Flip chip and flip chip packaging structure
By setting grooves at the edge of the functional surface of the flip chip to prevent the underfill from creeping up, the problems of voids and delamination caused by the underfill are solved, thus improving the reliability of flip chip packaging.
Patent Information
- Application Number
- CN202520182113.1
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-02-06
- Publication Date
- 2026-02-27
- Estimated Expiration
- 2035-02-06
AI Technical Summary
In existing flip chip packaging, the underfill adhesive climbs up the chip side to the non-functional surface, causing voids and delamination between the chip and the heat dissipation material layer, which affects the reliability of the package.
A groove is set at the edge of the chip's functional surface to prevent the underfill from climbing up to the non-functional surface, and underfill is filled between the chip and the substrate to ensure that the groove is filled with underfill and to prevent voids and delamination.
By setting grooves to prevent the bottom filler from climbing up, the non-functional surfaces of the chip are kept clean, voids and delamination are avoided, and packaging reliability is improved.
Smart Images
Figure CN223957972U_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The embodiment of the present disclosure belongs to the technical field of semiconductor packaging, and particularly relates to a flip chip and a flip chip packaging structure. BACKGROUND
[0002] In the prior flip chip packaging, after the chip is flip-chip set on the substrate, the underfill adhesive needs to be filled between the substrate and the chip. When the underfill adhesive is filled, due to the fluidity of the underfill adhesive, the underfill adhesive will climb to the non-functional surface of the chip along the side surface of the chip. When the heat dissipation material layer is pasted on the non-functional surface of the chip, due to the existence of the underfill adhesive, a cavity will be generated between the chip and the heat dissipation material layer, and delamination phenomenon is easy to occur, which affects the reliability of the chip packaging.
[0003] In view of the above problems, it is necessary to provide a flip chip and a flip chip packaging structure which are reasonable in design and can effectively improve the above problems. CONTENT OF THE INVENTION
[0004] The embodiment of the present disclosure aims to at least solve one of the technical problems existing in the prior art, and provide a flip chip and a flip chip packaging structure.
[0005] The embodiment of the present disclosure provides a flip chip, comprising a chip body, a conductive bump array is arranged on the central region of the functional surface of the chip body;
[0006] A groove is arranged on the edge region of the functional surface of the chip body, and the groove is arranged outside the conductive bump array; wherein,
[0007] The groove can block the underfill adhesive from climbing to the non-functional surface of the chip body when the underfill adhesive is filled between the chip body and the substrate.
[0008] Optionally, the depth of the groove is 30% to 50% of the thickness of the chip body.
[0009] Optionally, the width of the groove ranges from 30 microns to 50 microns.
[0010] Optionally, the distance between the groove and the edge circuit of the chip body is greater than 15 microns.
[0011] Optionally, the longitudinal section of the groove is rectangular.
[0012] Another aspect of the embodiment of the present disclosure provides a flip chip packaging structure, comprising
[0013] a substrate, a flip chip and an underfill adhesive layer; wherein the flip chip adopts the flip chip described above;
[0014] The flip chip is arranged on the substrate.
[0015] The bottom filler layer is sandwiched between the substrate and the flip chip, and is filled in the groove.
[0016] The flip chip and flip chip packaging structure of this disclosure include a chip body, a conductive bump array in the central region of the functional surface of the chip body, and a groove in the edge region of the functional surface of the chip body surrounding the conductive bump array. When filling the space between the chip body and the substrate with underfill, the groove prevents the underfill from climbing up the chip side to the non-functional surface of the chip body, ensuring the cleanliness of the non-functional surface. This prevents voids and delamination between the chip body and the heat dissipation material layer when they are bonded to the non-functional surface, thus improving the reliability of the chip packaging. Attached Figure Description
[0017] Figure 1 This is a schematic diagram of the structure of a flip chip according to one embodiment of the present disclosure;
[0018] Figure 2 This is a schematic diagram of the process for forming a groove in one embodiment of the present disclosure;
[0019] Figure 3 This is a schematic diagram of a flip-chip packaging structure according to another embodiment of this disclosure. Detailed Implementation
[0020] To enable those skilled in the art to better understand the technical solutions of the embodiments of this disclosure, the embodiments of this disclosure will be further described in detail below with reference to the accompanying drawings and specific implementation methods.
[0021] like Figure 1 As shown, one aspect of this disclosure provides a flip chip 100, including a chip body 110, wherein a conductive bump array 120 is provided in the central region of the functional surface of the chip body 110.
[0022] The edge region of the functional surface of the chip body 110 is provided with a groove 130, which surrounds the outer side of the conductive bump array 120.
[0023] The groove 130 can prevent the underfill adhesive from rising to the non-functional surface of the chip body 110 when the underfill adhesive is filled between the chip body 110 and the substrate 210.
[0024] Specifically, after the flip chip is placed on the substrate, when filling the space between the chip body 110 and the substrate 210 with underfill, since the edge area of the functional surface of the chip body 110 is provided with a groove 130, on the one hand, the groove 130 can accommodate excess underfill and prevent excess underfill from climbing to the non-functional surface of the chip body 110; on the other hand, the sidewall of the groove 130 also acts as a barrier, which can prevent the underfill from climbing to the non-functional surface of the chip body 110.
[0025] The flip chip of this disclosure includes a chip body, with a conductive bump array disposed in the central region of the functional surface of the chip body; and a groove disposed in the edge region of the functional surface of the chip body, surrounding the conductive bump array. When filling the space between the chip body and the substrate with underfill, the groove prevents the underfill from climbing up the chip side to the non-functional surface of the chip body, ensuring the cleanliness of the non-functional surface. This prevents voids and delamination between the chip body and the heat dissipation material layer when the non-functional surface of the chip body is adhered, thus improving the reliability of the chip packaging.
[0026] For example, in this embodiment, the depth of the groove 130 is 30% to 50% of the thickness of the chip body 110. The depth of the groove 130 within this range can better prevent the underfill adhesive from climbing up to the non-functional surface of the chip body 110.
[0027] It should be noted that the specific depth of the groove 130 can be set according to actual needs, and this embodiment does not impose a specific limitation.
[0028] For example, in this embodiment, the width of the groove 130 is in the range of 30μm to 50μm. Within this range, the width of the groove 130 can better prevent the underfill from climbing onto the non-functional surface of the chip body 110.
[0029] It should be noted that the specific width of the groove 130 can be set according to actual needs, and this embodiment does not impose a specific limitation.
[0030] For example, in this embodiment, the distance between the groove 130 and the edge lines of the chip body 110 is greater than 15 μm. The preset distance between the groove 130 and the edge lines of the chip body 110 prevents damage to the new edge lines of the chip body 110 when the groove 130 is formed, ensuring the reliability of the chip body 110's lines and thus improving the reliability of the flip chip.
[0031] For example, such as Figure 1 As shown, in this embodiment, the longitudinal section of the groove 130 is rectangular.
[0032] like Figure 2As shown, in this embodiment, the specific process of forming the groove 130 is as follows: In the wafer dicing process, wafer A is partially diced along both sides of the dicing path, with a dicing depth of 30% to 50% of the thickness of wafer A, forming a groove as shown in the figure. Figure 1 The aforementioned groove. Wafer A is then completely diced along the dicing path to form multiple chips with grooves 130.
[0033] Specifically, such as Figure 2 As shown, the wafer A is first partially cut along the left side of the dicing track using cutter 1 to form a groove 130, then partially cut along the right side of the dicing track using cutter 2 to form a groove 130, and finally fully cut along the dicing track using cutter 3 to cut the wafer A into multiple chips with grooves 130.
[0034] like Figure 3 As shown, another aspect of this disclosure provides a flip-chip package structure 200, including a substrate 210, a flip chip 100, and an underfill layer 220; wherein the flip chip 100 is the flip chip 100 described above. The specific structural features of the flip chip 100 have been described in detail above and will not be repeated here.
[0035] The flip chip 100 is disposed on the substrate 210.
[0036] The bottom filler layer 220 is sandwiched between the substrate 210 and the flip chip 100 and fills the groove 130.
[0037] Specifically, the underfill layer 220 is sandwiched between the chip body 110 and the substrate 210, fills the groove, and wraps around the conductive bump array 120.
[0038] The flip-chip packaging structure of this disclosure uses the flip-chip described above. When filling the space between the flip-chip and the substrate with underfill, the groove provided on the flip-chip can prevent the underfill from climbing up the chip side to the non-functional surface of the chip body. This ensures that the underfill layer is only located between the flip-chip and the substrate and is filled in the groove, without climbing up to the non-functional surface of the flip-chip, thus ensuring the cleanliness of the non-functional surface of the flip-chip. In this way, when the heat dissipation material layer is attached to the non-functional surface of the flip-chip, no voids will be generated between the flip-chip and the heat dissipation material layer, and delamination will not occur, thereby improving the reliability of the flip-chip packaging structure.
[0039] It can be understood that the above implementation is only an exemplary implementation adopted for illustrating the principles of the embodiments of the present disclosure, however, the embodiments of the present disclosure are not limited thereto. Various modifications and improvements can be made by those of ordinary skill in the art without departing from the spirit and principle of the embodiments of the present disclosure, and these modifications and improvements are also considered to be within the scope of protection of the embodiments of the present disclosure.
Claims
1. A flip chip, characterized in that, The chip body is provided with an array of conductive bumps in a central region of a functional surface of the chip body; An edge region of the functional surface of the chip body is provided with a groove, which surrounds an outer side of the array of conductive bumps; wherein, The groove can block the underfill adhesive from climbing to a non-functional surface of the chip body when the underfill adhesive is filled between the chip body and a substrate.
2. The flip chip according to claim 1, wherein The depth of the groove is 30% to 50% of the thickness of the chip body.
3. The flip chip of claim 1, wherein, The width of the groove ranges from 30 μm to 50 μm.
4. The flip chip according to any one of claims 1 to 3, wherein The distance between the groove and an edge circuit of the chip body is greater than 15 μm.
5. The flip chip according to any one of claims 1 to 3, wherein The longitudinal section of the groove is rectangular.
6. A flip chip package structure, comprising: The chip body is provided with an array of conductive bumps in a central region of a functional surface of the chip body; An edge region of the functional surface of the chip body is provided with a groove, which surrounds an outer side of the array of conductive bumps; wherein, The groove can block the underfill adhesive from climbing to a non-functional surface of the chip body when the underfill adhesive is filled between the chip body and a substrate. The depth of the groove is 30% to 50% of the thickness of the chip body. The width of the groove ranges from 30 μm to 50 μm. The distance between the groove and an edge circuit of the chip body is greater than 15 μm. The longitudinal section of the groove is rectangular. The chip body is provided with an array of conductive bumps in a central region of a functional surface of the chip body; An edge region of the functional surface of the chip body is provided with a groove, which surrounds an outer side of the array of conductive bumps; wherein, The groove can block the underfill adhesive from climbing to a non-functional surface of the chip body when the underfill adhesive is filled between the chip body and a substrate. The depth of the groove is 30% to 50% of the thickness of the chip body. The width of the groove ranges from 30 μm to 50 μm. The distance between the groove and an edge circuit of the chip body is greater than 15 μm. The longitudinal section of the groove is rectangular.