Automatic interconnection equipment

Abstract

The utility model relates to automatic interconnection equipment, which is used for heat dissipation of a mainboard in the equipment and comprises a box body, the mainboard, a first evaporator, a first water inlet pipe, a first water outlet pipe, a first condenser, a first water pump and first condensate. A first evaporation cavity is formed in the first evaporator, a first condensation cavity is formed in the first condenser, the main board is installed in the box body, and the first evaporator is installed on the main board. The first water pump comprises a first water suction end communicated with the first evaporation cavity through the first water outlet pipe and a first water drainage end communicated with the first condensation cavity through the first water outlet pipe, and the first water inlet pipe passes through the first evaporation cavity and the first condensation cavity to form a first circulation loop; the first condensate is arranged in the circulation loop in a flowing manner; the heat can be timely taken away after being generated, and the heat is prevented from being locally accumulated on the mainboard.

Description

Technical Field

[0001] This utility model relates to the field of equipment enclosure technology, and in particular to an automated interconnection device. Background Technology

[0002] As the functionality of automated, interconnected devices continues to increase, their internal motherboards generate significant amounts of heat under high load. For example, on server motherboards in data processing centers, when performing large-scale data computation, storage, and transmission tasks, the operating frequency of chips (such as CPUs and GPUs) increases dramatically, power consumption rises, and heat generation increases accordingly. If this heat cannot be dissipated in time, it can cause a sharp rise in motherboard temperature. Traditional cooling methods, such as simple air cooling, have certain limitations; when faced with the large amounts of heat generated by high-load operation, they can easily affect the performance and lifespan of the equipment. Utility Model Content

[0003] Therefore, the purpose of this utility model is to provide an automated interconnection device with high heat dissipation efficiency.

[0004] The present invention adopts the following technical solution:

[0005] An automated interconnected device is provided for heat dissipation of the internal motherboard. The automated interconnected device includes a housing, a motherboard, a first evaporator, a first inlet pipe, a first outlet pipe, a first condenser, a first water pump, and a first condensate. The first evaporator has a first evaporation chamber, and the first condenser has a first condensation chamber. The motherboard is installed in the housing, and the first evaporator is installed on the motherboard. The first water pump includes a first suction end connected to the first evaporation chamber through the first outlet pipe and a first discharge end connected to the first condensation chamber through the first outlet pipe. The first inlet pipe passes through the first evaporation chamber and the first condensation chamber respectively to form a first circulation loop, and the first condensate flows within the first circulation loop.

[0006] Furthermore, the motherboard is mounted on the side wall of the enclosure, the first condenser is mounted on the top of the enclosure, and the first water outlet pipe and the first water inlet pipe are respectively connected to the first condensation chamber through the bottom of the first condenser.

[0007] Furthermore, the automated interconnected device also includes a first cooling fan disposed at the bottom of the first condenser, with the air outlet of the first cooling fan facing the side of the first condenser and the air inlet of the first cooling fan facing the side away from the first condenser.

[0008] Furthermore, the casing near the first condenser is provided with a plurality of first air outlets, and the casing away from the first condenser is provided with a plurality of first air inlets.

[0009] Furthermore, the automated interconnected device also includes a first heat-conducting plate mounted on the motherboard, a first auxiliary evaporator mounted on the first heat-conducting plate, a second heat-conducting plate mounted on the motherboard, and a second auxiliary evaporator mounted on the second heat-conducting plate.

[0010] Furthermore, the first auxiliary evaporator includes a first auxiliary evaporation chamber, and the second auxiliary evaporator includes a second auxiliary evaporation chamber; the automated interconnected device further includes pipes, a second water pump, a second condenser, and a second condensate, the second condenser includes a second condensation chamber, the second water pump includes a second suction end connected to the top of the first auxiliary evaporation chamber through the pipe and a second drain end connected to the second condensation chamber through the pipe; the bottom of the first auxiliary evaporation chamber and the top of the second auxiliary evaporation chamber are connected through the pipe, and the bottom of the second auxiliary evaporation chamber is connected to the second condensation chamber through the pipe to form a second circulation loop, and the second condensate flows in the second circulation loop.

[0011] Furthermore, the second condenser is vertically installed on the side wall of the housing, and all the pipes are connected to the bottom of the second auxiliary evaporator on the side opposite to the housing connection side.

[0012] Furthermore, the automated interconnected device also includes a second cooling fan disposed on the second condenser, with the air outlet of the second cooling fan facing the side of the second condenser and the air inlet of the second cooling fan facing the side away from the second condenser.

[0013] Furthermore, the housing near the second cooling fan is provided with a plurality of second air outlets, and the housing away from the second cooling fan is provided with a plurality of second air inlets; the automated interconnection device also includes a ventilation fan disposed in the housing, the ventilation fan being mounted on the housing on the side of the second air inlet.

[0014] Furthermore, the first condenser also includes capillary channels arranged side by side within the first condensation chamber for containing the first condensate and heat dissipation fins arranged between the capillary channels; the two ends of the capillary channels are interconnected.

[0015] The beneficial effects of this utility model are as follows:

[0016] The automated interconnected device involved in this utility model, because the first evaporator is directly mounted on the motherboard, can quickly absorb the heat generated by the motherboard; ensuring that the heat is carried away in time after it is generated, avoiding the accumulation of heat in local areas of the motherboard; through the design of the first circulation loop, the first condensate continuously circulates in the closed system, continuously absorbing heat from the first evaporator and releasing it in the first condenser; thus maintaining the continuity of heat dissipation; compared with traditional heat dissipation methods, such as simple air cooling, when faced with a large amount of heat generated due to high load operation, the heat dissipation mode of this automated interconnected device can more effectively dissipate heat, thereby maintaining the internal temperature of the device within a suitable range. Attached Figure Description

[0017] Figure 1 This is a perspective view of an automated interconnected device according to an embodiment of the present invention;

[0018] Figure 2 for Figure 1 Exploded view of automated interconnected devices;

[0019] Figure 3 for Figure 2 A three-dimensional schematic diagram of the motherboard, first evaporator, first inlet pipe, first outlet pipe, first condenser, and first water pump of the automated interconnected equipment after connection;

[0020] Figure 4 for Figure 3 A three-dimensional diagram of automated interconnected devices from another angle.

[0021] Figure 5 for Figure 2 A three-dimensional schematic diagram of the first heat-conducting plate, the first auxiliary evaporator, the second heat-conducting plate, the second auxiliary evaporator, the pipes, the second water pump, and the second condenser of the automated interconnected equipment.

[0022] Figure 6 for Figure 2 A left sectional view of the first condenser of an automated interconnected device;

[0023] Figure 7 for Figure 2 A front sectional view of the first evaporator of the automated interconnected equipment. Detailed Implementation

[0024] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0025] In the description of this utility model, it should be noted that the terms "vertical direction," "up," "down," and "horizontal," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are used only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this utility model. In addition, "first," "second," "third," and "fourth" are used for descriptive purposes only and should not be construed as indicating or implying relative importance.

[0026] In the description of this utility model, it should also be noted that, unless otherwise explicitly specified and limited, the terms "set," "install," "connect," and "link" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or a connection through an intermediate medium; and they can refer to the internal communication between two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model according to the specific circumstances.

[0027] Please see Figures 1 to 7 This is an automated interconnected device according to one embodiment of the present invention, used for heat dissipation of the internal main board 20. The automated interconnected device includes a housing 10, a main board 20, a first evaporator 30, a first water inlet pipe 40, a first water outlet pipe 50, a first condenser 60, a first water pump 70, and a first condensate. The first evaporator 30 is provided with a first evaporation chamber 31, and the first condenser 60 is provided with a first condensation chamber 61. The main board 20 is installed inside the housing 10, and the first evaporator 30 is installed on the main board 20. The first water pump 70 includes a first water suction end 71 connected to the first evaporation chamber 31 through the first water outlet pipe 50 and a first water discharge end 72 connected to the first condensation chamber 61 through the first water outlet pipe 50. The first water inlet pipe 40 passes through the first evaporation chamber 31 and the first condensation chamber 61 respectively to form a first circulation loop, and the first condensate flows within the first circulation loop.

[0028] The working principle of the automated interconnected device of this utility model is as follows: During the operation of the device, the main board 20 generates heat; since the first evaporator 30 is installed on the main board 20, the heat of the main board 20 will be conducted to the first evaporator 30; the transfer of heat from the higher temperature main board 20 to the relatively lower temperature first evaporator 30 is based on the principle of heat conduction, that is, the heat inside an object will be transferred from the high temperature part to the low temperature part; the first condensate circulates in the first circulation loop. When the first condensate enters the first evaporation chamber 31, the heat absorbed by the first evaporator 30 from the main board 20 causes the temperature of the first condensate in the first evaporation chamber 31 to rise, thereby carrying away the heat generated by the main board 20; the first water pump 70 is the power source of the entire first circulation loop; the first water pump 70's first suction end 71 draws in the first condensate, which has risen in temperature after heat absorption, from the first evaporation chamber 31 through the first water outlet pipe 50; the first water pump 70 forms a low pressure at the first suction end 71, which in turn draws the first condensate, which has risen in temperature after heat absorption, from the first evaporation chamber 31. The first condensate in the first evaporation chamber 31 is drawn in; then it is transported to the first condensation chamber 61 through the first drain end 72 and the first outlet pipe 50; the first drain end 72 discharges the first condensate at a certain pressure, overcoming the resistance of the pipe 25 and the possible pressure in the first condensation chamber 61, and smoothly sending the first condensate into the first condensation chamber 61, ensuring that the first condensate continues to circulate in the first circulation loop; the first condensate entering the first condensation chamber 61 exchanges heat with the external environment and the surrounding air; since the temperature around the first condensation chamber 61 is lower than the temperature of the first condensate, heat will be transferred from the first condensate to the surrounding environment; after the heat is dissipated, the first condensate returns to the first evaporation chamber 31 through the first inlet pipe 40 to start the next round of heat absorption process, and so on, continuously absorbing and dissipating the heat generated by the motherboard 20 to the external environment, thereby realizing the heat dissipation function of the motherboard 20.

[0029] Compared to existing technologies, the automated interconnected device of this invention, because the first evaporator 30 is directly mounted on the motherboard 20, can quickly absorb the heat generated by the motherboard 20, ensuring that the heat is carried away in time after it is generated, avoiding local heat accumulation on the motherboard 20. Through the design of the first circulation loop, the first condensate continuously circulates in the closed system, continuously absorbing heat from the first evaporator 30 and releasing it in the first condenser 60, thus maintaining continuous heat dissipation. Compared with traditional heat dissipation methods, such as simple air cooling, this automated interconnected device's heat dissipation mode can more effectively dissipate heat when facing a large amount of heat generated by high-load operation, thereby maintaining the internal temperature of the device within a suitable range. The motherboard 20 has many temperature-sensitive electronic components, such as chips and capacitors. When the device is running, efficient heat dissipation can prevent these components from experiencing performance degradation, shortened lifespan, or even damage due to overheating. This heat dissipation system can significantly reduce the probability of device failure due to overheating. The device can operate stably for a long time in a suitable temperature environment, reducing faults such as short circuits and component damage caused by overheating, thereby improving the reliability of the device and reducing maintenance costs and equipment downtime.

[0030] Please see Figures 2 to 4 , Figure 6 and Figure 7The motherboard 20 is installed on the side wall of the housing 10, the first condenser 60 is installed on the top inside the housing 10, and the first water outlet pipe 50 and the first water inlet pipe 40 are respectively connected to the first condensing chamber 61 through the bottom of the first condenser 60. During operation, the mainboard 20 mounted on the side wall of the housing 10 generates heat. This heat is conducted through the material of the mainboard 20 to the first evaporator 30 in contact with it. The first condensate flows in the first circulation loop and enters the first evaporation chamber 31. After the first evaporator 30 absorbs the heat from the mainboard 20, the temperature of the first condensate in the first evaporation chamber 31 rises. The design of the first evaporation chamber 31 allows the condensate to fully contact the heated parts of the evaporator, thereby efficiently absorbing heat. The first suction end 71 of the first water pump 70 draws the heated first condensate from the first evaporation chamber 31 through the first outlet pipe 50. The first condensate drawn in by the first water pump 70 is then transported upward through the first drain end 72 and the first outlet pipe 50. Since the first condenser 60 is installed at the top inside the housing 10, the first outlet pipe 50 needs to transport the first condensate upward to the bottom of the first condenser 60, where it contacts the first condensation chamber. 61 is connected; during this process, the first water pump 70 overcomes the resistance of gravity and pipe 25, ensuring that the first condensate can circulate smoothly to the first condenser 60; after the first condensate enters the first condensing chamber 61 through the first outlet pipe 50, since the first condenser 60 is located at the top of the box 10, its position is conducive to heat dissipation; the first condensate in the first condensing chamber 61 is in full contact with the heat dissipation structure of the first condenser 60; at this time, the temperature of the first condensate is higher than the ambient temperature, and the heat will be dissipated into the air inside the box 10 through convection and radiation; after the heat is dissipated, the first condensate flows out from the bottom of the first condensing chamber 61 through the first inlet pipe 40 and returns to the first evaporation chamber 31 to start the next round of heat absorption process; in this way, the first condensate circulates continuously in the first circulation loop, continuously absorbing the heat generated by the motherboard 20 and dissipating it into the air inside the box 10, thereby achieving effective heat dissipation of the motherboard 20.

[0031] The automated interconnected device also includes a first cooling fan 15 located at the bottom of the first condenser 60. The air outlet of the first cooling fan 15 faces one side of the first condenser 60, and the air inlet of the first cooling fan 15 faces the side away from the first condenser 60. When the first cooling fan 15 is turned on, its air inlet draws in surrounding air. Since the air inlet faces the side away from the first condenser 60, the air is drawn in from a distance inside or outside the device. Then, the air is blown out from the air outlet by the fan, and the air outlet is also facing one side of the first condenser 60. This forms a directional airflow that blows directly towards the first condenser 60. When the airflow blows towards the first condenser 60, the first condensate inside the first condenser 60 is in the process of dissipating heat. The first condensate in the first condensation chamber 61 conducts heat out through contact with the wall of the first condenser 60. At this time, the flowing air... The air quickly passes over the heat dissipation surface of the first condenser 60. According to the principle of convection cooling, the hot air is rapidly replaced by the cold air. Compared with the case without a fan, the speed at which heat is transferred from the first condenser 60 to the air is greatly accelerated. The first cooling fan 15 keeps the air around the first condenser 60 constantly updated, carrying the heat emitted by the first condenser 60 to the outside of the device or spreading it to a wider area inside the device more quickly. The first condensate in the first condenser 60 can release the heat absorbed from the motherboard 20 to the surrounding environment more efficiently, so that the entire heat dissipation cycle can be carried out with higher efficiency, thereby more effectively reducing the temperature of the motherboard 20.

[0032] The housing 10 near the first condenser 60 is provided with multiple first air outlets 11, and the housing 10 away from the first condenser 60 is provided with multiple first air inlets 12. When the first cooling fan 15 is working, it draws in air through the air inlet and blows the air towards the first condenser 60 through the air outlet. Since the housing 10 away from the first condenser 60 is provided with multiple first air inlets 12, these air inlets provide an air source for the first cooling fan 15. External air enters the housing 10 through the first air inlets 12. After being accelerated by the first cooling fan 15, the air is blown towards the first condenser 60, carrying away the heat emitted by the first condenser 60. Then, the heated air, under the action of the pressure difference inside the housing 10, flows towards the multiple first air outlets 11 of the housing 10 near the first condenser 60, and is finally discharged to the outside of the equipment through these air outlets, thereby reducing the temperature around these components.

[0033] Please see Figure 2 and Figure 5The automated interconnected equipment also includes a first heat-conducting plate 21 mounted on the main board 20, a first auxiliary evaporator 22 mounted on the first heat-conducting plate 21, a second heat-conducting plate 23 mounted on the main board 20, and a second auxiliary evaporator 24 mounted on the second heat-conducting plate 23. The first auxiliary evaporator 22 mounted on the first heat-conducting plate 21 and the second auxiliary evaporator 24 mounted on the second heat-conducting plate 23 absorb heat from the heat-conducting plates. Because the first heat-conducting plate 21 is in contact with the first auxiliary evaporator 22, and the second heat-conducting plate 23 is in contact with the second auxiliary evaporator 24, and the temperature of the first and second auxiliary evaporators 24 is lower than that of the first and second heat-conducting plates 23, according to the principle that heat transfer is from high temperature to low temperature, heat is transferred from the first and second heat-conducting plates 23 to the first and second auxiliary evaporators 24. The heat generated by the main board 20 is absorbed by the auxiliary evaporators through the heat-conducting plates, realizing the diffusion and initial absorption of heat. The setting of the first auxiliary evaporator 22 and the second auxiliary evaporator 24 increases the heat absorption points of the main board 20. Compared with the case of only the main evaporator, the heat generated by the main board 20 can be absorbed more quickly and comprehensively. This helps to effectively control the heat generation in the early stage, avoid the accumulation of heat in local areas of the main board 20, thereby improving the heat dissipation efficiency of the entire automated interconnected device and ensuring that the main board 20 can work stably in a relatively low temperature environment.

[0034] The first auxiliary evaporator 22 includes a first auxiliary evaporation chamber, and the second auxiliary evaporator 24 includes a second auxiliary evaporation chamber. The automated interconnection equipment also includes a pipe 25, a second water pump 26, a second condenser 27, and a second condensate. The second condenser 27 includes a second condensation chamber. The second water pump 26 includes a second suction end 260 connected to the top of the first auxiliary evaporation chamber through the pipe 25 and a second drain end 261 connected to the second condensation chamber through the pipe 25. The bottom of the first auxiliary evaporation chamber is connected to the top of the second auxiliary evaporation chamber through the pipe 25, and the bottom of the second auxiliary evaporation chamber is connected to the second condensation chamber through the pipe 25 to form a second circulation loop. The second condensate flows in the second circulation loop. The mainboard 20 generates heat during operation. This heat is conducted through the first heat-conducting plate 21 to the first auxiliary evaporator 22, and through the second heat-conducting plate 23 to the second auxiliary evaporator 24. In the first auxiliary evaporation chamber of the first auxiliary evaporator 22 and the second auxiliary evaporation chamber of the second auxiliary evaporator 24, the heat is absorbed by the second condensate within the chamber. Because heat is transferred from the higher-temperature heat-conducting plate to the lower-temperature condensate, the temperature of the second condensate rises. As heat is absorbed, the second condensate may undergo a state change in the first and second auxiliary evaporation chambers. The second suction end 260 of the second water pump 26 draws the heated second condensate from the top of the first auxiliary evaporation chamber through the pipe 25. The second water pump 26 draws in the second condensate from the top of the first auxiliary evaporation chamber. The second condensate drawn in by the second water pump 26 is pressurized and then transported to the second condensation chamber of the second condenser 27 through the second drain end 261 and the pipe 25. During this process, the second water pump 26 overcomes the resistance of the pipe 25. The resistance ensures that the second condensate can circulate smoothly to the second condenser 27. At the same time, the bottom of the first auxiliary evaporator and the top of the second auxiliary evaporator are connected by a pipe 25, allowing the second condensate in the first auxiliary evaporator to flow to the second auxiliary evaporator under the action of gravity or pressure difference, realizing liquid exchange between the two auxiliary evaporators. After the second condensate enters the second condenser through the pipe 25, it makes full contact with the second condenser 27. At this time, the temperature of the second condensate is higher than the ambient temperature, and the heat will be dissipated to the surrounding environment through convection and radiation. After the heat is dissipated, the second condensate flows out from the bottom of the second condenser through the pipe 25, and then returns to the first auxiliary evaporator through the pipe 25 to start the next round of heat absorption process. In this way, the second condensate continuously circulates in the second circulation loop, continuously releasing the heat absorbed by the main board 20 through the auxiliary evaporator to the surrounding environment, working in conjunction with the first circulation loop to further enhance the heat dissipation capacity of the equipment.

[0035] Please see Figure 2 and Figure 5The second condenser 27 is vertically installed on the side wall inside the housing 10, and the pipes 25 are all connected to the bottom of the second auxiliary evaporator chamber on the side opposite to the housing 10. The vertical installation of the second condenser 27 facilitates natural air convection within the housing 10; hot air rises due to its lower density, while cold air sinks, allowing the air around the second condenser 27 to be constantly renewed, further improving the efficiency of heat dissipation. Moreover, this installation method works in conjunction with the first condenser 60 in the first circulation loop to optimize the temperature distribution within the housing 10, enabling heat to be dissipated more effectively. After heat dissipation, the second condensate collects at the bottom of the second condenser chamber and then returns to the first auxiliary evaporator chamber through the pipes 25 to begin the next round of heat absorption. In this way, the second condensate continuously circulates in this second circulation loop, continuously releasing the heat absorbed by the mainboard 20 through the auxiliary evaporator into the surrounding environment, effectively assisting in the heat dissipation of the entire automated interconnected device.

[0036] The automated interconnected device also includes a second cooling fan 16 mounted on the second condenser 27. The outlet of the second cooling fan 16 faces one side of the second condenser 27, while the inlet faces the side away from the second condenser 27. When the second cooling fan 16 is turned on, its inlet draws in surrounding air. Since the inlet faces the side away from the second condenser 27, the air is drawn in from a distance inside or outside the device. Then, driven by the fan, the air is blown out from the outlet, which also faces the second condenser 27. This creates a directional airflow that blows directly towards the second condenser 27. When the airflow hits the second condenser 27, the second condensate inside the second condenser 27 is in the process of dissipating heat. The second condensate conducts heat out through contact with the wall of the second condenser 27 within the second condensation chamber. At this time, the flowing air quickly passes over the heat dissipation area of ​​the second condenser 27. On the surface, according to the principle of convection heat dissipation, hot air is quickly replaced by cold air; compared with the absence of a fan, the speed at which heat is transferred from the second condenser 27 to the air is greatly accelerated; the second cooling fan 16 continuously refreshes the air around the second condenser 27, carrying the hot air emitted by the second condenser 27 to the outside of the device or spreading it to a wider area inside the device more quickly; the second condensate in the second condenser 27 can more efficiently release the heat absorbed from the motherboard 20 through the auxiliary evaporator to the surrounding environment, enabling the heat dissipation of the entire second circulation loop to be carried out with higher efficiency, working in conjunction with the heat dissipation components of the first circulation loop to further enhance the overall heat dissipation capacity of the device.

[0037] The housing 10 near the second cooling fan 16 is provided with multiple second air outlets 13, and the housing 10 away from the second cooling fan 16 is provided with multiple second air inlets 14; the automated interconnection device also includes a ventilation fan 17 installed inside the housing 10, and the ventilation fan 17 is installed on the housing 10 on the side of the second air inlet 14. Ventilation fan 17 is installed on the side of housing 10 away from the second cooling fan 16 and close to the second air inlet 14. When ventilation fan 17 is activated, it draws external cold air into housing 10 through the second air inlet 14. This cold air provides a low-temperature medium for subsequent heat dissipation, absorbing the heat generated inside the equipment. The drawn-in cold air flows towards the second condenser 27 within housing 10. Simultaneously, the second cooling fan 16 draws air in through its inlet and blows it towards the second condenser 27 through its outlet. Thus, the two airflows converge around the second condenser 27, increasing the flow of cold air around it. During heat dissipation, the second condensate in the second condenser 27 transfers heat to the surrounding air, causing the hot air to rise under the pressure of the cold air. Multiple second air vents 13 are provided on the side of the housing 10 near the second cooling fan 16. The hot air that has absorbed heat is discharged to the outside of the equipment through these second air vents 13, completing a complete air circulation process. The presence of the ventilation fan 17 enhances the airflow inside the housing 10. It not only provides a stable source of cold air for the heat dissipation of the second condenser 27, but also makes the air pressure distribution inside the housing 10 more reasonable through continuous air intake. This helps to improve the working efficiency of the second cooling fan 16, because the ventilation fan 17 ensures that enough cold air can be drawn in by the second cooling fan 16 and blown towards the second condenser 27. Through the coordinated work of multiple second air inlets 14, ventilation fan 17, second cooling fan 16 and multiple second air vents 13, a highly efficient heat dissipation channel is formed.

[0038] Please see Figure 6The first condenser also includes capillary channels 62 arranged side-by-side within the first condensing chamber to accommodate the first condensate, and heat dissipation fins 63 arranged between the capillary channels 62; the two ends of the capillary channels 62 are interconnected. When the first condensate is transported to the first condensing chamber of the first condenser by the first water pump 70 in the circulation loop, it carries the heat absorbed from the main board 20; this heat needs to be dissipated into the surrounding environment in the first condenser; the first condensate flows within the capillary channels 62; since the capillary channels 62 are arranged side-by-side, the first condensate can be evenly distributed within the first condensing chamber; and since the two ends of the capillary channels 62 are interconnected, the first condensate can circulate smoothly within these pipes 25; allowing the first condensate to remain sufficiently within the first condensing chamber for effective heat exchange; the first condensate flowing within the capillary channels 62 has a higher temperature, and it will transfer heat to the walls of the capillary channels 62 through heat conduction; since the heat dissipation fins 63 are arranged between the capillary channels 62, when the walls of the capillary channels 62 absorb the heat of the first condensate, the heat... The heat will be further conducted to the heat dissipation fins 63; because the heat dissipation fins 63 are in close contact with the capillary channel 62, heat will be transferred from the higher temperature capillary channel 62 wall to the lower temperature heat dissipation fins 63; the heat dissipation fins 63 have a large surface area, which can fully contact the surrounding air; when the heat is conducted to the heat dissipation fins 63, according to the principles of thermal convection and thermal radiation, the heat will be dissipated from the heat dissipation fins 63 into the surrounding air; thermal convection refers to the surrounding cold air constantly contacting the hot heat dissipation fins 63, absorbing heat and becoming hot air and rising, and new cold air will replenish it, thus continuously carrying away the heat; thermal radiation refers to the heat dissipation fins 63 emitting heat outward in the form of electromagnetic waves, which can also play a certain role in heat dissipation; in this way, through the synergistic effect of the capillary channel 62 and the heat dissipation fins 63, the heat carried by the first condensate is effectively dissipated into the surrounding environment.

[0039] The above description merely illustrates the preferred technical solution of this utility model, and while the description is relatively specific and detailed, it should not be construed as limiting the scope of the utility model patent. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of this utility model, and this utility model also intends to include these modifications and variations.

Claims

1. An automated interconnect device for heat dissipation of a motherboard inside a device, characterized in that, The automatic interconnected device comprises a box, a mainboard, a first evaporator, a first water inlet pipe, a first water outlet pipe, a first condenser, a first water pump and a first condensate; the first evaporator is internally provided with a first evaporation cavity, the first condenser is internally provided with a first condensation cavity, the mainboard is installed in the box, the first evaporator is installed on the mainboard, the first water pump comprises a first water suction end communicated with the first evaporation cavity through the first water outlet pipe and a first water discharge end communicated with the first condensation cavity through the first water outlet pipe, the first water inlet pipe is communicated with the first evaporation cavity and the first condensation cavity respectively to form a first circulation loop, and the first condensate is flowingly arranged in the circulation loop.

2. The automated interconnection device of claim 1, wherein, The mainboard is installed on the side wall of the box, the first condenser is installed on the top of the box, and the first water outlet pipe and the first water inlet pipe are communicated with the first condensation cavity through the bottom of the first condenser respectively.

3. The automated interconnection device of claim 2, wherein, The automatic interconnected device further comprises a first heat dissipation fan arranged on the bottom of the first condenser, an air outlet of the first heat dissipation fan is arranged on the side of the first condenser, and an air inlet of the first heat dissipation fan is arranged on the side away from the first condenser.

4. The automated interconnection device of claim 3, wherein, The box near the side of the first condenser is provided with a plurality of first air outlet holes, and the box away from the side of the first condenser is provided with a plurality of first air inlet holes.

5. The automated interconnection device of claim 1, wherein, The automatic interconnected device further comprises a first heat conduction plate installed on the mainboard, a first auxiliary evaporator installed on the first heat conduction plate, a second heat conduction plate installed on the mainboard and a second auxiliary evaporator installed on the second heat conduction plate.

6. The automated interconnection device of claim 5, wherein, The first auxiliary evaporator comprises a first auxiliary evaporation cavity, the second auxiliary evaporator comprises a second auxiliary evaporation cavity, the automatic interconnected device further comprises a pipeline, a second water pump, a second condenser and a second condensate, the second condenser comprises a second condensation cavity, the second water pump comprises a second water suction end communicated with the top of the first auxiliary evaporation cavity through the pipeline and a second water discharge end communicated with the second condensation cavity through the pipeline, the bottom of the first auxiliary evaporation cavity is communicated with the top of the second auxiliary evaporation cavity through the pipeline, the bottom of the second auxiliary evaporation cavity is communicated with the second condensation cavity through the pipeline to form a second circulation loop, and the second condensate is flowingly arranged in the second circulation loop.

7. The automated interconnection device of claim 6, wherein, The second condenser is vertically installed on the side wall in the box, and the pipeline is communicated with the bottom of the second auxiliary evaporation cavity on the side away from the connecting side of the box.

8. The automated interconnection device of claim 7, wherein, The automatic interconnected device further comprises a second heat dissipation fan arranged on the second condenser, an air outlet of the second heat dissipation fan is arranged on the side of the second condenser, and an air inlet of the second heat dissipation fan is arranged on the side away from the second condenser.

9. The automated interconnection device of claim 8, wherein, The box near the side of the second heat dissipation fan is provided with a plurality of second air outlet holes, the box away from the side of the second heat dissipation fan is provided with a plurality of second air inlet holes, and the automatic interconnected device further comprises a ventilation fan arranged in the box, and the ventilation fan is installed on the box on the side of the second air inlet hole.

10. The automated interconnection device of claim 1, wherein, The first condenser further comprises capillary channels arranged in the first condensing cavity and arranged in parallel for containing the first condensed liquid, and heat dissipation fins arranged between the capillary channels; the two ends of the capillary channels are communicated with each other.

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