Wafer level chip packaging mechanism

Abstract

The utility model relates to the technical field of chip processing, in particular to a wafer-level chip packaging mechanism, which comprises a base. Two supporting plates are fixed to the top of the base, and a mounting base is fixed to the tops of the two supporting plates. A supporting rod is fixed to the outer wall of the mounting base, a vertical plate is fixed to one end of the supporting rod, a platform is fixed to the bottom of the vertical plate, a first clamping plate is mounted at the top of the platform, a movable groove is formed in the outer wall of the vertical plate, and a movable block is movably arranged in the movable groove. A wafer-level chip body is placed at the top of the first clamping plate; according to the wafer level chip cooling device, the wafer level chip body can be cooled at multiple angles and multiple directions, and the purpose of cooling the wafer level chip body can be achieved only by using one fan, so that the use cost of the fan is greatly reduced, and the manufacturing cost of the wafer level chip body is further reduced.

Description

TECHNICAL FIELD

[0001] The utility model relates to chip processing technical field, concretely is a wafer level chip packaging mechanism. BACKGROUND

[0002] Wafer level chip refers to the semiconductor manufacturing process, with wafer as the basis material, through semiconductor technology, electronic devices and circuit structure are integrated on a single wafer chip. The design, manufacture of such chip involves chip design, manufacturing process and semiconductor technology and multiple fields, is the key component of modern electronic equipment. Wafer level chip is not limited by the area of photoetching machine, can greatly improve the chip performance and integration, reduce cost and power consumption simultaneously, has wide application prospect in high-performance computing, artificial intelligence and other fields, at present, when wafer level chip is processed, it needs to use packaging mechanism, China patent network discloses a kind of chip packaging device for chip processing, and the publication number is CN221239587U, although the packaging device is used to cool encapsulation for chip processing chip, through the clamping mechanism of setting, different shapes of chip can be clamped and fixed, so as to ensure the adaptability of the device, but the position of the first cold air fan, second cold air fan in the patent is fixed, on the one hand, it cannot be all-round cooling treatment for chip, there is obvious defect, on the other hand, the use cost of two cold air fans is higher, thereby increasing the manufacturing cost of chip.

[0003] Therefore, a wafer level chip packaging mechanism is provided. UTILITY MODEL CONTENT

[0004] The utility model aims at providing a wafer level chip packaging mechanism.

[0005] To achieve the above-mentioned purpose, the utility model provides the following technical scheme:

[0006] A wafer level chip packaging mechanism, comprising:

[0007] A base;

[0008] Two supporting plates are fixed on the top of the base, and two mounting seats are fixed on the top of the two supporting plates;

[0009] A supporting rod is fixed on the outer wall of the mounting seat, one end of the supporting rod is fixed with a vertical plate, the bottom of the vertical plate is fixed with a platform, the top of the platform is installed with a first clamping plate, and a movable slot is formed in the outer wall of the vertical plate;

[0010] The wafer level chip body is placed on the top of the first clamping plate;

[0011] A through slot is formed in the outer wall of the movable block;

[0012] The top of the platform is provided with an electric telescopic rod, the top of the electric telescopic rod is fixedly provided with a connecting strip, one end of the connecting strip penetrates through a penetrating groove and is fixedly provided with a second clamping plate.

[0013] The top of the platform is provided with a first annular sliding groove, the first annular sliding groove is internally provided with a first sliding block, and the top of the first sliding block is provided with a fan.

[0014] Preferably, the inner wall of the movable slot is provided with a linear sliding groove, the linear sliding groove is internally provided with a second sliding block, and the movable block is fixed to one end of the second sliding block.

[0015] Preferably, the inner bottom of the mounting seat is provided with a second annular sliding groove, the second annular sliding groove is internally provided with a third sliding block, the top of the first sliding block is fixedly provided with a first gear, the top of the first gear is fixedly provided with a connecting column, the outer wall of the connecting column is fixedly provided with a connecting rod, and one end of the connecting rod is fixedly provided with the fan.

[0016] Preferably, the top of the base is provided with a motor, the output end of the motor is fixedly provided with a driving rod in an upward direction, and the top of the driving rod penetrates through the mounting seat and is fixedly provided with a second gear which is engaged with the first gear.

[0017] Preferably, the outer wall of the supporting plate is provided with a container, the container is internally provided with lubricating oil, the inner wall of the container is provided with a pump, and the outlet end of the pump is connected with a pipeline which penetrates through the container and the mounting seat.

[0018] Preferably, one end of the pipeline is located in the inner part of the mounting seat and is provided with a spray head.

[0019] Compared with the prior art, the present application has the following beneficial effects:

[0020] After the wafer-level chip body is welded, the fan and the motor are started by the staff, the wafer-level chip body can be cooled under the action of the fan, and the second gear rotates under the driving of the motor, so that the fan rotates through the first gear, thereby enabling the motor to cool the wafer-level chip body at multiple angles and in multiple directions. BRIEF DESCRIPTION OF DRAWINGS

[0021] Figure 1 It is a schematic view of the overall structure of the present application;

[0022] Figure 2 It is a schematic view of the overall structure of the present application Figure 1 It is an enlarged view of A in the present application.

[0023] Figure 3 It is the first annular chute, first slider structure schematic view in the utility model;

[0024] Figure 4 It is the front structure schematic view of the utility model;

[0025] Figure 5 It is the first gear, second gear structure schematic view in the utility model.

[0026] In the drawing: 1, base; 2, support plate; 3, mounting seat; 4, support rod; 5, vertical plate; 6, first clamping plate; 7, second clamping plate; 8, wafer level chip body; 9, electric telescopic rod; 10, connecting strip; 11, movable groove; 12, movable block; 13, through slot; 14, straight line sliding slot; 15, second slider; 16, first annular chute; 17, first slider; 18, fan; 19, platform; 20, container; 21, pipeline; 22, spray head; 23, first gear; 24, connecting column; 25, connecting rod; 26, second gear; 27, motor; 28, drive rod. DETAILED DESCRIPTION

[0027] The technical solutions in the embodiments of the utility model will be described clearly and completely below with reference to the drawings in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by those skilled in the art without creative labor fall within the scope of protection of the utility model.

[0028] In order to better understand the above technical solutions, the above technical solutions will be described in detail below with reference to the drawings in the specification and specific embodiments.

[0029] Embodiment 1:

[0030] Please refer to Figures 1-5The utility model provides a technical scheme: to realize above -mentioned purpose, the utility model provides the following technical scheme: a wafer level chip packaging mechanism, it includes: base 1, two support plates 2 are fixed on the top of base 1, and two support plates 2 top fixed mounting seat 3, mounting seat 3 outer wall is fixed with support 4, and support 4 one end is fixed with vertical board 5, and vertical board 5 bottom is fixed with platform 19, and platform 19 top installs first clamping plate 6, and vertical board 5 outer wall is set up with movable slot 11, and movable block 12 is movably arranged in movable slot 11, first clamping plate 6 top is placed with wafer level chip body 8, movable block 12 outer wall is set up with through slot 13, platform 19 top installs electric telescopic handle 9, and electric telescopic handle 9 top is fixed with connecting strip 10, and connecting strip 10 one end passes through through slot 13 and is fixed with second clamping plate 7, platform 19 top is set up with first annular slide groove 16, and first annular slide groove 16 installs first sliding block 17, and first sliding block 17 top installs fan 18, and vertical board 5 inner wall is set up with straight line slide groove 14, and straight line slide groove 14 installs second sliding block 15, and movable block 12 is fixed in second sliding block 15 one end, and mounting seat 3 inner bottom is set up with second annular slide groove, and second annular slide groove installs third sliding block, and first sliding block 17 top is fixed with first gear wheel 23, and first gear wheel 23 top is fixed with connecting column 24, and connecting column 24 outer wall is fixed with connecting rod 25, and connecting rod 25 one end is fixed with fan 18, and base 1 top installs motor 27, and the output of motor 27 is fixed drive rod 28 upwards, and drive rod 28 top penetrates mounting seat 3 and is fixed with the second gear wheel 26 meshed with first gear wheel 23.

[0031] Specifically, after the wafer level chip body 8 is welded, the staff starts the fan 18 and the motor 27, the wafer level chip body 8 can be cooled under the action of the fan 18, and the second gear wheel 26 rotates under the driving of the motor 27, since the second gear wheel 26 is meshed with the first gear wheel 23, the fan 18 rotates through the first gear wheel 23, so that the motor 27 can cool the wafer level chip body 8 at multiple angles and in multiple directions, compared with the prior art, the wafer level chip body 8 can be cooled at multiple angles and in multiple directions, and the wafer level chip body 8 can be cooled by using only one fan 18, so that the use cost of the fan 18 is greatly reduced, and the manufacturing cost of the wafer level chip body 8 is further reduced.

[0032] Example 2:

[0033] Please refer to Figure 1 、 4The utility model provides a technical scheme: a wafer level chip packaging mechanism, a container 20 is installed to the outer wall of a support plate 2, lubricating oil is installed in the container 20, a pump is installed in the container 20, the outlet of the pump is connected with the pipeline 21 of the installation base 3 which penetrates the container 20, one end of the pipeline 21 is located in the installation base 3 and is installed with the shower nozzle 22.

[0034] Specifically, the staff can start the pump, under the action of the pump, the lubricating oil in the container 20 will be sprayed to the inside of the installation base 3 through the pipeline 21 and the spray head 22, to achieve the purpose of lubricating the first gear 23 and the second gear 26, by lubricating the first gear 23 and the second gear 26, on the one hand, the working efficiency of the first gear 23 and the second gear 26 can be improved, on the other hand, the wear of the first gear 23 and the second gear 26 can be reduced, thereby improving the service life of the first gear 23 and the second gear 26.

[0035] Working principle:

[0036] The staff first places the wafer level chip body 8 on the top of the first clamping plate 6, then the staff starts the electric telescopic rod 9, the electric telescopic rod 9 drives the second clamping plate 7 to move towards the first clamping plate 6, after the second clamping plate 7 abuts against the wafer level chip body 8, the wafer level chip body 8 can be fixed by the cooperation of the first clamping plate 6 and the second clamping plate 7, the staff starts the fan 18 and the motor 27, under the action of the fan 18, the wafer level chip body 8 can be cooled, and under the driving of the motor 27, the second gear 26 rotates, since the second gear 26 is engaged with the first gear 23, the second gear 26 drives the fan 18 to rotate through the first gear 23, so that the motor 27 can cool the wafer level chip body 8 at multiple angles and in multiple directions, the staff can start the pump, under the action of the pump, the lubricating oil in the container 20 will be sprayed to the inside of the installation base 3 through the pipeline 21 and the spray head 22, to achieve the purpose of lubricating the first gear 23 and the second gear 26.

[0037] In the description of the utility model, it is understood that the orientation or position relationship indicated by the terms "center", "front", "back", "vertical", "horizontal", "top", "bottom", "inner", "outer" and the like is the orientation or position relationship shown in the drawings, and is only for the convenience of describing the utility model and simplifying the description, and does not indicate or imply that the indicated device or element must have a particular orientation, be constructed and operated in a particular orientation, so it cannot be understood as a limitation on the protection scope of the utility model.

[0038] The basic principle, main features and advantages of the present application are shown and described above. Those skilled in the art should understand that the present application is not limited by the above examples, and the above examples and descriptions in the specification are only to illustrate the principles of the present application. Without departing from the spirit and scope of the present application, various changes and improvements can be made to the present application, and these changes and improvements all fall within the scope of the claimed present application. The scope of protection of the present application is defined by the appended claims and their equivalents.

Claims

1. A wafer-level chip packaging mechanism, characterized in that, include: Base (1); The base (1) has two support plates (2) fixed to its top, and the two support plates (2) have mounting bases (3) fixed to their tops; The mounting base (3) has a support rod (4) fixed on its outer wall. A vertical plate (5) is fixed at one end of the support rod (4). A platform (19) is fixed at the bottom of the vertical plate (5). A first clamping plate (6) is installed on the top of the platform (19). An movable groove (11) is opened on the outer wall of the vertical plate (5). A movable block (12) is movably arranged in the movable groove (11). A wafer-level chip body (8) is placed on top of the first clamping plate (6); The outer wall of the movable block (12) is provided with a through groove (13); An electric telescopic rod (9) is installed on the top of the platform (19), and a connecting strip (10) is fixed on the top of the electric telescopic rod (9). One end of the connecting strip (10) passes through the through groove (13) and is fixed with a second clamping plate (7). The platform (19) has a first annular groove (16) on its top, a first slider (17) is installed in the first annular groove (16), and a fan (18) is installed on the top of the first slider (17).

2. The wafer-level chip packaging mechanism according to claim 1, characterized in that, The inner wall of the movable groove (11) is provided with a straight slide groove (14), and a second slider (15) is installed in the straight slide groove (14). The movable block (12) is fixed to one end of the second slider (15).

3. The wafer-level chip packaging mechanism according to claim 1, characterized in that, The mounting base (3) has a second annular groove at its bottom, and a third slider is installed in the second annular groove. A first gear (23) is fixed to the top of the first slider (17), and a connecting column (24) is fixed to the top of the first gear (23). A connecting rod (25) is fixed to the outer wall of the connecting column (24), and one end of the connecting rod (25) is fixed to the fan (18).

4. The wafer-level chip packaging mechanism according to claim 3, characterized in that, A motor (27) is installed on the top of the base (1). The output end of the motor (27) is fixed with a drive rod (28) facing upward. The top of the drive rod (28) passes through the mounting base (3) and is fixed with a second gear (26) that meshes with the first gear (23).

5. A wafer-level chip packaging mechanism according to claim 1, characterized in that, A container (20) is installed on the outer wall of the support plate (2). The container (20) is filled with lubricating oil. A pump is installed inside the container (20). The outlet of the pump is connected to a pipe (21) that passes through the container (20) and the mounting base (3).

6. A wafer-level chip packaging mechanism according to claim 5, characterized in that, One end of the pipe (21) is located inside the mounting base (3) and is fitted with a nozzle (22).

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