Light emitting device for non-airtight environment of data center
By eliminating pins and glass insulators, the laser chip is directly bonded to the FPC and horizontally fixed, solving the problems of poor high-speed signal and heat dissipation of traditional optical emission devices in non-airtight environments of data centers. This achieves better heat dissipation and higher high-speed performance, while reducing cost and size.
Patent Information
- Application Number
- CN202520772434.7
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-04-22
- Publication Date
- 2026-03-03
- Estimated Expiration
- 2035-04-22
AI Technical Summary
Traditional optical emission devices suffer from poor high-speed signal quality and poor heat dissipation in non-airtight environments such as data centers. This is mainly because the laser chip is soldered onto the FPC by gold wires and pins, resulting in poor thermal conductivity.
By eliminating the pins, the laser chip is directly bonded to the FPC and horizontally fixed on the base, increasing the heat dissipation area. At the same time, the glass insulator and tube cap are eliminated, and the structure is optimized to adapt to the non-airtight environment of the data center.
It improves high-speed performance and heat dissipation, reduces costs, and shrinks the overall size.
Smart Images
Figure CN223966734U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to the field of optical device technology, specifically to an optical emitting device for use in non-airtight environments in data centers. Background Technology
[0002] Traditional optical emission device structures such as Figure 1 As shown, it includes: a tube body, a TO-CAN, an FPC (high-speed flexible circuit board), an LC adapter, and a laser chip. The lower end of the tube body is fitted over the cap of the TO-CAN and fixed to the base of the TO-CAN by welding. The base seals the lower opening of the tube body, and the upper end of the tube body is fixed to the LC adapter by welding. The TO-CAN includes: a base and a cap fixed on the base. A ceramic heat sink is fixed to the side of a protrusion on the upper surface of the base inside the cap. A laser chip is fixed on the ceramic heat sink, distributed vertically and coupled to a lens on the cap. An optical isolator is fixed inside the LC adapter. The lens is coupled to the fiber core inside the LC adapter through the optical isolator. Multiple through holes are opened vertically on the base, and pins are arranged in the through holes. A glass insulator is provided between the pins and the inner wall of the through holes. The laser chip is bonded to the pins with gold wire. An FPC is arranged below the base of the TO-CAN and welded to the pins. This type of emitting optical device has the following defects:
[0003] 1) Because the laser chip is first bonded to the pins with gold wires and then soldered onto the FPC via the pins, the high-speed signal is poor;
[0004] 2) Because the pins are surrounded by glass insulators, which have very poor thermal conductivity, and FPC is welded on them, which is also a material with very poor thermal conductivity, the heat dissipation surface is only the peripheral area of the base in the TO-CAN, which is small, resulting in poor heat dissipation. Utility Model Content
[0005] The technical problem to be solved by this utility model is to provide an optical emission device for use in non-airtight environments of data centers, so as to overcome the shortcomings of the prior art.
[0006] The technical solution of this utility model to solve the above-mentioned technical problems is as follows:
[0007] An optical transmitting device for use in non-hermetic environments of data centers includes an LC adapter and an FPC. The lower end of the tube body of the LC adapter is fixed with a base that seals its opening. A ceramic heat sink is fixed inside the tube body on the side of a protrusion on the upper surface of the base. A laser chip is fixed on the ceramic heat sink, which is vertically distributed and coupled to the fiber core inside the LC adapter. A notch is opened on the side wall of the tube body. One end of the FPC is located below the laser chip and fixed to the upper surface of the base, while the other end extends out of the tube body through the notch. The laser chip is bonded to the FPC with gold wire.
[0008] The beneficial effects of this utility model are as follows: Since the FPC is located below the laser chip and is fixed horizontally on the base, and the laser chip is directly bonded to the FPC with gold wire, this solution eliminates the pins compared to the prior art, thus effectively improving high-speed performance. At the same time, it effectively increases the heat dissipation area, resulting in better heat dissipation and making it suitable for non-airtight environments in data centers. Compared to the prior art, this solution also eliminates the glass insulator and tube cap, effectively reducing costs and shrinking the overall size.
[0009] Based on the above technical solution, the present invention can be further improved as follows.
[0010] Furthermore, an optical isolator is coupled between the optical fiber core and the laser chip inside the tube and fixed thereto.
[0011] Furthermore, a lens is fixed inside the tube and aligned with the fiber core, and the laser chip is coupled to the optical isolator through the lens.
[0012] The further beneficial effects of adopting the above are: centering the lens and fiber core, making optical coupling more convenient; and ensuring that the LC adapter, fiber core, optical isolator, and lens share a single tube, thereby guaranteeing that the optical axes are collinear.
[0013] Furthermore, the lens is located at the opening inside the tube and is fixed to the tube by adhesive bonding.
[0014] Furthermore, the tube body is fixed to the base by welding.
[0015] Furthermore, the FPC is fixed to the base using an adhesive method. Attached Figure Description
[0016] Figure 1 This is a structural diagram of an optical emitting device in the prior art;
[0017] Figure 2 This is a structural diagram of the optical emission device used in a non-airtight environment of a data center according to this utility model;
[0018] Figure 3 This is a cross-sectional view of the optical emission device used in a non-airtight environment of a data center according to the present invention.
[0019] The attached diagram lists the components represented by each number as follows:
[0020] 1. LC adapter, 110. Tube body, 111. Notch, 120. Fiber optic core, 2. FPC, 3. Lens, 4. Base, 410. Boss, 5. Ceramic heat sink, 6. Laser chip, 7. Gold wire, 8. Optical isolator. Detailed Implementation
[0021] The principles and features of this utility model are described below with reference to the accompanying drawings. The examples given are only for explaining this utility model and are not intended to limit the scope of this utility model.
[0022] Example 1
[0023] like Figure 2 , Figure 3 As shown, an optical emitting device for use in non-hermetic environments of data centers includes:
[0024] LC adapter 1 and FPC 2. In LC adapter 1, a base 4 is fixed to the lower end of tube 110 to cover its opening. On the upper surface of the base 4, there is a boss 410 in the area enclosed by tube 110. A ceramic heat sink 5 is fixed to the side of the boss 410 on the upper surface of the base 4 inside tube 110. A laser chip 6 distributed vertically is fixed on the ceramic heat sink 5. The laser chip 6 is coupled to the fiber core 120 in LC adapter 1. A notch 111 is opened on the side wall of tube 110. One end of FPC 2 is located below the laser chip 6 and is fixed to the upper surface of the base 4. The other end of FPC 2 extends out of tube 1 through notch 111. The laser chip 6 is bonded to FPC 2 with gold wire 7.
[0025] Since FPC2 is located below laser chip 6 and is fixed horizontally on base 4, and laser chip 6 is directly bonded to FPC2 with gold wire 7, this solution eliminates the pins compared to existing technologies, thus effectively improving high-speed performance. At the same time, it effectively increases the heat dissipation area (the heat dissipation area changes from only the periphery of base 4 to the periphery and bottom of base 4), resulting in better heat dissipation. It is suitable for non-airtight environments in data centers. Compared to existing technologies, this solution also eliminates glass insulators and tube caps, effectively reducing costs and shrinking the overall size.
[0026] Example 2
[0027] like Figure 2 , Figure 3 As shown, this embodiment is a further improvement on embodiment 1, as detailed below:
[0028] An optical isolator 8 is fixed inside the tube body 110, and the optical isolator 8 is located between the optical fiber core 120 and the laser chip 6. The laser chip 6 is coupled to the optical fiber core 120 through the optical isolator 8.
[0029] Furthermore, a lens 3 is fixed inside the tube 110 and centered on the fiber core 120. The laser chip 6 is coupled to the optical isolator 8 through the lens 3. The light emitted by the laser chip 6 is coupled into the fiber core 120 after passing through the lens 3 and the optical isolator 8 in sequence. The lens 3 is centered on the fiber core 120, which makes optical coupling more convenient. The LC adapter 1, the fiber core 120, the optical isolator 8, and the lens 3 share a tube 110, which can ensure that the optical axes are collinear.
[0030] The lens 3 is preferably located at the opening inside the tube 110 and is fixed to the tube 110 by adhesive bonding. The above-mentioned fixing method is only an exemplary fixing method, and other methods are not excluded in actual application.
[0031] Example 3
[0032] like Figure 2 , Figure 3 As shown, this embodiment is a further improvement on embodiment 1 or 2, as detailed below:
[0033] The tube body 1 is preferably fixed to the base 4 by welding. The above-mentioned fixing method is only an exemplary fixing method. In actual application, other methods are not excluded. The FPC2 is preferably fixed to the base 4 by adhesive bonding. The above-mentioned fixing method is only an exemplary fixing method. In actual application, other methods are not excluded.
[0034] Although embodiments of the present invention have been shown and described above, it is understood that the above embodiments are exemplary and should not be construed as limiting the present invention. Those skilled in the art can make changes, modifications, substitutions and variations to the above embodiments within the scope of the present invention.
Claims
1. An optical emitting device for use in non-hermetic environments of data centers, characterized in that, include: An LC adapter (1) and an FPC (2) are provided. In the LC adapter (1), a base (4) is fixed at the lower end of the tube body (110) to cover its opening. A ceramic heat sink (5) is fixed on the side of the boss (410) on the upper surface of the base (4) inside the tube body (110). A laser chip (6) is fixed on the ceramic heat sink (5) and is distributed vertically and coupled to the fiber core (120) inside the LC adapter (1). A notch (111) is opened on the side wall of the tube body (110). One end of the FPC (2) is located below the laser chip (6) and is fixed to the upper surface of the base (4). The other end extends out of the tube body (110) through the notch (111). The laser chip (6) is bonded to the FPC (2) with gold wire (7).
2. The optical emitting device for a non-hermetic environment in a data center according to claim 1, characterized in that, The tube body (110) contains an optical isolator (8) that is fixed to the optical fiber core (120) and the laser chip (6).
3. The optical emitting device for a non-hermetic environment in a data center according to claim 2, characterized in that, A lens (3) is fixed inside the tube (110) and aligned with the fiber core (120). The laser chip (6) is coupled to the optical isolator (8) through the lens (3).
4. The optical emitting device for a non-hermetic environment in a data center according to claim 3, characterized in that, The lens (3) is located at the opening inside the tube (110) and is fixed to the tube (110) by adhesive bonding.
5. The optical emitting device for a non-hermetic environment in a data center according to claim 1, characterized in that, The tube body (110) is fixed to the base (4) by welding.
6. The optical emitting device for a non-hermetic environment in a data center according to claim 1, characterized in that, The FPC (2) is fixed to the base (4) by adhesive bonding.