Cooking utensil
By combining microwave heating and heat conduction heating components, the problem of food being too wet or too dry in cooking appliances is solved, achieving uniform heating and improved taste, promoting the Maillard reaction of rice, and enhancing the aroma of food.
Patent Information
- Application Number
- CN202520436623.7
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-03-12
- Publication Date
- 2026-03-03
- Estimated Expiration
- 2035-03-12
AI Technical Summary
When using microwave heating elements in existing cooking appliances, food is prone to becoming too wet or too dry, affecting the taste of the food.
Combining microwave heating and heat conduction heating components, the microwave heating component achieves rapid and uniform heating, while the heat conduction heating component heats the food during the later stages of boiling. The temperature of the inner pot is monitored by a temperature detection element to determine the liquid evaporation status and prevent the food from becoming too wet or too dry.
It achieves uniform heating of ingredients, improves their texture, prevents rice from being too wet or too dry, and promotes the Maillard reaction in rice, thus enhancing its aroma.
Smart Images
Figure CN223968002U_ABST
Abstract
Description
Technical Field
[0001] This application relates to the field of electrical equipment technology, and in particular to a cooking appliance. Background Technology
[0002] In related technologies, some cooking appliances such as rice cookers and electric pressure cookers use microwave heating elements to heat food. These elements directly use microwaves to heat the food, achieving a relatively rapid and even temperature rise. However, when using microwave heating elements to heat rice or other foods, the heated food may become too wet or too dry, thus affecting its taste. Utility Model Content
[0003] In view of this, the present application aims to provide a cooking appliance that can achieve better and more uniform heating while also improving the taste of food.
[0004] To achieve the above objectives, one embodiment of this application provides a cooking utensil, comprising:
[0005] Inner liner;
[0006] A microwave heating assembly is disposed on the outside of the inner pot to microwave heat the food inside the inner pot;
[0007] A heat conduction heating component is disposed on the outside of the inner liner to conduct heat to heat the inner liner;
[0008] A first temperature sensing element, which works in conjunction with the heat conduction heating assembly, to detect the temperature of the inner liner.
[0009] In one embodiment, the heat conduction heating component is located on the bottom side of the inner pot along the height direction of the pressure cooker.
[0010] In one embodiment, the microwave heating assembly has a microwave emission port for conducting microwaves, and the microwave emission port is distributed on the outer periphery of the inner liner.
[0011] In one embodiment, the cooking appliance further includes an outer pot, the outer pot having a first receiving cavity for accommodating the inner pot and an inner pot placement opening and a microwave inlet opening respectively communicating with the first receiving cavity, the microwave heating component being disposed on the outside of the outer pot, and the microwave emission port of the microwave heating component facing the microwave inlet opening.
[0012] In one embodiment, the outer pot has a first clearance opening communicating with the first receiving cavity, and the heat conduction heating component is disposed at the first clearance opening.
[0013] In one embodiment, the heat conduction heating assembly has a second clearance opening, and the first temperature sensing element passes through the second clearance opening; and / or,
[0014] The outer pot has a third clearance opening, and the first temperature sensing element passes through the third clearance opening.
[0015] In one embodiment, the microwave inlet is located on the periphery of the outer pot, and the portion of the outer pot located on the periphery of the inner pot placement opening is folded outward to form a shielding fold.
[0016] In one embodiment, the cooking appliance includes a microwave shielding cover and a second temperature sensing element disposed on the microwave shielding cover. The microwave shielding cover is closable and disposed at the inner pot placement opening. When the microwave shielding cover is in the closed state covering the inner pot placement opening, the microwave shielding cover and the outer pot form a microwave shielding cavity, and the second temperature sensing element faces the inner pot; and / or,
[0017] The outer pot includes a shielding plate covering the microwave inlet, with the microwave emission port facing the shielding plate so that microwaves emitted from the microwave emission port pass through the shielding plate.
[0018] In one embodiment, the microwave heating assembly includes a magnetron, a waveguide box, and a waveguide with a microwave emission port. The waveguide box is connected to both the magnetron and the waveguide to guide the microwaves generated by the magnetron to the waveguide. The microwave emission port faces the inner liner.
[0019] In one embodiment, the waveguide surrounds a second receiving cavity, and at least a portion of the structure of the inner liner is located within the second receiving cavity.
[0020] In one embodiment, the waveguide has two microwave emitting ports, which are located on opposite sides of the inner liner.
[0021] This application provides a cooking appliance that, by incorporating a microwave heating component and a heat conduction heating component, allows for the use of the microwave heating component to heat rice during the heating phase, achieving a better and more uniform heating effect. During the boiling phase, the heat conduction heating component is used to heat the rice at least in the later stages of boiling, enabling a first temperature detection element to detect temperature changes in the inner pot. This allows the evaporation of liquid within the cooking cavity to be determined based on the temperature changes, thus effectively preventing the cooked rice from becoming too wet or too dry. Therefore, this cooking appliance achieves both better and more uniform heating and improves the texture of the food. Attached Figure Description
[0022] Figure 1 This is a cross-sectional view of a cooking appliance according to an embodiment of this application;
[0023] Figure 2 for Figure 1 An exploded view of the cooking appliance shown, omitting the inner pot;
[0024] Figure 3 for Figure 1 The diagram shows the structure of the cooking utensil.
[0025] Figure 4 This is a schematic diagram illustrating the temperature changes of a cooking appliance during various stages of the cooking process, according to an embodiment of this application.
[0026] Figure 5 This is a cooking process diagram of a cooking appliance according to an embodiment of this application.
[0027] Explanation of reference numerals in the attached figures:
[0028] 10. Inner pot; 10a. Cooking cavity; 20. Microwave heating assembly; 20a. Microwave emission port; 21. Magnetron; 22. Waveguide box; 23. Waveguide; 23a. Second receiving cavity; 30. Heat conduction heating assembly; 30a. Second clearance opening; 31. Main body; 32. Boss; 40. First temperature detection element; 50. Outer pot; 50a. First receiving cavity; 50b. Inner pot placement opening; 50c. First clearance opening; 51. Shielding fold; 52. Baffle plate; 60. Microwave shielding cover; 70. Second temperature detection element; 80. Outer shell. Detailed Implementation
[0029] In the description of the embodiments in this application, it should be noted that the term "height direction" is based on the attached... Figure 1 The orientation or positional relationship shown is merely for the convenience of describing the embodiments of this application and simplifying the description, and is not intended to indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation on the embodiments of this application.
[0030] This application provides a cooking appliance, which can be a rice cooker, electric pressure cooker, or other cooking appliances.
[0031] Please see Figures 1 to 3 The cooking appliance includes an inner pot 10, a microwave heating component 20, a heat conduction heating component 30, and a first temperature detection element 40.
[0032] A microwave heating element 20 is disposed on the outside of the inner pot 10 to microwave heat the food inside the inner pot 10. A heat conduction heating element 30 is disposed on the outside of the inner pot 10 to conduct heat to the inner pot 10. A first temperature detection element 40 cooperates with the heat conduction heating element 30 to detect the temperature of the inner pot 10.
[0033] Inner pot 10 is used to hold rice and other food items. Please refer to [link / reference]. Figure 1 The inner pot 10 has a cooking cavity 10a, and the food is placed in the cooking cavity 10a.
[0034] Both the microwave heating component 20 and the heat conduction heating component 30 are used to heat the food inside the inner pot 10.
[0035] The microwave heating component 20 is used to emit microwaves into the cooking cavity 10a of the inner pot 10, so that the microwaves directly act on the moisture in the food inside the cooking cavity 10a, thereby heating the food.
[0036] The heat conduction heating component 30 heats the inner pot 10 through heat conduction. In other words, the heat generated by the heat conduction heating component 30 is transferred to the food inside the cooking cavity 10a through the inner pot 10, thereby heating the food.
[0037] The heat conduction heating component 30 includes, but is not limited to, any heating component that achieves heating through heat conduction, such as a hot plate heating component or an electromagnetic induction (IH) heating component.
[0038] The first temperature sensing element 40 is used to detect the temperature of the inner liner 10. The first temperature sensing element 40 includes, but is not limited to, a temperature sensor.
[0039] The heat conduction heating component 30 and the first temperature sensing element 40 can be located on the same side of the inner liner 10, or they can be located on different sides of the inner liner 10.
[0040] For ease of description, this application uses the example of cooking rice in a cooking appliance.
[0041] Specifically, the microwave heating component 20 can achieve relatively rapid and uniform heating during the heating process. However, when the microwave heating component 20 is used alone, the temperature of liquids such as rice soup remains basically unchanged after boiling at normal pressure. After the liquid in the cooking cavity 10a has almost or completely evaporated due to boiling, the temperature change in the cooking cavity 10a is small and difficult to be detected by the first temperature detection element 40. Therefore, if only the microwave heating component 20 is used for heating, it is difficult to determine the evaporation of the liquid in the cooking cavity 10a by detecting the temperature change.
[0042] When the heat conduction heating component 30 is used for heating during the boiling stage, the temperature of the inner pot 10 will rise rapidly after the liquid in the cooking cavity 10a has almost or completely evaporated. Therefore, the first temperature detection element 40 can cooperate with the heat conduction heating component 30 to detect the temperature change of the inner pot 10 during the boiling stage. For example, when the first temperature detection element 40 detects that the temperature T1 of the inner pot 10 during the boiling stage reaches the first set temperature ΔT1, it can be determined that the liquid in the cooking cavity 10a has almost or completely evaporated.
[0043] It should be noted that the heat conduction heating component 30 can be energized in the later stage of the boiling stage (e.g., at least before the liquid in the cooking chamber 10a has almost or completely evaporated), or it can be kept energized throughout the entire boiling stage. In other stages outside the boiling stage, it can be energized or not.
[0044] Based on the different characteristics of the microwave heating component 20 and the heat conduction heating component 30, the cooking appliance of this embodiment, by incorporating both components, can utilize the microwave heating component 20 to heat the rice during the heating phase, achieving a better and more uniform heating effect. During the boiling phase, the heat conduction heating component 30 can be used to heat the rice at least in the later stages of boiling, allowing the first temperature detection element 40 to detect temperature changes in the inner pot 10. This temperature change can then be used to determine the evaporation of liquid within the cooking cavity 10a, thus effectively preventing the cooked rice from becoming too wet or too dry. Therefore, the cooking appliance of this embodiment achieves both better and more uniform heating and improves the texture of the food.
[0045] In addition, if the rice is heated using only the microwave heating element 20 throughout the entire cooking process, the cooking temperature cannot exceed 100°C, resulting in insufficient Maillard reaction and a lack of aroma in the rice. However, by using the heat conduction heating element 30 to heat the rice at least in the later stages of boiling, the cooking temperature can exceed 100°C, thereby promoting the Maillard reaction and enhancing the aroma of the rice.
[0046] In one embodiment, please refer to Figures 1 to 3 The heat conduction heating component 30 can be located on the bottom side of the inner pot 10 along the height direction of the cooking appliance. That is, the heat conduction heating component 30 heats the bottom area of the inner pot 10. The heat generated by the heat conduction heating component 30 is transferred from the bottom of the inner pot 10 to the cooking cavity 10a, thereby improving the heat conduction efficiency and heating uniformity between the heat conduction heating component 30 and the inner pot 10.
[0047] Preferably, the first temperature sensing element 40 can also be disposed on the bottom side of the inner liner 10 along the height direction. That is, both the heat conduction heating component 30 and the first temperature sensing element 40 are disposed on the bottom side of the inner liner 10, so that the first temperature sensing element 40 can detect the temperature change of the inner liner 10 in a timely manner.
[0048] In other embodiments, the heat conduction heating component 30 may also be disposed on the outer peripheral side of the inner liner 10, which refers to the side of the inner liner 10 other than the top and bottom sides along the height direction.
[0049] In one embodiment, please refer to Figure 2 and Figure 3 The microwave heating assembly 20 has microwave emission ports 20a for conducting microwaves. The microwave emission ports 20a are distributed on the outer periphery of the inner pot 10, meaning that microwaves enter the cooking cavity 10a from the outer periphery of the inner pot 10. This arrangement can improve the uniformity of heating by the microwave heating assembly 20.
[0050] In other embodiments, the microwave heating component 20 may also be disposed on the bottom side of the inner liner 10.
[0051] In one embodiment, please refer to Figure 2 and Figure 3 The microwave heating assembly 20 includes a magnetron 21, a waveguide box 22, and a waveguide 23 with a microwave emission port 20a. The waveguide box 22 is connected to the magnetron 21 and the waveguide 23 respectively to guide the microwaves generated by the magnetron 21 to the waveguide 23. The microwave emission port 20a faces the inner liner 10.
[0052] The magnetron 21 is used to generate microwaves, the waveguide box 22 is used to guide the microwaves to the waveguide 23, and the waveguide 23 is used to deliver the microwaves to a designated area so that the microwaves can act on the inner liner 10 from the microwave emission port 20a.
[0053] Please continue reading. Figure 2 and Figure 3 The waveguide 23 can enclose a second receiving cavity 23a, and at least a portion of the structure of the inner liner 10 is located within the second receiving cavity 23a. In other words, the waveguide 23 can surround at least a portion of the structure of the inner liner 10.
[0054] For example, the waveguide 23 may have two microwave emission ports 20a, which are located on opposite sides of the inner liner 10. That is, the microwave heating component 20 can emit microwaves to both opposite sides of the inner liner 10, thereby further improving the heating efficiency and heating uniformity of the microwave heating component 20.
[0055] Figure 2 and Figure 3The microwave heating assembly 20 shown has two opposing and spaced waveguides 23. The two waveguides 23 enclose a second receiving cavity 23a. The microwave emission ports 20a of each waveguide 23 are located on opposite sides of the inner liner 10 and face the inner liner 10. In other words, the waveguide box 22 can guide the microwaves generated by the magnetron 21 to the two waveguides 23 respectively to ensure the uniform distribution of microwaves and improve heating efficiency.
[0056] In one embodiment, please refer to Figures 1 to 3 The cooking appliance also includes an outer pot 50, which has a first receiving cavity 50a for receiving an inner pot 10 and an inner pot placement port 50b and a microwave inlet port respectively communicating with the first receiving cavity 50a. The microwave heating component 20 is disposed on the outside of the outer pot 50, and the microwave emission port 20a of the microwave heating component 20 faces the microwave inlet port.
[0057] The first receiving cavity 50a is used to receive the inner liner 10. The inner liner placement port 50b is used for inserting the inner liner 10 into or removing it from the first receiving cavity 50a. The microwave inlet is the entrance for microwaves to enter the first receiving cavity 50a.
[0058] The inner pot 10 is located in the first receiving cavity 50a, and the outer pot 50 can support the inner pot 10 to ensure stability during the cooking process.
[0059] Microwaves generated by the microwave heating assembly 20 are emitted from the microwave emitting port 20a. The microwave emitting port 20a faces the microwave cavitation port, that is, on a projection plane perpendicular to the through direction of the microwave emitting port 20a, at least a portion of the projection of the microwave emitting port 20a coincides with the projection of the microwave cavitation port, so that the microwaves emitted from the microwave emitting port 20a can enter the first receiving cavity 50a from the microwave cavitation port.
[0060] Please see Figure 2 The outer pot 50 may include a shield 52 covering the microwave inlet, with the microwave emission port 20a facing the shield 52 so that microwaves emitted from the microwave emission port 20a pass through the shield 52.
[0061] The shield 52 is used to block the microwave inlet to prevent water vapor generated during cooking from entering the microwave heating assembly 20 or seeping into other parts of the cooking appliance through the microwave inlet.
[0062] The shield 52 is made of a material that allows microwaves to pass through, such as glass, plastic and ceramics, which hardly absorb microwaves.
[0063] Please see Figure 1 and Figure 2The outer pot 50 may have a first clearance opening 50c communicating with the first receiving cavity 50a. The heat conduction heating component 30 is disposed at the first clearance opening 50c so that the inner pot 10 can directly contact the heat conduction heating component 30, thereby improving the heat conduction efficiency between the inner pot 10 and the heat conduction heating component 30.
[0064] The form in which the heat conduction heating component 30 is disposed at the first clearance opening 50c is not limited. For example, a portion of the structure of the heat conduction heating component 30 can extend into the first receiving cavity 50a from the first clearance opening 50c. For details, please refer to... Figure 1 The heat conduction heating assembly 30 includes a main body 31 and a boss 32 located on the outer periphery of the main body 31. The main body 31 passes through the first relief opening 50c, and the boss 32 is located in the first receiving cavity 50a and overlaps the peripheral area of the first relief opening 50c. This can improve the heat conduction efficiency between the main body and the inner liner 10, and also improve the installation stability of the heat conduction heating assembly 30.
[0065] In another embodiment, the heat conduction heating component 30 may also be located outside the outer pot 50, with part of the structure exposed at the first clearance opening 50c.
[0066] In one embodiment, please refer to Figure 1 and Figure 2 The heat conduction heating component 30 may have a second clearance opening 30a, and the first temperature sensing element 40 is disposed in the second clearance opening 30a. That is, the first temperature sensing element 40 is disposed on the heat conduction heating component 30.
[0067] In the embodiment where the heat conduction heating component 30 is disposed at the first clearance opening 50c, the second clearance opening 30a can communicate with the first receiving cavity 50a. When the inner liner 10 is disposed within the first receiving cavity 50a, the first temperature sensing element 40 can directly contact the inner liner 10, thereby improving the accuracy and timeliness of temperature detection. In another embodiment, the first temperature sensing element 40 can also be disposed at an interval from the inner liner 10.
[0068] In another embodiment, the outer pot 50 may have a third clearance opening, through which the first temperature sensing element 40 passes. That is, the first temperature sensing element 40 is disposed on the outer pot 50 and detects the temperature of the inner pot 10 through the third clearance opening.
[0069] In one embodiment, please refer to Figure 2 The microwave inlet can be located on the periphery of the outer pot 50. The part of the outer pot 50 located on the periphery of the inner pot placement opening 50b is folded outward to form a shielding fold 51.
[0070] The shielding fold 51 is used to reduce microwave leakage and reduce microwave radiation to the external environment.
[0071] Please see Figure 1 The cooking appliance also includes a housing 80, with the outer pot 50, microwave heating element 20, and heat conduction heating element 30 all located inside the housing 80. The outer pot 50 can be connected to the housing 80 via a shielding folded edge 51, thus enhancing the structural stability of the outer pot 50. Simultaneously, the shielding folded edge 51 can also cooperate with the microwave shielding cover 60 to prevent microwave leakage.
[0072] In one embodiment, please refer to Figure 1 The cooking appliance includes a microwave shielding cover 60 and a second temperature sensing element 70 disposed on the microwave shielding cover 60. The microwave shielding cover 60 is closable and disposed at the inner pot placement opening 50b. When the microwave shielding cover 60 is in the closed state covering the inner pot placement opening 50b, the microwave shielding cover 60 and the outer pot 50 form a microwave shielding cavity, and the second temperature sensing element 70 faces the inner pot 10.
[0073] The second temperature sensing element 70 is used to detect the temperature T2 of the cooking cavity 10a. For example, when the temperature T2 detected by the second temperature sensing element 70 reaches the second set temperature ΔT2 (e.g., 95°C), it can be determined that the cooking process inside the inner pot 10 has entered the boiling stage.
[0074] For example, please refer to Figure 4 and Figure 5 When the microwave shielding cover 60 is closed, the microwave heating component 20 can be powered on to heat the cooking cavity 10a of the inner pot 10. At this time, the cooking appliance is in the heating stage. When the second temperature detection element 70 detects that the temperature T2 of the cooking cavity 10a reaches the second set temperature ΔT2, the cooking appliance can be controlled to enter the boiling stage, and the heating power of the microwave heating component 20 can be reduced. In the later stage of the boiling stage, the liquid in the cooking cavity 10a continuously evaporates. The heat conduction heating component 30 can be powered on at least until the liquid in the cooking cavity 10a has almost or completely evaporated. When the first temperature detection element 40 detects that the temperature T1 of the inner pot 10 reaches the first set temperature ΔT1, which is greater than the second set temperature ΔT2, it can be determined that the liquid in the cooking cavity 10a has almost or completely evaporated. At this time, the cooking appliance can be controlled to enter the simmering stage. In this stage, the microwave heating component 20 can be powered off or kept powered on.
[0075] Preferably, during the rice cooking stage, the heat conduction heating component 30 can be powered on and heated with a lower heating power. At the same time, in conjunction with the first temperature detection element 40, the temperature of the inner pot 10 is kept within a certain range to promote the Maillard reaction of the rice and enhance its aroma.
[0076] In the description of this application, the references to terms such as "in one embodiment," "in some embodiments," "in other embodiments," "in yet another embodiment," or "exemplary," etc., refer to specific features, structures, materials, or characteristics described in connection with that embodiment or example, which are included in at least one embodiment or example of the embodiments of this application. In this application, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials, or characteristics described may be combined in a suitable manner in any one or more embodiments or examples. Furthermore, without contradiction, those skilled in the art can combine the different embodiments or examples described in this application, as well as the features of the different embodiments or examples.
[0077] The above description is merely a preferred embodiment of this application and is not intended to limit the application. Various modifications and variations can be made to this application by those skilled in the art. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of this application are included within the scope of protection of this application.
Claims
1. A cooking utensil, characterized in that, include: Inner liner; A microwave heating assembly is disposed on the outside of the inner pot to microwave heat the food inside the inner pot; A heat conduction heating component is disposed on the outside of the inner liner to conduct heat to heat the inner liner; A first temperature sensing element, which works in conjunction with the heat conduction heating assembly, to detect the temperature of the inner liner.
2. The cooking utensil according to claim 1, characterized in that, The heat conduction heating component is located on the bottom side of the inner pot along the height direction of the cooking appliance.
3. The cooking utensil according to claim 1 or 2, characterized in that, The microwave heating assembly has microwave emission ports for transmitting microwaves, and the microwave emission ports are distributed on the outer periphery of the inner liner.
4. The cooking utensil according to claim 1 or 2, characterized in that, The cooking appliance also includes an outer pot, which has a first receiving cavity for accommodating the inner pot and an inner pot placement opening and a microwave inlet opening respectively communicating with the first receiving cavity. The microwave heating component is disposed on the outside of the outer pot, and the microwave emission port of the microwave heating component faces the microwave inlet opening.
5. The cooking utensil according to claim 4, characterized in that, The outer pot has a first clearance opening that communicates with the first receiving cavity, and the heat conduction heating component is disposed at the first clearance opening.
6. The cooking utensil according to claim 4, characterized in that, The heat conduction heating assembly has a second clearance opening, and the first temperature sensing element passes through the second clearance opening; and / or The outer pot has a third clearance opening, and the first temperature sensing element passes through the third clearance opening.
7. The cooking utensil according to claim 4, characterized in that, The microwave inlet is located on the periphery of the outer pot, and the portion of the outer pot located on the periphery of the inner pot placement opening is folded outward to form a shielding fold.
8. The cooking utensil according to claim 4, characterized in that, The cooking appliance includes a microwave shielding cover and a second temperature sensing element disposed on the microwave shielding cover. The microwave shielding cover is closable and disposed at the inner pot placement opening. When the microwave shielding cover is in the closed state covering the inner pot placement opening, the microwave shielding cover and the outer pot form a microwave shielding cavity, and the second temperature sensing element faces the inner pot; and / or, The outer pot includes a shielding plate covering the microwave inlet, with the microwave emission port facing the shielding plate so that microwaves emitted from the microwave emission port pass through the shielding plate.
9. The cooking utensil according to claim 1 or 2, characterized in that, The microwave heating assembly includes a magnetron, a waveguide box, and a waveguide with a microwave emission port. The waveguide box is connected to both the magnetron and the waveguide to guide the microwaves generated by the magnetron to the waveguide. The microwave emission port faces the inner liner.
10. The cooking utensil according to claim 9, characterized in that, The waveguide surrounds a second receiving cavity, and at least a portion of the structure of the inner liner is located within the second receiving cavity.
11. The cooking utensil according to claim 10, characterized in that, The waveguide has two microwave emission ports, which are located on opposite sides of the inner liner.