Laminated busbar structure capable of reducing stray inductance

Abstract

The utility model discloses a laminated busbar structure for reducing stray inductance, which comprises an anode copper bar, a cathode copper bar, a terminal block and a plurality of standard capacitors, a first connecting end and a second connecting end of the standard capacitor are respectively connected with the anode copper bar, and a third connecting end and a fourth connecting end of the standard capacitor are respectively connected with the cathode copper bar; the positive pole copper bar is provided with a plurality of positive pole connecting units, and each positive pole connecting unit is provided with a first positive pole connecting end and a second positive pole connecting end. According to the laminated busbar structure capable of reducing stray inductance disclosed by the utility model, the standard capacitor is adopted, the laminated copper bars and the module installation copper bars connected by the bolts are integrated, and the laminated copper bars are integrated in the terminal block, so that direct-current support capacitors do not need to be developed in a customized manner, and the development period is shortened; meanwhile, laser welding is not needed, and the process difficulty and the production and manufacturing cost are reduced.

Description

Technical Field

[0001] This utility model belongs to the category of, specifically relating to, a stacked busbar structure for reducing noise. Background Technology

[0002] SiC modules are widely used in existing automotive high-voltage electric drive systems. Compared to traditional Si modules, SiC modules typically have faster switching speeds. This means that, with the same stray inductance in the power circuit, SiC modules experience greater voltage stress. To meet the voltage stress requirements of SiC modules, the power circuit design needs to be optimized to reduce stray inductance. A traditional solution is to first integrate the multilayer busbar and film capacitor together to form a complete, low-stray-inductance DC support capacitor, and then laser-weld the terminals of the DC support capacitor to the terminals of the power module to reduce stray inductance. This approach has two drawbacks:

[0003] 1. Due to the customized requirements, each solution needs to be optimized for noise, which is time-consuming.

[0004] 2. For the commonly used multilayer busbar design on the market, laser welding is required to achieve a low-impact design when connecting it to the power module, which requires the investment of laser welding production lines, resulting in high costs.

[0005] Therefore, further improvements will be made to address the aforementioned issues. Utility Model Content

[0006] The main objective of this invention is to provide a stacked busbar structure with reduced noise. By using standard capacitors, the stacked copper busbar is integrated with the bolt-connected module mounting copper busbar, and the stacked copper busbar is integrated into the terminal block. This eliminates the need for custom development of DC support capacitors, reducing the development cycle. At the same time, laser welding is not required, which reduces the process difficulty and manufacturing cost.

[0007] To achieve the above objectives, this utility model provides a multilayer busbar structure for reducing interference inductance, comprising a positive copper busbar, a negative copper busbar, a terminal block, and several standard capacitors, wherein:

[0008] The first and second connection terminals of the standard capacitor are respectively connected to the positive copper busbar, and the third and fourth connection terminals of the standard capacitor are respectively connected to the negative copper busbar.

[0009] The positive electrode copper busbar is provided with a plurality of positive electrode connection units, each of the positive electrode connection units being provided with a first positive electrode connection terminal and a second positive electrode connection terminal; the negative electrode copper busbar is provided with a plurality of negative electrode connection terminals, the negative electrode connection terminals being located between the first positive electrode connection terminal and the second positive electrode connection terminal.

[0010] The terminal block has a body and a stacked copper busbar built into the body. The body has a plurality of mounting units. Each mounting unit has a first mounting position, a second mounting position and a third mounting position. The first positive terminal is mounted to the first mounting position and connected to the stacked copper busbar by a first bolt. The second positive terminal is mounted to the third mounting position and connected to the stacked copper busbar by a second bolt. The negative terminal is mounted to the second mounting position by a third bolt (both the first and second mounting positions are provided with nuts, and the positive terminal is connected to the stacked copper busbar by bolts and nuts).

[0011] As a further preferred embodiment of the above technical solution, the standard capacitor is located above the positive copper busbar and a first insulating paper is provided between them; the positive copper busbar is located above the negative copper busbar and a second insulating paper is provided between them; and a third insulating paper is provided on the side of the negative copper busbar away from the positive copper busbar.

[0012] As a further preferred technical solution of the above technical solution, the terminal block is equipped with a plurality of module mounting copper busbars (so that the present invention can connect power modules). The module mounting copper busbars are provided with a first connector, a second connector and a third connector. The first connector is mounted above the first positive terminal by a first bolt and the third connector is mounted above the second positive terminal by a second bolt. The second connector is mounted above the negative terminal by a third bolt.

[0013] As a further preferred embodiment of the above technical solution, a first partition is provided between the first mounting position and the second mounting position, and a second partition is provided between the second mounting position and the third mounting position.

[0014] As a further preferred embodiment of the above technical solution, the terminal block is provided with a fixed end. Attached Figure Description

[0015] Figure 1 This is a schematic diagram of the structure of this utility model.

[0016] Figure 2 This is a schematic diagram of the structure of this utility model (the first insulating paper is hidden).

[0017] Figure 3 This is a schematic diagram of the structure of this utility model (the first and second insulating papers are hidden).

[0018] Figure 4 This is a schematic diagram of the positive copper busbar, negative copper busbar, and standard capacitor of this utility model.

[0019] Figure 5 This is a structural schematic diagram of the terminal block of this utility model.

[0020] Figure 6 This is an exploded view of this utility model.

[0021] The reference numerals in the accompanying drawings include: 100, positive copper busbar; 110, positive connection unit; 120, first positive connection terminal; 130, second positive connection terminal; 200, negative copper busbar; 210, negative connection terminal; 300, terminal block; 310, body; 311, first mounting position; 312, second mounting position; 313, third mounting position; 314, first partition; 315, second partition; 316, fixed end; 320, multilayer copper busbar; 330, module mounting copper busbar; 331, first connector; 332, second connector; 333, third connector; 400, standard capacitor; 500, first insulating paper; 600, second insulating paper; 700, third insulating paper. Detailed Implementation

[0022] The following description is intended to disclose the present invention so that those skilled in the art can implement it. The preferred embodiments described below are merely examples, and other obvious variations will occur to those skilled in the art. The basic principles of the present invention defined in the following description can be applied to other embodiments, modifications, improvements, equivalents, and other technical solutions that do not depart from the spirit and scope of the present invention.

[0023] This utility model discloses a stacked busbar structure for reducing noise. The specific embodiments of the utility model are further described below with reference to preferred embodiments.

[0024] In the embodiments of this utility model, those skilled in the art will note that the power modules and the like involved in this utility model can be considered as prior art.

[0025] Preferred embodiment.

[0026] like Figure 1-6 As shown, this utility model discloses a multilayer busbar structure for reducing interference inductance, including a positive copper busbar 100, a negative copper busbar 200, a terminal block 300, and several standard capacitors 400, wherein:

[0027] The first and second connection terminals of the standard capacitor 400 are respectively connected to the positive copper busbar 100, and the third and fourth connection terminals of the standard capacitor 400 are respectively connected to the negative copper busbar 200.

[0028] The positive electrode copper busbar 100 is provided with a plurality of positive electrode connection units 110, each of the positive electrode connection units 110 being provided with a first positive electrode connection terminal 120 and a second positive electrode connection terminal 130. The negative electrode copper busbar 200 is provided with a plurality of negative electrode connection terminals 210, the negative electrode connection terminals 210 being located between the first positive electrode connection terminal 120 and the second positive electrode connection terminal 130.

[0029] The terminal block 300 has a body 310 and a stacked copper busbar 320 built into the body 310. The body 310 has a plurality of mounting units. Each mounting unit has a first mounting position 311, a second mounting position 312 and a third mounting position 313. The first positive terminal 120 is mounted to the first mounting position 311 and connected to the stacked copper busbar 320 by a first bolt. The second positive terminal 130 is mounted to the third mounting position 313 and connected to the stacked copper busbar 320 by a second bolt. The negative terminal 210 is mounted to the second mounting position 312 by a third bolt (both the first and second mounting positions are provided with nuts, and the positive terminal is connected to the stacked copper busbar by bolts and nuts).

[0030] Specifically, the standard capacitor 400 is located above the positive copper busbar 100 and is provided with a first insulating paper 500 between them; the positive copper busbar 100 is located above the negative copper busbar 200 and is provided with a second insulating paper 600 between them; and a third insulating paper 700 is provided on the side of the negative copper busbar 200 away from the positive copper busbar 100.

[0031] More specifically, the terminal block 300 is equipped with several module mounting copper busbars 330 (so that the present invention can connect power modules). The module mounting copper busbars 330 are provided with a first connector 331, a second connector 332 and a third connector 333. The first connector 331 is mounted above the first positive terminal 120 by a first bolt and the third connector 333 is mounted above the second positive terminal 130 by a second bolt. The second connector 332 is mounted above the negative terminal 210 by a third bolt.

[0032] Furthermore, a first partition 314 is provided between the first mounting position 311 and the second mounting position 312, and a second partition 315 is provided between the second mounting position 312 and the third mounting position 313.

[0033] Furthermore, the terminal block 300 is provided with a fixed end 315.

[0034] The principle of this invention is as follows:

[0035] The gap between the first and second positive terminals 120 and 130 and the negative terminal 210 is necessary for standard module design and insulation (by setting up a barrier). This gap results in a lack of stacking between the positive copper busbar 100 and the negative copper busbar 200 at the capacitor and module connection point, increasing system stray inductance. The essence of this invention is to integrate a stacked copper busbar 320 into the terminal block 300. This stacked copper busbar 320 is only connected to the positive terminals 120 and 130 of the capacitor, and is not directly connected to the negative terminal 210 in the electrical topology, but spatially achieves a stacked design. This optimizes the lack of stacking between the positive copper busbar 100 and the negative copper busbar 200 at the module connection point, increasing the stacking at the connection point between the standard capacitor and the module, reducing stray inductance at this point, and thus improving the overall system efficiency.

[0036] It is worth mentioning that the technical features such as the power module involved in this utility model patent application should be regarded as prior art. The specific structure, working principle and possible control method and spatial arrangement of these technical features can be adopted by conventional choices in the field and should not be regarded as the inventive point of this utility model patent. This utility model patent will not be further elaborated in detail.

[0037] For those skilled in the art, modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some of the technical features. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of this utility model should be included within the protection scope of this utility model.

Claims

1. A lamination busbar structure for reducing crosstalk, characterized by, The application relates to a terminal block, which comprises a positive copper bar, a negative copper bar, a terminal block and a plurality of standard capacitors. First and second connecting ends of the standard capacitors are connected with the positive copper bar, and third and fourth connecting ends of the standard capacitors are connected with the negative copper bar. The positive copper bar is provided with a plurality of positive connecting units, each of which is provided with a first positive connecting end and a second positive connecting end. The terminal block is provided with a body and a laminated copper bar arranged in the body.

2. The laminated busbar structure of claim 1, wherein, The standard capacitors are arranged above the positive copper bar and are provided with first insulating paper.

3. The laminated busbar structure of claim 1, wherein, The terminal block is provided with a plurality of module installation copper bars.

4. The laminated busbar structure of claim 1, wherein, The first and second installation positions are provided with first and second partitions.

5. The laminated busbar structure of claim 1, wherein, The terminal block is provided with a fixed end.

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