Universal module of connector

Abstract

The utility model provides a universal module of a connector. The universal module of the connector comprises a circuit board, a central processing unit, a plurality of memory slots and a power supply module which are arranged on the front surface of the circuit board, and a connector arranged on the back surface of the circuit board, the plurality of memory slots are respectively arranged on two opposite sides of the central processing unit, and the central processing unit is electrically connected with the plurality of memory slots; the power supply module is arranged on the other side of the central processing unit and located on the same side of all the memory slots; the connector and the power supply module are arranged oppositely; the connector is arranged opposite to the power supply module; the power supply module supplies power to the central processor and the memory slot. A memory bank is detachably arranged in the memory slot and is used for storing data transmitted by the central processing unit; the connector is used for being connected with a mainboard of external equipment, a power source is arranged on the mainboard, the module is connected with the power source through the connector, and the connector is detachably fixed to the mainboard. The universal module of the connector is convenient to disassemble and assemble and strong in adaptability.

Description

Technical Field

[0001] This utility model relates to the field of server system architecture technology, and in particular to a universal connector module. Background Technology

[0002] Currently, server systems are all developed around a specific processor platform, undergoing "custom" development. How to rapidly expand server coverage presents a challenge to the architecture of general-purpose servers. Almost simultaneously, while AI servers largely handle the training and inference of large models, artificial intelligence also places new demands on general-purpose servers, such as the data storage required for large model training. General-purpose servers also possess intelligent acceleration capabilities, enabling them to run large model inference services. In the long run, the disruption and restructuring of data centers by intelligent computing clusters is also driving general-purpose servers, like AI servers, towards high-density deployment.

[0003] Therefore, the decoupling approach emerged. Previously, AI servers faced competition from various acceleration chips. The OAM (Operations, Administration, and Maintenance) standard, developed by the Open Compute Project (OCP), employs decoupling and standardized modules, enabling rapid deployment and mass production of chips from different manufacturers. The OAM approach has inspired us. If general-purpose servers can break with market conventions and no longer design their system architecture around a single processor, but instead define processors, memory, and other components as standardized modules, they can be assembled like Lego bricks to meet the diverse needs of different customers and application scenarios. If general-purpose servers adopt a layered decoupling design, turning computing units into small modules, it could become the starting point for achieving high-density deployment of data center servers.

[0004] However, the aforementioned general-purpose servers can only achieve partial decoupling of components such as the chassis and backplane; the motherboard still needs to be customized for different processors. Meanwhile, a few existing processing modules on the market solder LPDDR (Low Power Double Data Rate) memory onto the printed circuit board, which is not conducive to chip functional testing, restricts memory parameter debugging, and limits flexible insertion and removal, resulting in poor flexibility and compatibility. Utility Model Content

[0005] To address the shortcomings of the existing technologies, this utility model proposes a universal connector module to solve the problem of poor flexibility and compatibility of existing universal connector modules.

[0006] To solve the above-mentioned technical problems, the present invention adopts the following technical solution:

[0007] This utility model provides a universal connector module, which includes a circuit board, a central processing unit (CPU) disposed on the front side of the circuit board, multiple memory slots and a power module, and a connector disposed on the back side of the circuit board. The multiple memory slots are respectively disposed on opposite sides of the CPU, and the CPU is electrically connected to the multiple memory slots. The power module is disposed on the other side of the CPU and is located on the same side of all the memory slots. The connector and the power module are arranged facing each other.

[0008] The power module provides power to the central processing unit and the memory slots respectively;

[0009] The memory slot is used to insert a memory module, and the memory module is used to store the data transmitted by the central processing unit.

[0010] The connector is used to connect to the motherboard of an external device. The motherboard has a power supply. The connector universal module is connected to the power supply through the connector. The connector is detachably fixed to the motherboard.

[0011] Preferably, the central processing unit includes at least two, all of which are arranged at intervals along the length of the memory slot, and the two central processing units are interconnected via a SerDes bus.

[0012] Preferably, the central processing unit comprises four, each of which is electrically connected to the other three central processing units via the Serdes bus.

[0013] Preferably, the plurality of memory slots are arranged side by side and parallel to each other.

[0014] Preferably, the power supply module includes two power supply modules, which are respectively disposed on the other opposite sides of the central processing unit, and each power supply module is located on the same side of all the memory slots; the connector includes two connectors, which are respectively disposed opposite to the two power supply modules.

[0015] Preferably, the connector general module further includes a heat sink, which is fixed to the surface of the central processing unit for heat dissipation.

[0016] Preferably, the connector is electrically connected to the motherboard via a communication bus.

[0017] Preferably, the communication bus is one or more combinations of PCIe bus, I3C bus, I2C bus and QSPI bus.

[0018] Preferably, the connector is an OAM connector.

[0019] Preferably, the circuit board is a flexible circuit board.

[0020] Compared with related technologies, in the embodiments of this utility model, the central processing unit (CPU), memory slots, power module, and connector are mounted on a circuit board. The power module is integrated into the circuit board, and multiple memory slots are respectively arranged on opposite sides of the CPU, with the CPU electrically connected to the multiple memory slots. The power module is located on the other side of the CPU and on the same side of all the memory slots. The connector is positioned directly opposite the power module. The power module supplies power to both the CPU and the memory slots. Memory modules are detachably installed in the memory slots and are used to store data transmitted by the CPU. The connector is used to connect to the motherboard of external devices, and the module is connected to the power supply on the motherboard via the connector, which is detachably fixed to the motherboard. This achieves full decoupling of general-purpose server components. For different CPUs and memory, only the universal connector module needs to be replaced. Furthermore, it allows for flexible insertion and removal of memory modules, which is very user-friendly for chip function testing and facilitates the debugging of memory parameters. Attached Figure Description

[0021] The present invention will now be described in detail with reference to the accompanying drawings. The above and other aspects of the present invention will become clearer and easier to understand through the detailed description in conjunction with the following drawings. In the drawings:

[0022] Figure 1 A module diagram of a universal connector module provided in an embodiment of this utility model;

[0023] Figure 2 A top view of the universal connector module provided in the embodiments of this utility model;

[0024] Figure 3 A bottom view of the universal connector module provided in the embodiments of this utility model;

[0025] Figure 4 A connection diagram of the central processing unit of the connector universal module provided in this embodiment of the utility model;

[0026] Figure 5 This is an assembly diagram of the universal connector module provided in an embodiment of the present utility model;

[0027] Figure 6 This is a disassembly diagram of the universal connector module provided in an embodiment of the present utility model.

[0028] Among them, 100 is a universal connector module, 1 is a circuit board, 2 is a medium-voltage processor, 3 is a memory slot, 4 is a power module, and 5 is a connector. Detailed Implementation

[0029] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application pertains; the terminology used herein in the specification of the application is for the purpose of describing particular embodiments only and is not intended to be limiting of the application; the terms "comprising" and "having," and any variations thereof, in the specification, claims, and foregoing drawings of this application, are intended to cover non-exclusive inclusion. The terms "first," "second," etc., in the specification, claims, or foregoing drawings of this application are used to distinguish different objects, not to describe a particular order.

[0030] In this document, the term "embodiment" means that a particular feature, structure, or characteristic described in connection with an embodiment may be included in at least one embodiment of this application. The appearance of this phrase in various places throughout the specification does not necessarily refer to the same embodiment, nor is it a separate or alternative embodiment mutually exclusive with other embodiments. It will be explicitly and implicitly understood by those skilled in the art that the embodiments described herein can be combined with other embodiments.

[0031] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0032] Please see Figures 1-3 As shown, this utility model embodiment provides a universal connector module 100, which includes a circuit board 1, a central processing unit 2 disposed on the front side of the circuit board 1, a plurality of memory slots 3 and a power module 4, and a connector 5 disposed on the back side of the circuit board 1; the plurality of memory slots 3 are respectively disposed on opposite sides of the central processing unit 2, and the central processing unit 2 is electrically connected to the plurality of memory slots 3; the power module 4 is disposed on the other side of the central processing unit 2 and located on the same side of all the memory slots 3; the connector 5 is disposed directly opposite the power module 4.

[0033] The power module 4 supplies power to both the central processing unit 2 and the memory slot 3. The memory slot 3 is used to insert memory modules, which store data transmitted by the central processing unit 2. The connector 5 is used to connect to the motherboard of an external device. The motherboard has a power supply, and the universal connector module 100 connects to the power supply via the connector 5. The connector 5 is detachably fixed to the motherboard. This design achieves full decoupling of general-purpose server components. For different central processing units and memory, only the universal connector module 5 needs to be replaced. It also allows for flexible insertion and removal of memory modules, which is very user-friendly for chip function testing and facilitates memory parameter debugging. Optionally, the power module 4 is integrated into the circuit board 1. Optionally, the universal connector module 100 also connects to the motherboard's data interface via the connector 5 to enable the transmission of other signals.

[0034] In this embodiment, the central processing unit 2 includes at least two, all of which are arranged at intervals along the length of the memory slot 3, and are interconnected via a SerDes bus. Multiple central processing units 2 provide high data processing efficiency.

[0035] In this embodiment, as Figure 4 As shown, the central processing unit 2 includes four (S0, S1, S2, S3), and each of the central processing units 2 is electrically connected to the other three central processing units 2 via the SerDes bus. The SerDes bus is a high-speed serial communication technology used to convert parallel data into high-speed serial signals for transmission and to restore it to parallel data at the receiving end. It is widely used in data centers, inter-chip communication, fiber optic networks, and other fields, thereby improving the transmission efficiency between multiple central processing units 2.

[0036] In this embodiment, multiple memory slots 3 are arranged side by side and parallel to each other. This facilitates the installation of memory modules and allows for flexible insertion and replacement.

[0037] In this embodiment, the power supply module 4 includes two modules, which are respectively disposed on opposite sides of the central processing unit 2. Each power supply module 4 is located on the same side of all the memory slots 3. The connector 5 includes two modules, which are respectively disposed opposite to the two power supply modules 4. The multiple power supply modules 4 facilitate a stable power output, ensuring stable power supply to the central processing unit 2 and memory slots 3 on the circuit board. The two connectors 5 are respectively disposed opposite to the two power supply modules 4 and are connected to the motherboard via the two connectors 5, resulting in a good assembly effect.

[0038] In this embodiment, the connector 5 general module also includes a heat sink (not shown in the figure), which is fixed to the surface of the central processing unit 2 to dissipate heat from the central processing unit 2, thereby improving the service life of the central processing unit 2.

[0039] In this embodiment, the connector 5 is electrically connected to the motherboard via a communication bus.

[0040] In this embodiment, the communication bus is one or a combination of PCIe, I3C, I2C, and QSPI buses. PCIe (Peripheral Component Interconnect Express) is a high-speed serial computer expansion bus standard. I3C (Improved Inter-Integrated Circuit) is a simple, low-cost, bidirectional two-wire synchronous serial bus. It offers higher speed and lower power consumption. It supports in-band interrupts, enabling the target device to notify the controller of interrupts, eliminating the need for separate general-purpose input / output (GPIO) interrupts for each target device.

[0041] The I2C (Inter-Integrated Circuit) bus is a synchronous, bidirectional, half-duplex, two-wire serial interface bus. It transmits data bit by bit using a simple two-wire format (serial clock line SCL and serial data line SDA); it supports multiple devices connecting to the same bus, and multiple ICs can act as controllers.

[0042] The QSPI (Queued SPI) bus is an extension of the SPI bus, providing more efficient serial peripheral communication; it supports queued transmission, enabling the transmission of multiple data at once, thus improving transmission efficiency.

[0043] Optionally, the communication bus may include not only the various buses mentioned above, but also others, which will not be described in detail here.

[0044] In this embodiment, connector 5 is an OAM connector. In the electronics and communications fields, an OAM connector typically refers to an interface connector that integrates operation, administration, and maintenance functions. OAM connectors support adaptive straight-through and crossover network cable modes, enabling communication between the device and the network management computer.

[0045] In this embodiment, the circuit board 1 is a flexible circuit board.

[0046] The disassembly and assembly principle of this utility model is as follows;

[0047] like Figure 5 As shown, during assembly, one or more central processing units 2 and heat sinks are mounted on circuit board 1 to form a module. Multiple memory modules are inserted into memory slots 3 on circuit board 1. Power module 4 is mounted on the front of circuit board 1, and connector 5 is mounted on the back of circuit board 1, thus forming a general-purpose connector 5 module. The connector 5 of the general-purpose connector 5 module is then attached to the motherboard of an external device to complete the assembly application.

[0048] like Figure 6 As shown, when disassembly or replacement is required, all memory modules are removed from memory slot 3, the heatsink is removed, the CPU 2 is removed, and the module is unplugged from the host to complete the disassembly process. This achieves full decoupling of general-purpose server components. For different CPUs and memory, only the corresponding modules need to be replaced, making it convenient to use.

[0049] It should be noted that the various embodiments described above with reference to the accompanying drawings are only illustrative of the present invention and not intended to limit its scope. Those skilled in the art should understand that any modifications or equivalent substitutions made to the present invention without departing from its spirit and scope should be covered within the scope of the present invention. Furthermore, unless the context otherwise requires, singular terms include plural forms, and vice versa. Additionally, unless specifically stated otherwise, all or part of any embodiment may be used in conjunction with all or part of any other embodiment.

Claims

1. A connector universal module characterized by comprising: The connector universal module comprises a circuit board, a central processing unit arranged on the front surface of the circuit board, a plurality of memory slots and a power module, and a connector arranged on the back surface of the circuit board; the plurality of memory slots are arranged on opposite sides of the central processing unit respectively, and the central processing unit is electrically connected with the plurality of memory slots; the power module is arranged on the other side of the central processing unit and on the same side of all the memory slots; the connector is arranged opposite to the power module; The power module is used for supplying power to the central processing unit and the memory slots respectively; The memory slots are used for inserting memory sticks, and the memory sticks are used for storing data transmitted by the central processing unit; The connector is used for connecting the mainboard of an external device, the mainboard is provided with a power supply, the connector universal module is connected with the power supply through the connector, and the connector is detachably fixed on the mainboard.

2. The connector family module of claim 1, wherein, The central processing unit comprises at least two, all the central processing units are arranged at intervals along the length direction of the memory slots, and two central processing units are interconnected through a Serdes bus.

3. The connector family module of claim 2, wherein, The central processing unit comprises four, and each central processing unit is electrically connected with the other three central processing units through the Serdes bus.

4. The connector family module of claim 1, wherein, The plurality of memory slots are arranged side by side and parallel to each other.

5. The connector family module of claim 1, wherein, The power module comprises two, and the two power modules are arranged on the other opposite sides of the central processing unit respectively, each power module is located on the same side of all the memory slots; the connector comprises two, and the two connectors are arranged opposite to the two power modules respectively.

6. The connector family module of claim 1, wherein, The connector universal module further comprises a heat sink, and the heat sink is fixed on the surface of the central processing unit and used for heat dissipation of the central processing unit.

7. The connector family module of claim 1, wherein, The connector is electrically connected with the mainboard through a communication bus.

8. The connector family module of claim 7, wherein, The communication bus is one or a combination of PCIe bus, I3C bus, I2C bus and QSPI bus.

9. The connector family module of claim 1, wherein, The model of the connector is OAM connector.

10. The connector family of claim 1, wherein, The circuit board is a flexible circuit board.

Images