, and the stability of the position of the semiconductor chip during the test is effectively ensured.
[0033] The rotary disc 7 is higher than the table top of the test table 3, and an arc-shaped cover 6 is arranged between the front edge of the rotary disc 7 and the table top of the test table 3, and an arc-shaped cover 6 is also arranged between the front edge of the rotary disc 7 and the table top of the test table 3, which can reduce sundries from entering the lower part of the rotary disc 7, and also facilitates the cleaning of the lower part of the rotary disc 7 after the arc-shaped cover 6 is removed.
[0034] The limiting telescopic device 4 is arranged in the gap between the two arc-shaped covers 6; limiting holes 15 are arranged on the opposite sides of the rotary disc 7 respectively; and limiting telescopic devices 4 are arranged on the left and right sides of the test table 3 respectively.
[0035] The test probe 9 and the telescopic end of the vertical telescopic device 2 are provided with a probe mounting rack 16; the rear end of the probe mounting rack 16 is connected with the vertical telescopic device 2, and the test probe 9 is mounted on the front end of the probe mounting rack 16.
[0036] The working process of the device in the embodiment is as follows:
[0037] The operator places the semiconductor chip and the chip fixture 13 on the transverse moving table 8 of the taking and placing station, the rotary disc 7 drives the transverse moving table 8 to rotate, so that it moves to the test station, the test probe 9 contacts and tests the semiconductor chip, and after the transverse moving table 8 continuously moves to make multiple semiconductor chips complete the test, the rotary disc 7 drives the transverse moving table 8 to rotate again, so that it returns to the taking and placing station, and the operator replaces the semiconductor chip and the chip fixture 13.
[0038] In the above process, since the limiting telescopic device 4 is used to limit the rotary disc 7, it can prevent the rotary disc 7 from rotating when the semiconductor chip is taken and placed, and reduce the transmission of vibration to the test station, so as to ensure that the semiconductor chip at the test station does not shake, thereby ensuring the contact reliability of the test probe 9 and the semiconductor chip, improving the test accuracy, reducing the risk of short circuit, inaccurate test, chip damage and the like, and facilitating the simultaneous performance of the chip test and the chip taking and placing operation.
[0039] In addition, the rotary disc 7 is composed of two semicircular discs, which can further reduce the transmission of vibration generated by taking and placing the semiconductor chip to the test station, and further improve the stability and accuracy during the test.
[0040] The above embodiment is only an example for clearly illustrating the purpose, and is not a limitation on the implementation mode; all the implementation modes are not required and cannot be exhausted here. The obvious changes or changes derived therefrom are still within the protection scope of the technology.
Claims
1. A semiconductor chip processing test apparatus, characterized by: The utility model relates to a semiconductor chip testing device, including test platform (3), carousel (7), test probe (9) and vertical telescoping device (2), carousel (7) rotatable setting in the test platform (3) table top, and by rotary motor (5) drive, test station and pick-and-place station are provided with carousel (7) opposite both sides, carousel (7) on the setting two horizontal movement platform (8) can rotate between test station and pick-and-place station, horizontal movement platform (8) can be controlled under horizontal movement module (11) and carry out horizontal movement, semiconductor chip can be installed to horizontal movement platform (8) through chip fixture (13), test probe (9) setting in the upper carousel (7), and by vertical telescoping device (2) control lift, test probe (9) can be electrically contacted with the semiconductor chip at test station and carry out test, Limiting hole (15) is arranged at the edge of carousel (7), limiting telescoping device (4) is fixed on the test platform (3), when the telescoping end of limiting telescoping device (4) is stretched, it is inserted into limiting hole (15), to limit the rotation of carousel (7).
2. The semiconductor chip processing test apparatus of claim 1, wherein: Rotary motor (5) is arranged below the table top of test platform (3), rotary motor (5) is transmission connection with carousel (7) through speed reducer (12), and the speed reducer (12) is fixed below the table top of test platform (3).
3. The semiconductor chip processing test apparatus of claim 2, wherein: The output end of speed reducer (12) is provided with connecting seat, carousel (7) is composed of two semicircular discs, and two horizontal movement platforms (8) are located on different semicircular discs respectively, and the two semicircular discs are connected with connecting seat respectively and are fixed by bolt.
4. The semiconductor chip processing test apparatus of claim 1, wherein: Carousel (7) is higher than the table top of test platform (3), and arc cover (6) is arranged between the front side edge of carousel (7) and the table top of test platform (3), and arc cover (6) is also arranged between the front side edge of carousel (7) and the table top of test platform (3).
5. The semiconductor chip processing test apparatus of claim 4, wherein: Limiting telescoping device (4) is arranged in the gap between two arc covers (6), limiting hole (15) is arranged at the opposite sides of carousel (7) respectively, and limiting telescoping device (4) is arranged at the left and right sides of test platform (3) respectively.
6. The semiconductor chip processing test apparatus of claim 1, wherein: Probe mounting rack (16) is arranged between test probe (9) and the telescoping end of vertical telescoping device (2), the rear end of probe mounting rack (16) is connected with vertical telescoping device (2), and test probe (9) is mounted at the front end of probe mounting rack (16).
7. The semiconductor chip processing test apparatus of claim 1, wherein: Horizontal movement platform (8) is provided with a plurality of jig mounting positions, the arrangement direction of a plurality of jig mounting positions is same with the moving direction of horizontal movement platform (8), a plurality of alignment holes are arranged at each jig mounting position, alignment protrusion at the bottom of chip fixture (13) is inserted into alignment hole, so as to realize the installation of chip fixture (13).
8. The semiconductor chip processing test apparatus of claim 7, wherein: Chip fixture (13) is used for the placement of a plurality of semiconductor chips, and the arrangement direction of semiconductor chips on each chip fixture (13) is same with the moving direction of horizontal movement platform (8).
9. The semiconductor chip processing test apparatus of claim 1, wherein: The moving direction of two horizontal movement platforms (8) is parallel to each other and perpendicular to the radial direction of carousel (7).