Heat dissipation bonding pad, LED automobile lamp and automobile

Abstract

The utility model provides a heat dissipation bonding pad, an LED car lamp and an automobile, and relates to the technical field of bonding pads, the heat dissipation bonding pad is provided with a central bonding pad area and an edge bonding pad area comprising a plurality of small bonding pads, and the heat dissipation bonding pad comprises a plurality of resistance welding rods which are arranged in the central bonding pad area to separate the central bonding pad area. The beneficial effects are that the surface of the central bonding pad area is provided with the solder resist strip to divide the central bonding pad area into a plurality of small bonding pad areas, so that soldering tin in each small bonding pad area is independent from each other after a vacuum reflow soldering process and does not move to other small bonding pad areas due to vacuum pumping, the soldering tin uniformity of the whole copper-embedded plate area is ensured, and the soldering efficiency is improved. And thus, uniform distribution of the holes is ensured.

Description

Technical Field

[0001] This utility model relates to the field of solder pad technology, and in particular to a heat dissipation solder pad, LED automotive lights, and automobiles. Background Technology

[0002] With technological advancements, in addition to standard high and low beam functions, automotive headlights have seen animation projection capabilities become a new highlight. This enhanced functionality has led to a corresponding increase in the size of the LED light itself. Figure 1 The diagram shows the main body of the LED. The heat dissipation pad of the LED needs to use a copper-embedded plate design, that is, a whole copper plate is embedded in a FR4 material PCB board. The material is T2 purple copper, and the solder requires a void rate of ≤20% and uniform void distribution. In particular, large voids should not be formed in the middle area. To meet this requirement, a vacuum reflow soldering process is required. However, the heat dissipation pad design in the existing technology leads to uneven soldering during the process, resulting in uneven void distribution and a high process defect rate. Utility Model Content

[0003] To address the problems existing in the prior art, this utility model provides a heat dissipation pad, which has a central pad area and an edge pad area containing multiple small pads, and includes multiple solder resist strips, which are disposed in the central pad area to separate the central pad area.

[0004] Preferably, the solder resist includes a first solder resist disposed along the width direction of the heat dissipation pad, and / or a second solder resist disposed along the length direction of the heat dissipation pad.

[0005] Preferably, each of the solder resist strips is provided with a through hole, which penetrates the heat dissipation pad along the thickness direction of the heat dissipation pad.

[0006] Preferably, the via is a continuous via.

[0007] Preferably, the via is a segmented via.

[0008] Preferably, the via is circular, elliptical, or rectangular in shape.

[0009] This utility model also provides an LED vehicle light, including a circuit board, on which heat dissipation pads as described above are provided.

[0010] This utility model also provides an automobile, including the LED vehicle lights described above.

[0011] The above technical solution has the following advantages or beneficial effects: It provides a heat dissipation pad, which, based on the existing heat dissipation pad, sets a solder resist strip on the surface of the central pad area to divide it into multiple small pad areas. The purpose is that after the vacuum reflow soldering process, the solder in each small pad area is independent of each other and will not move to other small pad areas due to vacuuming, thus ensuring the solder uniformity of the entire copper-embedded board area and thus ensuring the uniform distribution of voids. Attached Figure Description

[0012] Figure 1 This is a schematic diagram of the LED body;

[0013] Figure 2 This is a schematic diagram of the structure of an existing heat dissipation pad;

[0014] Figures 3-6 This is a schematic diagram of the structure of the heat dissipation pad provided in a preferred embodiment of the present invention. Detailed Implementation

[0015] The present invention will now be described in detail with reference to the accompanying drawings and specific embodiments. The present invention is not limited to this embodiment; other embodiments that conform to the spirit of the present invention may also fall within its scope.

[0016] In a preferred embodiment of this utility model, based on the above-mentioned problems existing in the prior art, a heat dissipation pad is provided, such as... Figure 2 As shown, the heat dissipation pad 1 has a central pad area 10 and an edge pad area 11 containing multiple small pads, as follows: Figure 3 As shown, it includes multiple solder resist bars 12, which are set in the central solder pad area 11 to divide the central solder pad area.

[0017] Specifically, this embodiment provides a heat dissipation pad, which, in addition to existing heat dissipation pads (such as...), provides a heat dissipation pad for... Figure 2 Based on the above, solder resist 12 is placed on the surface of the central pad area 10 to divide it into multiple small pad areas (as shown). Figure 3 As shown, the purpose is to ensure that the solder in each small pad area is independent after the vacuum reflow soldering process, and will not move to other small pad areas due to vacuuming, thus ensuring the uniformity of solder in the entire copper-embedded board area and thus ensuring the uniform distribution of voids.

[0018] In a preferred embodiment of the present invention, the solder resist 12 includes a first solder resist 121 disposed along the width direction of the heat dissipation pad, and / or a second solder resist 122 disposed along the length direction of the heat dissipation pad.

[0019] Specifically, in this embodiment, as follows: Figures 3-6As shown, multiple first solder resist electrodes 121 and second solder resist electrodes 122 can be set to divide the central solder pad area into 3, 4, 6, 8, 10, etc. small solder pad areas.

[0020] In a preferred embodiment of this utility model, each solder resist 12 is provided with a through hole 13, which penetrates the heat dissipation pad along the thickness direction of the heat dissipation pad.

[0021] Specifically, such as Figure 3 As shown, a via 13 is provided on the solder resist 12. The purpose is to allow air bubbles in the solder to be discharged along the via 13 during the vacuuming process, so as to ensure the vacuuming effect and reduce the solder void rate.

[0022] In a preferred embodiment of this utility model, the via 13 is a continuous via.

[0023] In a preferred embodiment of this invention, the via 13 is a segmented via.

[0024] Specifically, such as Figure 5 As shown, via 13 can be a continuous via or a segmented via. A continuous via has a better air bubble removal effect, while a segmented via slightly improves the structural strength of the heat dissipation pad. The choice can be made according to the requirements.

[0025] In a preferred embodiment of this invention, the through hole 13 is circular, elliptical, or rectangular.

[0026] Specifically, various shapes are possible shapes for the through hole 13 of this utility model, and are not intended to be unique.

[0027] This utility model also provides an LED vehicle light, including a circuit board, on which heat dissipation pads as described above are provided.

[0028] This utility model also provides an automobile, including the LED vehicle lights described above.

[0029] The above are merely preferred embodiments of the present utility model and are not intended to limit the implementation methods and protection scope of the present utility model. Those skilled in the art should realize that any equivalent substitutions and obvious changes made using the content of this specification and illustrations should be included within the protection scope of the present utility model.

Claims

1. A heat dissipation pad, wherein the heat dissipation pad has a central pad area and an edge pad area comprising a plurality of small pads, characterized in that, It includes multiple solder resist strips, which are disposed in the central pad area to divide the central pad area; Each of the solder resist strips is provided with a through hole, which penetrates the heat dissipation pad along the thickness direction of the heat dissipation pad.

2. The heat dissipation pad according to claim 1, characterized in that, The solder resist includes a first solder resist disposed along the width direction of the heat dissipation pad, and / or a second solder resist disposed along the length direction of the heat dissipation pad.

3. The heat dissipation pad according to claim 1, characterized in that, The via is a continuous via.

4. The heat dissipation pad according to claim 1, characterized in that, The via is a segmented via.

5. The heat dissipation pad according to claim 1, characterized in that, The via can be circular, elliptical, or rectangular.

6. An LED vehicle light, characterized in that, The invention includes a circuit board having a heat dissipation pad as described in any one of claims 1-5.

7. A car, characterized in that, Includes the LED vehicle light described in claim 6.

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