Integrated multichannel temperature controller and temperature control system

Abstract

The utility model relates to the technical field of temperature control, and specifically discloses an integrated multichannel temperature controller and a temperature control system wherein the integrated multichannel temperature controller is an integral body which is formed by a processor, a power supply module, a multichannel temperature acquisition module and a multichannel driving module and is used for acquiring and adjusting temperature. The whole body is arranged in the shell, so that the multi-channel temperature controller can form an integrated structure, the wiring operation of each module of the multi-channel temperature controller is simplified, and the wiring of the temperature controller with a temperature sensor or a temperature acquisition plate and a solid-state relay is also facilitated; meanwhile, by arranging the multi-channel temperature acquisition module and the multi-channel driving module, multi-channel monitoring can be carried out on the temperature of a plurality of temperature acquisition points, namely, the temperature acquisition points can be monitored at the same time through one integrated multi-channel temperature controller, and the on-off of a plurality of solid-state relays can be controlled to adjust the temperature. Stacking of a plurality of industrial controllers is avoided, the size is small, and the occupied space is small.

Description

TECHNICAL FIELD

[0001] The utility model relates to temperature control technical field, especially relate to a kind of integrated multi-channel temperature controller and temperature control system. BACKGROUND

[0002] Industrial temperature controller is a kind of equipment for monitoring and controlling temperature in production process, it plays a vital role in modern industrial production. The existing industrial temperature controller can only realize single-path control, when in multi-path application occasion, it needs to use the way of stacking multiple industrial temperature controllers, not only high cost, but also bulky, large space occupation. UTILITY MODEL CONTENT

[0003] The utility model aims at providing a kind of integrated multi-channel temperature controller that can realize multi-path channel monitoring, and temperature control system with the integrated multi-channel temperature controller.

[0004] The integrated multi-channel temperature controller of the utility model, including shell, processor is arranged in shell, power module for supplying power for the integrated multi-channel temperature controller, multi-channel temperature acquisition module for temperature acquisition, multi-channel drive module for controlling channel on-off;The power module is respectively electrically connected with the processor, the multi-channel temperature acquisition module, the multi-channel drive module;The multi-channel temperature acquisition module, the multi-channel drive module are respectively electrically connected with the processor.

[0005] The integrated multi-channel temperature controller of the utility model, by processor, power module, multi-channel temperature acquisition module and multi-channel drive module form a whole for collecting and adjusting temperature, and the whole is placed in shell, can make multi-channel temperature controller form integrated structure, simplify the wiring operation of each module of multi-channel temperature controller, also be conducive to the wiring of temperature controller and temperature sensor or temperature acquisition board and solid-state relay;Meanwhile, by setting multi-channel temperature acquisition module and multi-channel drive module, the temperature of multiple temperature acquisition points can be monitored in multi-channel, that is, multiple temperature acquisition points can be monitored simultaneously by a integrated multi-channel temperature controller, and the on-off of multiple solid-state relays is controlled to adjust temperature, avoid multiple industrial controllers stacking, small volume, small space occupation.

[0006] Further, the multi-channel temperature acquisition module comprises at least one multi-channel temperature acquisition chip, at least one multi-channel temperature detection device interface module and at least one signal filtering and conditioning circuit, the signal filtering and conditioning circuit comprises a resistor R10, a resistor R14, a resistor R15, a capacitor C19 and a capacitor C20, one end of the resistor R10 is electrically connected to an electrical node VDD3V3, and the other end is electrically connected to a corresponding pin of the multi-channel temperature detection device interface, one end of the resistor R15 is electrically connected to a corresponding pin of the multi-channel temperature detection device interface, and the other end is electrically connected to one end of the resistor R14 and one end of the capacitor C20 respectively, the other end of the capacitor C20 is grounded, and the other end of the resistor R14 is electrically connected to a corresponding pin of the multi-channel temperature acquisition chip and one end of the capacitor C19 respectively, and the other end of the capacitor C19 is grounded; the multi-channel temperature acquisition chip is electrically connected to the processor.

[0007] Further, the multi-channel driving module comprises at least one multi-channel driving chip, at least one current limiting protection circuit and at least one load interface module, the current limiting protection circuit comprises a resistor R66 and a diode, one end of the resistor R66 is electrically connected to a corresponding pin of the multi-channel driving chip, the other end is electrically connected to one end of the diode, and the other end of the diode is grounded; the load interface module is electrically connected to the current limiting protection circuit.

[0008] Further, the output mode of the multi-channel driving chip is PNP or NPN.

[0009] Further, the power module comprises a power interface module, a first-stage voltage conversion circuit and a second-stage voltage conversion circuit, the power interface module, the first-stage voltage conversion circuit and the second-stage voltage conversion circuit are connected in series; after being subjected to voltage reduction by the first-stage voltage conversion circuit, current flows to the second-stage voltage conversion circuit, and after being subjected to voltage reduction again by the second-stage voltage conversion circuit, the working voltage of the integrated multi-channel temperature controller is formed.

[0010] Further, the first-stage voltage conversion circuit comprises a power conversion chip for voltage reduction, and capacitors C1, C2 and C3 are connected between the power input pin and the ground pin of the power conversion chip, the capacitors C1, C2 and C3 are connected in parallel; capacitors C4, C5 and C6 are connected between the power output positive pin and the power output negative pin of the power conversion chip, the capacitors C4, C5 and C6 are connected in parallel, and the parallel circuit formed by the capacitors C4, C5 and C6 is connected to an electrical node VDD5V, and the electrical node VDD5V is electrically connected to the second-stage voltage conversion circuit.

[0011] Further, the second-stage voltage conversion circuit comprises a buck circuit chip, a capacitor C11, a capacitor C12, a capacitor C13, a capacitor C14, a capacitor C15, a capacitor C16 and a capacitor C17, the capacitor C11 and the capacitor C12 are connected in parallel and connected to an output pin of the buck circuit chip, the capacitor C13, the capacitor C14, the capacitor C15, the capacitor C16 and the capacitor C17 are connected in parallel and connected to an output pin of the buck circuit chip, the parallel circuit formed by the capacitor C11 and the capacitor C12 is connected in series with the parallel circuit formed by the capacitor C13, the capacitor C14, the capacitor C15, the capacitor C16 and the capacitor C17, and the parallel circuit formed by the capacitor C13, the capacitor C14, the capacitor C15, the capacitor C16 and the capacitor C17 is electrically connected to an electrical node VDD3V3; an input pin of the buck circuit chip is electrically connected to the first-stage voltage conversion circuit.

[0012] Further, the integrated multi-channel temperature controller further comprises an ambient temperature detection sensor, which is electrically connected to the processor.

[0013] Further, the integrated multi-channel temperature controller further comprises a maintenance interface, which is electrically connected to the processor.

[0014] Alternatively, the integrated multi-channel temperature controller further comprises an RS485 interface, which is electrically connected to the processor and is electrically connected to a controller through an RS485 line.

[0015] Alternatively, the integrated multi-channel temperature controller further comprises a FLASH memory, which is electrically connected to the processor.

[0016] The utility model discloses a temperature control system, including controller, still include at least one above-mentioned integrated multi-channel temperature controller, the integrated multi-channel temperature controller passes through RS485 line and is electrically connected with the controller, the multi-channel temperature acquisition module in the integrated multi-channel temperature controller is electrically connected with a plurality of temperature sensors or a plurality of temperature acquisition boards, the multi-channel drive module in the integrated multi-channel temperature controller is electrically connected with a plurality of solid state relays, and each solid state relay is electrically connected with heating element, the quantity of temperature sensor or the quantity of temperature acquisition board is same with the quantity of solid state relay

[0017] The temperature control system described in this utility model has at least one integrated multi-channel temperature controller, and the integrated multi-channel temperature controller and the controller are connected by RS485 wired connection. Therefore, multiple integrated multi-channel temperature controllers can be expanded according to the actual number of temperature acquisition points required, and multiple channels of temperature monitoring and adjustment can be performed. In addition, since one integrated multi-channel temperature controller can realize multi-channel temperature monitoring and adjustment, the overall size of the temperature control system is also significantly reduced, occupying less space. Attached Figure Description

[0018] The above and other objects, features, and advantages of this invention will become clearer through a more detailed description of the preferred embodiments shown in the accompanying drawings. The same reference numerals indicate the same parts throughout the drawings, and the drawings are not intentionally drawn to scale with actual dimensions; the focus is on illustrating the gist of this invention.

[0019] Figure 1 This is a schematic diagram of the integrated multi-channel temperature controller of this utility model.

[0020] Figure 2 This is a perspective view of the integrated multi-channel temperature controller of this utility model.

[0021] Figure 3 This is the circuit schematic of the power module.

[0022] Figure 4 This is the circuit schematic of a multi-channel temperature acquisition module.

[0023] Figure 5 This is the circuit schematic of a multi-channel drive module.

[0024] Figure 6 This is the schematic diagram of the processor.

[0025] Figure 7 This is a schematic diagram of the connection structure of the temperature control system in this utility model. Detailed Implementation

[0026] To facilitate understanding of this utility model, a more comprehensive description will be given below with reference to the accompanying drawings.

[0027] It should be noted that when a component is considered to be "connected" to another component, it can be directly connected to and integrated with the other component, or there may be an intervening component present. The terms "mounted," "one end," "the other end," and similar expressions used in this document are for illustrative purposes only.

[0028] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this technology belongs. The terminology used in the description herein is for describing particular embodiments only and is not intended to be limiting of the present technology. As used herein, the term "and / or" includes any and all combinations of one or more of the associated listed items.

[0029] The utility model provides a kind of integrated multi-channel temperature controller's specific implementation, see Figure 1 And Figure 2 、 Figure 6 , including shell, processor, power module are provided in shell, multi-channel temperature acquisition module for temperature acquisition, multi-channel drive module for controlling channel on-off. Power supply circuit is used to provide power supply for integrated multi-channel temperature controller, that is, power module is electrically connected with processor, the multi-channel temperature acquisition module, the multi-channel drive module respectively, power module is electrically connected with external power supply by power supply interface module (such as row pin), since external power supply is usually 220V or 380V industrial power, so as to ensure the normal work of temperature controller, it needs to be reduced by power supply circuit to external power supply to provide the normal working voltage of processor, multi-channel temperature acquisition module, multi-channel drive module and other circuit structures or electric components. Multi-channel temperature acquisition module, multi-channel drive module are electrically connected with processor respectively.

[0030] In preferred embodiment, see Figure 3, the power module includes a power interface module P1 (such as a pin), a first voltage conversion circuit and a second voltage conversion circuit, the power interface module, the first voltage conversion circuit and the second voltage conversion circuit are connected in series; the current is reduced by the first voltage conversion circuit and then flows to the second voltage conversion circuit, and the current is reduced again by the second voltage conversion circuit to form the working voltage of the integrated multi-channel temperature controller. In this embodiment, the current is reduced by the first voltage conversion circuit to form a 5V voltage, and then reduced again by the second voltage conversion circuit to form a 3V-3.5V working voltage, for example, a 3.3V working voltage, to power the integrated multi-channel temperature controller; specifically, the first voltage conversion circuit includes a power conversion chip (M1 in the figure) for voltage reduction, the power conversion chip is a prior art, and the power conversion chip is connected with a capacitor C1, a capacitor C2 and a capacitor C3 between the power input pin and the ground pin, and the capacitor C1, the capacitor C2 and the capacitor C3 are connected in parallel; the power conversion chip is connected with a capacitor C4, a capacitor C5 and a capacitor C6 between the power output positive pin and the power output negative pin, and the capacitor C4, the capacitor C5 and the capacitor C6 are connected in parallel and connected to the electrical node VDD5V through the parallel circuit formed by the capacitor C4, the capacitor C5 and the capacitor C6, and the electrical node VDD5V is electrically connected with the second voltage conversion circuit, specifically, the input pin IN of the voltage reduction circuit chip in the second voltage conversion circuit, to provide a 5V voltage to the second voltage conversion circuit; the filter network formed by the capacitor C1, the capacitor C2 and the capacitor C3 can filter out the noise and noise in the power input from the power interface module, stabilize the voltage, that is, the first level filtering, ensure that the voltage input to the power conversion chip is stable and pure, and ensure the normal work of the power conversion chip; the filter network formed by the capacitor C4, the capacitor C5 and the capacitor C6 further performs low-frequency filtering on the power reduced by the power conversion chip, that is, the second level filtering; the first voltage conversion circuit further includes a capacitor C7 and a capacitor C8, the capacitor C7 and the capacitor C8 are connected in parallel, and one end of the parallel circuit formed by the capacitor C7 and the capacitor C8 is electrically connected to the electrical node VDD5V, and the other end is grounded; the filter network formed by the capacitor C7 and the capacitor C8 can eliminate high-frequency interference in the power, that is, the third level filtering, to realize the stability and purity of the power flowing into the second voltage conversion circuit.The second-stage voltage conversion circuit comprises a voltage reduction circuit chip (labeled as U3 in the figure), a capacitor C11, a capacitor C12, a capacitor C13, a capacitor C14, a capacitor C15, a capacitor C16 and a capacitor C17; wherein the voltage reduction circuit chip is a prior art; the capacitor C11 and the capacitor C12 are connected in parallel and connected to an output pin of the voltage reduction circuit chip, the capacitor C13, the capacitor C14, the capacitor C15, the capacitor C16 and the capacitor C17 are connected in parallel and connected to an output pin of the voltage reduction circuit chip, the parallel circuit formed by the capacitor C11 and the capacitor C12 is connected in series with the parallel circuit formed by the capacitor C13, the capacitor C14, the capacitor C15, the capacitor C16 and the capacitor C17, and the parallel circuit formed by the capacitor C13, the capacitor C14, the capacitor C15, the capacitor C16 and the capacitor C17 is electrically connected to an electrical node VDD3V3; an input pin of the voltage reduction circuit chip is electrically connected to the first-stage voltage conversion circuit, specifically, an input pin IN of the voltage reduction circuit chip is electrically connected to the electrical node VDD5V; through the joint action of the capacitor C11 and the capacitor C12, the power output by the voltage reduction circuit chip can be filtered and isolated from power supply noise; through the joint action of the capacitor C13 and the capacitor C14, energy storage and decoupling can be performed to stabilize the internal voltage of the power supply module; through the joint action of the capacitor C15, the capacitor C16 and the capacitor C17, the output power can be further filtered to ensure the purity of the voltage at the load end. The power interface module is arranged on the outer surface of the shell so that the joint of the power cord can be inserted.

[0031] In the embodiment, the multi-channel temperature acquisition module is electrically connected with the processor and acquires temperature from the temperature detection device such as the temperature sensor or the temperature acquisition board, and sends the acquired temperature data information to the processor. The multi-channel temperature acquisition module can be electrically connected with multiple temperature sensors, and the temperature sensor can be NTC (i.e. thermistor), thermocouple or PT100; when the temperature acquisition points are more, the temperature controller can be directly electrically connected with multiple temperature acquisition boards to improve the accuracy of temperature acquisition; for details, see Figure 4The multi-channel temperature acquisition module comprises at least one multi-channel temperature acquisition chip (labeled as U6 in the figure), at least one multi-channel temperature detection device interface module, and at least one signal filtering and conditioning circuit. The multi-channel temperature acquisition chip is a prior art and can be a commercially available multi-channel electronic switch chip. The number of multi-channel temperature acquisition chips is set according to actual requirements. If more data needs to be collected, the number of multi-channel temperature acquisition chips can be increased. In the embodiment, an implementation in which two eight-channel temperature acquisition chips (labeled as U6 and U7 in the figure) are used is given. Each eight-channel temperature acquisition chip controls eight signal filtering and conditioning circuits. The number of multi-channel temperature detection device interface modules is the same as the number of multi-channel temperature acquisition chips. In the embodiment, two eight-channel temperature detection device interface modules (labeled as P2 and P4 in the figure) are also provided. The multi-channel temperature detection device interface module can be a plug interface such as a pin. The signal filtering and conditioning circuit comprises a resistor R10, a resistor R14, a resistor R15, a capacitor C19, and a capacitor C20. One end of the resistor R10 is electrically connected to an electrical node VDD3V3, thereby providing power for the multi-channel temperature acquisition module. The other end of the resistor R10 is electrically connected to a corresponding pin of the multi-channel temperature detection device interface. One end of the resistor R15 is electrically connected to a corresponding pin of the multi-channel temperature detection device interface. The other end of the resistor R15 is electrically connected to one end of the resistor R14 and one end of the capacitor C20, respectively. The other end of the capacitor C20 is grounded. The other end of the resistor R14 is electrically connected to a corresponding pin of the multi-channel temperature acquisition chip and one end of the capacitor C19, respectively. The other end of the capacitor C19 is grounded. The signal filtering and conditioning circuit can perform noise suppression and conditioning on the input signal. The multi-channel temperature acquisition chip is electrically connected to the processor, thereby realizing transmission of the collected signal to the processor.

[0032] In the preferred embodiment, the multi-channel drive module is electrically connected to the processor and controls the on-off of the corresponding solid-state relay according to the instructions sent by the processor. Specifically, referring to Figure 5The multi-channel drive module comprises at least one multi-channel drive chip, at least one current-limiting protection circuit, and at least one load interface module. The multi-channel drive chip is a prior art and can be a commercially available multi-channel half-bridge drive chip. The number of multi-channel drive chips is set according to actual requirements. In this embodiment, one eight-channel drive chip (identified as U8 in the figure) is provided for controlling eight current-limiting protection circuits, i.e., eight solid-state relays (SSRs) can be connected. The load interface module in this embodiment is an eight-way load interface module and can be electrically connected to the eight solid-state relays. The current-limiting protection circuit comprises a resistor R66 and a diode. One end of the resistor R66 is electrically connected to a corresponding pin of the multi-channel drive chip, the other end is electrically connected to one end of the diode, and the other end of the diode is grounded. The current-limiting protection circuit is provided to ensure that the current of the output channel (such as OUTPUT1 shown in the figure) is stable within a safe range, thereby protecting the multi-channel drive chip and the solid-state relay. In addition, the output mode of the multi-channel drive chip is PNP or NPN. Furthermore, the multi-channel drive module further comprises a capacitor C57 and a capacitor C58. The capacitor C57 and the capacitor C58 are connected in parallel, and one end of the parallel circuit formed by the capacitor C57 and the capacitor C58 is connected to an electrical node VDD3V3, and the other end is grounded. By providing the capacitor C57 and the capacitor C58, the power supply input to the multi-channel drive module can be filtered and decoupled.

[0033] In this embodiment, the processor is used to send temperature acquisition instructions to the multi-channel temperature acquisition module and receive temperature data information sent by the multi-channel temperature acquisition module. The processor sends on-off instructions to the multi-channel driving module according to the temperature data information sent by the multi-channel temperature acquisition module, so that the multi-channel driving module controls the on-off of the corresponding solid-state relay according to the on-off instructions. The processor can adopt MCU (identified as U5 in the figure); the processor can identify the number of channels of the multi-channel temperature acquisition module and the number of channels of the multi-channel driving module, and can collect temperature data on all channels of the multi-channel temperature acquisition module in turn, or can collect temperature data on any channel of the multi-channel temperature acquisition module. The number of channels of the multi-channel driving module is consistent with the number of channels of the multi-channel temperature acquisition module, and one-to-one correspondence, the processor according to the temperature data collected on any channel of the multi-channel temperature acquisition module, and make the corresponding channel of the multi-channel driving module connected to the solid-state relay on-off, in order to realize the adjustment of temperature; the data processing method in the processor is prior art, which can refer to the processing method of the microprocessor unit in the parameter self-tuning PID temperature control method disclosed in Chinese patent CN113946172B, or refer to the program of the temperature control method running on the processor in the temperature control method, device, electronic equipment and storage medium disclosed in Chinese patent CN119144934A, or refer to the temperature control method stored in the MCU processor in the plastic machine temperature integrated controller disclosed in Chinese patent CN218003992U. The invention point of the utility model is not in the data processing method in the processor, but in the hardware connection relationship.

[0034] In this embodiment, the integrated multi-channel temperature controller is formed by the processor, the power module, the multi-channel temperature acquisition module and the multi-channel driving module for collecting and adjusting temperature, and is placed in the shell, so that the multi-channel temperature controller forms an integrated structure, simplifies the wiring operation of each module of the multi-channel temperature controller, and is also beneficial to the wiring of the temperature controller, the temperature sensor or the temperature acquisition board and the solid-state relay. At the same time, by setting the multi-channel temperature acquisition module and the multi-channel driving module, the temperature of multiple temperature acquisition points can be monitored in multiple channels, that is, multiple temperature acquisition points can be monitored simultaneously by one integrated multi-channel temperature controller, and the on-off of multiple solid-state relays can be controlled to adjust the temperature, avoiding the stacking of multiple industrial controllers, small size and small space occupation.

[0035] In the preferred embodiment, the integrated multi-channel temperature controller further comprises an ambient temperature detection sensor, which is electrically connected to the processor, and sends the detected ambient temperature data to the processor. The ambient temperature sensor can also be a thermistor (also known as NTC). By providing an ambient temperature detection sensor, the working ambient temperature of the integrated multi-channel temperature controller can be monitored, and the temperature anomaly caused by abnormal operation of other equipment can be determined according to the working ambient temperature.

[0036] In the preferred embodiment, the integrated multi-channel temperature controller further comprises a maintenance interface, which is electrically connected to the processor. By providing a maintenance interface, parameter configuration, fault code reading and other operations can be performed.

[0037] In the preferred embodiment, the integrated multi-channel temperature controller further comprises an RS485 interface, which is electrically connected to the processor, and is electrically connected to the controller through an RS485 line; to realize communication between the integrated multi-channel temperature controller and the upper computer.

[0038] In the preferred embodiment, the integrated multi-channel temperature controller further comprises a FLASH memory, which is electrically connected to the processor. Specifically, in the present example, the FLASH memory is electrically connected to the processor through an SPI interface. By providing a FLASH memory, data storage, data transmission and firmware storage can be achieved.

[0039] In the preferred embodiment, an LED status indicator light is provided on the shell, which is electrically connected to the processor. The LED status indicator light is used to receive the status instruction sent by the processor and operate based on the status instruction to show the working status of the processor. The LED status indicator light can be a light emitting diode (Light Emitting Diode), which can have only one or multiple, and the working status of the processor can be shown by displaying different colors or different frequency of the LED status indicator light, including normal working state, standby state, fault state or stop working state. Specifically, the processor sends different status instructions to the LED status indicator light in different working states to control the LED status indicator light to operate based on the status instruction and show the working status of the processor. For example, when the processor is suspended, the LED status indicator light is sent a red light display instruction to control the LED status indicator light to display red, informing the technician that the processor is suspended.

[0040] The utility model also provides a specific embodiment of a temperature control system, which is described in detail below. Figure 7The temperature control system comprises a controller, and at least one integrated multi-channel temperature controller, the number of the integrated multi-channel temperature controllers is determined according to the temperature acquisition points and distribution range of the actual monitored environment, the integrated multi-channel temperature controller is electrically connected with the controller through an RS485 line, when the integrated multi-channel temperature controller has multiple integrated multi-channel temperature controllers, the multiple integrated multi-channel temperature controllers are arranged in parallel and are electrically connected to the controller through the RS485 line, and the controller can adopt a PLC; the multi-channel temperature acquisition module in the integrated multi-channel temperature controller is electrically connected with multiple temperature sensors or multiple temperature acquisition boards, and the multi-channel driving module in the integrated multi-channel temperature controller is electrically connected with multiple solid-state relays; each solid-state relay is electrically connected with a heating element, and the number of the temperature sensors or the number of the temperature acquisition boards is the same as the number of the solid-state relays.

[0041] The temperature control system has the integrated multi-channel temperature controller, the integrated multi-channel temperature controller is electrically connected with the controller through the RS485 line, multiple integrated multi-channel temperature controllers can be expanded according to the number requirement of the actual temperature acquisition points, temperature monitoring and adjustment of more channels can be carried out, in addition, the temperature monitoring and adjustment of multiple channels can be realized by one integrated multi-channel temperature controller, and the overall volume of the temperature control system formed by the integrated multi-channel temperature controller is also greatly reduced, and the occupied space is small.

[0042] In the present application, unless otherwise explicitly specified and limited, the first feature is "on" or "under" the second feature, which can be direct contact between the first and second features, or indirect contact through an intermediate medium. Moreover, the first feature can be directly above or obliquely above the second feature, or only indicate that the first feature is higher than the second feature in horizontal height. The first feature can be directly below or obliquely below the second feature, or only indicate that the first feature is lower than the second feature in horizontal height.

[0043] In the description of the present application, the description of the terms "preferred embodiment", "further embodiment", "other embodiment" or "specific example" means that the specific features, structures, materials or characteristics described in combination with the embodiment or example are contained in at least one embodiment or example of the present application. In the present application, the illustrative description of the above terms does not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described can be combined in any one or more embodiments or examples in a suitable manner. In addition, the skilled in the art can combine and combine the different embodiments or examples described in the present application and the features of the different embodiments or examples without contradiction.

[0044] Although the embodiments of the present application have been shown and described above, it is understood that the above embodiments are exemplary, and are not to be interpreted as limiting the present application, and those skilled in the art can make changes, modifications, replacements and variations to the above embodiments within the scope of the present application.

Claims

1. An integrated multi-channel temperature controller comprising a housing, characterized by: A processor, a power module for powering the integrated multi-channel temperature controller, a multi-channel temperature acquisition module for temperature acquisition, and a multi-channel drive module for controlling the on-off of channels are arranged in the shell; the power module is electrically connected with the processor, the multi-channel temperature acquisition module, and the multi-channel drive module; the multi-channel temperature acquisition module and the multi-channel drive module are electrically connected with the processor.

2. The integrated multi-channel temperature controller of claim 1, wherein: The multi-channel temperature acquisition module comprises at least one multi-channel temperature acquisition chip, at least one multi-channel temperature detection device interface module, and at least one signal filtering and conditioning circuit, the signal filtering and conditioning circuit comprises a resistor R10, a resistor R14, a resistor R15, a capacitor C19, and a capacitor C20, one end of the resistor R10 is electrically connected to an electrical node VDD3V3, and the other end is electrically connected to a corresponding pin of the multi-channel temperature detection device interface, one end of the resistor R15 is electrically connected to a corresponding pin of the multi-channel temperature detection device interface, and the other end is electrically connected with one end of the resistor R14 and one end of the capacitor C20, respectively, the other end of the capacitor C20 is grounded, the other end of the resistor R14 is electrically connected with a corresponding pin of the multi-channel temperature acquisition chip and one end of the capacitor C19, respectively, and the other end of the capacitor C19 is grounded; the multi-channel temperature acquisition chip is electrically connected with the processor.

3. The integrated multi-channel temperature controller of claim 1, wherein: The multi-channel drive module comprises at least one multi-channel drive chip, at least one current limiting protection circuit, and at least one load interface module, the current limiting protection circuit comprises a resistor R66 and a diode, one end of the resistor R66 is electrically connected to a corresponding pin of the multi-channel drive chip, the other end is electrically connected with one end of the diode, and the other end of the diode is grounded; the load interface module is electrically connected with the current limiting protection circuit.

4. The integrated multi-channel temperature controller of claim 3, wherein: The output mode of the multi-channel drive chip is PNP or NPN.

5. The integrated multi-channel temperature controller of claim 1, wherein: The power module comprises a power interface module, a first-stage voltage conversion circuit, and a second-stage voltage conversion circuit, which are connected in series; after being stepped down by the first-stage voltage conversion circuit, the current flows to the second-stage voltage conversion circuit, and after being stepped down again by the second-stage voltage conversion circuit, the working voltage of the integrated multi-channel temperature controller is formed.

6. The integrated multi-channel temperature controller of claim 5, wherein: The first-stage voltage conversion circuit comprises a power conversion chip for stepping down, and a capacitor C1, a capacitor C2, and a capacitor C3 are connected between the power input pin and the ground pin of the power conversion chip; a capacitor C4, a capacitor C5, and a capacitor C6 are connected between the power output positive pin and the power output negative pin of the power conversion chip, the capacitor C4, the capacitor C5, and the capacitor C6 are connected in parallel, and the parallel circuit formed by the capacitor C4, the capacitor C5, and the capacitor C6 is connected to an electrical node VDD5V, and the electrical node VDD5V is electrically connected with the second-stage voltage conversion circuit.

7. The integrated multi-channel temperature controller of claim 5, wherein: The second-stage voltage conversion circuit comprises a buck circuit chip, a capacitor C11, a capacitor C12, a capacitor C13, a capacitor C14, a capacitor C15, a capacitor C16 and a capacitor C17, the capacitor C11 and the capacitor C12 are connected in parallel and connected to an output pin of the buck circuit chip, the capacitor C13, the capacitor C14, the capacitor C15, the capacitor C16 and the capacitor C17 are connected in parallel and connected to an output pin of the buck circuit chip, the parallel circuit formed by the capacitor C11 and the capacitor C12 is connected in series with the parallel circuit formed by the capacitor C13, the capacitor C14, the capacitor C15, the capacitor C16 and the capacitor C17, and the parallel circuit formed by the capacitor C13, the capacitor C14, the capacitor C15, the capacitor C16 and the capacitor C17 is electrically connected to an electrical node VDD3V3; an input pin of the buck circuit chip is electrically connected to the first-stage voltage conversion circuit.

8. The integrated multi-channel temperature controller of claim 1, wherein: The integrated multi-channel temperature controller further comprises an ambient temperature detection sensor, which is electrically connected to the processor.

9. The integrated multi-channel temperature controller of claim 1, wherein: The integrated multi-channel temperature controller further comprises a maintenance interface, which is electrically connected to the processor. Alternatively, the integrated multi-channel temperature controller further comprises an RS485 interface, which is electrically connected to the processor and is electrically connected to the controller through an RS485 line. Alternatively, the integrated multi-channel temperature controller further comprises a FLASH memory, which is electrically connected to the processor.

10. A temperature control system comprising a controller, characterized by: The system further comprises at least one integrated multi-channel temperature controller according to any one of claims 1-9, which is electrically connected to the controller through an RS485 line; the multi-channel temperature acquisition module in the integrated multi-channel temperature controller is electrically connected to a plurality of temperature sensors or a plurality of temperature acquisition boards, and the multi-channel driving module in the integrated multi-channel temperature controller is electrically connected to a plurality of solid-state relays, each of which is electrically connected to a heating element, and the number of the temperature sensors or the number of the temperature acquisition boards is the same as the number of the solid-state relays.

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