Overpressure LED light source and lamp

Abstract

The utility model relates to the technical field of illumination, in particular to an overpressure LED light source and a lamp. The LED light source comprises a substrate, a packaging glue layer and LED lamp beads. The LED lamp beads are arranged on the surface of one side of the substrate through the packaging glue layer. The surface of the side, not provided with the LED lamp beads, of the substrate is connected with the heat dissipation device. The heat dissipation device comprises a heat dissipation bottom face and a heat conduction layer. One side of the heat-conducting layer is connected with the radiating bottom surface, the other side of the heat-conducting layer is connected with the substrate, and the contact area of the heat-conducting layer and the substrate is smaller than that of the heat-conducting layer and the radiating bottom surface. The heat dissipation problem of the LED light source is solved in the mode that the heat dissipation device is connected to the surface of the side, where the LED lamp beads are not arranged, of the substrate, so that the LED lamp beads can be arranged on the substrate with the limited size as many as possible, and the light emitting power of the LED light source is improved under the condition that the size of the LED light source is not increased; miniaturization and light weight of an overpressure high-power LED light source are facilitated; and the overpressure LED light source and the lamp can be conveniently arranged on equipment with limited installation space and limited bearing capacity.

Description

Technical Field

[0001] This utility model relates to the field of lighting technology, and in particular to an overpressure LED light source and lamp. Background Technology

[0002] In environments requiring emergency lighting, such as earthquake rescue, the lighting system needs to maximize its luminous intensity and illumination range while minimizing its space, manpower, and power consumption, due to limitations of on-site conditions. Lighting drones equipped with light sources have emerged as a new emergency lighting solution due to their ease of carrying and operation, rapid deployment to designated areas without complex installation and debugging processes, and the fact that they mostly use LED lighting, making them more energy-efficient than traditional lighting methods.

[0003] However, the existing lighting drones equipped with LED light sources have limited lighting effects. To improve the lighting effect, the conventional technical means is to use LED light sources with more LED chips, or to use multiple LED light sources to increase the luminous power of the LED light source. However, this approach inevitably leads to an increase in the size of the LED light source, which in turn leads to an increase in the weight and volume of the LED light source. This places higher demands on the drone's payload capacity, meaning that achieving higher lighting effects requires drones with greater payload capacity. Utility Model Content

[0004] The purpose of this invention is to overcome the problem that existing technologies can only improve the luminous power of LED light sources by increasing the size of the LED light source and setting more LED beads when improving the LED lighting effect. This invention provides an overpressure LED light source and lamp that can set more LED beads and increase the luminous power of the LED light source with a fixed LED light source size. It also makes the overpressure high-power LED light source smaller and lighter, and easier to deploy on equipment with limited installation space and load-bearing capacity.

[0005] In a first aspect, this utility model provides an overpressure LED light source, comprising a substrate, an encapsulating layer, and LED chips. A plurality of the LED chips are arranged on one side surface of the substrate through the encapsulating layer. A heat dissipation device is connected to the side surface of the substrate away from the LED chips. The heat dissipation device includes a heat dissipation base, a plurality of heat dissipation fins, and a thermally conductive layer. The heat dissipation fins and the thermally conductive layer are connected to both sides of the heat dissipation base. The side of the thermally conductive layer away from the heat dissipation base is connected to the substrate, and the contact area between the thermally conductive layer and the substrate is smaller than the contact area between the thermally conductive layer and the heat dissipation base.

[0006] According to a preferred embodiment, the heat dissipation device further includes a mounting housing. The mounting housing is used to mount the substrate to the heat dissipation device. The mounting housing is connected to the heat dissipation bottom surface and clamps the substrate and the thermally conductive layer. The mounting housing can also be used to dissipate heat from the overpressure LED light source.

[0007] According to a preferred embodiment, the thermally conductive layer is larger than the substrate in size, and is used to conduct heat generated when the LED light source emits light along the extension direction of the thermally conductive layer. The substrate is disposed in the middle of the thermally conductive layer. The material used to fabricate the thermally conductive layer includes at least one of graphene, graphite, copper, silver, and gold, and the thickness of the thermally conductive layer is less than its length and width.

[0008] According to a preferred embodiment, the operating voltage of the LED light source is 300~3000V.

[0009] According to a preferred embodiment, the heat dissipation power density of the substrate after arranging the LED beads is 3.7~423w / cm². 2 .

[0010] According to a preferred embodiment, the power of the LED light source is 50~1000W.

[0011] According to a preferred embodiment, the LED beads are arranged on the substrate as follows: at least two LED beads are connected in series to form a primary lamp group; at least two primary lamp groups are connected in parallel to form a secondary lamp group; and the LED beads in each secondary lamp group are arranged on the substrate by connecting them end-to-end. The sum of the voltage differences between two primary lamp groups is less than the maximum isolation voltage between two adjacent LED beads.

[0012] This utility model also provides an overpressure LED lamp, including an LED light source and a heat dissipation device. The LED light source includes a substrate and a plurality of LED chips, which are mounted on one side of the substrate through an encapsulating adhesive layer. The heat dissipation device includes a heat dissipation base, a plurality of heat dissipation fins, and a thermally conductive layer. The heat dissipation fins and the thermally conductive layer are connected to both sides of the heat dissipation base. The side of the thermally conductive layer away from the heat dissipation base is connected to the substrate, and the contact area between the thermally conductive layer and the substrate is smaller than the contact area between the thermally conductive layer and the heat dissipation base. The substrate is connected to the middle of the thermally conductive layer.

[0013] According to a preferred embodiment, the operating voltage of the LED light source is 300~3000V. The heat dissipation power density of the LED light source is 3.7~423W / cm². 2The power of the LED light source is 50~1000W. Preferably, the arrangement of the LED beads on the substrate is as follows: at least two LED beads are connected in series to form a primary lamp group; at least two primary lamp groups are connected in parallel to form a secondary lamp group; and the secondary lamp groups are arranged on the substrate by connecting the LED beads end to end. Preferably, the sum of the voltage differences between two primary lamp groups is less than the maximum isolation voltage between two adjacent LED beads.

[0014] According to a preferred embodiment, the size of the thermally conductive layer is larger than the size of the substrate, and it is used to conduct the heat generated when the LED light source emits light along the extension direction of the thermally conductive layer. Preferably, the material of the thermally conductive layer includes at least one of graphene, graphite, copper, silver, and gold, and the thickness of the thermally conductive layer is smaller than its length and width, such that the thermal conductivity of the thermally conductive layer in its extension direction is higher than that in its extension direction.

[0015] Compared with the prior art, the beneficial effects of this utility model are as follows:

[0016] This invention solves the heat dissipation problem of LED light sources by first arranging a number of LED beads on one side of a substrate using an encapsulating adhesive layer, and then connecting a heat dissipation device to the side of the substrate where no LED beads are located. The heat dissipation device includes a heat dissipation base and a thermally conductive layer. One side of the thermally conductive layer is connected to the heat dissipation base, and the other side is connected to the substrate, with the contact area between the thermally conductive layer and the substrate being smaller than the contact area between the thermally conductive layer and the heat dissipation base. This invention solves the heat dissipation problem of LED light sources by connecting a heat dissipation device to the side of the substrate where no LED beads are located, thereby allowing as many LED beads as possible to be arranged on a substrate with limited size, and thus increasing the luminous power of the LED light source without increasing its size; it is also beneficial for miniaturizing and lightweighting high-power LED light sources under high pressure; and it facilitates the deployment of high-pressure LED light sources and luminaires on equipment with limited installation space and load-bearing capacity. Attached Figure Description

[0017] Figure 1 A schematic diagram of the structure of an LED light source in COB packaging;

[0018] Figure 2 This is a schematic diagram of a heat dissipation structure according to a preferred embodiment of the present invention;

[0019] Figure 3 This is a schematic diagram of an overpressure LED lamp according to a preferred embodiment of the present invention.

[0020] Figure label:

[0021] LED light source 100, substrate 110, LED beads 120, encapsulating adhesive layer 130, gold wire 140.

[0022] Heat dissipation device 200, heat dissipation base 210, heat dissipation fins 220, heat conduction layer 230, mounting housing 240. Detailed Implementation

[0023] The present invention will be further described in detail below with reference to specific embodiments. However, it should not be construed as limiting the scope of the present invention to the following embodiments; all technologies implemented based on the content of the present invention fall within the scope of the present invention.

[0024] Unless otherwise specified, the use of terms such as "upper," "lower," "left," "right," "center," "inner," and "outer" to indicate orientation or positional relationships in the description of specific embodiments of this utility model is based on the orientation or positional relationships shown in the accompanying drawings, or the orientation or positional relationship in which the utility model product / equipment / device is typically placed during use. These terms are merely for the purpose of facilitating the description of the utility model solution or simplifying the description in specific embodiments, enabling those skilled in the art to quickly understand the solution, and do not indicate or imply that a specific device / component / element must have a specific orientation, or be constructed and operated in a specific positional relationship. Therefore, they should not be construed as limitations on this utility model.

[0025] Furthermore, the use of terms such as "horizontal," "vertical," "suspended," and "parallel" does not imply that the corresponding device / component / element must be absolutely horizontal, vertical, suspended, or parallel, but rather that it can be slightly tilted or have a deviation. For example, "horizontal" merely means that its direction is more horizontal relative to "vertical," not that the structure must be completely horizontal, but can be slightly tilted. Alternatively, it can be simplified to mean that the corresponding device / component / element, when set in a "horizontal," "vertical," "suspended," or "parallel" direction, can have an error / deviation of ±10% relative to the corresponding direction, more preferably within ±8%, more preferably within ±6%, more preferably within ±5%, and more preferably within ±4%. As long as the corresponding device / component / element is within the error / deviation range, it can still achieve its function in the present invention.

[0026] Furthermore, the use of terms such as "first," "second," and "third" in terminology is merely for distinguishing between identical or similar components and should not be interpreted as emphasizing or implying the relative importance of a particular component.

[0027] Furthermore, in the description of the embodiments of this utility model, "several", "multiple", and "several" represent at least two. The number can be any number, such as two, three, four, five, six, seven, eight, or nine, and can even exceed nine.

[0028] Furthermore, in the description of the technical solution of this utility model, unless otherwise explicitly specified / limited / restricted, the terms "set up," "install," "connect," "link," "equipped with," "laid out," and "arranged" should be interpreted broadly. For example, they can refer to fixed connections, detachable connections, or integral connections; they can refer to common connection methods in the art, such as welding, riveting, bolting, and threaded connections. Such connections can be mechanical, electrical, or communication connections; they can be direct connections or indirect connections through an intermediate medium; and they can refer to the internal communication between two components.

[0029] Example 1

[0030] This embodiment provides an overpressure LED light source 100. See also... Figure 1 The LED light source 100 includes: a substrate 110, an encapsulating layer 130, LED beads 120, and gold wires 140. The LED beads 120 are disposed on the substrate 110, the gold wires 140 are used for electrical connection of the LED beads 120, and the encapsulating layer 130 encapsulates the LED beads 120 and the gold wires 140 on the substrate 110.

[0031] In the overpressure LED light source 100 provided in this embodiment, a plurality of LED beads 120 are arranged on one side surface of the substrate 110 through an encapsulating adhesive layer 130.

[0032] A heat dissipation device 200 is connected to the surface of substrate 110 on the side where the LED beads 120 are not located. See also Figure 2 Preferably, the heat dissipation device 200 includes a heat dissipation base surface 210, a plurality of heat dissipation fins 220, and a heat-conducting layer 230. The heat dissipation fins 220 and the heat-conducting layer 230 are disposed on both sides of the heat dissipation base surface 210. One side of the heat-conducting layer 230 is connected to the heat dissipation base surface 210, and the other side is connected to the substrate 110, and the contact area between the heat-conducting layer 230 and the substrate 110 is smaller than the contact area between the heat-conducting layer 230 and the heat dissipation base surface 210. Preferably, the substrate 110 is disposed in the middle of the heat-conducting layer 230.

[0033] This embodiment solves the heat dissipation problem of the LED light source 100 by connecting a heat dissipation device 200 to the surface of the substrate 110 on the side where the LED beads 120 are not located. This allows as many LED beads 120 as possible to be arranged on the substrate 110 with limited size, thereby increasing the luminous power of the LED light source 100 without increasing its size. It is also beneficial to miniaturize and lighten the high-power LED light source 100 under high pressure, and to facilitate its deployment on equipment with limited installation space and load-bearing capacity.

[0034] Example 2

[0035] This embodiment is a further improvement on Embodiment 1, and the repeated content will not be described again. In this embodiment, the operating voltage of the LED light source 100 is 300~3000V. Preferably, the heat dissipation power density of the LED beads 120 after being arranged on the substrate 110 is 3.7~423w / cm³. 2 The heat dissipation power density of the substrate 110 after arranging the LED beads 120 is 3.7~423w / cm³. 2 The preferred value is 3.7~44.6w / cm. 2 Or 160~423w / cm 2 Heat generation power density: power of the heat source / area of ​​the heat source, i.e., the heat generation power per unit area when the device is working. Preferably, the power of the LED light source 100 is 50~1000W, more preferably 80~100W. The arrangement of several LED beads 120 on the substrate 110 is as follows: at least two LED beads 120 are connected in series to form a primary lamp group; at least two primary lamp groups are connected in parallel to form a secondary lamp group; each secondary lamp group arranges several LED beads 120 on the substrate 110 by connecting them end-to-end. The sum of the voltage differences between two primary lamp groups is less than the maximum isolation voltage between two adjacent LED beads 120.

[0036] When the LED light source 100 emits light, it generates a lot of heat. If it cannot be dissipated in time, it will reduce the lifespan of the LED light source 100. In severe cases, it may even cause the LED to catch fire due to excessive temperature.

[0037] Most existing LED heat dissipation methods involve placing a semiconductor heat sink on the back of the LED light source 100 (the side surface without LED beads 120). However, the semiconductor heat sink mainly conducts heat in a direction perpendicular to the surface of the LED light source 100, resulting in the area of ​​the semiconductor heat sink facing the LED light source 100 having higher heat than other areas. Even if the area of ​​the semiconductor heat sink is larger than the area of ​​the LED light source 100, the area where the semiconductor heat sink actually performs heat dissipation is still the area facing the LED light source 100.

[0038] The LED light source 100 provided in this embodiment has high power and small size. When it emits light, the heat island effect is more obvious. Existing semiconductor heat sinks are difficult to effectively dissipate heat from the LED light source 100 provided in this embodiment.

[0039] Preferably, the heat dissipation device 200 is connected to the side surface of the substrate 110 where the LED beads 120 are not located. The heat dissipation device 200 includes a heat dissipation base surface 210, a plurality of heat dissipation fins 220, and a thermally conductive layer 230. The heat dissipation fins 220 and the thermally conductive layer 230 are connected to both sides of the heat dissipation base surface 210. The side of the thermally conductive layer 230 away from the heat dissipation base surface 210 is connected to the substrate 110, and the contact area between the thermally conductive layer 230 and the substrate 110 is smaller than the contact area between the thermally conductive layer 230 and the heat dissipation base surface 210. Preferably, the substrate 110 is connected to the middle of the thermally conductive layer 230.

[0040] Preferably, the size of the heat-conducting layer 230 is larger than the size of the substrate 110, and it is used to conduct the heat generated when the LED light source 100 emits light along the extension direction of the heat-conducting layer 230. The area of ​​the heat-conducting layer 230 is larger than the area of ​​the substrate 110, and the area of ​​the heat-conducting layer 230 is 1.1 to 5 times the area of ​​the substrate 110. The material used to fabricate the heat-conducting layer 230 includes at least one of graphene, graphite, copper, silver, and gold. The heat-conducting layer 230 can be constructed using graphene, and the thickness of the heat-conducting layer 230 is less than its length and width, so that the horizontal heat conduction efficiency of the heat-conducting layer 230 is higher than its vertical heat conduction efficiency.

[0041] Preferably, when one primary lamp group in a secondary lamp group is disconnected, the other primary lamp groups in that secondary lamp group can withstand the increased current; in other words, when a primary lamp group belonging to the same secondary lamp group is disconnected, its current is distributed to the other primary lamp groups and will not exceed the upper limit of the working current of a single lamp bead.

[0042] Preferably, the LED chip 120 has the following dimensions: length × width 559±38μm × 889±38μm, and thickness 150±15μm. Preferably, the photoelectric characteristics of the LED chip 120 at 22℃ are shown in the table below:

[0043]

[0044] Preferably, the LED beads 120 in the LED light source 100 are arranged in a long string design, that is, the number of primary light groups is much greater than the number of secondary light groups.

[0045] Preferably, the number of primary light groups can be ten times, tens of times, or even hundreds of times more than the number of secondary light groups.

[0046] Preferably, the number of LED beads 120 connected in series in the primary light group can be dozens or even hundreds.

[0047] Preferably, the LED light source 100 provided in this embodiment can adopt an overvoltage driving scheme, with an operating voltage of 300~3000V. Compared with the existing low-voltage driving scheme with a driving voltage of less than 100V, under the same power conditions, the current on the LED light source 100 circuit in the overvoltage driving scheme is smaller, which can significantly reduce the heat dissipation of the circuit.

[0048] The LED light source 100 directly adopts overvoltage drive. For applications that require long-distance DC power supply or have specific requirements on cable weight, there is no need to step down the overvoltage DC power to the low-voltage power supply required by the constant current driver chip via a step-down module, which reduces the weight of the end and improves energy efficiency.

[0049] In the LED light source 100, the LED beads 120 are arranged in a long string design. Within the suitable operating voltage range of the LED light source 100, the operating voltage range of the entire string of LED beads 120 is widened, and the power of the light source can be directly adjusted by adjusting the input voltage. This can replace the traditional PWM dimming method and simplify the complexity of the peripheral circuit design of the lamp.

[0050] In the LED light source 100, the LED beads 120 are arranged and connected in a long string design. Under the same power, the current of the LED beads 120 is smaller than that of the low-voltage driving scheme. Whether gold wire connection is used or the circuit is printed on the substrate, the wire diameter of the gold wire 140 or the thickness and width of the PCB printed circuit can be reduced, making the process simpler and the cost lower.

[0051] In terms of physical spatial layout, the LED light source 100 provided in this embodiment is configured with multiple secondary lamp groups to divide the voltage drop from VCC to GND into several segments, and control the voltage of each secondary lamp group within a reasonable range of 50-200V, which can effectively reduce the voltage between the secondary lamp groups and avoid the situation of wire breakdown.

[0052] The LED light source 100 provided in this embodiment uses a high voltage of 300V or more. Compared with the low voltage driving scheme, it is used to connect the parallel circuit path of each string of chips, and the current is small, which effectively reduces the line loss and improves the luminous efficiency of the entire LED light source 100.

[0053] The LED beads 120 are arranged in parallel within segments and in series across multiple segments, avoiding a single string throughout the entire length. This reduces the risk of overvoltage in the LED beads 120 due to uneven voltage distribution caused by fluctuations in individual LED beads 120 within a long string. Furthermore, if a single LED bead 120 in the LED light source 100 provided in this embodiment fails, the chips in the other primary LED groups within the same secondary LED group can share the current, preventing it from affecting the LED beads 120 in their respective secondary LED groups.

[0054] In this embodiment, the parallel cables of each primary lamp group and the series lines of each secondary lamp group are placed outside the light-emitting surface area, making the process controllable.

[0055] The LED light source 100 provided in this embodiment adopts a high-voltage DC direct drive design, eliminating the need for end voltage regulator and constant current chip and current limiting circuit at the end of the lamp, thus reducing the requirements for electrical clearance and creepage distance of the lamp due to component reasons.

[0056] Example 3

[0057] This embodiment provides an overpressure LED lamp, including an LED light source 100 and a heat dissipation device 200. See also... Figure 1 , Figure 2 and Figure 3 Preferably, the LED light source 100 involved in this embodiment can be the LED light source 100 provided in Embodiment 1 and Embodiment 2.

[0058] The LED light source 100 includes a substrate 110 and a plurality of LED beads 120, which are mounted on one side of the substrate 110 by an encapsulating adhesive layer 130. Preferably, the plurality of LED beads 120 are arranged on the substrate 110 as follows: at least two LED beads 120 are connected in series to form a primary lamp group; at least two primary lamp groups are connected in parallel to form a secondary lamp group; and the plurality of LED beads 120 are arranged on the substrate 110 by connecting the ends of each secondary lamp group. Preferably, the sum of the voltage differences between two primary lamp groups is less than the maximum isolation voltage between two adjacent LED beads 120.

[0059] The operating voltage of the LED light source 100 is 300~3000V. The heat dissipation power density of the LED light source 100 is 3.7~423W / cm³. 2 The power of the LED light source 100 is 50~1000W.

[0060] See Figure 3The heat dissipation device 200 includes a heat dissipation base surface 210, a plurality of heat dissipation fins 220, and a thermally conductive layer 230. The heat dissipation fins 220 and the thermally conductive layer 230 are disposed on both sides of the heat dissipation base surface 210. The side of the thermally conductive layer 230 away from the heat dissipation base surface 210 is connected to a substrate 110, and the contact area between the thermally conductive layer 230 and the substrate 110 is smaller than the contact area between the thermally conductive layer 230 and the heat dissipation base surface 210. Preferably, the substrate 110 is connected to the middle of the thermally conductive layer 230. Preferably, the size of the thermally conductive layer 230 is larger than the size of the substrate 110, for conducting the heat generated when the LED light source 100 emits light along the extension direction of the thermally conductive layer 230. Preferably, the material used to fabricate the thermally conductive layer 230 includes at least one of graphene, graphite, copper, silver, and gold, and the thickness of the thermally conductive layer 230 is less than its length and width, such that the thermal conductivity of the thermally conductive layer 230 in its extension direction is higher than that in its extension direction. The heat dissipation device 200 also includes a mounting housing 240. The mounting housing 240 is used to mount the substrate 110 to the heat dissipation device 200, and also serves to dissipate heat from the overpressure LED light source 100. The mounting housing 240 is connected to the heat dissipation bottom surface 210 and clamps the substrate 110 and the thermally conductive layer 230. Preferably, the LED light source 100 is embedded in the bottom of the mounting housing 240, and the mounting housing 240 is slightly lower than the top surface of the light source by 0.01~1cm. The thermally conductive layer 230 and several heat dissipation fins 220 are located above the mounting housing 240 and the LED light source 100. After installation, the mounting housing 240 is in close contact with the LED light source 100 and the thermally conductive layer 230. Preferably, the mounting housing 240 can be made of metal or other materials with good thermal conductivity.

[0061] Preferably, the thermally conductive layer 230 is a thin sheet, and its area is larger than that of the substrate 110 but smaller than that of the heat dissipation bottom surface 210. The thermal conductivity of the thermally conductive layer 230 is greater than that of the heat dissipation bottom surface 210. The heat generated when the ED chip 100 emits light can be conducted laterally within the thermally conductive layer 230, causing the temperature of the entire surface in contact with the heat dissipation bottom surface 210 to rise, thereby improving the thermal conductivity efficiency. The contact area between the thermally conductive layer 230 and the substrate 110 is smaller than the contact area between the thermally conductive layer 230 and the substrate 110. When the thermally conductive layer 230 is connected to the substrate 110, the thermally conductive layer 230 covers the substrate 110.

[0062] Preferably, the overpressure LED lamp provided in this embodiment can have 1 to 6 LED light sources 100 mounted on the heat dissipation device 200. The total input power of the overpressure LED lamp is >100W.

[0063] Preferably, the lighting performance of the overpressure LED luminaire provided in this embodiment is tested. Under the conditions that the overpressure LED luminaire is 50m away from the lighting plane, and the overpressure LED luminaire power is 800W, luminous efficacy is 225lm / W, and luminous flux is 180000lm, the maximum distance from the point on the lighting plane with an illuminance measurement value ≥2lx to the projection point of the overpressure LED luminaire on the lighting plane is 65m; under the condition that the overpressure LED luminaire is 50m away from the lighting plane, the area on the lit plane with an illuminance measurement value ≥2lx is 13267m². 2 .

[0064] The lighting performance (illuminance lx) of the overpressure LED luminaires is shown in the table below:

[0065]

[0066] In the table: height is the distance between the overpressure LED luminaire and the lighting plane; distance is the distance between the detection point on the lighting plane and the projection point of the overpressure LED luminaire; the overpressure LED luminaire has a power of 800W, a luminous efficacy of 225lm / W, and a luminous flux of 180000lm.

[0067] The above description is only a preferred embodiment of the present utility model and is not intended to limit the present utility model. Any modifications, equivalent substitutions and improvements made within the spirit and principles of the present utility model should be included within the protection scope of the present utility model.

Claims

1. An overvoltage LED light source, comprising a substrate (110), an encapsulation layer (130) and LED beads (120); characterized in that, a plurality of said LED beads (120) are mounted on one side of said substrate (110) through said encapsulation layer (130); a heat dissipation device (200) is connected to the side surface of said substrate (110) away from said LED beads (120); wherein said heat dissipation device (200) comprises a heat dissipation bottom surface (210), a plurality of heat dissipation fins (220) and a heat conduction layer (230); said heat dissipation fins (220) and said heat conduction layer (230) are connected to both sides of said heat dissipation bottom surface (210); the side of said heat conduction layer (230) away from said heat dissipation bottom surface (210) is connected to said substrate (110), and the area of said heat conduction layer (230) in contact with said substrate (110) is smaller than the area of said heat conduction layer (230) in contact with said heat dissipation bottom surface (210).

2. An overdriven LED light source as defined in claim 1, characterized in that said heat dissipation device (200) further comprises a mounting shell (240); said mounting shell (240) is used for mounting said substrate (110) to said heat dissipation device (200), said mounting shell (240) is connected to said heat dissipation bottom surface (210) and clamps said substrate (110) and said heat conduction layer (230); said mounting shell (240) can also be used for heat dissipation of said overvoltage LED light source (100).

3. An overdriven LED light source as defined in claim 1, characterized in that said substrate (110) is connected to the middle part of said heat conduction layer (230) and is used for conducting the heat generated by said LED light source (100) during light emission along the extension direction of said heat conduction layer (230); wherein the thickness dimension of said heat conduction layer (230) is lower than the length and width of said heat conduction layer (230).

4. An overdriven LED light source as defined in claim 1, characterized in that The working voltage of said LED light source (100) is 300-3000V.

5. An overdriven LED light source as defined in claim 4, characterized in that The heat power density of said LED light source (100) after arranging LED beads (120) on said substrate (110) is 3.7-423w / cm2.

6. An overpressure LED light source according to claim 5, characterized in that The power of said LED light source (100) is 50-1000w.

7. The overvoltage LED light source according to claim 1, characterized in that, the arrangement of a plurality of said LED beads (120) on said substrate (110) is that at least two LED beads (120) are connected in series to form a primary light group; at least two primary light groups are connected in parallel to form a secondary light group; and each secondary light group arranges a plurality of said LED beads (120) on said substrate (110) through head-to-tail connection; wherein the sum of the voltage difference of two primary light groups is less than the maximum isolation voltage of two adjacent LED beads (120).

8. An overvoltage LED lamp, characterized by comprising an LED light source (100) and a heat dissipation device (200); said LED light source (100) comprises a substrate (110) and a plurality of LED beads (120), and a plurality of said LED beads (120) are arranged on one side surface of said substrate (110) through an encapsulation layer (130); said heat dissipation device (200) comprises a heat dissipation bottom surface (210), a plurality of heat dissipation fins (220) and a heat conduction layer (230); The heat dissipation fins (220) and the heat conduction layer (230) are connected on both sides of the heat dissipation bottom surface (210); The heat conduction layer (230) is connected with the substrate (110) on the side away from the heat dissipation bottom surface (210), and the area of the heat conduction layer (230) in contact with the substrate (110) is smaller than the area of the heat conduction layer (230) in contact with the heat dissipation bottom surface (210).

9. An overpressure LED lamp according to claim 8, characterized in that The working voltage of the LED light source (100) is 300-3000V; the heat generation power density of the LED light source (100) is 3.7-423w / cm2; the power of the LED light source (100) is 50-1000w; The arrangement of the plurality of LED lamp beads (120) on the substrate (110) is: at least two LED lamp beads (120) are connected in series to form a first lamp group; at least two first lamp groups are connected in parallel to form a second lamp group; each second lamp group arranges a plurality of LED lamp beads (120) on the substrate (110) through head-to-tail connection; Wherein, the sum of the voltage difference of the two first lamp groups is less than the maximum isolation voltage of the adjacent two LED lamp beads (120).

10. An overvoltage LED lamp according to claim 9, characterized in that The size of the heat conduction layer (230) is greater than the size of the substrate (110), which is used to conduct the heat generated by the LED light source (100) during light emission along the extension direction of the heat conduction layer (230); the substrate (110) is connected in the middle of the heat conduction layer (230); Wherein, the thickness size of the heat conduction layer (230) is lower than the length and width of the heat conduction layer (230).

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