Server cooling system and server

By employing a protruding or recessed design where the first cooling plate directly contacts the CPU in the server, combined with a pump-driven circulation loop and heat exchanger, the space limitations and high noise levels of traditional server cooling methods are solved, achieving efficient and low-cost heat dissipation.

CN223966874UActive Publication Date: 2026-03-03SHANGHAI HAIXI TECHNOLOGY CO LTD
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Patent Information

Application Number
CN202520390832.2
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2025-03-07
Publication Date
2026-03-03
Estimated Expiration
2035-03-07

AI Technical Summary

Technical Problem

Traditional server cooling methods suffer from space limitations, high noise levels, and high costs, while liquid cooling solutions are complex in structure and difficult to maintain.

Method used

The design employs a protrusion or groove where the first cooling plate directly contacts the CPU, combined with a pump-driven circulation loop and heat exchanger, along with a fan for heat dissipation, and a temperature sensor and controller for dynamic adjustment.

Benefits of technology

It achieves efficient and simple heat dissipation, reduces energy consumption and maintenance costs, and ensures stable operation and service life of the server under high load.

✦ Generated by Eureka AI based on patent content.

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Abstract

The utility model belongs to the technical field of server heat dissipation, and discloses a server cooling system and a server. According to the server cooling system, direct contact of main heating point positions on the CPU can be achieved for heat dissipation, so that the efficiency of transferring heat to the first cooling plate by the CPU is improved, the occupied space of the first cooling plate is reduced, and it is guaranteed that the internal structure of a server is compact. The first cooling plate covers the CPU, so that the heat dissipation uniformity on the surface of the CPU can be ensured, the influence of local overheating on the CPU on the use performance is avoided, and the service life of the CPU is prolonged. The pump body can drive the refrigerant to flow in the circulation loop, so that the refrigerant can continuously dissipate heat in the heat exchanger and the circulation loop and then enters the first flow channel again to continuously absorb heat on the first cooling plate, and continuous heat dissipation of the CPU is achieved. The server cooling system is simple in structure, can be flexibly arranged in the server, is favorable for reducing the manufacturing cost and the use energy consumption, and ensures that the server stably runs under high load.
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Description

Technical Field

[0001] This utility model relates to the field of server heat dissipation technology, and in particular to a server cooling system and a server. Background Technology

[0002] With the rapid application and promotion of internet technology, the demand for various types of servers has grown rapidly, and the heat dissipation problem of high-power, large-capacity, and high-performance servers has become increasingly prominent. Traditional servers dissipate heat through air cooling or water cooling. Air cooling relies on airflow, but with the increasing demand for heat dissipation, the limited internal space of servers makes it impossible to meet the cooling requirements by increasing the number of fans, thus highlighting the problems of high power consumption, high speed, and high noise from the fans. Liquid cooling removes heat by physically contacting the liquid cooling medium with the components that require heat dissipation. Existing liquid cooling solutions have a relatively complex structure, making installation and maintenance difficult, increasing the complexity and cost of the system.

[0003] Therefore, there is an urgent need for a server cooling system and a server to solve the above problems. Utility Model Content

[0004] One objective of this invention is to provide a server cooling system that simplifies the system's structure, improves heat dissipation efficiency, and ensures the server's lifespan.

[0005] To achieve this objective, the present invention adopts the following technical solution:

[0006] A server cooling system is provided. The server is equipped with a CPU, and the server cooling system includes:

[0007] A first cooling plate covers one side of the CPU, a first flow channel is provided inside the first cooling plate, and a first protrusion is provided on the side of the first cooling plate facing the CPU, the first protrusion abutting against a portion of the CPU.

[0008] And / or, the side of the first cooling plate facing the CPU is provided with a first groove, the bottom surface of the first groove abutting against a portion of the CPU;

[0009] The heat exchanger is connected to the first flow channel to form a circulation loop;

[0010] Pump body, which is connected to the circulation loop.

[0011] As an alternative solution for the server cooling system, the first cooling plate is provided with a first protrusion, and the first protrusion is provided in multiple ways; and / or, the first cooling plate is provided with a first groove, and the first groove is provided in multiple ways.

[0012] As an alternative to the server cooling system, the server cooling system further includes a first fan, which is positioned toward the heat exchanger.

[0013] As an optional solution for the server cooling system, the server is also provided with a chip, and the server cooling system further includes a second cooling plate, the second cooling plate covering one side of the chip, the second cooling plate having a second flow channel inside, the second flow channel being connected to the circulation loop, the second cooling plate having a second protrusion on the side facing the chip, the second protrusion abutting against a portion of the chip; and / or, the second cooling plate having a second groove on the side facing the chip, the bottom surface of the second groove abutting against a portion of the chip.

[0014] As an alternative to the server cooling system, the second protrusion is provided in multiple locations; and / or, the second groove is provided in multiple locations.

[0015] As an optional solution for the server cooling system, the server cooling system also includes a temperature sensor, which is configured corresponding to the CPU and the chip.

[0016] As an alternative to the server cooling system, the server cooling system also includes a controller, which is signal-connected to the pump and the temperature sensor.

[0017] As an optional solution for the server cooling system, the server cooling system further includes a second fan, which is correspondingly disposed on the first cooling plate; and / or, the second fan is correspondingly disposed on the second cooling plate.

[0018] Another objective of this invention is to provide a server with a simple cooling system structure and high heat dissipation efficiency.

[0019] To achieve this objective, the present invention adopts the following technical solution:

[0020] A server is provided, comprising a CPU, a chip, a housing, and a server cooling system as described in any one of the claims, wherein the CPU, the chip, and the server cooling system are fixed within the housing.

[0021] As an alternative to the server, the housing is provided with ventilation holes.

[0022] The beneficial effects of this utility model are:

[0023] This invention provides a server cooling system. A first protrusion abuts against a heat-generating part of the CPU, or the bottom wall of a first groove abuts against a heat-generating part of the CPU, or the first protrusion and the first groove abut against different heat-generating parts of the CPU. This achieves contact heat dissipation at multiple points on the CPU, thereby improving heat transfer efficiency and reducing the space occupied by the first cooling plate. The first cooling plate covers the CPU, allowing for uniform heat dissipation on the CPU surface. A pump drives the refrigerant to flow in a circulation loop, allowing the refrigerant to continuously dissipate heat in the heat exchanger and circulation loop before entering the first flow channel to continue absorbing heat from the first cooling plate. This server cooling system has a simple structure, can be flexibly arranged within the server, helps reduce operating costs and energy consumption, and ensures stable server operation under high load. Attached Figure Description

[0024] Figure 1 This is a schematic diagram of the first cooling plate of the server cooling system provided by this utility model;

[0025] Figure 2 This is a schematic diagram of the second cooling plate of the server cooling system provided by this utility model;

[0026] Figure 3 This is a schematic diagram of the circulation loop of the server cooling system provided by this utility model;

[0027] Figure 4 This is a schematic diagram of the internal structure of the server provided by this utility model.

[0028] In the picture:

[0029] 100. CPU;

[0030] 200, First cooling plate; 210, First protrusion; 220, First groove;

[0031] 300. Heat exchanger;

[0032] 400. Pump body;

[0033] 500. First wind turbine;

[0034] 600, Chip;

[0035] 700, Second cooling plate; 710, Second protrusion; 720, Second groove;

[0036] 800. Second fan;

[0037] 900, shell; 910, vent. Detailed Implementation

[0038] The present invention will now be described in further detail with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the present invention and not intended to limit it. Furthermore, it should be noted that, for ease of description, the accompanying drawings show only the parts relevant to the present invention, not the entire structure.

[0039] In the description of this utility model, unless otherwise explicitly specified and limited, the terms "connected," "linked," and "fixed" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model based on the specific circumstances.

[0040] In this invention, unless otherwise explicitly specified and limited, "above" or "below" the second feature can include direct contact between the first and second features, or contact between the first and second features through another feature between them. Furthermore, "above," "over," and "on top" of the second feature includes the first feature directly above or diagonally above the second feature, or simply indicates that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature includes the first feature directly below or diagonally below the second feature, or simply indicates that the first feature is at a lower horizontal level than the second feature.

[0041] In the description of this embodiment, the terms "upper," "lower," "right," etc., refer to the orientation or positional relationship shown in the accompanying drawings. They are used only for ease of description and simplification of operation, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this utility model. In addition, the terms "first" and "second" are only used for distinction in description and have no special meaning.

[0042] like Figures 1 to 4As shown, the server is equipped with a CPU 100 and a chip 600. The server cooling system in this embodiment includes a first cooling plate 200, a heat exchanger 300, and a pump body 400. The first cooling plate 200 covers one side of the CPU 100, and a first flow channel is provided within the first cooling plate 200. A first protrusion 210 is provided on the side of the first cooling plate 200 facing the CPU 100, and the first protrusion 210 abuts against a portion of the CPU 100; alternatively, a first groove 220 is provided on the side of the first cooling plate 200 facing the CPU 100, and the bottom surface of the first groove 220 abuts against a portion of the CPU 100; or, the first cooling plate 200 has both the first protrusion 210 and the first groove 220. The heat exchanger 300 is connected to the first flow channel to form a circulation loop. The pump body 400 is connected to the circulation loop. The circulation loop is sealed to prevent refrigerant leakage and ensure the safety and reliability of the system.

[0043] Based on the above design, the server cooling system proposed in this embodiment has the first protrusion 210 abutting against the heat-generating part of the CPU 100, or the bottom wall of the first groove 220 abutting against the heat-generating part of the CPU 100, or the first protrusion 210 and the bottom wall of the first groove 220 abutting against different heat-generating parts of the CPU 100. This enables direct contact heat dissipation at the main heat-generating points on the CPU 100, thereby improving the efficiency of heat transfer from the CPU 100 to the first cooling plate 200 and reducing the space occupied by the first cooling plate 200, ensuring a compact internal structure of the server. The first cooling plate 200 covers the CPU 100, ensuring uniform heat dissipation on the surface of the CPU 100, preventing localized overheating of the CPU 100 from affecting performance, and extending the service life of the CPU 100. The pump body 400 drives the refrigerant to flow in the circulation loop, allowing the refrigerant to continuously dissipate heat in the heat exchanger 300 and the circulation loop before re-entering the first flow channel to continue absorbing heat from the first cooling plate 200, achieving continuous heat dissipation for the CPU 100. The server cooling system has a simple structure and can be flexibly laid out within the server, which helps reduce manufacturing costs and energy consumption, and ensures stable operation of the server under high load.

[0044] Optionally, multiple first protrusions 210 or multiple first grooves 220 may be provided, or multiple first protrusions 210 and multiple first grooves 220 may be provided, so that the first cooling plate 100 and the CPU 100 can make contact at multiple points, thereby further improving the heat conduction speed of the CPU 100 and ensuring the heat dissipation efficiency of the first cooling plate 100.

[0045] Furthermore, the server cooling system also includes a second cooling plate 700, which covers one side of the chip 600. A second flow channel is provided inside the second cooling plate 700, and the second flow channel is connected to the circulation loop. Specifically, the first flow channel, the second flow channel, and the heat exchanger 300 are connected in series to form a circulation loop. A second protrusion 710 is provided on the side of the second cooling plate 700 facing the chip 600, and the second protrusion 710 abuts against a portion of the chip 600; or, a second groove 720 is provided on the side of the second cooling plate 700 facing the chip 600, and the bottom surface of the second groove 720 abuts against a portion of the chip 600; or, the second cooling plate 700 is provided with both the second protrusion 710 and the second groove 720.

[0046] It is understandable that the second protrusion 710 abuts against the heat-generating part of the chip 600, or the second groove 720 abuts against the heat-generating part of the chip 600, or the second protrusion 710 and the second groove 720 abut against different heat-generating parts of the chip 600. This allows for direct contact and heat dissipation at the main heat-generating points on the chip 600, thereby improving the efficiency of heat transfer from the chip 600 to the second cooling plate 700 and reducing the space occupied by the second cooling plate 700, ensuring a compact internal structure for the server. The second cooling plate 700 covers the chip 600, ensuring uniform heat dissipation on the surface of the chip 600, preventing localized overheating of the chip 600 from affecting performance, and extending the lifespan of the chip 600.

[0047] Optionally, multiple second protrusions 710 may be provided, or multiple second grooves 720 may be provided, or multiple second protrusions 710 and multiple second grooves 720 may be provided, so that the second cooling plate 700 and the chip 600 can make contact at multiple points, further improving the heat conduction speed of the chip 600 and ensuring the heat dissipation efficiency of the second cooling plate 700.

[0048] Furthermore, the server cooling system also includes a first fan 500, which is positioned toward the heat exchanger 300 to accelerate the airflow outside the heat exchanger 300 and improve the heat dissipation efficiency of the heat exchanger 300.

[0049] Furthermore, the server cooling system also includes a second fan 800, which is disposed on the first cooling plate 200, or on the second cooling plate 700, or the second fan 800 can simultaneously correspond to the first cooling plate 200 and the second cooling plate 800, thereby increasing the airflow rate on the surfaces of the first cooling plate 200 and the second cooling plate 800, and further improving the heat dissipation efficiency of the cooling system.

[0050] Optionally, the server cooling system also includes a temperature sensor and a controller. The temperature sensor is correspondingly configured with the CPU 100 and the chip 600, and can measure the temperature of the CPU 100 and the chip 600. The controller is signal-connected to the temperature sensor, the pump 400, the first fan 500, and the second fan 800. Based on the feedback from the temperature sensor, the controller can control the power of the pump 400, the first fan 500, and the second fan 800 respectively, thereby controlling the flow rate of the refrigerant in the circulation loop and the rotation speed of the first fan 500 and the second fan 800, ensuring that the cooling system can meet the heat dissipation requirements of the server when it operates at different power levels. In this embodiment, the controller can be a centralized or distributed controller. For example, the controller can be a single microcontroller or a combination of multiple distributed microcontrollers. The microcontroller can run a control program to control each component to achieve its function.

[0051] This embodiment also provides a server, including a CPU 100, a chip 600, a housing 900, and the aforementioned server cooling system. The CPU 100, chip 600, and server cooling system are fixed inside the housing 900. The housing 900 is provided with ventilation holes 910 to ensure air circulation within the housing 900. The server has a flexible internal layout and can directly dissipate heat from the CPU, ensuring stable operation under high loads.

[0052] Obviously, the above embodiments of this utility model are merely examples for clearly illustrating the present utility model, and are not intended to limit the implementation of the present utility model. Those skilled in the art can make other variations or modifications based on the above description. It is neither necessary nor possible to exhaustively list all possible implementations here. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of this utility model should be included within the protection scope of the claims of this utility model.

Claims

1. A server cooling system, a server being provided with a CPU (100), characterized in that, Comprising: a first cooling plate (200) covering one side of the CPU (100), a first flow channel being provided in the first cooling plate (200), a first protruding part (210) being provided on the side of the first cooling plate (200) facing the CPU (100), the first protruding part (210) abutting part of the CPU (100); and / or, a first recess (220) being provided on the side of the first cooling plate (200) facing the CPU (100), the bottom surface of the first recess (220) abutting part of the CPU (100); a heat exchanger (300) communicating with the first flow channel to form a circulation loop; a pump body (400) connected to the circulation loop.

2. The server cooling system of claim 1, wherein, The first cooling plate (200) is provided with a plurality of first protruding parts (210). and / or, the first cooling plate (200) is provided with a plurality of first recesses (220).

3. The server cooling system of claim 1, wherein, The server cooling system further comprises a first fan (500) provided towards the heat exchanger (300).

4. The server cooling system according to any one of claims 1-3, the server being further provided with a chip (600), characterized in that, The server cooling system further comprises a second cooling plate (700) covering one side of the chip (600), a second flow channel being provided in the second cooling plate (700), the second flow channel communicating with the circulation loop, a second protruding part (710) being provided on the side of the second cooling plate (700) facing the chip (600), the second protruding part (710) abutting part of the chip (600); and / or, a second recess (720) being provided on the side of the second cooling plate (700) facing the chip (600), the bottom surface of the second recess (720) abutting part of the chip (600).

5. The server cooling system of claim 4, wherein, The second protruding part (710) is provided with a plurality of second protruding parts (710). and / or, the second recess (720) is provided with a plurality of second recesses (720).

6. The server cooling system of claim 4, wherein, The server cooling system further comprises a temperature sensor provided corresponding to the CPU (100) and the chip (600).

7. The server cooling system of claim 6, wherein, The server cooling system further comprises a controller signal connected with the pump body (400) and the temperature sensor.

8. The server cooling system of claim 4, wherein, The server cooling system further comprises a second fan (800) provided corresponding to the first cooling plate (200); and / or, the second fan (800) is provided corresponding to the second cooling plate (700).

9. A server comprising a CPU (100) and a chip (600), characterized in that Further comprising a housing (900) and the server cooling system according to any one of claims 1-8, the CPU (100), the chip (600) and the server cooling system being fixed in the housing (900).

10. The server of claim 9, wherein, The housing (900) is provided with a breathable hole (910).