Memory bank heat dissipation module

Abstract

The utility model relates to the technical field of memory bank heat dissipation, in particular to a memory bank heat dissipation module which comprises a connecting plate, a shell and a fan. The connecting plates wrap the top ends of the middles of the memory banks and are connected with the inner sides of the memory slots in an attached mode, the side faces of the connecting plates extend towards the side faces of the other memory banks, the ends of the connecting plates extend towards the ends of the memory slots, and the connecting plates and the memory banks are arranged in a one-to-one correspondence mode; the shell is arranged at one end of the memory groove and connected with the connecting plate, and a plurality of exhaust holes used for conducting air conveying between two adjacent memory banks in the using state are formed in the side face, close to the bottom end, of the shell. According to the utility model, the top between the two memory banks is shielded by the connecting plate, and the air flow channel is formed by enclosing, so that cold air exhausted by the exhaust holes exchanges heat with the memory banks and the connecting plate in the flow channel, and hot air in the flow channel moves towards the end parts of the memory banks and is exhausted, thereby effectively reducing the temperature of the memory banks and the ambient environment of the memory banks and prolonging the service life of the memory banks. And the heat dissipation efficiency is improved.

Description

Technical Field

[0001] This utility model relates to the field of memory module heat dissipation technology, specifically to a memory module heat dissipation module. Background Technology

[0002] With the development of technology, servers are being used more and more widely. Servers are equipped with a central processing unit (CPU) and memory modules, which enable the server to perform its required functions. Memory modules generate heat during operation, which can affect their performance, thus requiring heat dissipation measures.

[0003] Chinese patent document CN217114372U discloses a memory module heat dissipation module, including a heat sink and a heat dissipation side plate that can be fitted to the side of the memory module; the heat dissipation side plate is provided with a groove that can accommodate protruding parts on the memory module, and a thermal pad or thermal paste is provided in the groove; the heat dissipation side plate is connected to the heat sink through a heat pipe.

[0004] However, in the above solution, the heat generated by the memory module is conducted to the heat sink through the heat dissipation side plate and heat pipes. The heat sink quickly dissipates the conducted heat. During use, the memory module will continuously generate heat and heat the surrounding environment, resulting in a high overall ambient temperature around the memory module. The memory module and the surrounding environment will directly heat the heat dissipation side plate and heat pipes. The heat sink only dissipates heat from the heat pipes, resulting in low heat dissipation efficiency. Utility Model Content

[0005] The purpose of this invention is to address the problems existing in the background technology by proposing a memory module heat dissipation module.

[0006] The technical solution of this utility model is: a memory module heat dissipation module, including a connecting plate, a housing, and a fan;

[0007] The connecting plate wraps around the top of the middle part of the memory stick and is attached to the inside of the memory slot. The side of the connecting plate extends to the side of the other memory stick and the end extends to the end of the memory slot. The connecting plate and the memory stick are arranged in a one-to-one correspondence.

[0008] The housing is located at one end of the memory slot and connected to the connecting plate. The side of the housing and near the bottom are provided with multiple ventilation holes for airflow between two adjacent memory modules when in use.

[0009] The number of fans is at least one, the fans are installed at the top of the housing and facing the housing, and the air outlet of the fans is connected to the housing.

[0010] Preferably, a connecting strip is attached to the other end of the memory slot, and the side of the connecting strip is connected to the side end of the connecting plate.

[0011] Preferably, an extension plate is provided at the top side of the connecting plate and between the two memory modules. The two ends of the extension plate extend toward the end of the memory slot and are connected to the connecting strip and the housing, respectively. There is a gap between the side of the extension plate and one side of the memory module.

[0012] Preferably, a baffle is provided on the other side of the connecting plate between the two memory modules and below the extension plate. The top of the baffle has a gap with the bottom of the extension plate, and the side of the baffle has a gap with the other side of the memory module.

[0013] Preferably, the projection shape of the connecting plate is U-shaped, and the inner side of the opening of the connecting plate is chamfered.

[0014] Preferably, the top of the connecting plate and the extension plate, as well as the bottom of the baffle, are provided with multiple heat sinks, and there are gaps between the multiple heat sinks.

[0015] Preferably, a partition is provided on the inner side of the housing and at the end of the memory slot.

[0016] Compared with the prior art, the above-mentioned technical solution of this utility model has the following beneficial technical effects:

[0017] This invention uses a connecting plate to shield the top between two memory modules and enclose them to form an airflow channel. This allows the cold air discharged from the vent to exchange heat with the memory modules and the connecting plate in the channel, and moves the hot air in the channel toward the end of the memory modules and discharges it, thereby effectively reducing the temperature of the memory modules and their surrounding environment and improving heat dissipation efficiency. Attached Figure Description

[0018] Figure 1-2 All of these are perspective views of one embodiment of the present utility model.

[0019] Figure 3 This is a schematic diagram of the connecting plate structure in one embodiment of the present invention.

[0020] Figure 4 This is a cross-sectional schematic diagram of the connecting plate structure in one embodiment of the present invention.

[0021] Figure 5 This is a cross-sectional schematic diagram of the shell structure in one embodiment of the present invention.

[0022] Reference numerals in the attached diagram: 1. Memory slot; 2. Memory module; 3. Connecting plate; 4. Housing; 5. Fan; 6. Heat sink; 7. Connecting strip; 8. Extension plate; 9. Baffle; 10. Vent; 11. Partition. Detailed Implementation

[0023] Example 1

[0024] like Figure 1-5As shown, the present invention proposes a memory module heat dissipation module, which includes a connecting plate 3, a housing 4, and a fan 5.

[0025] The connecting plate 3 is wrapped around the top of the middle part of the memory stick 2 and is attached to the inside of the memory slot 1. The side of the connecting plate 3 extends to the side of the other memory stick 2 and the end extends to the end of the memory slot 1. The connecting plate 3 and the memory stick 2 are arranged in a one-to-one correspondence.

[0026] The housing 4 is located at one end of the memory slot 1 and connected to the connecting plate 3. The side of the housing 4 and near the bottom are provided with a plurality of exhaust holes 10 for conveying air between two adjacent memory modules 2 in use.

[0027] The number of fans 5 is at least one. The fans 5 are installed on the top of the housing 4 and are arranged facing the housing 4, and the air outlet of the fans 5 is connected to the housing 4.

[0028] In an optional embodiment, a connecting strip 7 is attached to the other end of the memory slot 1. The side of the connecting strip 7 is connected to the side end of the connecting plate 3. The connecting strip 7 connects the other ends of multiple connecting plates 3 into one piece, so that the connecting plate 3, the housing 4 and the connecting strip 7 are connected into one piece, thereby improving the installation stability of the connecting plate 3.

[0029] In an optional embodiment, the projection shape of the connecting plate 3 is U-shaped, and a chamfer is provided on the inner side of the opening of the connecting plate 3, so that when the connecting plate 3 is connected to the memory module 2, the connection between the connecting plate 3 and the memory module 2 is smoother through the chamfer.

[0030] In an optional embodiment, a partition 11 is provided on the inner side of the housing 4 and at the end of the memory slot 1. The partition 11 is used to lower the inner space of the housing 4 during use, so that the air delivered by the fan 5 moves directly to the exhaust hole 10, thereby improving the air outlet efficiency of the housing 4.

[0031] In this embodiment, a connecting plate 3 is wrapped around the top of the middle part of the memory module 2 and extends to the other memory module 2. The connecting plate 3 conducts heat to the memory module 2 while shielding the top of the space between the two memory modules 2. The connecting plate 3 has a gap between its side and the memory module 2 to prevent the connecting plate 3 from completely blocking the space between the two memory modules 2. At the same time, the fan 5 is started to deliver cold air to the inside of the housing 4, and the air inside the housing 4 is delivered to the space between the two memory modules 2 through the exhaust hole 10. The hot air between the two memory modules 2 moves from one end to the other and is discharged. At the same time, the cold air comes into contact with the connecting plate 3 and the memory module 2 during the movement and exchanges heat. The air exchanged heat is discharged synchronously. At the same time, the gap between the connecting plate 3 and the memory module 2 allows some of the cold air discharged from the exhaust hole 10 to exchange heat with the memory module 2 and the connecting plate 3 and then move upward through the gap, increasing the heat dissipation area and ensuring that the heat between the memory modules 2 is effectively dissipated, thereby improving the heat dissipation efficiency of the memory module 2.

[0032] Example 2

[0033] like Figure 3-4 As shown, the present invention proposes a memory module heat dissipation module. Compared with the first embodiment, the difference in this embodiment is that an extension plate 8 is provided on the top side of the connecting plate 3 and between the two memory modules 2. The two ends of the extension plate 8 extend toward the end of the memory slot 1 and are connected to the connecting strip 7 and the housing 4. There is a gap between the side of the extension plate 8 and one side of the memory module 2.

[0034] In this embodiment, the connecting plate 3, the housing 4 and the connecting strip 7 are connected as a whole by the extension plate 8, which enhances the stability of the installation of the connecting plate 3. At the same time, the gap between the extension plate 8 and the memory module 2 increases the air circulation area and efficiency, further improving the heat dissipation effect.

[0035] Example 3

[0036] like Figure 4 As shown, the present invention proposes a memory module heat dissipation module. Compared with the first embodiment, the difference is that a baffle 9 is provided on the other side of the connecting plate 3 between the two memory modules 2 and below the extension plate 8. The top of the baffle 9 has a gap with the bottom of the extension plate 8, and the side of the baffle 9 has a gap with the other side of the memory module 2.

[0037] In this embodiment, by setting a baffle 9 on the other side of the connecting plate 3, and making a gap between the baffle 9 and the extension plate 8 and the memory module 2, the baffle 9 can exchange heat and block the air discharged from the exhaust hole 10, reduce the amount of air flowing directly upward from the exhaust hole 10, and improve the heat dissipation effect of the connecting plate 3, so that the memory module maintains a stable temperature during operation.

[0038] Example 4

[0039] like Figure 4 As shown, the present invention proposes a memory module heat dissipation module. Compared with the first embodiment, the difference in this embodiment is that multiple heat sinks 6 are provided at the top of the connecting plate 3 and the extension plate 8 and at the bottom of the baffle 9, and there are gaps between the multiple heat sinks 6.

[0040] In this embodiment, the heat dissipation area of ​​the connecting plate 3 and the baffle 9 is increased by the heat sink 6, which improves the heat dissipation efficiency of the natural convection heat dissipation at the top of the connecting plate 3 and increases the contact area between the baffle 9 and the air discharged from the exhaust hole 10, thereby improving the heat dissipation effect of the baffle 9 on the connecting plate 3 and thus improving the heat dissipation effect of the memory module 2.

[0041] In this invention, a connecting plate 3 is wrapped around the top of the middle part of the memory module 2, and an extension plate 8 and a baffle 9 are respectively set on one side of the connecting plate 3, with both the extension plate 8 and the baffle 9 extending towards the end of the memory slot 1. The housing 4 and the connecting strip 7 are installed at the end of the memory slot 1 and connected to the connecting plate 3 as a whole. Multiple heat sinks 6 are provided on the connecting plate 3, the extension plate 8, and the baffle 9 to increase the heat dissipation area. The extension plate 8 and the baffle 9 shield the top of the space between the two memory modules 2. At the same time, the fan 5 is activated to deliver cold air to the inside of the housing 4 and to allow air to circulate inside the housing 4. The air is supplied through the exhaust vent 10 to the space between the two memory modules 2, causing the hot air between the two memory modules 2 to move from one end to the other and be discharged. At the same time, the cold air comes into contact with the connecting plate 3 and the memory modules 2 during the movement, exchanges heat, and is discharged synchronously with the hot air. In addition, there are gaps between the memory modules 2 and the memory modules 2 through the extension plate 8 and the baffle 9, so that an air flow path is formed between the memory modules 2 and the extension plate 8 and the baffle 9. This allows some of the cold air discharged from the exhaust vent 10 to move upwards of the memory modules 2 through the flow path, and to come into contact with the extension plate 8 and the baffle 9 during the movement, exchanging heat, further improving the heat dissipation effect, and enabling the memory modules to maintain a stable temperature during operation.

[0042] The embodiments of the present invention have been described in detail above with reference to the accompanying drawings. However, the present invention is not limited thereto. Various changes can be made within the scope of knowledge possessed by those skilled in the art without departing from the spirit of the present invention.

Claims

1. A memory module heat dissipation module, characterized in that, It includes a connecting plate (3), a housing (4), and a fan (5); The connecting plate (3) wraps around the top of the middle part of the memory stick (2) and is attached to the inside of the memory slot (1). The side of the connecting plate (3) extends to the side of the other memory stick (2) and the end extends to the end of the memory slot (1). The connecting plate (3) and the memory stick (2) are arranged in a one-to-one correspondence. The housing (4) is located at one end of the memory slot (1) and connected to the connecting plate (3). The side of the housing (4) and near the bottom end are provided with a number of exhaust holes (10) for conveying air between two adjacent memory modules (2) in use. The number of fans (5) is at least one. The fans (5) are installed on the top of the housing (4) and are arranged facing the housing (4), and the air outlet of the fans (5) is connected to the housing (4).

2. The memory module heat dissipation module according to claim 1, characterized in that, The other end of the memory slot (1) is fitted with a connecting strip (7), and the side of the connecting strip (7) is connected to the side end of the connecting plate (3).

3. A memory module heat dissipation module according to claim 2, characterized in that, An extension plate (8) is provided on the top side of the connecting plate (3) and between the two memory modules (2). The two ends of the extension plate (8) extend toward the end of the memory slot (1) and are connected to the connecting strip (7) and the housing (4). There is a gap between the side of the extension plate (8) and one side of the memory module (2).

4. A memory module heat dissipation module according to claim 3, characterized in that, A baffle (9) is provided on the other side of the connecting plate (3) between the two memory modules (2) and below the extension plate (8). The top of the baffle (9) has a gap with the bottom of the extension plate (8), and the side of the baffle (9) has a gap with the other side of the memory module (2).

5. A memory module heat dissipation module according to claim 1, characterized in that, The projection shape of the connecting plate (3) is U-shaped, and the inner side of the opening of the connecting plate (3) is chamfered.

6. A memory module heat dissipation module according to claim 4, characterized in that, Multiple heat sinks (6) are provided at the top of the connecting plate (3) and the extension plate (8) and at the bottom of the baffle (9), with gaps between the multiple heat sinks (6).

7. A memory module heat dissipation module according to claim 1, characterized in that, A partition (11) is provided on the inner side of the housing (4) and at the end of the memory slot (1).

Images