Heat dissipation device suitable for electric appliance assembly
The heat dissipation device, which combines a heat-conducting block, a TEC semiconductor cooling chip, and a liquid cooling head, solves the problem of heat accumulation in the FPGA module, achieves efficient temperature management and uniform heat dissipation, and ensures the stability and performance of the FPGA.
Patent Information
- Application Number
- CN202423211898.5
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-12-25
- Publication Date
- 2026-02-27
- Estimated Expiration
- 2034-12-25
AI Technical Summary
FPGA modules generate a lot of heat during operation, which can lead to excessively high temperatures, affecting their performance and stability, and may even cause damage. Existing heat dissipation designs are inadequate.
The heat dissipation device combines a heat-conducting block, a TEC semiconductor cooling chip, and a liquid cooling head. The heat is conducted through the heat-conducting block, the TEC semiconductor cooling chip performs precise heat exchange, the liquid cooling head performs heat exchange, and the fan group and radiator module accelerate airflow to achieve uniform temperature distribution.
It effectively reduces the hot spot temperature of the FPGA module, improves heat dissipation efficiency, and ensures its long-term stable operation.
Smart Images
Figure CN223957811U_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The utility model relates to a heat dissipation technical field especially suitable for heat dissipation device of electric appliance component. BACKGROUND
[0002] FPGA module power consumption is big, is sealed in instrument inside, instrument is in constant high temperature environment, since the FPGA will produce a large amount of heat when working, if these heat can not be promptly and effectively dissipated, will lead to FPGA temperature too high, and then influence its performance and stability, serious overheating can even lead to FPGA damage. Therefore, reasonable heat dissipation design is important to ensure the long-term stable operation of FPGA. Based on this, the utility model provides a kind of heat dissipation device suitable for electric appliance component. UTILITY MODEL CONTENT
[0003] The utility model aims at providing a kind of heat dissipation device suitable for electric appliance component, solve the problem mentioned above.
[0004] To solve the above technical problem, the utility model adopts the following technical scheme:
[0005] The utility model discloses a kind of heat dissipation device suitable for electric appliance component, including shell, bracket is arranged in the shell, electric appliance component is arranged on the bracket, the bottom of the electric appliance component is provided with refrigeration module;Cooling liquid inlet end and cooling liquid outlet end connected with the refrigeration module are arranged on the lateral wall of the shell, the cooling liquid inlet end and the cooling liquid outlet end are connected with the circulating pump and fan cold row module located in the outside of the shell respectively, pipeline connection is together between the fan cold row module and the circulating pump.
[0006] Further, the refrigeration module includes heat-conducting block located at the bottom of the electric appliance component, the lower end of the heat-conducting block is attached with TEC semiconductor refrigeration sheet, the lower end of the TEC semiconductor refrigeration sheet is provided with liquid cooling head, the liquid cooling head is connected with cooling liquid inlet end through cooling liquid inlet pipe respectively, and cooling liquid outlet end through cooling liquid outlet pipe.
[0007] Further, the pipeline in the liquid cooling head is laid in a serpentine shape.
[0008] Further, the liquid cooling head is arranged at the bottom of the shell by mounting bracket.
[0009] Further, temperature control plate is arranged on the outer lateral wall of the bracket, and the temperature control plate is electrically connected with the fan cold row module, the TEC semiconductor refrigeration sheet and the circulating pump.
[0010] Further, the fan cold row module includes cold row connected with the cooling liquid outlet end, and fan is arranged on the outer lateral wall of the cold row.
[0011] Further, a fan group is arranged on one side of the support.
[0012] Compared with the prior art, the present application has the beneficial technical effects of:
[0013] The heat conduction block of the heat dissipation device for the electrical component can effectively conduct the heat generated by the electrical component to the outside, the TEC semiconductor refrigerating sheet and the liquid cooling head precisely exchange the heat of the heat conduction block, and the purpose of cooling is achieved; meanwhile, the fan group is started, the air in the instrument flows, the uneven temperature field is accelerated to exchange speed, the phenomenon of uneven temperature distribution is effectively improved, and the purpose of uniform temperature is achieved. BRIEF DESCRIPTION OF DRAWINGS
[0014] The present application will be further described below in combination with the drawings.
[0015] Figure 1 Structure diagram of the heat dissipation device for the electrical component Figure 1 ;
[0016] Figure 2 Structure diagram of the heat dissipation device for the electrical component Figure 2 ;
[0017] Figure 3 Structure diagram of the heat dissipation device for the electrical component
[0018] Figure 4 Structure diagram of the heat dissipation device for the electrical component
[0019] Figure 5 Structure diagram of the heat dissipation device for the electrical component
[0020] Figure 6 Structure diagram of the heat dissipation device for the electrical component
[0021] BRIEF DESCRIPTION OF DRAWINGS: 1, shell; 2, support; 3, electrical component; 4, fan cooling module; 5, temperature control plate; 6, cold liquid inlet end; 7, cold liquid outlet end; 8, refrigeration module; 9, circulating pump; 10, fan group;
[0022] 401, cooling row; 402, fan; 403, protective net;
[0023] 801, heat conduction block; 802, TEC semiconductor refrigerating sheet; 803, liquid cooling head; 804, cold liquid inlet pipe; 805, cold liquid outlet pipe; 806, mounting support. DETAILED DESCRIPTION
[0024] As Figures 1-6As shown, a heat dissipation device suitable for electrical components, comprising a housing 1, the housing 1 inside the installation of the bracket 2, the bracket 2 on the installation of electrical components 3, the bottom of the electrical components 3 installed refrigeration module 8. The bracket 2 on one side of the position of the installation of the fan group 10, high-speed rotating fan blade stirring instrument air flow, make uneven temperature field to speed up the exchange rate, effectively improve the uneven temperature distribution phenomenon, to achieve the purpose of uniform temperature. The housing 1 side wall on the installation of the cold liquid inlet end 6 and cold liquid outlet end 7 connected with the refrigeration module 8, the cold liquid inlet end 6 and the cold liquid outlet end 7 are connected with the circulation pump 9 and fan cooling module 4 located outside the housing 1, the fan cooling module 4 and the circulation pump 9 between the pipeline connection together. The bracket 2 of the outer wall on the installation of temperature control board 5, the temperature control board 5 electrically connected with the fan cooling module 4, TEC semiconductor refrigeration piece 802 and circulation pump 9, effective control of heat dissipation, can realize the temperature control in the high temperature sealed environment.
[0025] The refrigeration module 8 includes the bottom of the electrical components 3 of the heat conducting block 801, the top structure of the refrigeration module is the high thermal conductivity of the heat conducting block, used to absorb the heat generated by the electrical components 3 in the work of FPGA module, specifically, the high thermal conductivity of the heat conducting block can adopt copper aluminum combination heat conducting block, which will be copper and aluminum perfect combination of a certain process, let copper quickly heat transfer to aluminum, and then by the large area of aluminum heat dissipation, which not only increases the aluminum thermal conductivity than copper, but also makes up for the copper heat dissipation than aluminum, organic combination to achieve the effect of rapid heat transfer and rapid heat dissipation.
[0026] The lower end of the heat-conducting block 801 is attached with a TEC semiconductor refrigeration sheet 802, which uses the Peltier effect to refrigerate, and the cold end is attached to the heat-conducting block 801, so that the heat of the heat-conducting block 801 can be quickly reduced. An electric resistance temperature sensor is mounted on the heat-conducting block 801, and the sensor is connected to the temperature control panel 5, so that the temperature of the heat-conducting block 801 can be accurately controlled. The lower end of the TEC semiconductor refrigeration sheet 802 is provided with a liquid cooling head 803, which is connected to the cold liquid inlet end 6 through a cold liquid inlet pipe 804 and connected to the cold liquid outlet end 7 through a cold liquid outlet pipe 805. Through the heat exchange of the cold liquid, the heat on the TEC semiconductor refrigeration sheet 802 is effectively reduced. The pipeline in the liquid cooling head 803 is laid in a serpentine shape, which can increase the contact area and then more efficiently absorb the heat of the hot end of the TEC semiconductor refrigeration sheet 802. Specifically, in this embodiment, the pipeline is distributed in an M shape, and the heat exchange liquid in the liquid cooling head 803 can use cold water, which is economical and practical and can also achieve the purpose of heat dissipation. The temperature control panel 5 can detect the temperature and humidity of the surrounding air. When the monitored temperature is lower than the set temperature, the TEC semiconductor refrigeration sheet 802 stops refrigeration; when the monitored temperature is higher than the set temperature, the TEC semiconductor refrigeration sheet 802 starts refrigeration, and the heat-conducting block 801 rapidly cools the electric appliance assembly 3, and the absorbed heat is dissipated to the air.
[0027] The liquid cooling head 803 is installed on the bottom of the shell 1 through a mounting bracket 806.
[0028] The fan cooling module 4 includes a cooling row 401 connected to the cold liquid outlet end 7, and a fan 402 is mounted on the outer side wall of the cooling row 401. Specifically, two connectors are mounted on the side wall of the cooling row 401, which are used to connect the pipeline on the cold liquid outlet pipe 805 and the circulating pump 9. The left part of the cooling row 401 is an upper water chamber, which is formed by a separate design into a cold and hot cavity; the middle part is a strip water channel to increase the flow area, wherein the lower water channel is connected to the hot cavity, and the upper water channel is connected to the cold cavity, and the upper water channel is connected to the high-density fin to increase the heat dissipation area; the right part of the cooling row 401 is a lower water chamber, which can make the flat mouth water channel communicate, and the cold and hot cavities circulate as shown in the figure; the water liquid with a higher temperature flowing into the hot cavity flows through the flat mouth water channel and is blown by the fan to effectively dissipate heat, and the water liquid with a lower temperature flowing out of the cold cavity. Figure 5
[0029] The heat dissipation process of the utility model is as follows:
[0030] First, the resistance temperature sensor on the temperature control plate 5 can detect the temperature and humidity of the surrounding air, when the monitored temperature is higher than the set temperature, the TEC semiconductor refrigeration piece 802 starts to cool and quickly transfer to the heat conduction block 801; then, the heat conduction block 801 quickly absorbs the heat consumption of the electrical components 3, and timely dissipates the heat to the air; then, the liquid cooling head 803 exchanges heat with the TEC semiconductor refrigeration piece 802, the water cooling liquid enters the liquid cooling head 803 from the cold liquid inlet pipe 804 to exchange heat, the water cooling liquid with higher temperature after heat exchange flows out from the cold liquid outlet pipe 805, and flows out from the upper end (hot cavity) of the water chamber of the cold row 401, flows through the flat mouth waterway, and flows out from the upper end (cold cavity) of the water chamber of the cold row, then flows into the circulating pump 9, and under the action of the circulating pump 9, enters the liquid cooling head 803 again to carry out a new round of heat dissipation; finally, the fan group 10 circulates the cold air on the heat conduction block 801 to the air during operation, so as to neutralize the heat in the air which is not timely dissipated to the air during the operation of the electrical device.
[0031] The above-described embodiments are only used to describe the preferred modes of the present application, and do not limit the scope of the present application. Without departing from the design spirit of the present application, various modifications and improvements of the technical solutions of the present application made by those skilled in the art shall fall within the protection scope determined by the claims of the present application.
Claims
1. A heat dissipating device suitable for use in an electrical appliance assembly, characterized in that: The utility model provides a kind of electric appliance cooling device, including shell (1), the bracket (2) is arranged inside the shell (1), the electric appliance component (3) to be cooled is arranged on the bracket (2), the bottom of the electric appliance component (3) is provided with refrigeration module (8);The side wall of the shell (1) is provided with cold liquid inlet end (6) and cold liquid outlet end (7) connected with the refrigeration module (8), and the cold liquid inlet end (6) and cold liquid outlet end (7) are connected with circulating pump (9) and fan cold row module (4) located outside the shell (1) respectively, and the pipeline connection between fan cold row module (4) and circulating pump (9) is connected together.
2. The heat dissipating device suitable for use in an electrical appliance assembly according to claim 1, wherein: The refrigeration module (8) includes the heat-conducting block (801) located at the bottom of the electric appliance component (3), the lower end of the heat-conducting block (801) is attached with TEC semiconductor refrigeration sheet (802), the lower end of the TEC semiconductor refrigeration sheet (802) is provided with liquid cooling head (803), and the liquid cooling head (803) is connected with the cold liquid inlet end (6) and the cold liquid outlet end (7) through the cold liquid inlet pipe (804) and the cold liquid outlet pipe (805) respectively.
3. The heat dissipating device for electrical components according to claim 2, wherein: The pipeline inside the liquid cooling head (803) is laid in a serpentine shape.
4. The heat dissipating device for electrical components according to claim 2, wherein: The liquid cooling head (803) is arranged at the bottom of the shell (1) through the mounting bracket (806).
5. The heat dissipating device for electrical components according to claim 2, wherein: The temperature control plate (5) is arranged on the outer side wall of the bracket (2), and the temperature control plate (5) is electrically connected with the fan cold row module (4), the TEC semiconductor refrigeration sheet (802) and the circulating pump (9).
6. The heat dissipating device suitable for use in an electrical appliance assembly according to claim 1, wherein: The fan cold row module (4) includes the cold row (401) connected with the cold liquid outlet end (7), and the fan (402) is arranged on the outer side wall of the cold row (401).
7. The heat dissipating device suitable for use in an electrical appliance assembly according to claim 1, wherein: The fan group (10) is arranged on one side of the bracket (2).