Chip testing device
By designing a vertically connected test board and PCB structure in the thermal flow meter testing equipment, the problem of low efficiency in small-batch chip testing was solved, enabling more efficient testing of multiple chips and simplifying the operation process.
Patent Information
- Application Number
- CN202520020616.9
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-01-03
- Publication Date
- 2026-03-06
- Estimated Expiration
- 2035-01-03
AI Technical Summary
Existing thermal flow meter testing equipment is inefficient when testing small batches of chips and cannot quickly complete the testing of multiple chips.
A chip testing device was designed, wherein a test board is inserted vertically into a PCB board, and each test board has a chip on at least one side. By utilizing the combined structure of the heat insulation cover and the PCB board, the chip density is increased without expanding the internal space of the heat insulation cover, enabling simultaneous testing of multiple chips.
It improves the testing efficiency of small batches of chips, enabling the testing of a larger number of chips without expanding the internal space of the insulation enclosure, and simplifies the chip assembly and disassembly process, thereby improving the convenience and efficiency of testing.
Smart Images
Figure CN223977312U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to the field of chip testing technology, and specifically to a chip testing device. Background Technology
[0002] Currently, intelligent storage chips such as IC chips and LED chips need to undergo reliability testing under extreme environments during factory testing to determine the temperature range at which the chip fails.
[0003] Related technologies typically employ heat flow meter testing equipment to blow a wide-range (-45°C to +125°C) airflow into the heat flow meter's insulation chamber to perform high and low temperature tests on chips. Traditional heat flow meter testing equipment generally places the chip horizontally on a test board, then covers it with an insulation chamber, and delivers a controlled-temperature airflow into the chamber for testing. To ensure a small temperature gradient from the center to the edges of the insulation chamber to meet testing requirements, a relatively small internal space is required for the insulation chamber. This results in a small area of the test board covered by the insulation chamber in traditional heat flow meter testing equipment, limiting the testing efficiency to single or small batch testing at a time, making rapid, small-batch testing impractical. Utility Model Content
[0004] In view of this, the present invention provides a chip testing device to solve the problem that existing thermal flow meter testing equipment is not convenient for rapid testing of small batches of chips.
[0005] This utility model provides a chip testing device for use in a thermal flow meter, the testing device comprising:
[0006] A heat shield is used to connect to a heat flow meter and to receive the airflow output from the heat flow meter.
[0007] A first PCB board is disposed at the lower end of the heat insulation cover. Multiple test boards are disposed in the area of the first PCB board located inside the heat insulation cover. The test boards are inserted into the first PCB board in a vertical direction. Each test board has a chip disposed on at least one side along its thickness direction. The thickness direction of the test board is perpendicular to the vertical direction.
[0008] The chip testing device according to this utility model has at least the following beneficial effects:
[0009] By placing at least one chip on at least one side of each test board along its thickness direction, and by vertically inserting each test board into the first PCB board, compared to placing the chip horizontally on the upper part of the first PCB board in the vertical direction, this chip testing device reduces the space occupied by a single chip-bearing test board on the upper part of the first PCB board in the vertical direction. This allows for the close vertical insertion of more chip-bearing test boards in the upper part of the area of the first PCB board located inside the insulation cover, enabling the testing of more chips at a time without expanding the internal space of the insulation cover. This effectively improves testing efficiency and facilitates rapid testing of small batches of chips.
[0010] In one alternative implementation, the test board is configured as a PCB board, and the chip is soldered to the test board.
[0011] In one optional implementation, the first PCB board is provided with a plurality of first positioning pair plugs, and the test board is provided with a second positioning pair plug corresponding to one of the first positioning pair plugs, and the first positioning pair plugs and the second positioning pair plugs are plugged into each other.
[0012] In one alternative implementation, the first positioning pair plug is configured as a slot, and the second positioning pair plug is configured as a pin.
[0013] In one alternative implementation, the first positioning pair is configured as a pin, and the second positioning pair is configured as a slot.
[0014] In one alternative implementation, a plurality of the first positioning pair plugs are arranged in an array on the first PCB board.
[0015] In one alternative embodiment, the chip is disposed on both sides of the test board along its thickness direction.
[0016] In one alternative embodiment, the test board has at least two of the chips on one side along its thickness direction, and a plurality of the chips are spaced apart along the vertical direction.
[0017] In one alternative embodiment, a connecting pipe is connected to the middle of the top of the heat insulation cover. The connecting pipe is used to connect to the heat flow meter and to allow the airflow output by the heat flow meter to flow through it.
[0018] In one alternative implementation, at least a portion of the vertical projection of the first PCB board does not fall onto the thermal insulation cover. Attached Figure Description
[0019] To more clearly illustrate the specific embodiments of this utility model or the technical solutions in the prior art, the drawings used in the description of the specific embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are some embodiments of this utility model. For those skilled in the art, other drawings can be obtained from these drawings without creative effort.
[0020] Figure 1 This is a schematic diagram of the structure of a chip testing device according to an embodiment of the present invention;
[0021] Figure 2 This is a schematic diagram of a test board with a chip on one side in an embodiment of the present invention;
[0022] Figure 3 This is a schematic diagram of the structure of a test board with a chip on each side in an embodiment of the present invention;
[0023] Figure 4 This is a schematic diagram of the structure of a test board with two chips on one side in an embodiment of the present invention;
[0024] Figure 5 This is a schematic diagram of the structure of a test board with two chips on each side in an embodiment of this utility model.
[0025] Explanation of reference numerals in the attached figures:
[0026] 100-Insulation cover, 110-Circular arc section, 120-Connecting tube, 200-First PCB board, 300-Test board, 310-Pin, 400-Chip. Detailed Implementation
[0027] To make the objectives, technical solutions, and advantages of the embodiments of this utility model clearer, the technical solutions of the embodiments of this utility model will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this utility model, not all embodiments. Based on the embodiments of this utility model, all other embodiments obtained by those skilled in the art without creative effort are within the protection scope of this utility model.
[0028] In the description of this embodiment, it should be noted that the terms "center," "upper," "lower," "left," "right," "vertical," "horizontal," "inner," and "outer," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this embodiment and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this embodiment. In addition, the terms "first," "second," and "third" are used for descriptive purposes only and should not be construed as indicating or implying relative importance.
[0029] In the description of this embodiment, it should be noted that, unless otherwise explicitly specified and limited, the terms "installation," "connection," and "linking" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in this embodiment according to the specific circumstances.
[0030] The following is combined with Figures 1 to 5 The following describes embodiments of the present invention.
[0031] A chip testing device according to an embodiment of the present invention is applied to a heat flow meter. The testing device includes a heat insulation cover 100 and a first PCB board 200. The heat insulation cover 100 covers the upper surface of the first PCB board 200 in the vertical direction. The heat insulation cover 100 is used to connect to the outlet end of the heat flow meter and receive the airflow output from the heat flow meter. A plurality of test boards 300 are arranged in the area of the first PCB board 200 located inside the heat insulation cover 100. The test boards 300 are inserted into the first PCB board 200 in the vertical direction. Each test board 300 has a chip 400 arranged on at least one side along its thickness direction.
[0032] The chip testing apparatus of this embodiment has at least one chip 400 disposed on at least one side of each test board 300 along its thickness direction, and each test board 300 is vertically inserted into the first PCB board 200. Compared with placing the chip 400 horizontally at the upper end of the first PCB board 200 in the vertical direction, the chip testing apparatus of this embodiment reduces the space occupied by a single test board 300 with chip 400 in the upper part of the first PCB board 200 in the vertical direction by vertically inserting the test board 300 with chip 400 into the upper part of the first PCB board 200. This allows for a larger number of test boards 300 with chip 400 to be vertically inserted tightly into the upper part of the area of the first PCB board 200 located inside the heat insulation cover 100. This enables a larger number of chips 400 to be tested at once without expanding the internal space of the heat insulation cover 100, effectively improving testing efficiency and facilitating rapid testing of small batches of chips 400.
[0033] It should be noted that, in specific applications, the chip testing device of this embodiment can vertically insert 18 to 24 test boards 300 tightly at the upper part of the area of the first PCB board 200 located within the heat insulation cover 100 without expanding the internal space of the heat insulation cover 100. In this embodiment, 24 test boards 300 are vertically inserted tightly at the upper part of the first PCB board 200. In other embodiments, other numbers of test boards 300, such as 18, 19, 20, 21, 22, or 23, can also be vertically inserted. Of course, it is understood that with improvements to the heat insulation cover 100, more than 24 test boards 300 or 10 to 17 test boards 300 can be vertically inserted tightly at the upper part of the area of the first PCB board 200 located within the heat insulation cover 100, but this should not be construed as a specific limitation on the exact number of test boards 300.
[0034] In practical applications, the heat insulation cover 100 is set as a double-layer structure. The air thermal conductivity between the heat insulation covers 100 is low, which can achieve a good heat preservation effect inside the heat insulation cover 100.
[0035] It is understood that the vertical direction mentioned in the text refers to the axial direction of the heat insulation cover 100. The vertical direction and the thickness direction of the test plate 300 are located in the vertical plane. For ease of description, this embodiment uses... Figure 1 The vertical direction and the first direction shown are used to describe the vertical direction and the thickness direction of the test plate 300, respectively, but should not be construed as making explicit limitations on the vertical direction and the thickness direction of the test plate 300.
[0036] It should be noted that the cross-sectional area of the chip 400 perpendicular to the first direction is smaller than the cross-sectional area of the test board 300 perpendicular to the first direction, and the sum of the dimensions of the chip 400 along the first direction and the dimensions of the test board 300 along the first direction is smaller. Therefore, compared to placing the chip 400 horizontally at the upper end of the first PCB board 200 along the vertical direction, this embodiment can effectively reduce the space occupied by a single test board 300 with the chip 400 in the upper part of the first PCB board 200 along the vertical direction.
[0037] Understandably, the heat flow meter uses a mature model available on the market. Depending on the different testing requirements, it can inject low-temperature or high-temperature airflow into the space formed between the insulation cover 100 and the first PCB board 200, so that the chip 400 located inside the insulation cover 100 can be tested in low-temperature, normal-temperature and high-temperature environments.
[0038] Specifically, the test board 300 is configured as a PCB board, and the chip 400 is soldered to the test board 300. The chip 400 is reliably fixed to the PCB board by ultrasonic welding or soldering, which helps to improve the accuracy of the test.
[0039] In some embodiments, the first PCB board 200 is provided with a plurality of first positioning pairs, and the test board 300 is provided with a second positioning pair corresponding to one of the first positioning pairs, the first positioning pairs and the second positioning pairs being plugged into each other. When the test board 300 with chip 400 needs to be assembled onto the first PCB board 200 for testing, it is only necessary to guide and position the second positioning pair with the corresponding first positioning pair to achieve assembly of the test board 300 and the first PCB board 200; when the test board 300 with chip 400 needs to be separated from the first PCB board 200 after testing, it is only necessary to separate the second positioning pair with the corresponding first positioning pair, the whole disassembly and assembly process is simple to operate.
[0040] Specifically, multiple first positioning pair plugs are arranged in an array on the first PCB board 200. Preferably, 24 first positioning pair plugs are arranged in a six-row, four-column manner, which is beneficial for tightly inserting 24 test boards 300 with chips 400 vertically at the upper part of the area of the first PCB board 200 located inside the heat insulation cover 100. This allows for testing of up to 24 chips 400 on a single test board 300 without expanding the internal space of the heat insulation cover 100.
[0041] The structure of the first positioning pair plugin and the second positioning pair plugin in this embodiment will be described in detail below.
[0042] In some embodiments, the first positioning pair is configured as a slot, and the second positioning pair is configured as a pin 310. When the test board 300 with chip 400 needs to be assembled onto the first PCB board 200 for testing, simply align the pin 310 with the corresponding slot vertically, and then insert the pin 310 downwards into the corresponding slot to achieve assembly of the test board 300 and the first PCB board 200. When the test board 300 with chip 400 needs to be separated from the first PCB board 200 after testing, simply pull the pin 310 out of the corresponding slot. The entire assembly and disassembly process is simple to operate.
[0043] In practical applications, the necessary electrical connections such as power and signals on the pin 310 enable the chip 400 to function properly.
[0044] In other embodiments, the first positioning pair is configured as a pin 310, and the second positioning pair is configured as a slot. When the test board 300 with chip 400 needs to be assembled onto the first PCB board 200 for testing, simply align the slot with the corresponding pin 310 vertically, and then insert the slot into the corresponding pin 310 to assemble the test board 300 onto the first PCB board 200. When the test board 300 with chip 400 needs to be separated from the first PCB board 200 after testing, simply pull the slot out of the corresponding pin 310. The entire assembly and disassembly process is simple.
[0045] like Figure 3 and Figure 5 As shown, in some embodiments, the test board 300 is provided with chips 400 on both sides along its thickness direction; the thickness of the chips 400 is usually about 1 mm. Therefore, the chips 400 are ultrasonically welded or soldered on both sides of the test board 300, which can not only make the space occupied by the single test board 300 with chips 400 in the vertical direction of the first PCB board 200 basically not increase, but also double the testing efficiency of the chips 400.
[0046] Specifically, at least two chips 400 are disposed on one side of the test board 300 along its thickness direction, such as... Figure 4 and Figure 5 As shown, preferably, two chips 400 are disposed on one side of the test board 300 along its thickness direction, and the two chips 400 are disposed at intervals in the vertical direction; compared with disposing of one chip 400 on one side of the test board 300 along its thickness direction, this embodiment can double the testing efficiency of the chip 400.
[0047] In specific applications, the number of chips 400 disposed on the same side of the test board 300 along its thickness direction is reasonably increased or decreased based on the vertical dimensions of the test board 300, the ratio of the vertical dimensions of the test board 300 to the vertical dimensions of the chips 400, and the vertical dimensions of the insulation cover 100. For example, in other embodiments, one, three, four, or other numbers of chips 400 are disposed on one side of the test board 300 along its thickness direction.
[0048] In practical applications, the heat insulation cover 100 can be integrated with the heat flow meter or set separately from it. In this embodiment, it is preferable to set the heat insulation cover 100 and the heat flow meter separately. The top of the heat insulation cover 100 is set as an arc portion 110, which arches in the direction away from the first PCB board 200. The middle part of the arc portion 110 is used to connect to the heat flow meter. Utilizing the upward arched shape of the arc portion 110, the heat flow meter delivers the controlled temperature airflow to the arc portion 110, which then diffuses from the center outwards along the inner wall of the arc portion 110 and gradually delivers it downwards, improving the temperature uniformity inside the heat insulation cover 100 and thus improving detection accuracy.
[0049] Specifically, a connecting pipe 120 is connected to the middle of the arc portion 110. The connecting pipe 120 is used to connect to the heat flow meter and to allow the airflow output by the heat flow meter to flow through it. The connecting pipe 120 facilitates the delivery of the controlled temperature airflow to the arc portion 110, which then diffuses from the center outwards along the inner wall of the arc portion 110.
[0050] In specific applications, in order to facilitate the observation of the status of the chip 400 by the test personnel during the test, some embodiments have a transparent viewing window on the heat insulation cover 100; other embodiments have a transparent cover on the heat insulation cover 100.
[0051] Specifically, at least a portion of the projection of the first PCB board 200 along the vertical direction does not fall on the heat insulation cover 100; by setting the cross-sectional area of the first PCB board 200 perpendicular to the vertical direction to be larger than the cross-sectional area of the heat insulation cover 100 perpendicular to the vertical direction, it is beneficial to improve the sealing of the space formed between the heat insulation cover 100 and the first PCB board 200.
[0052] The specific working process of the chip testing device in this embodiment is as follows:
[0053] like Figure 1As shown, 24 chips 400 are soldered onto one side of 24 test boards 300 along the thickness direction of the test boards 300. Then, the pins 310 of the 24 test boards 300 are inserted into the 24 slots located on the upper end of the first PCB board 200. Then, the heat insulation cover 100 is placed on the upper end of the first PCB board 200 to cover the 24 test boards 300 with the soldered chips 400. Then, the connecting pipe 120 is connected to the outlet of the heat flow meter. Finally, the heat flow meter is started to deliver the controlled temperature airflow to the heat insulation cover 100 to realize the test.
[0054] Although embodiments of the present invention have been described in conjunction with the accompanying drawings, those skilled in the art can make various modifications and variations without departing from the spirit and scope of the present invention, and all such modifications and variations fall within the scope defined by the appended invention.
Claims
1. A chip testing device applied to a heat flow meter, characterized in that, The test device comprises: A temperature insulation cover (100) for connecting a heat flow meter and receiving air flow output from the heat flow meter; A first PCB board (200) arranged at the lower end of the temperature insulation cover (100), wherein a region of the first PCB board (200) in the temperature insulation cover (100) is provided with a plurality of test boards (300), the test boards (300) are inserted into the first PCB board (200) along the vertical direction, and each test board (300) is provided with a chip (400) on at least one side along the thickness direction of the test board (300); the thickness direction of the test board (300) is perpendicular to the vertical direction.
2. The chip testing apparatus according to claim 1, wherein The test board (300) is arranged as a PCB board, and the chip (400) is welded to the test board (300).
3. A chip testing apparatus according to claim 1 or 2, wherein The first PCB board (200) is provided with a plurality of first positioning plug-in elements, and the test board (300) is provided with a second positioning plug-in element corresponding to the position of one of the first positioning plug-in elements, and the first positioning plug-in element and the second positioning plug-in element are inserted into each other.
4. The chip testing apparatus according to claim 3, wherein The first positioning plug-in element is arranged as a slot, and the second positioning plug-in element is arranged as a pin (310).
5. The chip testing apparatus according to claim 3, wherein The first positioning plug-in element is arranged as a pin (310), and the second positioning plug-in element is arranged as a slot.
6. The chip testing apparatus according to claim 3, wherein The plurality of first positioning plug-in elements are arranged in an array on the first PCB board (200).
7. The chip testing apparatus according to claim 1, wherein The test board (300) is provided with the chip (400) on both sides along the thickness direction of the test board (300).
8. The chip testing apparatus according to claim 1 or 7, wherein The test board (300) is provided with at least two chips (400) on one side along the thickness direction of the test board (300), and the plurality of chips (400) are arranged at intervals along the vertical direction.
9. The chip testing apparatus according to claim 1, wherein A connecting pipe (120) is communicated with the middle part of the top end of the temperature insulation cover (100), and the connecting pipe (120) is used for connecting the heat flow meter and for the air flow output from the heat flow meter to flow through.
10. The chip testing apparatus according to claim 1, wherein At least part of the projection of the first PCB board (200) along the vertical direction does not fall on the temperature insulation cover (100).