Paster die bonding jig based on anti-shake structure

Abstract

The utility model discloses a patch die bonding jig based on an anti-shake structure, which is used for holding materials conveyed in a patch die bonding process, and comprises a patch die bonding part and a supporting part, the supporting part is arranged at the bottom of the patch die bonding part, a plurality of bottom holes are arranged on the bottom surface of the supporting part, and the bottom holes are communicated with the bottom holes. The circle centers of the bottom open holes are all arranged on the central axis of the supporting part in the conveying direction. A plurality of discharging holes are formed in the patch die bonding part, the discharging holes are formed in the two sides of the central axis of the patch die bonding part in the conveying direction, and the discharging holes are symmetrical according to the central axis; the hole depth of the bottom opening hole is one half of the hole depth of the discharging hole. Through the application of the anti-shake structure and the magnetic material, the patch die bonding jig significantly reduces the shake in the patch die bonding transmission process, and improves the stability and precision of the patch die bonding process. The overall weight of the jig is reduced through the optimal design of the chip-mounting and die-bonding part and the supporting part, so that the operation is more convenient, and the burden of the conveyor belt and the chip-mounting and die-bonding machine is reduced.

Description

TECHNICAL FIELD

[0001] The utility model relates to the technical field of semiconductor processing especially relates to a patch die bonder based on anti -shake structure. BACKGROUND

[0002] Patch die bonder is a widely used semiconductor packaging technology, which realizes the whole process packaging of PCB, frame and other products through special patch die bonder equipment. In this process, the patch die bonder plays a crucial role, and this bonder is suitable for continuous automatic die bonding operation based on single non-integral special product packaging patch. In the field of patch die bonder forming, the stability of the bonder is a key factor to ensure production efficiency and product quality. However, the existing patch die bonder is prone to shaking during the conveying process of the patch die bonder machine. This instability can cause the offset of the patch, thereby affecting the size accuracy and surface quality of the patch die bonder product. The existing bonder design often fails to effectively control the stable packaging material conveying, resulting in problems such as die bonding offset, inclination and collision during the patch die bonder process, which further aggravates the defects of the packaging product. SUMMARY

[0003] The utility model embodiment provides a kind of patch die bonder based on anti -shake structure, to solve the problem of poor stability of patch die bonder in the conveying process of patch die bonder machine in prior art method.

[0004] The utility model embodiment discloses a kind of patch die bonder based on anti -shake structure, for the material that is conveyed in patch die bonder process, bonder includes patch die bonding part and support part, the support part is set to the bottom of the patch die bonding part, multiple bottom openings are set on the bottom surface of the support part, the center of the bottom opening is set on the central axis of the support part in conveying direction;Multiple material discharge holes are set on the patch die bonding part, the material discharge hole is set on the central axis in conveying direction of the patch die bonding part two sides, the material discharge hole is symmetrical according to the central axis;The hole depth of the bottom opening is set as the half of the hole depth of the material discharge hole.

[0005] Further, the horizontal plane of the patch die bonding part is set as rectangle, the total area of the support part is less than the total area of the patch die bonding part, the patch die bonding part is set as plate, the thickness of the patch die bonding part is 30%-50% of the thickness of the support part.

[0006] Further, the patch die bonding part and the support part are made of magnetic material, and the support part is fixedly connected to the bottom surface of the patch die bonding part by welding.

[0007] Further, the aperture of the feeding hole is 120%-140% of the aperture of the bottom opening.

[0008] Further, the feeding hole is divided into a core hole and a peripheral hole according to the stepped inner wall.

[0009] Further, the aperture of the core hole is 30%-60% of the aperture of the feeding hole.

[0010] Further, the bottom surface of the support part is provided with an auxiliary hole, and the aperture of the auxiliary hole is 5%-10% of the aperture of the bottom opening.

[0011] Further, the area of the bottom opening accounts for 5%-15% of the total area of the support part.

[0012] Further, the area of the feeding hole accounts for 10%-30% of the total area of the die-bonding part.

[0013] Further, two U-shaped buffer openings are arranged on the support part, one of which is open towards the conveying direction of the die-bonding jig, and the other is open towards the opposite direction of the conveying direction of the die-bonding jig.

[0014] The die-bonding jig described above significantly reduces the jitter in the die-bonding conveying process through the application of the anti-shake structure and the magnetic material, improves the stability and precision of the die-bonding process, and optimizes the design of the die-bonding part and the support part to reduce the overall weight of the jig, making the operation more convenient, while reducing the burden on the conveying belt and the die-bonding machine. The accurate area ratio of the feeding hole and the bottom opening ensures the efficient flow of raw materials, improves the die-bonding efficiency, and reduces the production cycle. The stepped inner wall design of the core hole and the peripheral hole realizes more precise material flow control, improves the uniformity and quality of the die-bonding products. BRIEF DESCRIPTION OF DRAWINGS

[0015] In order to more clearly illustrate the technical scheme of the embodiments of the present application, the following will briefly introduce the drawings needed in the embodiment description. Obviously, the drawings in the following description are some embodiments of the present application, and for those skilled in the art, other drawings can also be obtained without creative labor on the basis of these drawings.

[0016] Figure 1 The overall structure diagram of the die-bonding jig based on the anti-shake structure provided by the embodiments of the present application is shown in the figure.

[0017] Figure 2 Another overall structure diagram of the die-bonding jig based on the anti-shake structure provided by the embodiments of the present application is shown in the figure.

[0018] Reference Signs:

[0019] 1, patch part; 2, support part; 11, feeding hole; 21, bottom opening; 22, auxiliary hole; 23, U-shaped buffer port. DETAILED DESCRIPTION

[0020] The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application. Obviously, the described embodiments are only some of the embodiments of the present application, rather than all the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without creative work fall within the scope of protection of the present application.

[0021] It should be understood that the terms "comprising" and "including" as used in the specification and the appended claims indicate the presence of the recited features, integers, steps, operations, elements, and / or components but do not preclude the presence or addition of one or more other features, integers, steps, operations, elements, components, and / or groups thereof.

[0022] It should also be understood that the terms used in the present application specification are only for the purpose of describing specific embodiments and are not intended to limit the present application. As used in the present application specification and the appended claims, the singular forms "a", "an" and "the" are intended to include the plural forms unless the context clearly indicates otherwise.

[0023] It should be further understood that the term "and / or" as used in the present application specification and the appended claims means any combination of one or more of the associated listed items and all possible combinations, and includes these combinations.

[0024] As shown in Figure 1 and Figure 2 The present embodiment provides a patch die bonder based on an anti-shake structure, which is used for holding materials to be conveyed in a patch die bonding process. The die bonder includes a patch part 1 and a support part 2. The support part 2 is arranged at the bottom of the patch part 1. A plurality of bottom openings 21 are arranged on the bottom surface of the support part 2. The centers of the bottom openings 21 are arranged on the central axis of the support part 2 in the conveying direction. A plurality of feeding holes 11 are arranged on the patch part 1. The feeding holes 11 are arranged on both sides of the central axis of the patch part 1 in the conveying direction, and the feeding holes 11 are symmetrical about the central axis. The depth of the bottom openings 21 is half of the depth of the feeding holes 11.

[0025] In actual use scenarios, during the dispensing stage of the die bonding process, plastic raw materials are fed into the die bonder and placed through the jig. The die bonding portion 1 of the jig receives the raw materials, and the design of the dispensing holes 11 allows the raw materials to be evenly filled into the mold. When the jig moves with the conveyor belt, the bottom openings 21 of the support portion 2 allow negative pressure to be generated below the mold, which helps the raw materials to be better adsorbed on the mold, reducing shaking during the conveying process. The central axis of the support portion 2 and the central axis of the die bonding portion 1 are consistent, ensuring the stability of the raw materials in the conveying direction. After reaching the die bonding position, the die bonder performs die bonding through the dispensing holes 11. Due to the symmetrical arrangement of the dispensing holes 11, the die bonding material can be evenly distributed in the mold, improving product quality. After die bonding is completed, the design of the bottom openings 21 helps to reduce damage to the product during conveying. The design of the bottom openings 21 helps to generate negative pressure during the conveying process, improving the adsorption force between the jig and the conveyor belt, reducing shaking, and thus improving the precision and stability of die bonding. The symmetrical design of the dispensing holes 11 ensures that the die bonding raw materials can be evenly die bonded, reducing die bonding offset defects caused by uneven distribution, and improving the yield of the product. By setting the center of the bottom opening 21 on the central axis, further reducing the offset and shaking that may occur during the conveying process, ensuring the continuity and stability of the die bonding process. Stable conveying process reduces downtime in production, improving production efficiency. Due to the reduction of equipment wear caused by shaking, the design of this jig helps to prolong the service life of the equipment and reduce maintenance costs. Through uniform material injection and reduced shaking, the final product has better appearance and more stable dimensional accuracy, enhancing the market competitiveness of the product.

[0026] In summary, the die bonding jig based on the anti-shaking structure not only effectively reduces the shaking during the die bonding conveying process, but also achieves weight reduction of the jig through optimized design. The symmetrical design of the bottom openings 21 and the dispensing holes 11 significantly reduces the shaking during the die bonding conveying process, improving the precision and stability of die bonding. Through the design of the bottom openings 21, the weight of the jig is reduced, making the jig more lightweight and easy to operate and maintain. The lightweight jig reduces energy consumption and improves the speed of the production line, thereby improving production efficiency. After the weight of the jig is reduced, the burden on the conveyor belt and the die bonder is reduced, reducing the overall energy consumption. Reduced shaking and weight reduction reduce equipment wear, prolonging the service life of the jig and other related equipment. The lightweight jig is easier to operate, reducing the risk of worker injury and improving the safety of the work environment. Through this double optimization, the jig not only ensures the quality of the die bonding process, but also improves cost-effectiveness and production efficiency.

[0027] Further, the patch part 1 is rectangular in horizontal plane, the total area of the support part 2 is less than that of the patch part 1, the patch part 1 is plate-shaped, and the thickness of the patch part 1 is 30%-50% of that of the support part 2.

[0028] Specifically, the patch part 1 is rectangular in horizontal plane, and the total area of the support part 2 is less than that of the patch part 1. Such a structure design reduces the amount of material used while maintaining sufficient strength, further reducing the weight of the jig. Since the total area of the support part 2 is less than that of the patch part 1, this design helps to save material costs while maintaining the stability of the jig. The patch part 1 is plate-shaped, and its thickness is 30%-50% of that of the support part 2. Such a thickness ratio helps to enhance the rigidity of the patch part 1 and reduce deformation caused by pressure during die bonding. The thickness design of the patch part 1 enables it to better withstand pressure and temperature changes during die bonding, thereby improving the durability and service life of the jig. The plate-shaped patch part 1 helps to more evenly conduct heat, thereby improving the melting and filling efficiency of raw materials in the die bonding process, further improving product quality. By optimizing the thickness ratio of the patch part 1 and the support part 2, stress concentration can be reduced, and the risk of fatigue damage to the jig during long-term use can be reduced. In summary, these design improvements not only further reduce the weight of the jig, but also enhance the structural strength and durability of the jig, while optimizing heat conduction and stress distribution, thereby improving the overall performance and economic benefits of the die bonding process.

[0029] Further, the patch part 1 and the support part 2 are both made of magnetic material, and the support part 2 is fixedly connected to the bottom surface of the patch part 1 by welding.

[0030] Further, the hole diameter of the discharge hole 11 is 120%-140% of that of the bottom opening 21.

[0031] Further, the discharge hole 11 is provided with a stepped inner wall, and the discharge hole 11 is divided into a core hole and a peripheral hole according to the stepped inner wall.

[0032] Specifically, the patch part 1 and the support part 2 are both made of magnetic material, making the jig more convenient and fast to install and replace. Magnetic connection can provide stable fixing effect, while facilitating quick disassembly for maintenance or replacement. The magnetic material may have certain shock absorption effect, which helps to further reduce vibration during patch die bonding and improve patch die bonding precision. The support part 2 is fixedly connected to the bottom surface of the patch part 1 by welding, providing strong structural stability and ensuring that the jig does not shift or fall off during patch die bonding. The welding connection point can withstand large force and temperature change, increasing the overall durability of the jig. The hole diameter of the discharge hole 11 is 120%-140% of the hole diameter of the bottom opening 21. This design helps to optimize the flow control of raw materials and ensure uniform distribution of raw materials during patch die bonding, reducing quality problems caused by uneven flow. The discharge hole 11 is provided with a stepped inner wall, divided into a core hole and a peripheral hole. This design can improve the characteristics and speed distribution of the flow, making the raw materials more uniform when injected into the mold, reducing defects such as air bubbles and weld lines. The stepped inner wall helps to guide the flow of raw materials and improve the filling effect of patch die bonding, especially in the design of complex molds, it can better control the flow direction and speed, and improve the quality of the final product. In summary, this patch die bonding jig based on the anti-shake structure not only has better structural stability and durability, but also improves the efficiency and product quality of the patch die bonding process by optimizing the design of the discharge hole 11. The application of magnetic material and stepped inner wall further enhances the performance of the jig, making it play a greater role in patch die bonding production.

[0033] Further, the core hole has a hole diameter of 30%-60% of the hole diameter of the discharge hole 11.

[0034] Further, the bottom surface of the support part 2 is provided with an auxiliary hole 22, and the hole diameter of the auxiliary hole 22 is set to be 5%-10% of the hole diameter of the bottom opening 21.

[0035] Specifically, the core hole is set to 30%-60% of the size of the feed hole 11, which helps to achieve more precise flow control. As the main channel for the flow, the smaller aperture can increase the flow rate, reduce vortex and stagnation, and thus improve the uniformity of die bonding and the quality of the product. By controlling the aperture of the core hole, the flow rate during die bonding can be more accurately controlled, which is particularly important for products that require high-precision die bonding, helping to reduce waste and improve production efficiency. The bottom surface of the support part 2 is provided with auxiliary holes 22, which help to reduce the weight of the jig while maintaining its structural stability. The design of the auxiliary holes 22 can make the jig maintain sufficient strength while reducing material usage and cost. Auxiliary holes 22 can also serve as heat dissipation channels to help the jig dissipate heat better during die bonding, preventing the die bonding effect from being affected or the jig from being damaged due to excessive temperature. Adjust the flow characteristics: The auxiliary holes 22 are set to 5%-10% of the size of the bottom opening 21, which can adjust the flow characteristics to some extent, making the raw material more uniform when injected into the mold, reducing defects caused by uneven flow. Through the design of the core hole and auxiliary holes 22, more precise and uniform flow control is achieved, improving the precision of the die bonding process and the quality of the product. The application of magnetic materials, welding and fixed connection, and the setting of auxiliary holes 22 enhance the structural stability and durability of the jig. The heat dissipation effect of auxiliary holes 22 helps to maintain the stability and service life of the jig in high-temperature environments. By optimizing material usage and improving production efficiency, production costs are reduced, and the economic benefits of the enterprise are improved. The design of this jig fully considers the actual needs of the die bonding process, providing a more efficient, stable and reliable solution for die bonding production.

[0036] Further, the area of the bottom opening 21 accounts for 5%-15% of the total area of the support part 2.

[0037] Further, the area of the feed hole 11 accounts for 10%-30% of the total area of the die part 1.

[0038] Further, two U-shaped buffer openings 23 are provided on the support part 2, one of which is open towards the conveying direction of the die bonding jig, and the other is open towards the opposite direction of the conveying direction of the die bonding jig.

[0039] Specifically, the area of the bottom opening 21 accounts for 5%-15% of the total area of the support part 2. Such design ensures sufficient structural strength of the jig without excessive weight increase. Moderate opening area helps stable material flow during die bonding process while maintaining the overall stability of the jig. Reasonable opening ratio helps optimize material distribution of the jig, reducing unnecessary material waste and lowering production cost. The area of the discharge hole 11 accounts for 10%-30% of the total area of the die part 1. Such design helps ensure the efficiency of the die bonding process while controlling the rate and direction of material flow, improving the quality of die bonding products. The appropriate ratio of the area of the discharge hole 11 can ensure uniform filling of raw materials in the mold, reducing product defects caused by uneven filling. Two U-shaped buffer ports 23 are arranged on the support part 2. The design helps reduce vibration and impact during die bonding process, improving the stability of the jig. The U-shaped buffer port 23 can absorb and disperse the force generated by machine movement or material flow impact, thereby protecting the jig and mold. One U-shaped buffer port 23 is open towards the conveying direction, and the other is open towards the opposite direction. Such layout can provide buffering effect for different stages of the die bonding process, whether it is the material flow entering or pushing out stage, which can effectively reduce impact and vibration. By reducing vibration, the U-shaped buffer port 23 also improves the safety of the operators and the overall safety of the equipment, reducing the risk of equipment failure caused by excessive vibration. In summary, the design of this die bonding jig ensures structural stability and die bonding efficiency, while further improving the stability of the die bonding process and the quality of the products through precise opening ratio and buffer port design. Such jig is not only suitable for efficient die bonding production, but also can prolong the service life of the equipment and reduce maintenance cost, bringing significant economic benefits to the production enterprises.

[0040] The utility model discloses a kind of patch die bonder based on anti-shake structure, for patch die bonding process conveying process discharging, jig includes patch part 1 and support part 2, support part 2 is set to the bottom of patch part 1, multiple bottom openings 21 are set on the bottom surface of support part 2, the center of bottom opening 21 is set on the central axis of support part 2 in conveying direction;Multiple discharging holes 11 are set on patch part 1, discharging hole 11 is set on the central axis of patch part 1 in conveying direction, and discharging hole 11 is symmetrical according to central axis;The hole depth of bottom opening 21 is set as the hole depth of discharging hole 11 Half. The above-mentioned jig is applied by anti-shake structure and magnetic material, and the jig significantly reduces the jitter in patch die bonding conveying process, improves the stability and precision of patch die bonding process. The optimization design of patch part 1 and support part 2 reduces the overall weight of the jig, so that operation is more convenient, while reducing the burden of conveying belt and patch die bonder. The accurate area ratio of discharging hole 11 and bottom opening 21 ensures the efficient flow of raw materials, improves the patch die bonding efficiency, and reduces the production cycle. The stepped inner wall design of core hole and peripheral hole realizes more fine flow control, improves the uniformity and quality of patch die bonding product. The opening and auxiliary hole 22 of the bottom of support part 2 help heat dissipation, maintain the stability of the jig in high-temperature environment, and prolong its service life. The plate structure of patch part 1 and the welding connection of support part 2 enhance the structural strength of the jig, so that it can withstand the pressure and impact in patch die bonding process. The design of U-shaped buffer port 23 effectively absorbs and disperses vibration and impact, further protects the jig and mold, and improves operation safety and equipment life. Lightweight jig and reduced vibration reduce the labor intensity and injury risk of operating workers, and improve the safety of working environment. Through material saving, improving production efficiency and reducing scrap rate, the jig helps to reduce production cost and improve the economic benefit of enterprise. The design of magnetic material and U-shaped buffer port 23 makes the jig easier to install and adjust, and adapts to different patch die bonding process requirements. The design of the jig comprehensively considers stability, efficiency, safety, cost and adaptability, etc.

[0041] The above is only a specific embodiment of the utility model, but the protection scope of the utility model is not limited to this, and anyone skilled in the art can easily think of various equivalent modifications or replacements within the technical range disclosed by the utility model, and these modifications or replacements should be covered in the protection scope of the utility model. Therefore, the protection scope of the utility model should be subject to the protection scope of claims.

Claims

1. A patch die bonder jig based on an anti-shake structure, used for holding materials to be conveyed in a patch die bonding process, characterized in that, The patch part and the support part, the support part is arranged at the bottom of the patch part, a plurality of bottom openings are arranged on the bottom surface of the support part, the centers of the bottom openings are arranged on the central axis of the support part in the conveying direction; A plurality of discharge holes are arranged on the patch part, the discharge holes are arranged on both sides of the central axis of the patch part in the conveying direction, the discharge holes are symmetrical according to the central axis; The hole depth of the bottom opening is set to be half of the hole depth of the discharge hole. The horizontal plane of the patch part is set to be rectangular, the total area of the support part is smaller than the total area of the patch part, the patch part is set to be plate-shaped, and the thickness of the patch part is 30%-50% of the thickness of the support part.

2. The anti-vibration structure based die bonding jig according to claim 1, wherein The patch part and the support part are both made of magnetic material, and the support part is fixedly connected to the bottom surface of the patch part by welding.

3. The anti-vibration structure based die bonding tooling fixture of claim 1, wherein, The hole diameter of the discharge hole is 120%-140% of the hole diameter of the bottom opening.

4. The anti-vibration structure based die bonding tooling fixture of claim 1, wherein, A stepped inner wall is arranged in the hole of the discharge hole, and the discharge hole is divided into a core hole and a peripheral hole according to the stepped inner wall.

5. The anti-vibration structure based die bonding tooling according to claim 4, wherein, The hole diameter of the core hole is 30%-60% of the hole diameter of the discharge hole.

6. The anti-vibration structure based die bonding tooling fixture of claim 5, wherein, An auxiliary hole is arranged on the bottom surface of the support part, and the hole diameter of the auxiliary hole is set to be 5%-10% of the hole diameter of the bottom opening.

7. The anti-vibration structure based die bonding tooling fixture of claim 1, wherein, The area of the bottom opening accounts for 5%-15% of the total area of the support part.

8. The anti-vibration structure based die bonding tooling fixture of claim 1, wherein, The area of the discharge hole accounts for 10%-30% of the total area of the patch part.

9. The anti-vibration structure based die bonding tooling fixture of claim 1, wherein, Two U-shaped buffer openings are arranged on the support part, one of the U-shaped buffer openings is open in the conveying direction of the patch die bonding tool, and the other U-shaped buffer opening is open in the opposite direction of the conveying direction of the patch die bonding tool.

10. The anti-vibration structure based die bonding jig according to claim 1, wherein ​

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