Frequency conversion device

Abstract

The utility model relates to a frequency conversion device. Comprising a support, a driving board, a heat dissipation assembly, a capacitor module and an inductor module. Wherein the driving plate is connected with the bracket; the heat dissipation assembly is connected with the support and arranged on one side of the driving plate. The capacitor module and the inductor module are respectively connected with the support, the capacitor module and the inductor module are arranged on the same side of the driving plate with the heat dissipation assembly, and the capacitor module and the inductor module are electrically connected with the driving plate; the heat dissipation assembly is arranged between the capacitor module and the inductor module. According to the frequency conversion device, the capacitor module and the inductor module which are large in size are arranged in a split mode with the drive board, the heat dissipation assembly, the capacitor module and the inductor module are arranged on the same side of the circuit board, the space of the capacitor module and the inductor module in the height direction can be fully utilized, and the size of the frequency conversion device is reduced. The heating driving board, the capacitor module and the inductor module are not in direct contact and are respectively arranged around the heat dissipation assembly, so that the heat dissipation effect is improved, the distances among the driving board, the capacitor module and the inductor module are reduced, and the size of the device is reduced.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of frequency converter, in particular to a frequency converter with good heat dissipation. BACKGROUND

[0002] With the development of elevator technology, frequency converter technology appears. Frequency converters are generally arranged in elevator control cabinets and used to control the operation of traction machines to control the operation of elevators.

[0003] In related technologies, electronic components are generally integrated on circuit boards to reduce the size of frequency converters and improve processing efficiency. Electronic components in frequency converters generate heat during operation. Therefore, heat sinks are arranged at some electronic components with large heat generation to keep the electronic components at a low temperature and ensure the normal operation of frequency converters.

[0004] In the above arrangement, there are electronic components with large size, such as capacitors and inductors. Since these electronic components with large size need to be integrated on circuit boards, and in order to facilitate the installation and connection of electronic components on circuit boards, electronic components are generally arranged on the same side of the circuit board, resulting in a large area of the circuit board, thus making the size of the frequency converter still large, requiring a large space, and not easy to install and transport. In addition, since electronic components generate heat during operation, in order to avoid the heat generated by electronic components affecting other electronic components, a certain gap or a larger and more powerful heat dissipation assembly needs to be arranged between different electronic components, thus greatly reducing the space utilization of the frequency converter and making it difficult to further reduce the size of the frequency converter. CONTENT OF THE INVENTION

[0005] Therefore, it is necessary to provide a frequency converter to solve the above problems of large size and heat dissipation.

[0006] The present application provides a frequency converter, which comprises:

[0007] a support;

[0008] a driving board connected with the support;

[0009] a heat dissipation assembly connected with the support and arranged on one side of the driving board;

[0010] a capacitor module and an inductor module connected with the support and arranged on the same side of the heat dissipation assembly, the capacitor module and the inductor module are electrically connected with the driving board, and the heat dissipation assembly is arranged between the capacitor module and the inductor module.

[0011] In some embodiments, the heat dissipation assembly comprises a heat sink and a fan, both of which are connected to the bracket, and the heat sink is arranged on one side of the drive plate.

[0012] The first opening and the second opening are formed between the first opening and the second opening, and the heat sink is arranged in the middle of the air duct; the fan is arranged at the first opening, and the capacitor module and the inductor module are arranged on both sides of the air duct.

[0013] In some embodiments, a wind deflector is arranged between the bracket and the fan, and the wind deflector is connected to the bracket and is arranged obliquely relative to the side wall of the bracket.

[0014] In some embodiments, the bracket is also provided with a heat dissipation hole, which is arranged between the wind deflector and the heat sink.

[0015] In some embodiments, the capacitor module comprises a plurality of capacitors and a circuit board, the circuit board is connected to the bracket, a plurality of capacitors are connected to the circuit board and arranged on the side of the circuit board away from the drive plate, and a plurality of capacitors are electrically connected to the drive plate through the circuit board.

[0016] In some embodiments, a plurality of capacitors are arranged side by side along the length direction of the air duct.

[0017] In some embodiments, the inductor module comprises a plurality of inductor coils, and a plurality of inductor coils are connected to the drive plate and arranged on the side of the drive plate facing the heat dissipation assembly.

[0018] In some embodiments, the bottom surface of the plurality of inductor coils is parallel to the length direction of the air duct.

[0019] In some embodiments, a plurality of fans are arranged side by side at the first opening.

[0020] In some embodiments, the variable frequency device further comprises a control element, the control element is connected to the side of the drive plate away from the heat dissipation assembly, and the capacitor module and the inductor module are electrically connected to the control element through the drive plate.

[0021] The driving board, the heat dissipation assembly, the capacitor module and the inductor module of the variable frequency device are connected to the support, which is convenient for installation to the cabinet or other positions. The heat dissipation assembly is arranged on one side of the driving board, which can dissipate heat of the driving board to ensure that the temperature of the driving board is not too high. The capacitor module and the inductor module are arranged separately from the driving board or arranged on the back of the driving board relative to other electronic elements, so that the capacitor module and the inductor module are arranged on the side where the heat dissipation assembly is arranged. The capacitor module and the inductor module are arranged on two sides of the heat dissipation assembly, and the heat dissipation assembly can dissipate heat of the capacitor module and the inductor module at the same time. By arranging the capacitor module and the inductor module with large volume separately from the driving board and on one side of the driving board, the area of the driving board can be appropriately reduced. By arranging the heat dissipation assembly, the capacitor module and the inductor module on the same side of the circuit board, the height of the heat dissipation assembly can be matched with the height of the capacitor module and the inductor module, so that the space of the capacitor module and the inductor module in the height direction is fully utilized, the space utilization is effectively improved, and the volume of the variable frequency device is reduced by the above method. In addition, the driving board, the capacitor module and the inductor module which generate heat do not directly contact each other and are arranged around the heat dissipation assembly, so that the heat dissipation effect is effectively improved, and the volume of the device can be reduced by reducing the distance between the driving board, the capacitor module, the inductor module and the heat dissipation assembly. BRIEF DESCRIPTION OF DRAWINGS

[0022] Figure 1 FIG. 1 is a structural schematic diagram of a variable frequency device according to an embodiment of the present application.

[0023] Figure 2 FIG. 2 is a bottom structural schematic diagram of the variable frequency device according to the embodiment of the present application.

[0024] Figure 3 FIG. 3 is a support structural schematic diagram of the variable frequency device according to the embodiment of the present application.

[0025] Figure 4 FIG. 4 is a fan structural schematic diagram of the variable frequency device according to the embodiment of the present application.

[0026] In the figure, 100 is a support, 110 is a first opening, 120 is an air duct, 130 is a guide vane, 140 is a heat dissipation hole, 150 is a first mounting hole, 160 is a second mounting hole, 200 is a driving board, 300 is a heat dissipation assembly, 310 is a heat sink, 320 is a fan, 400 is a capacitor module, 410 is a capacitor, 420 is a circuit board, 500 is an inductor module, 510 is an inductor coil, and 600 is a control element. DETAILED DESCRIPTION

[0027] In order to make the above objectives, features and advantages of the present application more clear and comprehensible, the specific embodiments of the present application will be described in detail below with reference to the accompanying drawings. In the following description, numerous specific details are set forth in order to provide a thorough understanding of the present application. However, the present application can be practiced in a number of different ways beyond the specific embodiments described herein and with modifications thereof, without departing from the scope of the present application, and it is understood that these specific embodiments are given for purposes of example and exemplary description only and are not presented in a way of limitation to the present application.

[0028] In the description of the present application, it should be understood that, if there are terms such as "center", "longitudinal", "transverse", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc. appear, these terms indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings, and are only for the purpose of facilitating the description of the present application and simplifying the description, and are not intended to indicate or imply that the device or element referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as a limitation to the present application.

[0029] In addition, if the terms "first", "second" appear, these terms are only for the purpose of description, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of technical features referred to. Therefore, the features defined with "first", "second" can explicitly or implicitly include at least one of the features. In the description of the present application, if the term "a plurality of" appears, the meaning of "a plurality of" is at least two, for example, two, three, etc., unless otherwise specifically limited.

[0030] In the present application, unless otherwise specifically defined and limited, if the terms "mounting", "connecting", "connecting", "fixing" and the like appear, these terms should be understood in a broad sense. For example, it can be fixedly connected, or it can be detachably connected, or it can be integrated; it can be mechanically connected, or it can be electrically connected; it can be directly connected, or it can be indirectly connected through an intermediate medium; it can be the internal communication of two elements or the interaction relationship between two elements, unless otherwise specifically limited. For those skilled in the art, the specific meaning of the above terms in the present application can be understood according to the specific circumstances.

[0031] In the present application, unless specifically stated and limited otherwise, if there is a description of a first feature "on" or "under" a second feature, etc., it can mean that the first and second features are in direct contact, or the first and second features are indirectly in contact through an intermediate medium. Moreover, the first feature "over", "above" and "on" the second feature can be that the first feature is directly above or obliquely above the second feature, or only means that the horizontal height of the first feature is higher than that of the second feature. The first feature "under", "below" and "under" the second feature can be that the first feature is directly below or obliquely below the second feature, or only means that the horizontal height of the first feature is less than that of the second feature.

[0032] It should be noted that if an element is referred to as "fixed to" or "disposed on" another element, it can be directly on the other element or there can be an intermediate element. If an element is considered to be "connected" to another element, it can be directly connected to the other element or there can be an intermediate element. If present, the terms "vertical", "horizontal", "up", "down", "left", "right" and similar expressions used in the present application are for illustrative purposes only and do not represent the only implementation.

[0033] Referring to Figure 1 and Figure 2 , Figure 1 shows a structural schematic diagram of a frequency conversion device in an embodiment of the present application, Figure 2 The frequency conversion device provided in the embodiment of the present application includes a support 100, a driving plate 200, a heat dissipation assembly 300, a capacitor module 400 and an inductor module 500. The driving plate 200 is connected with the support 100. The heat dissipation assembly 300 is connected with the support 100 and is arranged on one side of the driving plate 200. The capacitor module 400 and the inductor module 500 are respectively connected with the support 100 and are arranged on the same side of the driving plate 200 as the heat dissipation assembly 300. The capacitor module 400 and the inductor module 500 are both electrically connected with the driving plate 200; and the heat dissipation assembly 300 is arranged between the capacitor module 400 and the inductor module 500.

[0034] As shown in Figure 1 and Figure 2 Preferably, the driving plate 200 is connected and fixed with the support 100 through bolts. The side surface of the driving plate 200 is arranged opposite to the side surface of the support 100 and is spaced apart by a certain distance, so that there is a gap between the side surface of the driving plate 200 and the opposite side surface of the support 100. Figure 1As shown, the heat dissipation assembly 300 is arranged below the drive board 200 to dissipate heat from the drive board 200. The large-volume capacitor module 400 and the inductor module 500 are also arranged below the drive board 200, and the capacitor module 400 and the inductor module 500 can be directly connected to the drive board 200 or arranged separately from the drive board 200. The capacitor module 400, the heat dissipation assembly 300, and the inductor module 500 are arranged in sequence and side by side below the drive board 200, and the heat dissipation assembly 300 is arranged between the capacitor module 400 and the inductor module 500, so that the heat dissipation assembly 300 can dissipate heat from the drive board 200, the capacitor module 400, and the inductor module 500 at the same time. The capacitor module 400 and the inductor module 500 are electrically connected to the drive board 200 according to the designed circuit to realize the function of controlling the elevator by the variable frequency device.

[0035] It should be noted that, to realize the control of the elevator by the variable frequency device, the drive board 200 usually includes input, filtering, rectification, bus, inversion, output, and other circuits with different functions, and the circuits with different functions are formed by electrically connecting different electronic elements according to a specific circuit, and the circuits with different functions include large-volume electrical elements such as capacitor elements and inductor elements. By taking out the capacitor elements in the above-mentioned different circuits from the original circuit, integrating the capacitor elements to form the capacitor module 400, and connecting the capacitor elements in the capacitor module 400 to the original position of the original circuit by wires or other electrical connection methods, the capacitor elements can be separated from the drive board 200 while ensuring that the function of the original circuit remains unchanged. Similarly, the inductor elements in different circuits can also be integrated to form the inductor module 500, so that the large-volume capacitor elements and inductor elements are separated from the drive board 200. In addition, smaller elements other than the large-volume electrical elements such as the capacitor elements and the inductor elements can be arranged on the same side of the drive board 200, and the capacitor elements and the inductor elements are arranged on the opposite side of the drive board 200 relative to the smaller elements. The electrical connection between the other elements on the drive board 200 and the capacitor elements and the inductor elements can be achieved by the circuit in the drive board 200, and the circuit function on the drive board 200 can be achieved. By the above-mentioned method, the smaller elements, the capacitor elements, and the inductor elements are overlapped in the height direction, which can appropriately reduce the area of the drive board 200. The above-mentioned method is prior art, which is not described in detail here, and is only used to describe the working mode of the capacitor module 400 and the inductor module 500, and does not limit the present application.

[0036] In use, the drive board 200 is mounted on the support 100, the capacitor module 400 and the inductor module 500 are mounted on the support 100 and below the drive board 200, and the heat dissipation assembly 300 is mounted between the capacitor module 400 and the inductor module 500. Starting the heat dissipation assembly 300 can dissipate heat from the drive board 200, the capacitor module 400, and the inductor module 500 at the same time.

[0037] Through the above arrangement, the large volume of capacitive elements and inductive elements are not directly set on the drive board 200, compared with directly setting all electronic components on the same side of the drive board 200, the area of the drive board 200 can be appropriately reduced; by setting the heat dissipation assembly 300, the capacitor module 400 and the inductor module 500 on the same side (below) of the drive board 200, and arranging them side by side, the height of the heat dissipation assembly 300 can be adjusted according to the height of the capacitor module 400 and the inductor module 500, thereby making full use of the space in the height direction to place the heat dissipation assembly 300, so as to reduce the volume of the frequency conversion device.

[0038] In addition, the drive board 200, the capacitor module 400 and the inductor module 500 are respectively arranged around the heat dissipation assembly 300, and are all cooled by the heat dissipation assembly 300, which can improve the heat dissipation effect; since the heat dissipation assembly 300 is not affected by the high temperature of the electronic components, compared with the distance between the capacitor module 400 and the inductor module 500 when they are arranged side by side, the distance between the capacitor module 400 and the heat dissipation assembly 300 and the distance between the inductor module 500 and the heat dissipation assembly 300 in the above arrangement can be adjusted to be smaller, that is, the gap between the electronic components can be reduced, which can further reduce the volume of the frequency conversion device while taking into account the heat dissipation effect.

[0039] In some embodiments, the heat dissipation assembly 300 includes a heat sink 310 and a fan 320, both of which are connected with the support 100, and the heat sink 310 is arranged on one side of the drive board 200.

[0040] The opposite two sides of the support 100 are respectively provided with a first opening 110 and a second opening (not shown in the figure), and an air duct 120 is formed between the first opening 110 and the second opening; the heat sink 310 is arranged in the middle of the air duct 120; the fan 320 is arranged at the first opening 110, and the capacitor module 400 and the inductor module 500 are respectively arranged on both sides of the air duct 120.

[0041] As shown in Figure 1 , Figure 2 and Figure 3 , preferably, the first opening 110 and the second opening are arranged at the middle position of the side wall of the support 100, and the air duct 120 is located in the middle of the support 100. The heat sink 310 is arranged in the middle of the air duct 120, that is, below the drive board 200, for absorbing the heat of the drive board 200 to cool the drive board 200. The fan 320 is arranged at the first opening 110, that is, at one end of the air duct 120, and the capacitor module 400 and the inductor module 500 are respectively arranged on both sides of the air duct 120. In use, the fan 320 is started to form an air flow in the air duct 120 flowing from the second opening to the first opening 110 (at the fan 320) to carry away the heat of the heat sink 310, thereby improving the heat dissipation effect.

[0042] In addition, part of the airflow in the air duct 120 can flow to the capacitance module 400 and the inductance module 500 to achieve the heat dissipation of the capacitance module 400 and the inductance module 500 at the same time.

[0043] In some embodiments, a guide plate 130 is arranged between the bracket 100 and the fan 320, and the guide plate 130 is connected with the bracket 100 and is arranged obliquely relative to the side wall of the bracket 100.

[0044] As shown in Figure 3 Preferably, one side of the guide plate 130 is connected and fixed with the side wall of the bracket 100, and the side opposite to the side connected with the bracket 100 of the guide plate 130 abuts against the fan 320, so that the airflow in the air duct 120 enters the fan 320 along the oblique direction of the guide plate 130.

[0045] By arranging the guide plate 130, the airflow in the air duct 120 can pass through the fan 320 completely, which is suitable for fans 320 of different sizes.

[0046] For example, the fan 320 with a larger cross-sectional area of the airflow passing part than the cross-sectional area of the air duct 120 can be selected, and the guide plate 130 is arranged obliquely away from the air duct 120, so that the fan 320 with a larger cross-sectional area is arranged in the air duct 120 with a smaller cross-sectional area, which can improve the airflow speed in the air duct 120 to a certain extent and improve the heat dissipation effect. Figure 3 In this case, the side of the guide plate 130 close to the first opening 110 is arranged obliquely away from the air duct 120, so that the fan 320 with a larger cross-sectional area is arranged in the air duct 120 with a smaller cross-sectional area, which can improve the airflow speed in the air duct 120 to a certain extent and improve the heat dissipation effect.

[0047] Further, the guide plate 130 can be fixedly connected with the bracket 100, that is, the angle between the guide plate 130 and the side wall of the bracket 100 is fixed, so as to cooperate with the fan 320 of a specific size; or the guide plate 130 can be rotatably connected with the bracket 100, so as to adjust the angle between the guide plate 130 and the side wall of the bracket 100 according to the size of the selected fan 320 and then fix it, so as to ensure that the airflow in the air duct 120 can pass through the fan 320, that is, the airflow formed by the fan 320 can flow in the air duct 120.

[0048] In addition, as shown in Figure 1As shown, the driving plate 200 can be provided with a slot corresponding to the shape of the first opening 110 to avoid the installation position of the fan 320. In this way, the height of the selected fan 320 can be flush with the installation position of the driving plate 200, so that a fan 320 with a larger cross-sectional area can be selected to improve the heat dissipation effect without increasing the volume of the frequency conversion device.

[0049] In some embodiments, the bracket 100 is further provided with a heat dissipation hole 140 between the air deflector 130 and the heat sink 310.

[0050] It should be noted that the heat sink 310 has various structures and models, and in some embodiments, the heat sink 310 has a side wall or a shell, so that the air flow entering the heat sink 310 from the second opening cannot directly flow to the capacitor module 400 and the inductor module 500 from the side of the heat sink 310.

[0051] Due to the above problems, as Figure 2 As shown, preferably, the heat dissipation hole 140 is provided between the air deflector 130 and the heat sink 310, so that part of the air flow in the air duct 120 can flow out of the air duct 120 through the heat dissipation hole 140, and at this time, the air flow flowing out of the heat dissipation hole 140 is not blocked and can flow to the capacitor module 400 and the inductor module 500 to achieve heat dissipation of the capacitor module 400 and the inductor module 500.

[0052] Further, the heat dissipation hole 140 can be provided with two heat dissipation holes 140, one of which is provided near the capacitor module 400, and the other of which is provided near the inductor module 500, so that the air flow flowing out of the heat dissipation hole 140 can directly flow to the capacitor module 400 and the inductor module 500 to improve the heat dissipation effect.

[0053] In some embodiments, the capacitor module 400 includes a plurality of capacitors 410 and a circuit board 420, the circuit board 420 is connected to the bracket 100, the plurality of capacitors 410 are connected to the circuit board 420 and are arranged on the side of the circuit board 420 away from the driving plate 200, and the plurality of capacitors 410 are electrically connected to the driving plate 200 through the circuit board 420.

[0054] As shown in Figure 1 , Figure 2 and Figure 3 Preferably, the bracket 100 is provided with a first mounting hole 150 corresponding to the position of the capacitor module 400, and the area of the circuit board 420 is greater than the diameter of the first mounting hole 150, so that the circuit board 420 can be fixed to the bracket 100 by bolts, and the plurality of capacitors 410 can pass through the first mounting hole 150 to be arranged away from the driving plate 200.

[0055] The plurality of capacitors 410 can be connected to specific positions on the drive board 200 through wires respectively, ensuring that the circuit functions of the elevator controlled by the variable frequency device are normal. Through the above arrangement, the capacitors 410 are spaced apart from the drive board 200, and the heat generated by the capacitors 410 is less likely to affect the drive board 200, thereby appropriately reducing the spacing between the drive board 200 and the capacitor module 400, while taking into account the effect that the heating elements do not affect each other while reducing the size of the variable frequency device.

[0056] In some embodiments, the plurality of capacitors 410 are arranged side by side along the length direction of the air duct 120.

[0057] As shown in Figure 2 , preferably, the plurality of capacitors 410 are arranged side by side along the length direction of the air duct 120, so that the plurality of capacitors 410 do not block each other, and the airflow in the air duct 120 can flow through all the capacitors 410 to dissipate heat from the plurality of capacitors 410.

[0058] In some embodiments, the inductor module 500 includes a plurality of inductor coils 510, and the plurality of inductor coils 510 are connected to the drive board 200 and arranged on the side of the drive board 200 facing the heat dissipation assembly 300.

[0059] As shown in Figure 1 , Figure 2 , and Figure 3 , preferably, the second mounting hole 160 is formed in the support 100 corresponding to the position of the inductor module 500, and the plurality of inductor coils 510 can pass through the second mounting hole 160 to be arranged on the side (below) of the drive board 200 facing the heat dissipation assembly 300. The plurality of inductor coils 510 are connected to the drive board 200, ensuring that the circuit functions of the elevator controlled by the variable frequency device are normal.

[0060] Through the above arrangement, the inductor coils 510 are located below the drive board 200, thereby appropriately reducing the area of the drive board 200, thereby reducing the size of the variable frequency device.

[0061] In some embodiments, the bottom surface of the plurality of inductor coils 510 is parallel to the length direction of the air duct 120.

[0062] As shown in Figure 2 , preferably, the center hole of the inductor coil 510 faces the direction of the air duct 120, so that the airflow flowing from the air duct 120 to the inductor coil 510 can pass through the center hole of the inductor coil 510, improving the heat dissipation effect of the inductor coil 510.

[0063] Further, as shown in Figure 2As shown in the figures, the number of inductance coils 510 is set to three, two of which are coaxial and arranged side by side, and the other is arranged on one side of the two, with the axis of the central hole of the other inductance coil 510 perpendicular to the central hole axis of the two, so as to reasonably use the installation space and improve the space utilization.

[0064] In some embodiments, multiple fans 320 are provided, which are arranged side by side at the first opening 110.

[0065] As shown in the figures, Figure 1 and Figure 4 Preferably, two fans 320 are provided, which are arranged side by side at the first opening 110, so as to increase the air flow in the air duct 120 and improve the heat dissipation effect.

[0066] In some embodiments, the frequency conversion device further comprises a control element 600, which is connected to the side of the drive board 200 away from the heat dissipation assembly 300, and the capacitor module 400 and the inductance module 500 are electrically connected to the control element 600 through the drive board 200.

[0067] As shown in the figures, Figure 1 and Figure 2 Preferably, the control element 600 is arranged on the side of the drive board 200 away from the heat dissipation assembly 300, the capacitor module 400 and the inductance module 500, so that the control element 600 is not blocked and is convenient to maintain and replace. The drive board 200 is electrically connected to the capacitor module 400 and the inductance module 500, respectively, for realizing circuit functions.

[0068] Further, the electronic elements with relatively large heat in the control element 600 can be arranged at the middle position of the drive board 200, corresponding to the heat dissipation assembly 300, so as to specifically cool the electronic elements with relatively large heat, thereby improving the overall heat dissipation effect.

[0069] The technical features of the above-mentioned embodiments can be combined arbitrarily. In order to make the description simple, not all possible combinations of the technical features in the above-mentioned embodiments are described, however, as long as the combinations of the technical features do not exist contradictory, they should be considered as the scope of the present application.

[0070] The above-mentioned embodiments only express several implementation manners of the present application, and the description is relatively specific and detailed, but it should not be understood as a limitation on the patent scope of the application. It should be pointed out that for ordinary skilled in the art, without departing from the concept of the present application, a number of modifications and improvements can be made, which are all within the protection scope of the present application. Therefore, the patent protection scope of the present application should be subject to the appended claims.

Claims

1. A frequency conversion device, characterized by The utility model relates to a kind of capacitor module and inductor module, respectively with the bracket is connected, and with the heat dissipation component is arranged on the same side of the drive plate, the capacitor module and the inductor module are electrically connected with the drive plate;The heat dissipation component is arranged between the capacitor module and the inductor module. The heat dissipation component includes radiator and fan, and the radiator and the fan are connected with the bracket, and the radiator is arranged on one side of the drive plate. The first opening and the second opening are formed between the wind channel, the radiator is arranged in the middle of the wind channel, the fan is arranged at the first opening, and the capacitor module and the inductor module are arranged on both sides of the wind channel. The bracket is connected with the air deflector, and the air deflector is inclined relative to the side wall of the bracket. The bracket is also provided with a heat dissipation hole between the air deflector and the radiator.

2. The frequency varying device of claim 1, wherein, The capacitor module includes multiple capacitors and a circuit board, the circuit board is connected to the bracket, multiple capacitors are connected to the circuit board and arranged on the side of the circuit board away from the drive plate, and multiple capacitors are electrically connected to the drive plate through the circuit board. Multiple capacitors are arranged side by side along the length direction of the wind channel.

3. The frequency varying device of claim 2, wherein, The inductor module includes multiple inductor coils, and multiple inductor coils are connected to the drive plate and arranged on the side of the drive plate facing the heat dissipation component.

4. The frequency varying device of claim 3, wherein, The bottom surface of multiple inductor coils is parallel to the length direction of the wind channel.

5. The frequency varying device of claim 2, wherein, Multiple fans are arranged side by side at the first opening.

6. The frequency varying device of claim 5, wherein, The utility model also includes a control element, which is connected to the side of the drive plate away from the heat dissipation component, and the capacitor module and the inductor module are electrically connected to the control element through the drive plate.

7. The frequency varying device of claim 2, wherein, ​ 8. The frequency varying device of claim 7, wherein, ​ 9. The frequency varying device of claim 2, wherein, ​ 10. The frequency varying device of claim 1, wherein, ​

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