Printed circuit board processing structure with multiple temporary connecting parts

Abstract

The utility model provides a printed circuit board processing structure with a plurality of temporary connecting parts, the circuit board processing structure is formed on a processing substrate of a printed circuit board, and the circuit board processing structure comprises a first board area, a second board area, a connecting bridge, a plurality of temporary connecting parts and a plurality of positioning pins. The first plate region and the second plate region are connected via the connection bridge. And the second plate area is also connected with the first plate area through the plurality of temporary connecting parts, so that the processing stability of the second plate area is enhanced. A pin hole is formed in the temporary connecting part, and the positioning pin penetrates through the pin hole to position the temporary connecting part.

Description

Technical Field

[0001] This application relates to the field of printed circuit board technology, and particularly to a printed circuit board processing structure having multiple temporary connections. Background Technology

[0002] Due to limitations in the actual installation environment of printed circuit boards (PCBs), some PCBs consist of multiple boards, which are often connected only by relatively small bridges. For example... Figure 1 The printed circuit board shown may include a first board area 110 and a second board area 120, wherein the first board area 110 is the main board area and the second board area 120 is the secondary board area, and the first board area 110 and the second board area 120 are connected only by a connecting bridge 130. When processing the shape of the second board area 120, due to the lack of a stable support structure, the second board area 120 is prone to displacement and deformation, resulting in significant errors in the processing dimensions of the second board area 120. There is an urgent need to improve the processing structure of this type of printed circuit board to reduce the dimensional processing errors of the second board area 120. Utility Model Content

[0003] This application is made in view of the aforementioned state of the prior art. The purpose of this application is to provide a printed circuit board processing structure with multiple temporary connections, which forms stable support for a second board area through the multiple temporary connections, thereby reducing processing errors in the second board area.

[0004] This application provides a printed circuit board (PCB) fabrication structure with multiple temporary connections. The PCB fabrication structure is formed on a PCB fabrication substrate and includes a first board area, a second board area, connecting bridges, multiple temporary connections, and multiple positioning pins.

[0005] The first board area and the second board area are connected via the connecting bridge.

[0006] The second plate area is also connected to the first plate area via the plurality of temporary connecting parts to enhance the processing stability of the second plate area.

[0007] The temporary connection portion has a pin hole, through which the positioning pin passes to position the temporary connection portion.

[0008] In at least one possible implementation, the printed circuit board processing structure having multiple temporary connections further includes a cover plate disposed above and abutting against the processing substrate.

[0009] In at least one possible implementation, the locating pin passes through the cover plate to press the cover plate against the processing substrate.

[0010] In at least one possible implementation, at least a partial area of the cover plate is identical in shape and area to the second plate region to cover the second plate region.

[0011] In at least one possible implementation, the plurality of temporary connecting portions are evenly distributed at the outer edge of the second plate region.

[0012] In at least one possible implementation, the second plate region is a polygon, and each side of the second plate region is provided with the temporary connecting portion.

[0013] In at least one possible implementation, the aspect ratio of the temporary connecting portion is not greater than 3:1, and / or

[0014] The length of the temporary connecting portion is greater than or equal to the length of the connecting bridge, and the width of the temporary connecting portion is greater than or equal to the width of the connecting bridge.

[0015] In at least one possible implementation, the length of the second plate region is greater than or equal to 1 cm, and the width of the second plate region is greater than or equal to 0.5 cm.

[0016] In at least one possible implementation, the printed circuit board processing structure further comprises a base plate, the processing substrate 100 is arranged on the base plate, the positioning pin is inserted into the positioning hole of the base plate through the pin hole, and the temporary connecting portion is positioned on the base plate.

[0017] In at least one possible implementation, the thickness of the cover plate is not greater than 0.6 mm.

[0018] The printed circuit board processing structure provided by the present application has a plurality of temporary connecting portions, which are arranged during the substrate shape processing stage of the printed circuit board. The plurality of temporary connecting portions can form stable support for the second plate region, which can reduce or prevent displacement and deformation of the second plate region during shape processing of the second plate region, thereby reducing the shape size processing error of the second plate region. The printed circuit board processing structure provided by the present application can effectively improve the processing precision of the printed circuit board during milling processing. BRIEF DESCRIPTION OF DRAWINGS

[0019] Figure 1 A product structure diagram of a printed circuit board according to an embodiment of the present application.

[0020] Figure 2 A processing structure diagram of a printed circuit board according to an embodiment of the present application.

[0021] Figure 3 A three-dimensional processing structure diagram of a printed circuit board according to an embodiment of the present application.

[0022] Figure 4 A cross-sectional view of a printed circuit board processing structure according to an embodiment of the present application.

[0023] Reference Signs List

[0024] 100 processing substrate

[0025] 110 first plate region

[0026] 120 second plate region

[0027] 130 connecting bridge

[0028] 140 temporary connecting portion

[0029] 150 processing region

[0030] 200 positioning pin

[0031] 300 cover plate

[0032] 400 cushion plate

[0033] 500 processing equipment DETAILED DESCRIPTION

[0034] The exemplary embodiments of the present application will be described herein below with reference to the accompanying drawings. It should be understood that the specific description is merely for the purpose of teaching one skilled in the art how to practice the present application, and is not intended to limit the scope of the present application in any way.

[0035] The embodiments of the present application provide a printed circuit board processing structure (hereinafter, sometimes referred to as simply "circuit board processing structure") having a plurality of temporary connecting portions, such as Figure 2 As shown, the circuit board processing structure can be formed on a processing substrate 100 of a printed circuit board. The circuit board processing structure can include a first plate region 110, a second plate region 120, a connecting bridge 130, and a plurality of temporary connecting portions 140.

[0036] As shown in Figure 1 and Figure 2 According to the actual product usage requirements, it is usually necessary to process part of the processing substrate 100 to obtain a suitable printed circuit board shape. That is, one or more processing regions 150 can be formed on the processing substrate 100, and by processing (e.g., milling) the processing regions 150, the processing substrate 100 can form the target shape of the printed circuit board product after the processing regions 150 are removed.

[0037] As shown in Figure 1 and Figure 2As shown, the first board area 110 and the second board area 120 can be the main functional areas of the printed circuit board, i.e., the copper plating areas. In this embodiment, the first board area 110 can form the main board of the printed circuit board product, and the second board area 120 can form the sub-board of the printed circuit board product. The area of ​​the first board area 110 can be larger than the area of ​​the second board area 120.

[0038] For example, such as Figure 1 and Figure 2 As shown, the first plate area 110 may include the central region of the processing substrate 100 and the edge regions of the processing substrate 100 (in Figure 1 In the example, all areas on the processing substrate 100 except for the second plate area 120 and the two processing areas 150 can be the first plate area 110. In other words, the first plate area 110 can be the main area of ​​the processing substrate 100, and the second plate area 120 can be an island-shaped area connected to the first plate area 110 by the connecting bridge 130.

[0039] The first plate area 110 and the second plate area 120 can be connected by a connecting bridge 130. It is understood that when the dimensions of the connecting bridge 130 differ significantly from those of the second plate area 120, the connecting bridge 130 alone is insufficient to provide stable support for the second plate area 120. During milling or other machining operations on the machining area 150 near the second plate area 120, the second plate area 120 is prone to displacement and / or deformation, which significantly affects the machining accuracy of the second plate area 120.

[0040] like Figure 2 and Figure 3 As shown, the circuit board processing structure provided in the embodiment of this application includes multiple temporary connection portions 140 connected to the second board area 120. These temporary connection portions 140 connect the second board area 120 to the first board area 110, providing stable support for the second board area 120 during processing, reducing displacement and / or deformation, and thereby improving the machining accuracy of the second board area 120's shape. It is understood that the multiple temporary connection portions 140 can separate the processing area 150 surrounding the second board area 120. During milling or other processing operations, the separated processing areas 150 need to be processed separately. After all the processing areas surrounding the second board area 120 are processed, the temporary connection portions 140 can be removed to form the target shape of the printed circuit board. The removal order of the temporary connection portions 140, as well as the selection of the milling cutter type and the design of the processing trajectory for the corresponding process, can be set according to actual conditions.

[0041] Optionally, according to actual circuit board processing requirements, the circuit board processing structure provided in the application can further include one or more expansion board areas. When the expansion board area is also connected to the main board area through a single connecting bridge, a temporary connecting part 140 can be arranged according to actual requirements to connect the expansion board area to the first board area 110 or the second board area 120.

[0042] It can be understood that the length, width, number, position and other parameters of the temporary connecting part 140 can be determined according to the processing area of the printed circuit board, the area of the second board area 120, the stress condition and the like.

[0043] Preferably, a plurality of temporary connecting parts 140 can be uniformly distributed at the outer edge of the second board area 120.

[0044] Preferably, the second board area 120 can have a polygonal structure, and one temporary connecting part 140 can be arranged at each side of the second board area 120.

[0045] Preferably, the size of the temporary connecting part 140 can be greater than or equal to the size of the connecting bridge 130, that is, the length, width and area of the temporary connecting part 140 can be greater than or equal to the length, width and area of the connecting bridge 130.

[0046] Preferably, the aspect ratio of the temporary connecting part 140 is not greater than 3:1.

[0047] Preferably, the thickness of the processing substrate 100 can be less than or equal to 0.8 millimeters. It can be understood that when the thickness of the processing substrate 100 is small, the second board area 120 is more likely to displace or deform during processing.

[0048] Preferably, the length of the second board area 120 can be greater than or equal to 1 centimeter, and the width of the second board area 120 can be greater than or equal to 0.5 centimeters. It can be understood that if the size of the second board area 120 is too small, it is not easy to arrange the temporary connecting part 140.

[0049] It can be understood that in the embodiments of the application, "long" can be the longer side of the corresponding structure itself, and "wide" can be the shorter side of the corresponding structure itself.

[0050] Further, as shown in FIG. 1, the processing substrate 100 can further include a plurality of temporary connecting parts 140. Figure 3 and Figure 4As shown, the circuit board processing structure can further comprise a plurality of positioning pins 200. The positioning pins 200 can be arranged on the temporary connecting portions 140, in particular, each of the temporary connecting portions 140 can be arranged with a positioning pin 200, so as to further enhance the stability of the temporary connecting portions 140 and increase the stable support to the second board area 120. The temporary connecting portions 140 can be formed with pin holes, and the positioning pins 200 can pass through the pin holes to position the temporary connecting portions 140 on a base plate 400 arranged under the processing base plate 100 (the base plate 400 can be further fixed to a processing equipment 500, for example, the base plate 400 can be fixed to a milling machine). The base plate 400 can be formed with positioning holes, and the positioning pins 200 can pass through the pin holes of the cover plate 300 and the temporary connecting portions 140 and then be inserted into the positioning holes of the base plate 400. Figure 2 The cross section of the positioning pin inserted into the base plate is not shown in the figure, and the positioning holes of the base plate 400 are shown, which have a diameter larger than that of the positioning pins 200.

[0051] It can be understood that the positioning pins 200 can be arranged on the temporary connecting portions 140 before the processing of the processing area 150, and the positioning pins 200 can be removed before the temporary connecting portions 140 are removed.

[0052] Further, as shown, Figure 4 The circuit board processing structure can further comprise a cover plate 300. The cover plate 300 can be arranged above the processing base plate 300 and abut against the processing base plate 100, so as to form a limit in the direction perpendicular to the processing base plate 100, and further reduce the displacement and deformation of the processing base plate 100 (in particular, the second board area 120 thereof).

[0053] Preferably, the positioning pins 200 can pass through the cover plate 300 and the processing base plate 100, so as to press the cover plate 300 against the processing base plate 100 and position the cover plate 300 and the processing base plate 100 on the base plate 400.

[0054] Preferably, the cover plate 300 can be a resin plate.

[0055] Preferably, the thickness of the cover plate 300 is not greater than 0.6 mm.

[0056] Preferably, the size of the cover plate 300 is not smaller than that of the processing base plate 100. More preferably, at least part of the cover plate 300 can have the same shape and size as the target shape of the printed circuit board (including the first board area 110, the second board area 120 and the connecting bridge 130), and the cover plate 300 can cover the second board area 120.

[0057] The following briefly describes some beneficial effects of the above embodiments of the present application.

[0058] The printed circuit board processing structure provided by the embodiments of the present application has a plurality of temporary connecting portions. The plurality of temporary connecting portions can form stable support for the second board area, and can reduce or prevent displacement and deformation of the second board area during the contour processing of the second board area, thereby reducing the contour size processing error of the second board area. The embodiments of the present application can also be provided with a positioning pin, which can position the temporary connecting portion on the base plate to enhance its stability. The embodiments of the present application can also be provided with a base plate on the processing substrate 100 to limit the direction perpendicular to the processing substrate, further reducing the displacement and deformation of the second board area. The printed circuit board processing structure provided by the embodiments of the present application can effectively improve the processing precision of the printed circuit board during milling processing.

[0059] It can be understood that, in the present application, when the number of components or members is not particularly limited, the number thereof can be one or more, and the plurality herein refers to two or more. For the case where the number of components or members is specifically described as, for example, two, three, four, etc. in the drawings and / or the description, the specific number is generally exemplary and not limiting, and can be understood as a plurality, i.e. two or more, but this does not mean that the present application excludes the case of one.

[0060] It should be understood that the above embodiments are only exemplary and are not intended to limit the present application. Those skilled in the art can make various modifications and changes to the above embodiments under the teachings of the present application without departing from the scope of the present application.

Claims

1. A printed circuit board processing structure having a plurality of temporary connection portions, the printed circuit board processing structure being formed on a processing substrate of a printed circuit board, characterized by, The circuit board processing structure comprises a first plate area, a second plate area, a connecting bridge, a plurality of temporary connecting portions, and a plurality of positioning pins, The first plate area and the second plate area are connected via the connecting bridge, The second plate area is also connected to the first plate area via the plurality of temporary connecting portions to enhance the processing stability of the second plate area, The temporary connecting portions are formed with pin holes, and the positioning pins pass through the pin holes to position the temporary connecting portions.

2. The printed circuit board processing structure having a plurality of temporary connections according to claim 1, wherein, A cover plate is further included, which is arranged above the processing substrate and abuts against the processing substrate.

3. The printed circuit board processing structure having a plurality of temporary connections according to claim 2, wherein, The positioning pins pass through the cover plate to press the cover plate against the processing substrate.

4. The printed circuit board processing structure having a plurality of temporary connections according to claim 2, wherein, At least a part of the cover plate has the same shape and area as the second plate area to cover the second plate area.

5. The printed circuit board processing structure having a plurality of temporary connections according to claim 1, wherein, The plurality of temporary connecting portions are uniformly distributed at the outer edge of the second plate area.

6. The printed circuit board processing structure having a plurality of temporary connections according to claim 1, wherein, The second plate area is a polygon, and the temporary connecting portions are arranged at each side of the second plate area.

7. The printed circuit board processing structure having a plurality of temporary connections according to claim 1, wherein, The aspect ratio of the temporary connecting portions is not greater than 3:1, and / or The length of the temporary connecting portions is greater than or equal to the length of the connecting bridge, and the width of the temporary connecting portions is greater than or equal to the width of the connecting bridge.

8. The printed circuit board processing structure having a plurality of temporary connections according to claim 1, wherein, The length of the second plate area is greater than or equal to 1 cm, and the width of the second plate area is greater than or equal to 0.5 cm.

9. The printed circuit board processing structure having a plurality of temporary connections according to claim 1, wherein, The circuit board processing structure further comprises a base plate, the processing substrate is arranged on the base plate, the positioning pins pass through the pin holes and are inserted into the positioning holes of the base plate to position the temporary connecting portions on the base plate.

10. The printed circuit board processing structure having a plurality of temporary connections according to claim 2, wherein, The thickness of the cover plate is not greater than 0.6 mm.

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