Integrated alternating current temperature controller and temperature control system

By integrating the temperature control module, temperature acquisition module, and thyristor power output adjustment module into a single housing, the problem of difficult wiring and maintenance in existing temperature control systems is solved, achieving miniaturization and convenient installation of the temperature control system.

CN223956003UActive Publication Date: 2026-02-27GUANGZHOU RONGSHUO ELECTRONIC TECH CO LTD
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Patent Information

Application Number
CN202520838510.X
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2025-04-29
Publication Date
2026-02-27
Estimated Expiration
2035-04-29

AI Technical Summary

Technical Problem

In existing temperature control systems, the temperature control module, temperature acquisition module, and thyristor power output adjustment module exist independently, which makes on-site wiring difficult, maintenance difficult, and occupies a large space, making it difficult to adapt to environments with limited space.

Method used

The temperature control module, temperature acquisition module, and thyristor power output adjustment module are integrated into a single housing to form an integrated AC temperature controller, reducing the difficulty of on-site wiring and maintenance, and reducing the size through the stacking design of the PCB board.

Benefits of technology

It simplifies the on-site installation process, reduces wiring and maintenance difficulties, and significantly reduces the size of the temperature control system, making it more suitable for environments with limited space.

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Abstract

The utility model relates to the technical field of temperature control, and particularly discloses an integrated alternating current temperature controller and a temperature control system, the integrated alternating current temperature controller is formed by integrating a temperature control module, a temperature acquisition module and a silicon controlled rectifier power output adjusting module in an outer shell to form a whole body, and the temperature control module, the temperature acquisition module and the silicon controlled rectifier power output adjusting module are installed on site. The temperature control module, the temperature acquisition module and the silicon controlled rectifier power output adjusting module need wiring operation due to mutual independence in the prior art, field wiring difficulty and maintenance difficulty are reduced, the field installation process is simplified, meanwhile, the three modules are directly integrated in one shell, the situation that one shell is adopted independently is avoided, and the cost is reduced. And the size is greatly reduced, and the device is more suitable for an environment with limited space.
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Description

TECHNICAL FIELD

[0001] The utility model relates to temperature control technical field, especially related to an integrated alternating current temperature controller and temperature control system. BACKGROUND

[0002] In industrial production, the temperature control system is mainly used for detecting and adjusting the temperature of a specific environment, sensing the temperature change through a temperature sensor, and transmitting data to a control unit. The control unit compares the difference between the actual temperature and the target temperature according to the preset temperature range, and controls the on-off of the heating element through the execution unit, so that the temperature of the specific environment is maintained within the set temperature range.

[0003] Referring to the temperature control system and industrial oven disclosed in Chinese patent CN117812860B, when the temperature control system is applied, a corresponding number of power regulators are equipped according to the number of heating elements in the use environment, and each heating element is connected to one load terminal. When there is only one power regulator, the power regulator is directly connected in communication with the power adapter, and when there are multiple power regulators, the multiple power regulators are connected in communication in sequence, and the power regulator adjacent to the power adapter is connected in signal communication with the power adapter, so that one power adapter can control multiple power regulators at the same time. The power adapter is also connected in communication with the temperature control host, and the real-time temperature information is transmitted to the temperature control host through the temperature collection element. The temperature control host compares the received real-time temperature information with the preset target temperature, sends instructions to the power adapter according to the comparison result, and the power adapter receives the instructions and sends the on-off instructions to the power regulator control chip of the corresponding power regulator. The power regulator control chip in the power regulator controls the on-off of the corresponding thyristor according to the instructions transmitted by the power adapter, so as to control the on-off of the heating element connected with the thyristor. However, the temperature control system in the above-mentioned Chinese patent has a temperature control host, a power regulator assembly and a temperature collection element, which are independent individuals. The on-site wiring difficulty and maintenance difficulty are large, and the space occupation is also large. For some space-limited environments, it is not conducive to the placement of the temperature control system. SUMMARY

[0004] The utility model aims at solving the technical problems existing in the prior art, providing an integrated alternating current temperature controller, reducing the on-site wiring difficulty and maintenance difficulty, and reducing the volume to adapt to the space-limited environment. The utility model also provides a temperature control system with the integrated alternating current temperature controller.

[0005] To solve the above technical problems, the utility model provides the following technical scheme:

[0006] The utility model relates to an integrated alternating current temperature controller, including the shell body, be provided with weak current PCB board, strong current PCB board, temperature control module, temperature acquisition module and thyristor power output adjusting module in the shell body, weak current PCB board and strong current PCB board are connected with PCB connector electricity, and weak current PCB board and strong current PCB board are in the shell and are in the state of stacking, temperature acquisition module includes at least one input terminal for with external temperature detection device electricity connection and at least one temperature acquisition circuit with input terminal electricity connection, temperature acquisition circuit is connected on weak current PCB board, and with temperature control module electricity connection, input terminal sets up on the shell body and is connected with strong current PCB board inside the shell body electricity, the thyristor power output adjusting module includes at least one output terminal for with external heating piece electricity connection and at least one thyristor drive circuit with output terminal electricity connection, output terminal sets up on the shell body and is connected with strong current PCB board inside the shell body electricity, thyristor drive circuit is connected on strong current PCB board, and with temperature control module electricity connection.

[0007] The utility model discloses an integrated alternating current temperature controller, integrates temperature control module, temperature acquisition module and thyristor power output adjusting module in a shell body, forms a whole, when installing on site, reduced the operation of wiring of temperature control module, temperature acquisition module and thyristor power output adjusting module independent in prior art, reduces the difficulty of on-site wiring and maintenance difficulty, simplifies the on-site installation technology, simultaneously, directly integrates three in a shell interior, avoids each independent adoption a shell, greatly reduces the volume, is more favorable to adapt to the environment of limited space.

[0008] Further, the temperature acquisition circuit includes resistance R42, resistance R47, resistance R54, resistance R61, capacitor C13, capacitor C16 and capacitor C21, one end of the resistance R42 is electrically connected with the terminal K1+ and one end of the resistance R47 respectively, the other end of the resistance R42 is electrically connected with the analog-digital conversion chip, one end of the capacitor C13 and one end of the capacitor C16 respectively, one end of the resistance R61 is electrically connected with the terminal K1- and one end of the resistance R54 respectively, the other end of the resistance R61 is electrically connected with the analog-digital conversion chip, the other end of the capacitor C16 and one end of the capacitor C21 respectively, the other end of the resistance R47 is electrically connected to the electrical node AVCC3V3, the other end of the resistance R54 is grounded, the other end of the capacitor C13 is electrically connected with the other end of the capacitor C21.

[0009] Further, the temperature acquisition circuit further includes an optical coupler VD1, the anode of the optical coupler VD1 is electrically connected with the terminal K1+, the cathode of the optical coupler VD1 is electrically connected with the terminal K1-, and the collector of the optical coupler VD1 is grounded.

[0010] Further, the silicon controlled drive circuit includes a silicon controlled drive and power regulation circuit; the silicon controlled drive and power regulation circuit includes a resistor R50, a resistor R45, a resistor R52, a variable resistor VR1, a capacitor C20, a resistor R59, a silicon controlled and a silicon controlled optocoupler, one end of the resistor R50 is electrically connected to the temperature control module, the other end is electrically connected to the cathode pin of the silicon controlled optocoupler, the anode pin of the silicon controlled optocoupler is electrically connected to the electrical node VDD5V, the first output pin of the silicon controlled optocoupler is electrically connected to one end of the resistor R45, the second output pin of the silicon controlled optocoupler is respectively electrically connected to one end of the resistor R52 and the silicon controlled, the other end of the resistor R52 is electrically connected to the corresponding pin of the output terminal, the capacitor C20 and the resistor R59 are connected in series, the series circuit formed by the capacitor C20 and the resistor R59 is connected in parallel with the silicon controlled, the variable resistor VR1, one end of the parallel circuit formed by the series circuit, the silicon controlled and the variable resistor VR1 is electrically connected to the other end of the resistor R45, and the other end is electrically connected to the other end of the resistor R52.

[0011] Further, the silicon controlled drive circuit further includes an LED state indication circuit; the LED state indication circuit includes a resistor R40 and an optocoupler U5, one end of the resistor R40 is electrically connected to the corresponding pin of the output terminal, the other end is electrically connected to the anode pin of the optocoupler U5, the cathode pin of the optocoupler U5 is electrically connected to the corresponding pin of the output terminal, the collector of the optocoupler U5 is electrically connected to the corresponding LED lamp, and the emitter of the optocoupler U5 is grounded.

[0012] Further, a dial switch is further arranged on the shell body, and the dial switch is electrically connected to the temperature control module through an I / O interface.

[0013] Further, a digital tube display screen is further arranged on the shell body, and the digital tube display screen is electrically connected to the temperature control module through a digital tube drive chip.

[0014] Further, a heat dissipation fan and a first temperature sensor for monitoring the working temperature of the heat dissipation fan are arranged in the shell body, the heat dissipation fan is electrically connected to the temperature control module, and the first temperature sensor is electrically connected to the temperature control module through an analog-to-digital converter;

[0015] Alternatively, a heat dissipation hole is further arranged on the shell body.

[0016] Further, an RS485 interface module is arranged in the outer shell, the RS485 interface module comprises RS485 interface terminals, an RS485 interface chip and an isolation chip, the RS485 interface terminals, the RS485 interface chip and the isolation chip are sequentially and orderly electrically connected, the isolation chip is further electrically connected with the temperature control module, and the RS485 interface terminals are arranged on the surface of the outer shell.

[0017] Alternatively, the integrated AC temperature controller further comprises a FLASH memory, the FLASH memory is arranged in the outer shell and is electrically connected with the temperature control module.

[0018] The utility model discloses a temperature control system, including integrated AC temperature controller above, integrated AC temperature controller passes through RS485 line and is connected with the controller electricity, integrated AC temperature controller passes through temperature acquisition module and is connected with at least one temperature detection device electricity, integrated AC temperature controller passes through silicon controlled rectifier power output adjustment module and is connected with at least one heating piece electricity.

[0019] The utility model discloses a temperature control system, because of having integrated AC temperature controller above, thus the volume of whole temperature control system is greatly reduced, and the space occupation is little, and wiring is little, and the difficulty of field wiring and the difficulty of maintenance are reduced. BRIEF DESCRIPTION OF DRAWINGS

[0020] The above and other objects, features and advantages of the present application will become more apparent from the following detailed description when taken in conjunction with the accompanying drawings. In the drawings similar reference characters denote similar elements throughout the several views, but the size and scale of elements are not necessarily shown to scale for illustrative clarity. The emphasis is on the principles of the present application.

[0021] Figure 1 It is the structure schematic diagram of integrated AC temperature controller in the utility model.

[0022] Figure 2 It is Figure 1 It is the structure schematic diagram of removing outer shell.

[0023] Figure 3 It is the principle block diagram of integrated AC temperature controller.

[0024] Figure 4 It is the temperature acquisition module circuit principle block diagram.

[0025] Figure 5 It is the silicon controlled rectifier power output adjustment module circuit principle block diagram.

[0026] Figure 6 It is the temperature control module circuit principle block diagram.

[0027] Figure 7The temperature control system connection structure schematic diagram of the utility model. DETAILED DESCRIPTION

[0028] For the purpose of facilitating understanding of the utility model, the following will make a more comprehensive description of the utility model with reference to the relevant drawings.

[0029] It should be noted that when an element is considered to be "connected" to another element, it can be directly connected to the other element and integrated with the other element, or a middle element can exist simultaneously. The terms "mount", "one end", "the other end" and similar expressions used herein are only for the purpose of illustration.

[0030] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this technology belongs. The terms used in the specification herein are only for the purpose of describing specific embodiments and are not intended to limit the utility model. The term "and / or" used herein includes any and all combinations of one or more related listed items.

[0031] The utility model provides an embodiment of integrated alternating current temperature controller, see Figures 1-3 , including shell body 1, be provided with weak current PCB board 2, strong current PCB board 3, temperature control module, temperature acquisition module and thyristor power output adjusting module in shell body 1, weak current PCB board 2 and strong current PCB board 3 are electrically connected by PCB connector, and weak current PCB board 2 and strong current PCB board 3 are in the state of stacking in shell 1, with the Figure 2For example, the weak current PCB board 2 and the strong current PCB board 3 are stacked in the thickness direction of the shell 1; the temperature acquisition module includes at least one input terminal 4 for electrically connecting with an external temperature detection device and at least one temperature acquisition circuit electrically connected with the input terminal 4, the temperature acquisition circuit is electrically connected on the weak current PCB board 2 and electrically connected with the temperature control module, the input terminal 4 is arranged on the shell 1 and electrically connected with the strong current PCB board 3 inside the shell 1, the silicon controlled power output adjustment module includes at least one output terminal 5 for electrically connecting with an external heat generating part and at least one silicon controlled drive circuit electrically connected with the output terminal 5, the output terminal 5 is arranged on the shell 1 and electrically connected with the strong current PCB board 3 inside the shell 1, the silicon controlled drive circuit is electrically connected on the strong current PCB board 3 and electrically connected with the temperature control module. Specifically, the number of temperature acquisition circuits can be determined according to the number of connected temperature detection devices, and the number of input terminals 4 corresponds to and matches the number of temperature acquisition circuits one by one, so that the temperature detection devices are electrically connected with the temperature acquisition circuits through the input terminals 4, and the collection of temperature data detected by the temperature detection devices is realized; the number of silicon controlled drive circuits of the silicon controlled power output adjustment module can be determined according to the number of connected heat generating parts, and the number of output terminals 5 corresponds to and matches the number of silicon controlled drive circuits one by one, so that the heat generating parts are electrically connected with the silicon controlled drive circuits through the output terminals 5, and the adjustment of the heating power of the heat generating parts is realized. In addition, in the embodiment, the temperature acquisition module is used to collect temperature data and send the collected temperature data to the temperature control module; the silicon controlled power output adjustment module is used to receive the output power size adjustment instruction sent by the temperature control module, and according to the output power size adjustment instruction, the heating temperature of the heat generating part is controlled; the temperature control module is used to receive the temperature data sent by the temperature acquisition module, form an output power size adjustment instruction according to the temperature data, and send the output power size adjustment instruction to the silicon controlled power output adjustment module. The temperature control module is a processor, which can be an MCU, mainly for data processing, and the data processing process of the temperature control module belongs to the prior art and is not the invention point of the utility model, specifically referring to the temperature control system and the industrial oven disclosed in Chinese patent CN117812860B, wherein the temperature control host can be the temperature control module, and the data processing process of the temperature control module refers to the data processing process of the temperature control host in Chinese patent CN117812860B.The integrated AC temperature controller in the embodiment integrates the temperature control module, the temperature acquisition module and the silicon controlled power output adjustment module in one shell to form a whole. When installed on site, the operation of wiring due to the independent temperature control module, the temperature acquisition module and the silicon controlled power output adjustment module in the prior art is reduced, the difficulty of on-site wiring and maintenance is reduced, the on-site installation process is simplified, meanwhile, the three are directly integrated in one shell, avoiding independent use of one shell, greatly reducing the volume, and being more conducive to adapting to the environment with limited space. In addition, in the embodiment, the PCB connector can be an FPC docking terminal, an FFC connector, a board-to-board (BTB) connector or a terminal pin array, etc.

[0032] In the preferred embodiment, referring to Figure 4The temperature acquisition circuit includes a resistor R42, a resistor R47, a resistor R54, a resistor R61, a capacitor C13, a capacitor C16 and a capacitor C21. One end of the resistor R42 is electrically connected with the terminal K1+ and one end of the resistor R47 respectively. The other end of the resistor R42 is electrically connected with an analog-digital conversion chip, one end of the capacitor C13 and one end of the capacitor C16 respectively. One end of the resistor R61 is electrically connected with the terminal K1- and one end of the resistor R54 respectively. The other end of the resistor R61 is electrically connected with the analog-digital conversion chip (marked as U22 in the figure), the other end of the capacitor C16 and one end of the capacitor C21 respectively. The other end of the resistor R47 is electrically connected to the electrical node AVCC3V3. The other end of the resistor R54 is grounded. The other end of the capacitor C13 is electrically connected with the other end of the capacitor C21. The analog-digital conversion chip is a prior art and can be purchased on the market. Specifically, in the above temperature acquisition circuit, the resistor-capacitor filter circuit formed by the resistor R42, the resistor R47, the resistor R54, the resistor R61, the capacitor C13, the capacitor C16 and the capacitor C21 can suppress noise, stabilize signals and be beneficial to the precision and stability of temperature signal acquisition. In the embodiment, eight temperature acquisition circuits are provided, and correspondingly, eight input terminals 4 are provided. The eight temperature acquisition circuits are electrically connected to the analog-digital conversion chip respectively. In addition, the temperature acquisition module further includes a capacitor C45, a capacitor C46 and a capacitor C47. The capacitor C45, the capacitor C46 and the capacitor C47 are connected in parallel. One end of the parallel circuit formed by the capacitor C45, the capacitor C46 and the capacitor C47 is electrically connected to the electrical node AVCC3V3, and the other end is grounded. The filter circuit formed by the capacitor C45, the capacitor C46 and the capacitor C47 can filter high-frequency noise in the power supply, the power supply voltage of the temperature analog-digital conversion chip and further ensure the precision and stability of temperature signal acquisition. In the embodiment, the structures of all the temperature acquisition circuits are the same. Only the marks of the resistors and the marks of the capacitors are represented by different numbers for the convenience of distinction. However, the consistency of the structures of the temperature acquisition circuits is not affected. The temperature acquisition module is electrically connected with the temperature detection device through the input terminal 4. The temperature detection device can be a thermocouple, a PT100 or an NTC. The temperature control module can collect temperature data of the temperature detection devices on all channels in turn or collect temperature data of the temperature detection devices on any channel. The selection is based on actual needs and belongs to the conventional technical means in the field.

[0033] In the preferred embodiment, the temperature acquisition circuit further comprises a photocoupler VD1, an anode of the photocoupler VD1 is electrically connected to the terminal K1+, a cathode of the photocoupler VD1 is electrically connected to the terminal K1-, and a collector of the photocoupler VD1 is grounded. The terminal K1+ and the terminal K1- are used to be electrically connected to an external temperature detection device. By arranging the photocoupler VD1, electrical isolation can be achieved, the chip lamp precision device can be protected from damage, mutual interference between circuits can be avoided, and system reliability can be improved; meanwhile, interference resistance can be achieved, accurate temperature signal transmission can be ensured, and signal distortion or acquisition error caused by interference can be avoided.

[0034] In the preferred embodiment, referring to Figure 5 The silicon controlled drive circuit comprises a silicon controlled drive and power regulation circuit; the silicon controlled drive and power regulation circuit comprises a resistor R50, a resistor R45, a resistor R52, a variable resistor VR1, a capacitor C20, a resistor R59, a silicon controlled (identified as Q4 in the figure), and a silicon controlled photocoupler (identified as U7 in the figure); one end of the resistor R50 is electrically connected to the temperature control module, the other end is electrically connected to a cathode pin of the silicon controlled photocoupler, an anode pin of the silicon controlled photocoupler is electrically connected to an electrical node VDD5V, a first output pin of the silicon controlled photocoupler is electrically connected to one end of the resistor R45, a second output pin of the silicon controlled photocoupler is respectively electrically connected to one end of the resistor R52 and the silicon controlled, the other end of the resistor R52 is electrically connected to a corresponding pin of the output terminal 5, the capacitor C20 and the resistor R59 are connected in series, the series circuit formed by the capacitor C20 and the resistor R59 is connected in parallel with the silicon controlled and the variable resistor VR1, one end of the parallel circuit formed by the series circuit, the silicon controlled, and the variable resistor VR1 is electrically connected to the other end of the resistor R45, and the other end is electrically connected to the other end of the resistor R52. Specifically, by the above silicon controlled drive and power regulation circuit, the conduction angle of the silicon controlled can be adjusted to control the output power of the alternating current power supply to the heat generating member, precise power regulation is achieved, and precise temperature control is realized. The silicon controlled drive and power regulation circuit is electrically connected to the heat generating member through the output terminal 5 to control the temperature of the heat generating member. In the embodiment, there are eight silicon controlled drive and power regulation circuits, which are respectively electrically connected to the temperature control module. Correspondingly, there are also eight output terminals 5, forming eight output terminals. There are eight heat generating members, and the eight heat generating members are respectively electrically connected to the output terminals. That is, the output terminals form eight channels, each channel connects one heat generating member. The temperature control module can control the temperature of the heat generating member in any channel through the silicon controlled drive and power regulation circuit, and the selection is made according to the actual needs, which belongs to the conventional technical means in the field. In the embodiment, the structures of all silicon controlled drive and power regulation circuits are the same, and only the marks of the resistors, the marks of the capacitors, the marks of the silicon controlled photocouplers, and the marks of the silicon controlled are represented by different numbers for the convenience of distinction, but this does not affect the consistency of the structures of the silicon controlled drive and power regulation circuits.

[0035] In the preferred embodiment, referring to Figure 5 The silicon controlled rectifier driving circuit further comprises an LED state indicating circuit; the LED state indicating circuit comprises a resistor R40, a photo-coupler U5, one end of the resistor R40 is electrically connected to the corresponding pin of the output terminal 5, the other end is electrically connected to the anode pin of the photo-coupler U5, the cathode pin of the photo-coupler U5 is electrically connected to the corresponding pin of the output terminal, the collector of the photo-coupler U5 is electrically connected to the corresponding LED lamp 8, and the emitter of the photo-coupler U5 is grounded. By setting the LED state indicating circuit, an intuitive working state can be provided. In the embodiment, the number of structures of the LED state indicating circuit is also multiple, and the structures of each LED state indicating circuit are consistent, and only for the convenience of distinction, the marks of the resistors R and the marks of the photo-couplers U are represented by different numbers, but it does not affect the consistency of the structures of the silicon controlled rectifier driving and power regulating circuits.

[0036] In the preferred embodiment, referring to Figure 1 The shell 1 is further provided with a code dial switch 6, and the code dial switch 6 is electrically connected to the temperature control module through an I / O interface. The code dial switch 6 in the embodiment is a four-bit code dial switch, the temperature control module reads the state of the code dial switch 6 through the I / O interface, and sets the state as the station number of the device or node.

[0037] In the preferred embodiment, referring to Figure 1 The shell 1 is further provided with a digital tube display screen 7, and the digital tube display screen 7 is electrically connected to the temperature control module through a digital tube driving chip. The temperature control module controls the actual content and brightness of the digital tube display screen 7 through the digital tube driving chip.

[0038] In the preferred embodiment, a heat dissipation fan and a first temperature sensor for monitoring the working temperature of the heat dissipation fan are arranged in the outer shell 1. The heat dissipation fan 12 is electrically connected with the temperature control module, and the first temperature sensor is electrically connected with the temperature control module through an analog-to-digital converter. The first temperature sensor monitors the temperature data of the heat dissipation fan in real time, and sends the temperature data to the temperature control module through the analog-to-digital converter. The temperature control module controls the rotating speed of the heat dissipation fan according to the received temperature data of the heat dissipation fan. In this embodiment, a heat dissipation aluminum part is also included, and a plurality of thyristors are arranged in double rows and spaced apart to clamp the heat dissipation aluminum part between the two rows of thyristors. Each thyristor is in close contact with the heat dissipation aluminum part. Since the thyristor generates a large amount of heat when working, it needs to be cooled in time to ensure the normal working of the integrated AC temperature controller. The heat dissipation aluminum part 11 is square in shape and has a cavity inside, and the cavity penetrates through both ends of the heat dissipation aluminum part. A plurality of heat dissipation fins are arranged on the inner wall of the cavity and spaced apart. The heat dissipation channels are formed between adjacent heat dissipation fins. By arranging a plurality of heat dissipation fins on the inner wall of the cavity of the heat dissipation aluminum part, the heat dissipation area of the heat dissipation aluminum part is increased, thereby improving the heat dissipation effect of the heat dissipation aluminum part. The heat dissipation fan is arranged on one port of the heat dissipation aluminum part. The heat dissipation fan 12 quickly removes the heat on the heat dissipation aluminum part to improve the heat dissipation effect and ensure the normal working of the integrated AC temperature controller. In addition, a heat dissipation hole 10 is also arranged on the outer shell 1 to further accelerate the heat dissipation of the heat inside the outer shell.

[0039] In the preferred embodiment, an RS485 interface module is also arranged in the outer shell. The RS485 interface module includes an RS485 interface terminal, an RS485 interface chip and an isolation chip, which are electrically connected in sequence. The isolation chip is also electrically connected with the temperature control module, and the RS485 interface terminal is arranged on the surface of the outer shell 1. By arranging the RS485 interface module, the RS485 line can be electrically connected with the upper computer. The upper computer can be a PLC. By arranging the isolation chip, the reliability, safety and anti-interference ability of the system can be effectively improved, the integrated AC temperature controller is protected from high voltage and electrical failure, the communication distance is prolonged, and the signal quality is improved.

[0040] In the preferred embodiment, the integrated AC temperature controller also includes a FLASH memory, which is arranged inside the outer shell and electrically connected with the temperature control module to store data in the temperature control module.

[0041] In the embodiment, the dial switch 6, the digital tube display screen 7, the LED lamp 8 and the FLASH memory are arranged on the weak-current PCB board 2, and the input terminal 4 of the temperature acquisition module, the RS485 interface module, the AC power interface 9, the heat dissipation fan and the first temperature sensor are arranged on the strong-current PCB board 3. The weak-current PCB board 3 and the strong-current PCB board 3 are arranged in a spaced apart manner in an up-down state, so that the shell body is smaller in size, the integrated AC temperature controller formed finally is smaller in size, the position requirements of the buttons, the interfaces, the LED lamp and other components on the shell body 1 can be met, and the appearance design requirements can be met.

[0042] The utility model also provides a kind of concrete implementation of temperature control system, refer to Figure 7 Including the integrated AC temperature controller described above, the integrated AC temperature controller is electrically connected with controller by RS485 line, the controller can be PLC, the integrated AC temperature controller is electrically connected with at least one temperature temperature detection device by temperature acquisition module, the integrated AC temperature controller is electrically connected with at least one heating element by silicon controlled power output adjustment module.The temperature control system has the integrated AC temperature controller described above, so that the volume of the whole temperature control system is greatly reduced, the space occupation is less, and the wiring is less, which reduces the difficulty of field wiring and maintenance.

[0043] In the present application, unless otherwise explicitly specified and limited, the first feature is "on" or "under" the second feature, which can be direct contact between the first and second features, or indirect contact through an intermediate medium. Moreover, the first feature "above", "above" and "above" the second feature can be directly above or obliquely above the first feature, or only indicate that the horizontal height of the first feature is higher than that of the second feature. The first feature "below", "below" and "below" the second feature can be directly below or obliquely below the first feature, or only indicate that the horizontal height of the first feature is less than that of the second feature.

[0044] In the description of the present application, the description of the terms "preferred embodiment", "another embodiment", "other embodiments" or "specific examples" means that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the present application. In the present application, the illustrative description of the above terms does not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described can be combined in any one or more embodiments or examples in a suitable manner. In addition, those skilled in the art can combine and combine different embodiments or examples described in the present application and the features of different embodiments or examples without contradiction.

[0045] Although the embodiments of the present application have been shown and described above, it is understood that the above-described embodiments are exemplary and are not to be construed as limiting the present application, and that changes, modifications, substitutions and variations can be made by those skilled in the art without departing from the scope of the present application.

Claims

1. An integrated AC thermostat, characterized by: The temperature acquisition circuit comprises a resistor R42, a resistor R47, a resistor R54, a resistor R61, a capacitor C13, a capacitor C16 and a capacitor C21, one end of the resistor R42 is electrically connected with the wiring terminal K1+ and one end of the resistor R47 respectively, the other end of the resistor R42 is electrically connected with an analog-digital conversion chip, one end of the capacitor C13 and one end of the capacitor C16 respectively, one end of the resistor R61 is electrically connected with the wiring terminal K1- and one end of the resistor R54 respectively, the other end of the resistor R61 is electrically connected with the analog-digital conversion chip, the other end of the capacitor C16 and one end of the capacitor C21 respectively, the other end of the resistor R47 is electrically connected to an electrical node AVCC3V3, the other end of the resistor R54 is grounded, and the other end of the capacitor C13 is electrically connected with the other end of the capacitor C21.

2. The integrated AC thermostat of claim 1, wherein: The temperature acquisition circuit further comprises an optical coupler VD1, the anode of the optical coupler VD1 is electrically connected with the wiring terminal K1+, the cathode of the optical coupler VD1 is electrically connected with the wiring terminal K1-, and the collector of the optical coupler VD1 is grounded.

3. The integrated AC thermostat of claim 2, wherein: ​ 4. The integrated AC thermostat of claim 1, wherein: The silicon controlled rectifier driving circuit comprises a silicon controlled rectifier driving and power regulating circuit; the silicon controlled rectifier driving and power regulating circuit comprises a resistor R50, a resistor R45, a resistor R52, a variable resistor VR1, a capacitor C20, a resistor R59, a silicon controlled rectifier and a silicon controlled rectifier optocoupler, one end of the resistor R50 is electrically connected to a temperature control module, the other end of the resistor R50 is electrically connected to a cathode pin of the silicon controlled rectifier optocoupler, an anode pin of the silicon controlled rectifier optocoupler is electrically connected to an electrical node VDD5V, a first output pin of the silicon controlled rectifier optocoupler is electrically connected to one end of the resistor R45, second output pins of the silicon controlled rectifier optocoupler are respectively electrically connected to one end of the resistor R52 and a silicon controlled rectifier, the other end of the resistor R52 is electrically connected to corresponding pins of the output terminal, the capacitor C20 and the resistor R59 are connected in series, a series circuit formed by the capacitor C20 and the resistor R59 is connected in parallel with the silicon controlled rectifier and the variable resistor VR1, one end of a parallel circuit formed by the series circuit, the silicon controlled rectifier and the variable resistor VR1 is electrically connected to the other end of the resistor R45, and the other end of the parallel circuit is electrically connected to the other end of the resistor R52.

5. The integrated AC thermostat of claim 4, wherein: The silicon controlled rectifier driving circuit further comprises an LED state indicating circuit; the LED state indicating circuit comprises a resistor R40 and an optocoupler U5, one end of the resistor R40 is electrically connected to corresponding pins of the output terminal, the other end of the resistor R40 is electrically connected to an anode pin of the optocoupler U5, a cathode pin of the optocoupler U5 is electrically connected to corresponding pins of the output terminal, a collector of the optocoupler U5 is electrically connected to corresponding LED lamps, and an emitter of the optocoupler U5 is grounded.

6. The integrated AC thermostat of claim 1, wherein: A code dial switch is further arranged on the outer shell and is electrically connected to the temperature control module through an I / O interface.

7. The integrated AC thermostat of claim 1, wherein: A nixie tube display screen is further arranged on the outer shell and is electrically connected to the temperature control module through a nixie tube driving chip.

8. The integrated AC thermostat of claim 1, wherein: A heat dissipation fan and a first temperature sensor for monitoring the working temperature of the heat dissipation fan are arranged in the outer shell, the heat dissipation fan is electrically connected to the temperature control module, and the first temperature sensor is electrically connected to the temperature control module through an analog-to-digital converter. Alternatively, a heat dissipation hole is further arranged on the outer shell.

9. The integrated AC thermostat of claim 1, wherein: An RS485 interface module is further arranged in the outer shell, the RS485 interface module comprises an RS485 interface terminal, an RS485 interface chip and an isolation chip, the RS485 interface terminal, the RS485 interface chip and the isolation chip are sequentially and orderly electrically connected, the isolation chip is further electrically connected to the temperature control module, and the RS485 interface terminal is arranged on the surface of the outer shell. Alternatively, the integrated AC temperature controller further comprises a FLASH memory, the FLASH memory is arranged in the outer shell and is electrically connected to the temperature control module.

10. A temperature control system characterized by: The integrated AC temperature controller as claimed in any one of claims 1-9 is electrically connected with a controller through RS485 line, electrically connected with at least one temperature detecting device through a temperature collecting module, and electrically connected with at least one heating element through a thyristor power output adjusting module.

Citation Information

Patent Citations

  • Temperature control system and industrial oven

    CN117812860B