PCB layer changing structure and PCB structure

Abstract

The utility model provides a PCB layer changing structure and a PCB structure. The PCB layer changing structure is embedded in the PCB structure. The PCB layer changing structure comprises a differential signal track unit and a reference vertical plate, and the differential signal track unit and the reference vertical plate are separately arranged. The differential signal track unit comprises a first signal track vertical plate and a second signal track vertical plate. The PCB structure comprises a plurality of layers of stacked PCBs. In the stacking direction of the multiple layers of PCBs, at least part of the PCB layer changing structure penetrates through the PCB structure. And the PCB layer changing structure is at least electrically connected with a PCB. The PCB layer changing structure can meet the layer changing requirement of signals between different layers, impedance can be controlled simply, conveniently and finely, the impedance characteristic and the signal transmission quality are effectively improved, and the PCB layer changing structure is suitable for high-frequency and high-speed application scenes. The working performance of the PCB structure is effectively improved.

Description

TECHNICAL FIELD

[0001] The application belongs to the technical field of printed circuit boards, and relates to a PCB layer-changing structure and a PCB structure. BACKGROUND

[0002] A printed circuit board (PCB) is a core component in a communication device and is a support body and provider of electrical connection for electronic components. With the development of high performance and miniaturization of electronic devices, a traditional single-layer or PCB structure is difficult to accommodate a large number of components and complex wiring, and a multi-layer PCB structure, which is formed by alternately laminating multiple conductive copper foils and insulating materials, can effectively improve signal transmission efficiency, reduce electromagnetic interference and optimize space utilization to meet the needs of modern electronic devices for circuit complexity, miniaturization, high performance and high reliability and the like.

[0003] As an essential component in a multi-layer PCB structure, the PCB layer-changing structure is used to transmit signals and power between different layers. However, the current PCB layer-changing structure has deficiencies in terms of impedance control, loss, space occupation and noise interference. Taking a via as an example, although the via can effectively improve the wiring density and functional integration of the PCB, the impedance characteristics of the via, as a complex electromagnetic structure, are affected by various factors (geometric size, layering structure, material properties and the like), and usually need to be controlled based on an electromagnetic field 3D simulation method (for example, HFSS and CST), so the design of the via is relatively complex. Moreover, the via is usually accompanied by various losses, and with the continuous improvement of data speed, the electrical performance of the via cannot meet the performance requirements.

[0004] Therefore, how to provide a PCB layer-changing structure and a PCB structure to improve the performance of the PCB layer-changing structure in the prior art has become an important technical problem to be solved by those skilled in the art.

[0005] It should be noted that the above introduction to the technical background is only to facilitate the clear and complete description of the technical scheme of the application, and to facilitate the understanding of those skilled in the art. The above technical scheme cannot be considered as known to those skilled in the art merely because it is described in the background section of the application. CONTENT OF THE INVENTION

[0006] In view of the above-mentioned deficiencies of the prior art, the purpose of the present application is to provide a PCB layer-changing structure and a PCB structure to solve the problems of the PCB layer-changing structure in the prior art.

[0007] To achieve the above-mentioned purpose and other related purposes, in a first aspect, the application provides a PCB layer-changing structure embedded in a PCB structure.

[0008] The PCB layer-changing structure comprises a differential signal track unit and a reference vertical plate, the differential signal track unit and the reference vertical plate are arranged separately, wherein the differential signal track unit comprises a first signal track vertical plate and a second signal track vertical plate;

[0009] The PCB structure comprises a plurality of stacked PCB boards, and the PCB layer-changing structure at least partially penetrates the PCB structure in the stacking direction of the plurality of PCB boards, and the PCB layer-changing structure is electrically connected to at least one of the PCB boards.

[0010] Optionally, the thickness of the first signal track vertical plate in the first direction is less than the width of the first signal track vertical plate in the second direction;

[0011] The thickness of the second signal track vertical plate in the first direction is less than the width of the second signal track vertical plate in the second direction;

[0012] Wherein, the first direction is parallel to the arrangement direction of the first signal track vertical plate and the second signal track vertical plate, and the second direction is perpendicular to the first direction.

[0013] Optionally, the first signal track vertical plate and the second signal track vertical plate are both rectangular strips, and the first signal track vertical plate and the second signal track vertical plate are arranged in parallel.

[0014] Optionally, in the first direction, the reference vertical plate is located between the first signal track vertical plate and the second signal track vertical plate.

[0015] Optionally, the reference vertical plate is a rectangular strip, and the first signal track vertical plate and the second signal track vertical plate are symmetrically arranged about the reference vertical plate.

[0016] Optionally, in the second direction, the width of the reference vertical plate is greater than the width of the first signal track vertical plate, and the width of the reference vertical plate is greater than the width of the second signal track vertical plate.

[0017] Optionally, the reference vertical plate partially surrounds the differential signal track unit.

[0018] Optionally, the PCB layer-changing structure further comprises three pad groups, each of the three pad groups is arranged one-to-one with the first signal track vertical plate, the second signal track vertical plate and the reference vertical plate, and each of the pad groups comprises two pads arranged separately; wherein,

[0019] At least one of the pads in the PCB layer-changing structure is an isosceles trapezoid, and the axis of symmetry of the isosceles trapezoid is perpendicular to the arrangement direction of the first signal trajectory vertical plate and the second signal trajectory vertical plate.

[0020] Optionally, the PCB layer replacement structure partially penetrates the PCB structure; or, the PCB layer replacement structure completely penetrates the PCB structure.

[0021] Secondly, this application provides a PCB structure, including multi-layered PCB boards, a cutout area, and at least one PCB layer replacement structure as described above;

[0022] The cut-out area penetrates at least a portion of the PCB structure in the stacking direction of the multiple PCB boards;

[0023] At least a portion of the PCB layer replacement structure is located within the cut-out area.

[0024] As described above, the PCB layer-switching structure of this application includes a differential signal trace unit and a reference vertical plate. The differential signal trace unit includes a first signal trace vertical plate and a second signal trace vertical plate. This PCB layer-switching structure can meet the requirements for signal switching between different layers. Based on the arrangement of the first and second signal trace vertical plates, impedance characteristics can be effectively improved, and signal transmission quality can be enhanced, making it particularly suitable for high-frequency and high-speed applications. Furthermore, based on the structural design of the first and second signal trace vertical plates, the impedance of the PCB layer-switching structure can be easily and accurately controlled to achieve impedance matching, improve signal integrity, and reduce design complexity. The PCB structure of this application, based on the PCB layer-switching structure, helps to improve the integrity of high-speed signals transmitted internally, effectively enhancing its performance and meeting the high-performance and miniaturization requirements of modern electronic devices. Attached Figure Description

[0025] Figure 1 This is a partial schematic diagram of a PCB structure having the PCB layer replacement structure provided in the embodiments of this application.

[0026] Figure 2 for Figure 1 A top view of the structure shown.

[0027] Figure 3 for Figure 1 The diagram shows a side view of the structure in the first direction.

[0028] Figure 4 for Figure 1 The diagram shows a side view of the structure in the second direction.

[0029] Figure 5 forFigure 1 A partial schematic diagram of the PCB structure shown.

[0030] Figure 6 for Figure 1 The diagram shows an overall schematic of the PCB layer replacement structure.

[0031] Explanation of reference numerals in the attached figures:

[0032] 10-PCB layer change structure, 11-First signal trace vertical plate, 12-Second signal trace vertical plate, 13-Reference vertical plate, 14-Pad; 20-PCB structure, 21-PCB planar layer, 22-Knockout area. Detailed Implementation

[0033] The following specific examples illustrate the implementation of this application. Those skilled in the art can easily understand other advantages and effects of this application from the content disclosed in this specification. This application can also be implemented or applied through other different specific embodiments, and various details in this specification can also be modified or changed based on different viewpoints and applications without departing from the spirit of this application.

[0034] Please see Figures 1 to 6 It should be noted that the illustrations provided in this embodiment are only schematic representations of the basic concept of this application. Therefore, the drawings only show the components related to this application and are not drawn according to the actual number, shape and size of the components in the actual implementation. In the actual implementation, the form, quantity and proportion of each component can be arbitrarily changed, and the layout of the components may also be more complex.

[0035] Example 1

[0036] This application provides a PCB layer replacement structure. Please refer to [link / reference]. Figure 1 The diagram shows a schematic of a PCB structure with this PCB layer-swapping structure. Please refer to the attached diagram. Figures 2 to 4 They respectively showed Figure 1 Schematic diagram of the structure shown in different directions

[0037] Specifically, such as Figure 1 As shown, the PCB layer replacement structure 10 is embedded in the PCB structure 20. (See also...) Figure 5 , showed Figure 1 Please refer to the partial schematic diagram of the PCB structure shown. Figure 1 and Figure 6 , Figure 6 It shows Figure 1The diagram shows an overall schematic of the PCB layer-swapping structure. The PCB layer-swapping structure 10 includes a differential signal trajectory unit and a reference vertical plate 13. The differential signal trajectory unit and the reference vertical plate 13 are separately disposed. The differential signal trajectory unit includes a first signal trajectory vertical plate 11 and a second signal trajectory vertical plate 12. The differential signal trajectory unit is used to transmit differential signals, and the reference vertical plate 13 can serve as a reference plane for signal transmission, providing a stable signal return path. The PCB structure 20 includes multiple stacked PCBs. In the stacking direction of the multiple PCBs, the PCB layer-swapping structure 10 at least partially penetrates the PCB structure 20, and the PCB layer-swapping structure 10 is electrically connected to at least one of the PCBs. More specifically, the PCB layer-swapping structure 10 is electrically connected to the structural layer of the signal line on the PCB that needs to be swapped. The PCB board includes a PCB planar layer 21. The specific structure of the PCB board is not shown in detail in the accompanying drawings. The PCB planar layer 21 is used to illustrate the positional relationship between the PCB layer structure 10 and the PCB structure 20, as well as the stacking direction of the multilayer PCB boards in the PCB structure 20.

[0038] In optional embodiments, such as Figure 6 As shown, the thickness 'a' of the first signal trajectory vertical plate 11 in the first direction Y is less than the width 'b' of the first signal trajectory vertical plate 11 in the second direction X. The thickness 'c' of the second signal trajectory vertical plate 12 in the first direction Y is less than the width 'd' of the second signal trajectory vertical plate 12 in the second direction X. The first direction Y is parallel to the arrangement direction of the first signal trajectory vertical plate 11 and the second signal trajectory vertical plate 12, and the second direction X is perpendicular to the first direction Y. Further, in the stacking direction Z of the multilayer PCB board, the length of the first signal trajectory vertical plate 11 is equal to the length of the second signal trajectory vertical plate 12. That is, in this PCB layer-changing structure 10, the larger side of the first signal trajectory vertical plate 11 (hereinafter referred to as the "wide side") is positioned opposite to the larger side of the second signal trajectory vertical plate 12 (hereinafter referred to as the "narrow side"). To avoid ambiguity, the arrangement direction of the first signal trajectory vertical plate 11 and the second signal trajectory vertical plate 12 is the direction of the line connecting their central axes.

[0039] Specifically, in high-frequency signal transmission, both inductive effect and capacitive effect of the signal transmission line will affect the impedance, and since the inductance is linearly related to the frequency, the higher the frequency, the greater the inductive reactance. In contrast, although the inductive effect also affects the impedance at high frequency, the capacitive effect is realized through electric field coupling, and the capacitive reactance is inversely proportional to the frequency, that is, the higher the frequency, the smaller the capacitive reactance. Therefore, in high-speed signal transmission, the inductive effect dominates the effect on the impedance. In the embodiment of the present application, by arranging the wide surfaces of the first signal track vertical plate and the second signal track vertical plate to face each other, the coupling area between the two is larger, thereby increasing the coupling capacitance to increase the capacitive coupling and weaken the inductive coupling. Compared with the case where the narrow surfaces of the two face each other, this design helps to ensure signal stability. In addition, when the wide surfaces of the first signal track vertical plate and the second signal track vertical plate face each other, the electromagnetic field distribution between the two is more uniform, and the mutual cancellation effect is better, thereby effectively reducing the influence of external electromagnetic interference on the signals transmitted in the PCB layer-changing structure and ensuring signal integrity. In addition, in the manufacturing process of the PCB layer-changing structure, the structure in which the wide surfaces of the first signal track vertical plate and the second signal track vertical plate face each other has relatively low requirements for processing precision. Even if there is a slight deviation in the processing process, it will not significantly affect the impedance characteristics. However, when the narrow surfaces face each other, since the coupling area is small, slight deviations in processing (such as uneven line width and spacing) are more likely to cause inconsistent impedance and affect signal transmission performance. Therefore, the structure of the differential signal track unit in the embodiment of the present application can effectively improve the impedance characteristics, improve the quality of signal transmission, and is particularly suitable for high-frequency and high-speed applications.

[0040] In an optional embodiment, the first signal track vertical plate 11 and the second signal track vertical plate 12 are both in the shape of a rectangular strip (more precisely, a flat cuboid), and the first signal track vertical plate 11 and the second signal track vertical plate 12 are arranged in parallel. That is, the cross-sectional morphology of the first signal track vertical plate 11 (and the second signal track vertical plate 12) in the direction perpendicular to the stacking direction Z of the multi-layer PCB board is a rectangle, wherein the length of the side parallel to the first direction Y (i.e., the width of the rectangle) is smaller than the length of the side parallel to the second direction X (i.e., the length of the rectangle).

[0041] In the embodiment of the present application, by designing the size (i.e., the width and length of the above-mentioned rectangle) of the first signal track vertical plate (the second signal track vertical plate), the impedance of the PCB layer-changing structure can be conveniently and accurately controlled without the need for multiple simulation simulations using electromagnetic field simulation software, thereby achieving impedance matching, improving signal integrity, and reducing the design difficulty of the PCB layer-changing structure.

[0042] In optional embodiments, such as Figure 3 and Figure 6 As shown, in the first direction Y, the reference vertical plate 13 is located between the first signal trajectory vertical plate 11 and the second signal trajectory vertical plate 12. Further, the reference vertical plate 13 is rectangular, and the first signal trajectory vertical plate 11 and the second signal trajectory vertical plate 12 are symmetrically arranged about the reference vertical plate 13. Further, the width e of the reference vertical plate 13 is equal to or unequal to the width a of the first signal trajectory vertical plate 11 (and the width c of the second signal trajectory vertical plate). The distances between the first signal trajectory vertical plate 11 and the second signal trajectory vertical plate 12 and the reference vertical plate 13 are designed based on actual needs and are not strictly limited here.

[0043] In this embodiment, the reference vertical plate is placed between the first signal trajectory vertical plate and the second signal trajectory vertical plate. This reference vertical plate provides a stable reference potential for the differential signals transmitted in both plates, resulting in more stable signal transmission. Furthermore, the reference vertical plate helps maintain the consistency of the characteristic impedance of the differential signals, reducing signal reflection and attenuation caused by impedance discontinuities. Additionally, the vertical reference plate further reduces inductive effects to control impedance. The symmetrical distribution ensures that the electrical characteristics of the first and second signal trajectory vertical plates are consistent, contributing to improved signal quality.

[0044] In an optional embodiment, in the second direction X, the width of the reference vertical plate 13 is greater than the width of the first signal trajectory vertical plate 11 (e.g., the width ratio is 1.5 to 2), and the width of the reference vertical plate 13 is greater than the width of the second signal trajectory vertical plate 12 (e.g., the width ratio is 1.5 to 2). Further, in the first direction Y, the projections of both the first signal trajectory vertical plate 11 and the second signal trajectory vertical plate 12 fall within the projection range of the reference vertical plate 13. That is, the vertical reference plate 13 completely separates the first signal trajectory vertical plate 11 and the second signal trajectory vertical plate 12 in the first direction Y, and ensures that the positional relationship between any point on either the first or second signal trajectory vertical plate and the reference vertical plate remains consistent, reducing impedance discontinuities in the return path and thus mitigating signal integrity issues.

[0045] In an optional embodiment, the PCB layer switching structure 10 further comprises three solder pad groups. The three solder pad groups are arranged one-to-one corresponding to the first signal trace vertical plate 11, the second signal trace vertical plate 12 and the reference vertical plate 13. Each of the solder pad groups comprises two solder pads 14 arranged separately. The solder pads 14 are used to realize electrical connection between the PCB layer switching structure 10 and the signal traces arranged on the corresponding PCB board. Taking the first signal trace vertical plate 11 as an example, one solder pad 14 is arranged at each end of the first signal trace vertical plate 11 in the stacking direction Z of the multi-layer PCB board. Among them, at least one of the solder pads 14 in the PCB layer switching structure 10 is isosceles trapezoidal, and the symmetry axis of the isosceles trapezoid is perpendicular to the arrangement direction of the first signal trace vertical plate 11 and the second signal trace vertical plate 12 (i.e. the symmetry axis is parallel to the second direction X). For example, as shown in Figure 6 , one solder pad 14a corresponding to the first signal trace vertical plate 11, one solder pad 14a corresponding to the second signal trace vertical plate 12, and two solder pads 14b corresponding to the reference vertical plate 13 are all isosceles trapezoidal, while the other solder pad 14 corresponding to the first signal trace vertical plate 11 and the other solder pad 14 corresponding to the second signal trace vertical plate 12 are both circular. It should be noted that the solder pad 14 being isosceles trapezoidal means that the cross-sectional morphology of the solder pad perpendicular to the stacking direction of the multi-layer PCB board is isosceles trapezoidal (i.e. the solder pad is more correctly an isosceles trapezoidal column). In addition, when the isosceles trapezoidal solder pad is connected to the signal line on the corresponding PCB board, the signal line is connected to the shortest side of the isosceles trapezoid.

[0046] In the embodiments of the present application, through the morphology setting of at least one of the solder pads in the PCB layer switching structure, the signal can be smoothly transitioned from the signal line on the PCB board into the PCB layer switching structure when entering the PCB layer switching structure, or smoothly transitioned from the PCB layer switching structure into the signal line on the PCB board when leaving the PCB layer switching structure, so that the impedance change of the signal when entering or leaving the PCB layer switching structure is more smooth, thereby reducing the impedance mutation of the signal transmission path and avoiding signal reflection and transmission loss caused by impedance mutation, i.e. the isosceles trapezoidal solder pad structure makes the impedance can be gradually changed, so as to play a good transition buffering role.

[0047] In an optional embodiment, as shown in Figure 1 , Figure 2 and Figure 6As shown, the length of the shortest side of the isosceles trapezoid-shaped pad 14 is greater than or equal to the thickness of the corresponding preset structure of the pad 14, and the height of the isosceles trapezoid-shaped pad 14 is greater than or equal to the width of the corresponding preset structure of the pad 14, the preset structure being the first signal trace vertical plate 11, the second signal trace vertical plate 12, or the reference vertical plate 13. That is, under the premise of ensuring that the pad 14 has a large enough area for welding and electrical connection, the above size setting of the pad 14 can ensure that the area of the pad 14 is as small as possible, which helps to reduce the parasitic capacitance that may be generated between the pad 14 and its environment, and helps to further maintain the integrity of the signal. For example, as shown in FIG. 2, one of the pads 14a corresponding to the first signal trace vertical plate 11 is in the shape of an isosceles trapezoid, and the length of the shortest side of the isosceles trapezoid is equal to the thickness a of the first signal trace vertical plate 11. For another example, as shown in FIG. 3, two pads 14b corresponding to the reference vertical plate 13 are both in the shape of an isosceles trapezoid, and the length of the shortest side of the isosceles trapezoid is equal to the thickness e of the reference vertical plate. Of course, although not shown, the length of the shortest side of the isosceles trapezoid-shaped pad can also be greater than the thickness of the corresponding structure. Figure 6 As shown, the length of the shortest side of the isosceles trapezoid-shaped pad 14 is greater than or equal to the thickness of the corresponding preset structure of the pad 14, and the height of the isosceles trapezoid-shaped pad 14 is greater than or equal to the width of the corresponding preset structure of the pad 14, the preset structure being the first signal trace vertical plate 11, the second signal trace vertical plate 12, or the reference vertical plate 13. That is, under the premise of ensuring that the pad 14 has a large enough area for welding and electrical connection, the above size setting of the pad 14 can ensure that the area of the pad 14 is as small as possible, which helps to reduce the parasitic capacitance that may be generated between the pad 14 and its environment, and helps to further maintain the integrity of the signal. For example, as shown in FIG. 2, one of the pads 14a corresponding to the first signal trace vertical plate 11 is in the shape of an isosceles trapezoid, and the length of the shortest side of the isosceles trapezoid is equal to the thickness a of the first signal trace vertical plate 11. For another example, as shown in FIG. 3, two pads 14b corresponding to the reference vertical plate 13 are both in the shape of an isosceles trapezoid, and the length of the shortest side of the isosceles trapezoid is equal to the thickness e of the reference vertical plate. Of course, although not shown, the length of the shortest side of the isosceles trapezoid-shaped pad can also be greater than the thickness of the corresponding structure. Figure 6 As shown, the length of the shortest side of the isosceles trapezoid-shaped pad 14 is greater than or equal to the thickness of the corresponding preset structure of the pad 14, and the height of the isosceles trapezoid-shaped pad 14 is greater than or equal to the width of the corresponding preset structure of the pad 14, the preset structure being the first signal trace vertical plate 11, the second signal trace vertical plate 12, or the reference vertical plate 13. That is, under the premise of ensuring that the pad 14 has a large enough area for welding and electrical connection, the above size setting of the pad 14 can ensure that the area of the pad 14 is as small as possible, which helps to reduce the parasitic capacitance that may be generated between the pad 14 and its environment, and helps to further maintain the integrity of the signal. For example, as shown in FIG. 2, one of the pads 14a corresponding to the first signal trace vertical plate 11 is in the shape of an isosceles trapezoid, and the length of the shortest side of the isosceles trapezoid is equal to the thickness a of the first signal trace vertical plate 11. For another example, as shown in FIG. 3, two pads 14b corresponding to the reference vertical plate 13 are both in the shape of an isosceles trapezoid, and the length of the shortest side of the isosceles trapezoid is equal to the thickness e of the reference vertical plate. Of course, although not shown, the length of the shortest side of the isosceles trapezoid-shaped pad can also be greater than the thickness of the corresponding structure.

[0048] In another embodiment of the present application, the reference vertical plate 13 partially surrounds the differential signal trace unit. That is, in the stacking direction Z of the multi-layer PCB, the projection of the reference vertical plate 13 surrounds a part of the projection of the differential signal trace unit. At this time, the reference vertical plate 13 can have a good electric field shielding effect on the differential signal trace unit, so as to reduce the noise interference of other structures in the PCB structure 20 on the PCB layer-changing structure 10, and help to maintain the transmission quality of the signal.

[0049] In optional embodiments, the PCB layer switching structure 10 at least partially penetrates the PCB structure 20 in two ways: the PCB layer switching structure 10 partially penetrates the PCB structure 20; or, the PCB layer switching structure 10 completely penetrates the PCB structure 20. In the case that the PCB layer switching structure 10 partially penetrates the PCB structure 20, the PCB layer switching structure 10 can penetrate a number of PCB boards at the top of the PCB structure 20, or a number of PCB boards at the bottom of the PCB structure 20, or a number of PCB boards in the middle of the PCB structure 20. That is, the ratio between the number of PCB boards penetrated by the PCB layer switching structure 10 and the number of PCB boards included in the PCB structure 20 is less than or equal to 1. The PCB layer switching structure according to the embodiments of the present application can meet the switching requirement of signals between different layers in the PCB structure, and the impedance can be effectively controlled based on the structure of the differential signal track unit, which is suitable for different application scenarios.

[0050] The PCB layer switching structure according to the embodiments of the present application includes a differential signal track unit and a reference vertical plate, wherein the differential signal track unit includes a first signal track vertical plate and a second signal track vertical plate. The PCB layer switching structure can meet the switching requirement of signals between different layers. Moreover, based on the arrangement of the first signal track vertical plate and the second signal track vertical plate, the impedance characteristics can be effectively improved, the quality of signal transmission can be improved, and the PCB layer switching structure is particularly suitable for high-frequency and high-speed applications. Furthermore, based on the structure of the first signal track vertical plate and the second signal track vertical plate, the impedance of the PCB layer switching structure can be conveniently and accurately controlled to achieve impedance matching, improve signal integrity, and reduce design difficulty.

[0051] Embodiment Two

[0052] The embodiments of the present application also provide a PCB structure, which will be described in combination with Figures 1 to 6 The PCB structure 20 includes a plurality of stacked PCB boards, a hollow region 22, and at least one PCB layer switching structure 10 according to Embodiment One. The hollow region 22 penetrates at least a portion of the PCB structure 20 in the stacking direction Z of the plurality of PCB boards. At least a portion of the PCB layer switching structure 10 is located in the hollow region 22.

[0053] In optional embodiments, the hollow region 22 has a regular hexagonal cross section in a direction perpendicular to the stacking direction of the plurality of PCB boards, and the center axis of the reference vertical plate 13 coincides with the center axis of the hollow region 22.

[0054] In the embodiment of the present application, the hollowed-out region 22 of the regular hexagon cooperates with the structural design of the differential signal trace unit, that is, the thickness of the first signal trace vertical plate 11 (second signal trace vertical plate 12) is less than the width of the first signal trace vertical plate 11 (second signal trace vertical plate 12), which is beneficial to save the space occupied by the PCB layer-changing structure 10 in the PCB structure 20, so that there is more space in the PCB structure 20 for other designs, and more precise and efficient optimization can be performed for the complex fan-out in the PCB structure 20.

[0055] The PCB structure of the embodiment of the present application, based on the arrangement of the PCB layer-changing structure, is helpful to improve the high-speed signal integrity transmitted in the PCB structure, effectively improves the working performance, and meets the high-performance and miniaturization requirements of modern electronic devices.

[0056] In summary, the PCB layer-changing structure of the present application includes a differential signal trace unit and a reference vertical plate, the differential signal trace unit includes a first signal trace vertical plate and a second signal trace vertical plate, and the PCB layer-changing structure can meet the layer-changing requirements of signals between different layers. Based on the arrangement design of the first signal trace vertical plate and the second signal trace vertical plate, the impedance characteristics can be effectively improved, the quality of signal transmission can be improved, and it is especially suitable for high-frequency and high-speed applications. Further based on the structural design of the first signal trace vertical plate and the second signal trace vertical plate, the impedance of the PCB layer-changing structure can be simply and accurately controlled to achieve impedance matching, improve signal integrity, and reduce design difficulty. The PCB structure of the present application, based on the arrangement of the PCB layer-changing structure, is helpful to improve the high-speed signal integrity transmitted in the PCB structure, effectively improves the working performance, and meets the high-performance and miniaturization requirements of modern electronic devices. Therefore, the present application effectively overcomes the shortcomings of the prior art and has high industrial utilization value.

[0057] The above embodiments only exemplarily illustrate the principles and effects of the present application, and are not used to limit the present application. Any person skilled in the art can modify or change the above embodiments without departing from the spirit and scope of the present application. Therefore, all equivalent modifications or changes made by those skilled in the art without departing from the spirit and technical thought of the present application should be covered by the claims of the present application.

Claims

1. A PCB layer swap structure, characterized by: The PCB structure is embedded in a PCB structure, the PCB layer structure includes a differential signal track unit and a reference vertical plate, the differential signal track unit and the reference vertical plate are separately arranged, wherein the differential signal track unit includes a first signal track vertical plate and a second signal track vertical plate; The PCB structure includes a plurality of stacked PCB boards, and in the stacking direction of the plurality of PCB boards, the PCB layer structure at least partially penetrates the PCB structure, and the PCB layer structure is electrically connected to at least one of the PCB boards.

2. The PCB layer structure according to claim 1, wherein: The thickness of the first signal track vertical plate in the first direction is less than the width of the first signal track vertical plate in the second direction; The thickness of the second signal track vertical plate in the first direction is less than the width of the second signal track vertical plate in the second direction; Wherein, the first direction is parallel to the arrangement direction of the first signal track vertical plate and the second signal track vertical plate, and the second direction is perpendicular to the first direction.

3. The PCB layer swap structure of claim 2, wherein: The first signal track vertical plate and the second signal track vertical plate are both rectangular strips, and the first signal track vertical plate and the second signal track vertical plate are arranged in parallel.

4. The PCB layer swap structure of claim 2 or 3, wherein: In the first direction, the reference vertical plate is located between the first signal track vertical plate and the second signal track vertical plate.

5. The PCB layer swap structure of claim 4, wherein: The reference vertical plate is a rectangular strip, and the first signal track vertical plate and the second signal track vertical plate are symmetrically arranged about the reference vertical plate.

6. The PCB layer swap structure of claim 5, wherein: In the second direction, the width of the reference vertical plate is greater than the width of the first signal track vertical plate, and the width of the reference vertical plate is greater than the width of the second signal track vertical plate.

7. The PCB layer swap structure of claim 1 or 2, wherein: The reference vertical plate partially surrounds the differential signal track unit.

8. The PCB layer swap structure of claim 1 or 2, wherein: The PCB layer structure further includes three pad groups, three pad groups are arranged one-to-one with the first signal track vertical plate, the second signal track vertical plate and the reference vertical plate, and each pad group includes two pads arranged separately; wherein, At least one pad in the PCB layer structure is an isosceles trapezoid, and the axis of symmetry of the isosceles trapezoid is perpendicular to the arrangement direction of the first signal track vertical plate and the second signal track vertical plate.

9. The PCB layer swap structure of claim 1, wherein: The PCB layer structure partially penetrates the PCB structure; or, the PCB layer structure completely penetrates the PCB structure.

10. A PCB structure, characterized by It includes a plurality of stacked PCB boards, a hollow region, and at least one PCB layer structure according to any one of claims 1-9; The hollow region penetrates at least part of the PCB structure in the stacking direction of the plurality of PCB boards; At least part of the PCB layer structure is located in the hollow region.

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