High-stability M.2 solid state disk

By introducing a heat dissipation module and a shock absorption module into the M.2 solid-state drive, the problems of poor heat dissipation and vibration effects are solved, thereby achieving the stability and extended lifespan of the drive.

CN223967031UActive Publication Date: 2026-03-03HUIJU ELECTRONICS (DONGGUAN) IND CO LTD
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Patent Information

Application Number
CN202520482985.X
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2025-03-19
Publication Date
2026-03-03
Estimated Expiration
2035-03-19

AI Technical Summary

Technical Problem

M.2 solid-state drives suffer from poor heat dissipation in confined spaces and are susceptible to vibration, leading to performance degradation and shortened lifespan.

Method used

The system employs a heat dissipation module and a shock absorption module. The heat dissipation module absorbs and dissipates heat through heat-absorbing base plates and heat dissipation fins, while the shock absorption module provides support and absorbs vibration energy through pads and shock absorption columns, ensuring the stability of the hard drive.

Benefits of technology

It improves the transmission stability and lifespan of the hard drive, prevents interface wear and data transmission instability caused by vibration, and enhances heat dissipation.

✦ Generated by Eureka AI based on patent content.

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Abstract

The utility model discloses a high-stability M.2 solid state disk, which relates to the technical field of hard disks, and comprises a hard disk main body, two ends of the hard disk main body are respectively provided with a golden finger and a fastening notch; the heat dissipation module is arranged on the upper side of the hard disk main body and is used for absorbing and dissipating heat generated by the hard disk main body; the cushioning module comprises a gasket arranged on the lower side of the hard disk main body and a plurality of cushioning columns arranged on the lower side of the gasket, the gasket and the heat dissipation module are clamped and fixed, the cushioning columns abut against the mainboard, vibration energy is absorbed through elastic deformation, and heat dissipated during working can be absorbed and dissipated through the heat dissipation module on the upper side; the hard disk main body is prevented from being in a high-heat state for a long time to improve transmission stability and service life; the cushioning columns can support the middle part of the hard disk main body and absorb vibration energy when vibration occurs, so that the degree of influence of vibration on the hard disk main body is reduced, and the conditions of poor contact and unstable transmission caused by vibration are prevented.
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Description

Technical Field

[0001] This utility model relates to the field of hard disk technology, and in particular to a highly stable M.2 solid-state drive. Background Technology

[0002] Currently, with the continuous development of computer technology, people's demand for storage capacity and speed is also increasing. As a new type of storage device, M.2 solid-state drives use the M.2 interface and have advantages such as fast transmission speed, small size, and low power consumption. They are widely used in devices such as laptops, desktops, and servers.

[0003] However, while M.2 SSDs achieve better performance, their smaller size compared to SATA SSDs leads to concentrated heat. The limited space on motherboards for M.2 SSDs further restricts heat dissipation, causing them to remain overheated under heavy loads for extended periods, severely impacting performance and lifespan.

[0004] Meanwhile, after installation, current M.2 solid-state drives generally have two support points: the gold fingers after they are plugged into the interface and the other end after the bolts are tightened. The middle part is in a suspended state. When vibration occurs, the middle part is prone to slight deformation due to the lack of proper support. This is especially true when a heat dissipation module is installed on top of the drive, which increases the pressure on the middle part and amplifies the deformation during vibration. Frequent vibration of the drive can cause fluctuations in the connection between the gold fingers and the interface, resulting in unstable data transmission.

[0005] Therefore, it is necessary to propose a new technical solution to address the above problems. Utility Model Content

[0006] To overcome the shortcomings mentioned above, this utility model aims to provide a technical solution that can solve the aforementioned problems.

[0007] To achieve the above objectives, this utility model provides the following technical solution: a highly stable M.2 solid-state drive, comprising:

[0008] The hard drive body has gold fingers and fastening notches at both ends;

[0009] A heat dissipation module is disposed on the upper side of the hard drive body to absorb and dissipate the heat generated by the hard drive body;

[0010] The shock absorption module includes a pad disposed on the underside of the hard drive body and several shock absorption columns disposed on the underside of the pad. The pad is snapped and fixed to the heat dissipation module, and the shock absorption columns abut against the motherboard, absorbing vibration energy through elastic deformation.

[0011] As a further embodiment of this utility model: the heat dissipation module includes a heat-absorbing base plate disposed on the upper side of the hard disk body and heat dissipation fins disposed on the heat-absorbing base plate;

[0012] The heat dissipation fins are arranged in a uniform array.

[0013] As a further embodiment of this utility model: clamping plates are provided on both sides of the gasket, and a deformable clamping plate is provided on the clamping plate. A clamping block is provided at the upper end of the clamping plate, and the upper end of the clamping block has an inclined surface on the side away from the gasket.

[0014] The heat-absorbing base plate has perforations on both sides corresponding to the card block.

[0015] As a further embodiment of this utility model: the bottom surface of the shock-absorbing column has a diamond-shaped pattern.

[0016] As a further embodiment of this invention, the gasket is made of epoxy resin material.

[0017] As a further embodiment of this invention, the shock-absorbing column is made of silicone material.

[0018] Compared with existing technologies, the beneficial effects of this technical solution are as follows: The heat dissipation module and the pad are fixed together by snap-fit, and the hard drive body is sandwiched in the middle, ensuring that the pad and the heat dissipation module can be in close contact with the upper and lower sides of the hard drive body. After the hard drive body is installed on the motherboard, the heat dissipation module on the upper side can absorb and dissipate the heat generated during operation, avoiding the hard drive body from being in a high-heat state for a long time, thereby improving transmission stability and service life. Secondly, the shock-absorbing column set on the lower side of the pad can provide support for the middle part of the hard drive body, thereby reducing the pressure on the middle part. When vibration occurs, the shock-absorbing column can also absorb vibration energy, reducing the degree of vibration affecting the middle part and the whole of the hard drive body, ensuring that the hard drive body remains stable after installation and fixing, and preventing interface wear caused by vibration, which could lead to poor contact and unstable transmission.

[0019] The heat dissipation module's heat-absorbing base absorbs the heat generated by the hard drive's main chamber and then conducts it to the heat dissipation fins. The evenly arranged array of heat dissipation fins can dissipate the heat, while the gaps between the fins allow air to flow through, carrying away the heat and improving the heat dissipation effect.

[0020] Additional aspects and advantages of this invention will be set forth in part in the description which follows, and in part will be obvious from the description, or may be learned by practice of the invention. Attached Figure Description

[0021] To more clearly illustrate the technical solutions in the embodiments of this utility model or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0022] Figure 1 This is a schematic diagram of the overall structure of this utility model;

[0023] Figure 2 This is a cross-sectional structural diagram of the present invention;

[0024] Figure 3 This is an exploded structural diagram of the present invention;

[0025] Figure 4 This is a schematic diagram of the structure of this utility model after it has been flipped over;

[0026] Figure 5 yes Figure 2 Enlarged schematic diagram of a local structure at point A;

[0027] The corresponding labels in the attached diagram are explained as follows:

[0028] 1. Hard drive body; 11. Gold fingers; 12. Fastening notch; 2. Heat dissipation module; 21. Heat-absorbing base plate; 22. Heat dissipation fins; 23. Perforation; 3. Shock absorption module; 31. Pad; 32. Shock absorption column; 33. Clamping plate; 34. Card plate; 35. Card block; 36. Angled surface. Detailed Implementation

[0029] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0030] Please see Figure 1-5 A highly stable M.2 solid-state drive, comprising:

[0031] The hard disk body 1 has gold fingers 11 and fastening notches 12 at both ends;

[0032] Heat dissipation module 2 is located on the upper side of hard disk body 1 and is used to absorb and dissipate the heat generated by hard disk body 1;

[0033] The shock absorption module 3 includes a pad 31 disposed on the lower side of the hard drive body 1 and several shock absorption pillars 32 disposed on the lower side of the pad 31. The pad 31 is snapped and fixed to the heat dissipation module 2, and the shock absorption pillars 32 abut against the motherboard and absorb vibration energy through elastic deformation.

[0034] Specifically, when installing the hard drive body 1, first insert the gold fingers 11 into the interface on the motherboard at an angle, then flatten the hard drive body 1, and fix the hard drive body 1 in place by the cooperation of the bolts and the fastening notches 12.

[0035] The heat dissipation module 2 and the pad 31 are fixed together by a snap-fit, clamping the hard drive body 1 in the middle. This ensures that the pad 31 and the heat dissipation module 2 can fit tightly against the upper and lower sides of the hard drive body 1. After the hard drive body 1 is installed on the motherboard, the heat dissipation module 2 on the upper side can absorb and dissipate the heat generated during operation, preventing the hard drive body 1 from being in a high-heat state for a long time, thereby improving transmission stability and service life. Secondly, the shock-absorbing column 32 set on the lower side of the pad 31 can provide support for the middle part of the hard drive body 1, thereby reducing the pressure on the middle part. When vibration occurs, the shock-absorbing column 32 can also absorb vibration energy, reducing the degree of vibration affecting the middle part and the whole of the hard drive body 1, ensuring that the hard drive body 1 remains stable after installation and fixing, and preventing interface wear caused by vibration, which could lead to poor contact and unstable transmission.

[0036] Among them, the gasket 31 is made of epoxy resin, which gives it high torsional resistance and high temperature resistance, ensuring that the gasket 31 will not deform at high temperatures; while the shock absorber 32 is made of silicone. Silicone has excellent elastic deformation ability, which can effectively absorb impact energy and quickly return to its original shape, preventing permanent deformation of the shock absorber 32. It is suitable for high-frequency impact scenarios, and can maintain stable performance in the range of -50°C to 200°C, making the shock absorber 32 resistant to high temperatures; moreover, both epoxy resin and silicone are insulating materials, which can prevent short circuits with components on the motherboard and ensure safety.

[0037] Furthermore, the heat dissipation module 2 includes a heat-absorbing base plate 21 disposed on the upper side of the hard disk body 1 and heat dissipation fins 22 disposed on the heat-absorbing base plate 21. The heat dissipation fins 22 are arranged in a uniform array. When the hard disk body 1 is working, the heat-absorbing base plate 21 absorbs the heat generated by the hard disk body 1 and then conducts it to the heat dissipation fins 22. The uniformly arranged heat dissipation fins 22 can dissipate the heat, and the gaps between the heat dissipation fins 22 allow air to flow through to carry away the heat, thereby improving the heat dissipation effect.

[0038] refer to Figure 5 Preferably, the gasket 31 is provided with clamping plates 33 on both sides, and the clamping plates 33 are provided with deformable clamping plates 34. The upper end of the clamping plate 34 is provided with a clamping block 35, and the upper end of the clamping block 35 away from the gasket 31 has an inclined surface 36.

[0039] The heat-absorbing base plate 21 has perforations 23 on both sides corresponding to the card block 35.

[0040] Specifically, when installing the heat dissipation module 2 and the shock absorption module 3, the pad 31 is placed under the hard drive body 1, and then the heat-absorbing base 21 is placed on the hard drive body 1. During this process, the bottom of the heat-absorbing base 21 presses against the locking block 35, while the edge of the perforation 23 abuts against the inclined surface 36 on the locking block 35. This can be understood as the position of the perforation 23 and the locking block 35 not being on the same straight line, but the width of the perforation 23 being the same as that of the locking block 35. With the continuous downward pressure of the heat-absorbing base 21, the inclined surface 36 of the locking block 35 gradually moves inward under pressure, that is, the locking plate 34 deforms, allowing the locking block 35 to enter and pass through the perforation 23. After passing through the perforation 23, the locking plate 34 elastically recovers its shape, allowing... The position of the clip 35 returns to its original straight line, so that the lower side of the clip 35 abuts against the heat-absorbing base plate 21, thereby fixing the heat-absorbing base plate 21 and the pad 31 together. At the same time, the clamping plate 33 is always in close contact with the hard drive body 1 to clamp the hard drive body 1. This allows the hard drive components to be assembled and fixed in advance. During installation, only the gold fingers 11 and the fastening notch 12 need to be fixed, which reduces the difficulty of operation. When it is necessary to replace the heat dissipation module 2 and the shock absorption module 3 to gradually remove the hard drive body 1, the clips 35 at both ends are pushed towards the middle, causing the clamping plate 34 to deform and align the clip 35 with the through hole 23, so that the heat-absorbing base plate 21 can be removed, thereby making it easier to remove the hard drive body 1.

[0041] Among them, the clamping plate 33, the clamping plate 34 and the clamping block 35 are integrally formed. The corner between the clamping plate 34 and the clamping plate 33 is also rounded to disperse the stress caused by the deformation of the clamping plate 34. The clamping plate 33, the clamping plate 34 and the clamping block 35 are made of epoxy resin that is the same as that of the gasket 31, so that they are not affected by high temperature when in contact with the heat-absorbing base plate 21. They can be integrally formed with the gasket 31 by injection molding technology, or they can be fixedly connected by welding or other methods. No limitation is made here.

[0042] Furthermore, Figure 5 As shown, a guide slope with the same angle as the slope 36 can also be designed at the lower edge of the perforation 23 to facilitate the force on the slope 36 and avoid jamming.

[0043] refer to Figure 4Preferably, two shock-absorbing pillars 32 are provided on both sides of the lower end of the pad 31, and five are provided in the middle part of the pad 31; increasing the number of shock-absorbing pillars 32 in the middle part of the pad 31 indirectly improves the support strength and shock absorption performance of the hard disk body 1, and can further reduce the impact of vibration on the hard disk body 1.

[0044] Furthermore, the bottom surface of the shock-absorbing column 32 has a diamond-shaped pattern.

[0045] Specifically, the rhomboid pattern geometry disperses the impact force concentrated on the shock absorber column 32 to a larger area through multi-directional concave and convex surfaces, thereby reducing local pressure. Furthermore, when under pressure, the rhomboid pattern geometry will generate controllable deformation, providing initial rigid support and absorbing high-frequency vibrations through gradual collapse.

[0046] More preferably, in this embodiment, the design position of each damping post 32 avoids existing components on the motherboard to prevent damage to the components, while ensuring contact with the plane of the motherboard to maximize the damping effect.

[0047] It will be apparent to those skilled in the art that this invention is not limited to the details of the exemplary embodiments described above, and that it can be implemented in other specific forms without departing from the spirit or essential characteristics of this invention. Therefore, the embodiments should be considered illustrative and non-limiting in all respects, and the scope of this invention is defined by the appended claims rather than the foregoing description. Thus, it is intended that all variations falling within the meaning and scope of equivalents of the claims be included within this invention. No reference numerals in the claims should be construed as limiting the scope of the claims.

Claims

1. A high-stability M.2 solid state disk, characterized in that, Include: Hard disk body (1), the hard disk body (1) is provided with gold finger (11) and fastening gap (12) respectively at both ends; Heat dissipation module (2), the heat dissipation module (2) is arranged on the upper side of hard disk body (1), for absorbing and dissipating the heat generated by hard disk body (1); Cushioning module (3), the cushioning module (3) includes gasket (31) arranged on the lower side of hard disk body (1) and a plurality of cushioning columns (32) arranged on the lower side of gasket (31), wherein the gasket (31) is clamped and fixed with heat dissipation module (2), the cushioning column (32) is in abutment with the mainboard, and the vibration energy is absorbed by elastic deformation.

2. The high-stability M.2 solid state drive of claim 1, wherein, The heat dissipation module (2) includes heat absorption base sheet (21) arranged on the upper side of hard disk body (1) and heat dissipation fin (22) arranged on heat absorption base sheet (21); Wherein, the heat dissipation fin (22) is evenly arranged in array.

3. The high-stability M.2 solid state drive of claim 2, wherein, The gasket (31) is provided with clamping plate (33) on both sides, the clamping plate (33) is provided with clamping plate (34) that can produce deformation, the clamping plate (34) is provided with clamping block (35) on the upper end, the clamping block (35) is provided with inclined surface (36) on the side away from the gasket (31) on the upper end. The heat absorption base sheet (21) is provided with perforation (23) corresponding to clamping block (35) on both sides.

4. The high-stability M.2 solid state drive of claim 1, wherein, The bottom surface of the cushioning column (32) has a diamond pattern.

5. The high-stability M.2 solid state drive of claim 1, wherein, The gasket (31) is made of epoxy resin material.

6. The high-stability M.2 solid state drive of claim 1, wherein, The cushioning column (32) is made of silica gel material.