Cleaning device used in wafer processing technology

Abstract

The utility model discloses a cleaning device used in a wafer processing technology. The cleaning device comprises a rack, a cleaning tank, a rotating assembly, a plurality of cleaning nozzles and a cleaning seat, the rotating assembly is installed at the upper end of the cleaning tank to rotate, the multiple cleaning nozzles are installed on the rotating assembly and face the interior of the cleaning tank, and a water outlet is formed in the bottom of the cleaning tank. The cleaning seat is arranged in the cleaning tank and comprises a tray and a hydraulic oil cylinder, a telescopic rod of the hydraulic oil cylinder faces upwards and is fixedly connected with the bottom of the tray, the upper end of the tray is concavely provided with a circular placement groove, and a plurality of water leakage holes are formed in the bottom of the placement groove in a penetrating mode; the water retaining cover is fixedly arranged at the lower end of the tray and is in a circular truncated cone shape, the upper end of the water retaining cover is fixedly connected with the lower end of the tray, and the hydraulic oil cylinder is located below the water retaining cover and completely located in the projection of the water retaining cover in the horizontal plane, so that basic waterproof protection is conducted on the hydraulic oil cylinder, and the hydraulic oil cylinder is prevented from being stained with water to be quickly rusted; and the service life of the hydraulic oil cylinder is prolonged.

Description

Technical Field

[0001] This utility model relates to the field of wafer cleaning technology, specifically to a cleaning device used in wafer processing. Background Technology

[0002] Cleaning is a crucial step in semiconductor manufacturing and one of the most important factors affecting the yield of semiconductor devices. Cleaning is an essential part of wafer fabrication. In order to minimize the impact of impurities on chip yield, in actual production, it is necessary not only to ensure efficient single-pass cleaning, but also to perform frequent cleaning before and after almost every process.

[0003] In the prior art, invention patent publication number "CN119133006A" discloses a cleaning device for semiconductor manufacturing, including a base, a cleaning chamber disposed on the base, a tray for placing wafers, a first driving device for driving the tray to lift and lower, a spraying device for cleaning the wafers, and a rotating device for driving the spraying device to rotate. The first driving device is installed at the bottom of the cleaning chamber; the tray is disposed on the driving end of the first driving device; the spraying device is rotatably connected to the top opening of the cleaning chamber; the rotating device is installed on the base and is drively connected to the spraying device. This solves the technical problem in the prior art where the cleaning fluid can only be sprayed vertically from top to bottom when cleaning wafers, which results in the wafer surface not being able to ensure complete contact with the cleaning fluid, thus causing impurities to remain on the surface of the wafers after cleaning.

[0004] However, in the aforementioned patent, the tray has a hollow design to facilitate drainage, and the first drive device used to drive the tray lifting is a hydraulic cylinder located inside the cleaning chamber and below the tray. Therefore, during cleaning, the cleaning fluid will leak from the tray and drip onto the hydraulic cylinder, which can easily accelerate the corrosion of the hydraulic cylinder and reduce its service life. Utility Model Content

[0005] To address the shortcomings of the prior art, this invention proposes a cleaning device for use in wafer fabrication processes.

[0006] To achieve the above-mentioned technical effects, the present invention adopts the following solution:

[0007] A cleaning apparatus for use in wafer fabrication processes includes a frame, a cleaning tank, a rotating assembly, several cleaning nozzles, and a cleaning base;

[0008] The cleaning tank is fixedly installed on the frame, the rotating assembly is installed on the upper end of the cleaning tank and rotates, a number of cleaning nozzles are installed on the rotating assembly and face into the cleaning tank, and the bottom of the cleaning tank is provided with a drain outlet.

[0009] The cleaning seat is located in the cleaning tank. The cleaning seat includes a tray and a hydraulic cylinder. The hydraulic cylinder is vertically installed in the cleaning tank. The extension rod of the hydraulic cylinder is fixedly connected to the bottom of the tray with its extension rod facing upward. The upper end of the tray is recessed with a circular placement groove. The bottom of the placement groove is provided with several drainage holes. The center of the tray is located on the rotation axis of the rotating component.

[0010] A water baffle is fixedly provided at the lower end of the tray. The water baffle is shaped like a frustum. The upper end of the water baffle is fixedly connected to the lower end of the tray. The hydraulic cylinder is located below the water baffle and is completely within the projection of the water baffle on the horizontal plane.

[0011] In a preferred embodiment, the bottom of the cleaning tank is inclined, and the drain outlet is connected to the lowest point of the bottom of the cleaning tank.

[0012] In a preferred embodiment, a mounting block is provided at the center of the cleaning tank, the hydraulic cylinder is mounted on the upper end of the mounting block, the mounting block is mounted on the bottom of the cleaning tank by bolts, a vertical threaded hole is provided at the lower end of the mounting block, and a mounting hole extending to the lower end of the cleaning tank is provided at the bottom of the cleaning tank. The mounting hole matches the bolt, and the bolt is inserted into the mounting hole from below the cleaning tank and screwed into the threaded hole for locking.

[0013] In a preferred embodiment, a sealing gasket is sandwiched between the mounting block and the bottom of the cleaning tank, and the sealing gasket has a through hole for bolts to pass through.

[0014] In a preferred embodiment, the lower end of the mounting block is provided with at least two downwardly extending positioning posts around the threaded hole, and the bottom of the cleaning tank is provided with positioning holes that are compatible with the positioning posts.

[0015] In a preferred embodiment, the rotating assembly includes a rotating ring and a motor. The rotating ring is mounted on the upper end of the cleaning tank and rotates. Several cleaning nozzles are mounted on the inner side of the rotating ring. A slide rail is provided at the lower end of the rotating ring. A groove adapted to the slide rail is provided on the upper surface of the cleaning tank. The slide rail slides within the groove. A second synchronous pulley is provided on the outer side of the rotating ring. The motor is mounted on a frame. A first synchronous pulley is provided at the output end of the motor. The first synchronous pulley and the second synchronous pulley are connected by a synchronous belt drive.

[0016] In a preferred embodiment, a liquid storage tank is arranged around the upper end of the rotating ring, and several cleaning nozzles are connected to the liquid storage tank. The opening of the liquid storage tank faces upward, and a liquid supply pipe is provided on the frame, with the end of the liquid supply pipe extending into the opening of the liquid storage tank.

[0017] Compared with existing technologies, the beneficial effects are:

[0018] This utility model has a simple structure and is easy to use. During the rinsing process of the wafer, the cleaning fluid is discharged downward from the drain hole at the bottom of the placement tank and flows onto the water baffle. It flows downward along the water baffle at an angle, preventing the cleaning fluid from flowing onto the hydraulic cylinder. This provides basic waterproof protection for the hydraulic cylinder, preventing it from getting wet and corroding quickly, and extending the service life of the hydraulic cylinder. Attached Figure Description

[0019] Figure 1 This is a schematic diagram of the structure of this utility model.

[0020] Figure 2 This is a cross-sectional schematic diagram of the present invention.

[0021] Reference numerals: 1. Frame; 2. Cleaning tank; 3. Tray; 4. Placement slot; 5. Drain hole; 6. Liquid storage tank; 7. Second synchronous pulley; 8. Cleaning nozzle; 9. Motor; 10. First synchronous pulley; 11. Synchronous belt; 12. Drain outlet; 13. Water baffle; 14. Hydraulic cylinder; 15. Mounting block; 16. Bolt; 17. Positioning post; 18. Sealing gasket. Detailed Implementation

[0022] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments of the present utility model. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments.

[0023] A cleaning device used in wafer processing includes a frame 1, a cleaning tank 2, a rotating assembly, a plurality of cleaning nozzles 8, and a cleaning seat; the frame 1 is the overall support frame of the cleaning device, the opening of the cleaning tank 2 faces upward, the cleaning seat is used to place the wafer to be cleaned, the rotating assembly drives the plurality of cleaning nozzles 8 to rotate, and the cleaning nozzles 8 spray water toward the upper surface of the wafer for cleaning.

[0024] The cleaning tank 2 is fixedly installed on the frame 1. The rotating assembly is installed on the upper end of the cleaning tank 2 and rotates. The rotation axis of the rotating assembly coincides with the central axis of the cleaning tank 2. Several cleaning nozzles 8 are installed on the rotating assembly and face the wafer surface inside the cleaning tank 2. The bottom of the cleaning tank 2 is provided with a drain outlet 12 to discharge the cleaning wastewater.

[0025] The cleaning seat is located inside the cleaning tank 2. The cleaning seat includes a tray 3 and a hydraulic cylinder 14. The hydraulic cylinder 14 is vertically installed inside the cleaning tank 2. The telescopic rod of the hydraulic cylinder 14 is fixedly connected to the bottom of the tray 3 with its extension rod facing upward to drive the tray 3 to rise and fall. The tray 3 rises above the cleaning tank 2 to facilitate the placement and removal of wafers. The tray 3 falls below the cleaning nozzles 8 to rinse the wafers through the cleaning nozzles 8. The upper end of the tray 3 is recessed with a circular placement groove 4, in which wafers are placed. The bottom of the placement groove 4 is provided with several drainage holes 5. The center of the tray 3 is located on the rotation axis of the rotating assembly, so that several cleaning nozzles 8 rotate around the tray 3.

[0026] A water baffle 13 is fixedly provided at the lower end of the tray 3. The water baffle 13 is shaped like a frustum. The upper end of the water baffle 13 is fixedly connected to the lower end of the tray 3. The hydraulic cylinder 14 is located below the water baffle 13. The upper end of the water baffle 13 is fixedly connected to the connection between the extension rod of the hydraulic cylinder 14 and the tray 3. The hydraulic cylinder 14 is completely located within the projection of the water baffle 13 on the horizontal plane, so that the water baffle 13 can completely block the hydraulic cylinder 14 from above.

[0027] The hydraulic cylinder 14 drives the tray 3 to rise and extend out of the cleaning tank 2. Then, the wafer to be cleaned is placed in the placement slot 4 of the tray 3. The hydraulic cylinder 14 drives the tray 3 to fall to a position lower than the cleaning nozzle 8. The cleaning nozzle 8 sprays water to rinse the upper surface of the wafer. The rotating component drives several cleaning nozzles 8 to rotate around the tray 3. The cleaning nozzles 8 continuously rinse the wafer during the rotation. After one side of the wafer is rinsed, the hydraulic cylinder 14 drives the tray 3 to rise outside the cleaning tank 2, flips the wafer over, and repeats the above rinsing operation to rinse both sides of the wafer.

[0028] During the rinsing process of the wafers, the cleaning fluid is discharged downward from the drain hole 5 at the bottom of the placement tank 4 and flows onto the water baffle 13. It flows downward at an angle along the water baffle 13, preventing the cleaning fluid from flowing onto the hydraulic cylinder 14. This provides basic waterproof protection for the hydraulic cylinder 14, preventing it from getting wet and corroding quickly, and extending the service life of the hydraulic cylinder 14.

[0029] In a preferred embodiment, the bottom of the cleaning tank 2 is inclined, and the drain outlet 12 is connected to the lowest point of the bottom of the cleaning tank 2.

[0030] The inclined bottom of the cleaning tank 2 can guide the wastewater, allowing the wastewater after cleaning to collect at the drain outlet 12 and be discharged from the drain outlet 12, thus avoiding wastewater residue in the cleaning tank 2 and further preventing water from getting into the hydraulic cylinder 14.

[0031] In a preferred embodiment, a mounting block 15 is provided at the center of the cleaning tank 2, and the hydraulic cylinder 14 is mounted on the upper end of the mounting block 15. The mounting block 15 is mounted on the bottom of the cleaning tank 2 by bolts 16. A vertical threaded hole is provided at the lower end of the mounting block 15, and a mounting hole extending to the lower end of the cleaning tank 2 is provided at the bottom of the cleaning tank 2. The mounting hole matches the bolt 16, and the bolt 16 is inserted into the mounting hole from below the cleaning tank 2 and screwed into the threaded hole for locking. The mounting block 15 is locked to the bottom of the cleaning tank 2 by the bolt 16.

[0032] By installing block 15, the hydraulic cylinder 14 is positioned above the bottom of the cleaning tank 2, preventing wastewater flowing down from the water shield 13 and into the bottom of the cleaning tank 2 from contacting the hydraulic cylinder 14.

[0033] In a preferred embodiment, a sealing gasket 18 is sandwiched between the mounting block 15 and the bottom of the cleaning tank 2, and the sealing gasket 18 has a through hole for the bolt 16 to pass through.

[0034] After the mounting block 15 is locked to the bottom of the cleaning tank 2 by bolt 16, the mounting block 15 and the bottom of the cleaning tank 2 together clamp the sealing gasket 18 to prevent wastewater from seeping out from the mounting hole.

[0035] In a preferred embodiment, the lower end of the mounting block 15 is provided with at least two downwardly extending positioning posts 17 around the threaded hole, and the bottom of the cleaning tank 2 is provided with positioning holes that are adapted to the positioning posts 17.

[0036] When fixing the mounting block 15, first insert the positioning pin 17 into the positioning hole for positioning, and then tighten the bolt 16.

[0037] In a preferred embodiment, the rotating assembly includes a rotating ring and a motor 9. The rotating ring is mounted on the upper end of the cleaning tank 2 and rotates. A plurality of cleaning nozzles 8 are mounted on the inner side of the rotating ring. The lower end of the rotating ring is provided with a slide rail. The upper surface of the cleaning tank 2 is provided with a groove that matches the slide rail. The slide rail slides within the groove. The outer side of the rotating ring is provided with a second synchronous pulley 7. The motor 9 is mounted on the frame 1. The output end of the motor 9 is provided with a first synchronous pulley 10. The first synchronous pulley 10 and the second synchronous pulley 7 are connected by a synchronous belt 11.

[0038] The rotating ring rotates at the upper end of the cleaning tank 2 through the cooperation of the annular slide rail and the slide groove. The motor 9 drives the first synchronous pulley 10 to rotate, and then the first synchronous pulley 10 drives the second synchronous pulley 7 and the rotating ring to rotate through the synchronous belt 11.

[0039] In a preferred embodiment, a liquid storage tank 6 is arranged around the upper end of the rotating ring, and a plurality of cleaning nozzles 8 are connected to the liquid storage tank 6. The opening of the liquid storage tank 6 is arranged facing upward, and a liquid supply pipe is provided on the frame 1, with the end of the liquid supply pipe extending into the opening of the liquid storage tank 6.

[0040] The liquid supply pipe connects to an external liquid supply device to inject cleaning fluid into the liquid storage tank 6. The cleaning fluid is then sprayed onto the surface of the wafer through the cleaning nozzle 8. The cleaning nozzle 8 is used to drain the cleaning fluid from the liquid storage tank 6 and spray it onto the wafer; therefore, the cleaning nozzle 8 can also be a tubular body with both ends open.

[0041] In the description of this utility model, it should be understood that the terms "upper", "lower", "top", "bottom", "inner", "outer", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, or the orientation or positional relationship commonly used when the utility model product is in use, or the orientation or positional relationship commonly understood by those skilled in the art. They are only used to facilitate the description of this utility model and simplify the description, and are not intended to indicate or imply that the device or component referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this utility model.

[0042] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of this utility model, "a plurality of" means two or more, unless otherwise explicitly specified.

[0043] Based on the embodiments of this utility model, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this utility model.

Claims

1. A cleaning apparatus for use in a wafer processing procedure, characterized by: It comprises a frame (1), a cleaning tank (2), a rotating assembly, a plurality of cleaning nozzles (8) and a cleaning seat; The cleaning tank (2) is fixedly installed on the frame (1), the rotating assembly is installed on the upper end of the cleaning tank (2) and rotates, and the plurality of cleaning nozzles (8) are installed on the rotating assembly and face the cleaning tank (2); the bottom of the cleaning tank (2) is provided with a drain port (12); The cleaning seat is arranged in the cleaning tank (2), and the cleaning seat comprises a tray (3) and a hydraulic oil cylinder (14); the hydraulic oil cylinder (14) is vertically installed in the cleaning tank (2); the telescopic rod of the hydraulic oil cylinder (14) is fixedly connected to the bottom of the tray (3) upward; the upper end of the tray (3) is recessed to form a circular placing groove (4); a plurality of water leakage holes (5) are formed in the bottom of the placing groove (4); and the center of the tray (3) is located on the rotation axis of the rotating assembly. The lower end of the tray (3) is fixedly provided with a water baffle (13); the water baffle (13) surrounds the tray (3) in a circular truncated cone shape; the upper end of the water baffle (13) is fixedly connected to the lower end of the tray (3); the hydraulic oil cylinder (14) is located below the water baffle (13), and the hydraulic oil cylinder (14) is completely located in the projection of the water baffle (13) on the horizontal plane.

2. The cleaning apparatus for use in a wafer processing process according to claim 1, wherein The bottom of the cleaning tank (2) is inclinedly arranged; and the drain port (12) is connected to the lowest part of the bottom of the cleaning tank (2).

3. The cleaning apparatus for use in a wafer processing process according to claim 2, wherein The center of the cleaning tank (2) is provided with a mounting block (15); the hydraulic oil cylinder (14) is installed on the upper end of the mounting block (15); the mounting block (15) is installed on the bottom of the cleaning tank (2) through a bolt (16); the lower end of the mounting block (15) is provided with a vertical threaded hole; the bottom of the cleaning tank (2) is provided with a mounting hole extending to the lower end of the cleaning tank (2); the mounting hole is matched with the bolt (16); the bolt (16) is inserted into the mounting hole from below the cleaning tank (2) and is screwed and locked with the threaded hole.

4. The cleaning apparatus for use in a wafer processing process according to claim 3, wherein A sealing gasket (18) is clamped between the mounting block (15) and the bottom of the cleaning tank (2); the sealing gasket (18) is provided with a through hole for the bolt (16) to pass through.

5. The cleaning apparatus for use in a wafer processing process according to claim 3, wherein The lower end of the mounting block (15) is provided with at least two downward extending positioning columns (17) around the threaded hole; and the bottom of the cleaning tank (2) is provided with positioning holes matched with the positioning columns (17).

6. The cleaning apparatus for use in a wafer processing process as recited in claim 1, wherein The rotating assembly comprises a rotating ring and a motor (9); the rotating ring is installed on the upper end of the cleaning tank (2) to rotate; the plurality of cleaning nozzles (8) are installed on the inner side of the rotating ring; the lower end of the rotating ring is provided with a circle of sliding rails; the upper end surface of the cleaning tank (2) is provided with a circle of sliding grooves matched with the sliding rails; the sliding rails are embedded in the sliding grooves to slide; the outer side of the rotating ring is provided with a circle of second synchronous wheels (7); the motor (9) is installed on the frame (1); the output end of the motor (9) is provided with a first synchronous wheel (10); and the first synchronous wheel (10) is in transmission connection with the second synchronous wheel (7) through a synchronous belt (11).

7. The cleaning apparatus for use in a wafer processing process according to claim 6, wherein The upper end of the rotating ring is provided with a ring-shaped liquid storage groove (6), and several cleaning nozzles (8) are connected to the liquid storage groove (6), the opening of the liquid storage groove (6) is upward, and the rack (1) is provided with a liquid supply pipe, and the end of the liquid supply pipe extends into the opening of the liquid storage groove (6).

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