Wave soldering equipment
By monitoring the PCB temperature in real time and adjusting the amount of solder wave flow in the wave soldering equipment, the problem of solder overflow was solved, and the soldering quality and efficiency were improved.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-12-13
- Publication Date
- 2026-03-06
AI Technical Summary
How to avoid solder overflow during wave soldering, especially the problem of molten solder overflowing from the back side to the front side of the PCB board.
By installing a temperature detection device in the wave soldering equipment, the temperature of the PCB board is monitored in real time, and the speed of the vane pump is controlled according to the temperature value to adjust the amount of solder wave flowing out, ensuring that the soldering temperature is within the standard range.
It effectively reduces solder overflow, improves soldering quality and efficiency, and ensures the stability and reliability of the soldering process.
Smart Images
Figure CN223978835U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to the field of welding equipment technology, and in particular to a wave soldering equipment. Background Technology
[0002] Wave soldering refers to the process of placing a PCB directly in contact with hot liquid solder to achieve mechanical and electrical connections between components and the pins of the printed circuit board. It is a common process in electronics manufacturing.
[0003] In actual production, many companies experience solder overflow during wave soldering, where some of the molten solder used in wave soldering overflows from the back of the PCB onto the front. There are various reasons for this, such as incorrect wave soldering equipment settings; excessively large openings on the PCB for electronic component soldering; deformation of the PCB mount or the PCB itself. Therefore, preventing solder overflow during wave soldering is a pressing problem that needs to be solved. Utility Model Content
[0004] The purpose of this invention is to provide a wave soldering device that monitors the temperature of the PCB board in real time and reduces the occurrence of solder overflow.
[0005] To achieve the above objectives, this utility model provides the following technical solution:
[0006] A wave soldering apparatus includes: a base; a guide rail disposed on the base for conveying a PCB board to be soldered, the guide rail being inclined from bottom to top along the conveying direction of the PCB board; a wave soldering furnace disposed within the base and below the guide rail for preheating and soldering the PCB board, the wave soldering furnace having a preheating platform and a soldering platform disposed along the conveying direction of the PCB board, the soldering platform having a solder wave pipe, a solder wave outlet and a vane pump, the solder wave outlet being disposed within the solder wave pipe and close to the guide rail, the vane pump being disposed below the solder wave outlet, the vane pump having a vane, and the vane pump being used to drive the vane to rotate to make a solder wave in the solder wave pipe flow out along the solder wave outlet; and a control device communicatively connected to the vane pump and the temperature detection device for controlling the rotation speed of the vane pump according to the temperature of the PCB board.
[0007] Preferably, the temperature detection device includes: an image acquisition module for acquiring a first thermal imaging image corresponding to the PCB board on the welding station, the first thermal imaging image including a plurality of first image units; a temperature value acquisition module, communicatively connected to the image acquisition module, for obtaining a plurality of first temperature values corresponding to the plurality of first image units respectively; and a comparison module, communicatively connected to the temperature value acquisition module, for comparing the plurality of first temperature values with a welding standard temperature value respectively and generating a first comparison result, wherein when the first comparison result is that the first temperature value is greater than the welding standard temperature value, the control device reduces the speed of the vane pump; when the first comparison result is that the first temperature value is less than the welding standard temperature value, the control device increases the speed of the vane pump.
[0008] Preferably, it further includes a display unit for displaying the first thermal imaging image and displaying a first temperature value higher than the welding standard temperature value on the first thermal imaging image according to the first comparison result.
[0009] Preferably, the display unit is further configured to display a first temperature value lower than the welding standard temperature value on the first thermal imaging image based on the first comparison result.
[0010] Preferably, the image acquisition module is further configured to acquire a second thermal imaging image corresponding to the PCB board on the preheating platform, the second thermal imaging image including a plurality of second image units, the temperature value acquisition module is further configured to obtain a plurality of second temperature values corresponding to the plurality of second image units respectively, the comparison module is further configured to compare the plurality of second temperature values with a preheating standard temperature value respectively, and generate a second comparison result, and the control device is configured to control the temperature of the preheating platform according to the second comparison result.
[0011] Preferably, when the second comparison result is that the second temperature value is greater than the preheating standard temperature value, the control device lowers the temperature of the preheating platform; when the second comparison result is that the second temperature value is less than the preheating standard temperature value, the control device raises the temperature of the preheating platform.
[0012] Compared with existing technologies, the beneficial effects of this invention are as follows: The control device can monitor the temperature of the PCB board on the soldering station. When the first temperature value is greater than the standard soldering temperature value, the speed of the vane pump is reduced to decrease the amount of solder wave output; when the first temperature value is less than the standard soldering temperature value, the speed of the vane pump is increased to increase the amount of solder wave output, preventing soldering defects caused by insufficient solder wave output. Through this method, the occurrence of solder overflow can be greatly reduced, improving the soldering quality and efficiency of wave soldering equipment, and effectively addressing the shortcomings of the prior art. Attached Figure Description
[0013] Figure 1 This is a schematic diagram of the internal structure of a wave soldering equipment;
[0014] Figure 2 This is a schematic diagram of the internal structure of the welding station;
[0015] Figure 3 This is a schematic diagram showing the connection between the temperature detection device and the control device. Detailed Implementation
[0016] To make the technical problems, technical solutions, and beneficial effects of this utility model clearer, the present utility model will be further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the present utility model and are not intended to limit the present utility model.
[0017] It should be noted that when a component is referred to as being "fixed to" or "set on" another component, it can be directly on or indirectly on that other component. When a component is referred to as being "connected to" another component, it can be directly connected to or indirectly connected to that other component.
[0018] It should be understood that the terms "length", "width", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", and "outer" indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this utility model.
[0019] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of this utility model, "a plurality of" means two or more, unless otherwise explicitly specified.
[0020] See Figures 1-3 This invention provides a wave soldering device, including a base 100, a guide rail 200, a wave soldering furnace, a temperature detection device 500, and a control device 600. The base 100 adopts a robust steel structure to ensure the stability and durability of the equipment. The guide rail 200 is used to transport the PCB board to be soldered, and the guide rail 200 is inclinedly arranged inside the base 100, inclined from bottom to top along the transport direction of the PCB board. As a preferred embodiment, the guide rail 200 is made of stainless steel, and the surface is specially treated to reduce friction and ensure the smooth passage of the PCB board. The inclined guide rail 200 allows for control of the soldering time between the PCB board and the wave soldering surface by adjusting the tilt angle. The larger the tilt angle, the shorter the contact time between each solder joint and the wave soldering surface, and the shorter the soldering time; the smaller the tilt angle, the longer the contact time between each solder joint and the wave soldering surface, and the longer the soldering time. This helps the solder surface to separate from the PCB more quickly and return to the solder pot, reducing bridging and encapsulation costs.
[0021] Next, a wave soldering oven is installed inside the base and below the guide rails for preheating and soldering the PCB board. Inside the wave soldering oven, along the PCB board conveying direction, there is a preheating table 300 and a soldering table 400. The soldering table 400 is equipped with a solder wave channel 401, a solder wave outlet 402, and a vane pump 403. The solder wave outlet 402 is located within the solder wave channel 401 and close to the guide rail 200. The vane pump 403 is located below the solder wave outlet 402 and has fan blades. The vane pump 403 drives the fan blades to rotate, causing the solder wave in the solder wave channel 401 to flow out along the solder wave outlet 402. The vane pump 403 uses a brushless motor to improve efficiency and lifespan. Then, a temperature detection device 500 is installed above the wave soldering oven to detect the temperature of the PCB board inside the wave soldering oven. The temperature detection device 500 includes an image acquisition module 501 for acquiring a first thermal imaging image corresponding to the PCB board on the soldering station 400, the first thermal imaging image including multiple first image units; a temperature value acquisition module 502, communicatively connected to the image acquisition module, for obtaining multiple first temperature values corresponding to the multiple first image units; and a comparison module 503, communicatively connected to the temperature value acquisition module, for comparing the multiple first temperature values with a soldering standard temperature value and generating a first comparison result. Finally, a control device 600 is communicatively connected to the vane pump 403 and the temperature detection device 500, thereby controlling the rotational speed of the vane pump 403 according to the first comparison result. When the first comparison result indicates that the first temperature value is greater than the soldering standard temperature value, the control device 600 reduces the rotational speed of the vane pump 403; when the first comparison result indicates that the first temperature value is less than the soldering standard temperature value, the control device 600 increases the rotational speed of the vane pump 403. The control device 600 is communicatively connected to the temperature detection device 500 to receive the first comparison result from the comparison module.
[0022] In other words, the control device 600 can monitor the temperature of the PCB board on the soldering station 400. When the first temperature value is greater than the standard soldering temperature value, the speed of the vane pump 403 is reduced to decrease the solder wave and reduce the amount of solder flowing out. When the first temperature value is less than the standard soldering temperature value, the speed of the vane pump 403 is increased to increase the amount of solder flowing out, preventing soldering defects caused by insufficient solder waves. Through the above methods, the occurrence of solder overflow can be greatly reduced, the soldering quality and efficiency of the wave soldering equipment can be improved, and the shortcomings of the prior art can be effectively solved.
[0023] It should be noted that the standard welding temperature value can be a numerical range. For example, temperature values within 300°-350° can be considered to meet the requirements of the standard welding temperature value. When the first temperature value is greater than 350°, it is considered that the first temperature value is greater than the standard welding temperature value; when the first temperature value is less than 300°, it is considered that the first temperature value is less than the standard welding temperature value.
[0024] In a preferred embodiment, the temperature detection device 500 is a thermal imager, which integrates an image acquisition module 501, a temperature value acquisition module 502, and a comparison module 503. The thermal imager, also known as an infrared thermal imager, is a high-tech device that uses the principle of infrared thermal radiation to convert the surface temperature of a target object into a visual image. It can detect and record the heat distribution of a target. Its basic principle is to utilize the infrared radiation generated by the object, and through specialized sensors and software, convert this information into a visual thermal image, reflecting the distribution of heat on the object's surface.
[0025] In a preferred embodiment, the wave soldering equipment further includes a display unit for displaying a first thermal imaging image. Based on a first comparison result, the display unit shows a first temperature value on the first thermal imaging image that is higher than the standard welding temperature value, and also shows a first temperature value on the first thermal imaging image that is lower than the standard welding temperature value, based on the first comparison result. The display unit employs a high-resolution liquid crystal display screen, capable of clearly displaying the first thermal imaging image, and marking areas on the image with different colors according to the first comparison result, indicating areas higher than the standard welding temperature value. For example, areas higher than the standard temperature can be marked in red, while areas lower than or equal to the standard temperature are marked in green. This intuitive color-coding system allows the operator to quickly identify hot spots during the soldering process and make timely adjustments.
[0026] In a preferred embodiment, the image acquisition module 501 is further configured to acquire a second thermal imaging image corresponding to the PCB board on the preheating stage 300. The second thermal imaging image includes multiple second image units. The temperature value acquisition module 502 is further configured to obtain multiple second temperature values corresponding to the multiple second image units. The comparison module is further configured to compare the multiple second temperature values with a preheating standard temperature value and generate a second comparison result. The control device 600 is configured to control the temperature of the preheating stage 300 according to the second comparison result. For example, if the second comparison result indicates that the second temperature value is greater than the preheating standard temperature value, the control device 600 lowers the temperature of the preheating stage 300; if the second comparison result indicates that the second temperature value is less than the preheating standard temperature value, the control device raises the temperature of the preheating stage 300. In this way, the temperature of the PCB board on the preheating stage 300 can be monitored to ensure that the temperature of the PCB board on the preheating stage 300 meets the relevant preheating standard temperature value.
[0027] Similarly, the preheating standard temperature value can be a numerical range, such as a temperature value within 200°-250°, which can be considered to meet the requirements of the preheating standard temperature value. When the second temperature value is greater than 250°, it is considered that the second temperature value is greater than the preheating standard temperature value; when the second temperature value is less than 200°, it is considered that the second temperature value is less than the preheating standard temperature value.
[0028] In a preferred embodiment, the display unit is further configured to display, on the second thermal imaging image, a second temperature value that is lower than the welding standard temperature value and a second temperature value that is higher than the welding standard temperature value, based on the second comparison result.
[0029] Based on the disclosure and teachings of the above specification, those skilled in the art can make changes and modifications to the above embodiments. Therefore, this utility model is not limited to the specific embodiments disclosed and described above, and some modifications and changes to this utility model should also fall within the protection scope of the claims of this utility model. Furthermore, although some specific terms are used in this specification, these terms are only for convenience of explanation and do not constitute any limitation on this utility model.
Claims
1. A wave soldering apparatus, characterized by, The application relates to a wave-soldering device, which comprises: a base (100); a guide rail (200) arranged on the base (100) and used for conveying a PCB to be soldered, the guide rail (200) being arranged in an inclined manner from bottom to top along the conveying direction of the PCB; a wave-soldering furnace arranged in the base (100) and below the guide rail (200) and used for preheating and soldering the PCB, the wave-soldering furnace being provided with a preheating table (300) and a soldering table (400) along the conveying direction of the PCB, the soldering table (400) being provided with a solder wave pipe (401), a solder wave outlet (402) and a vane pump (403), the solder wave outlet (402) being arranged on the solder wave pipe (401) and close to the guide rail (200), the vane pump (403) being arranged below the solder wave outlet (402), the vane pump (403) being provided with a vane, and the vane pump (403) being used for driving the vane to rotate and make a solder wave in the solder wave pipe (401) flow out along the solder wave outlet (402); a temperature detection device (500) arranged above the wave-soldering furnace and used for detecting the temperature of the PCB in the wave-soldering furnace; and a control device (600) in communication connection with the vane pump (403) and the temperature detection device (500) and used for controlling the rotating speed of the vane pump according to the temperature of the PCB.
2. The wave soldering apparatus according to claim 1, characterized in that The temperature detection device comprises: an image collection module (501) used for collecting a first thermal imaging image corresponding to the PCB on the soldering table, the first thermal imaging image comprising a plurality of first image units; a temperature value acquisition module (502) in communication connection with the image collection module (501) and used for obtaining a plurality of first temperature values corresponding to the plurality of first image units respectively; and a comparison module (503) in communication connection with the temperature value acquisition module (502) and used for comparing the plurality of first temperature values with a soldering standard temperature value respectively and generating a first comparison result, wherein when the first comparison result is that the first temperature value is greater than the soldering standard temperature value, the control device reduces the rotating speed of the vane pump (403); and when the first comparison result is that the first temperature value is less than the soldering standard temperature value, the control device increases the rotating speed of the vane pump (403).
3. The wave soldering apparatus according to claim 2, characterized in that The application further comprises a display unit used for displaying the first thermal imaging image and displaying the first temperature value higher than the soldering standard temperature value on the first thermal imaging image according to the first comparison result.
4. The wave soldering apparatus according to claim 3, characterized in that The display unit is further used for displaying the first temperature value lower than the soldering standard temperature value on the first thermal imaging image according to the first comparison result.
5. The wave soldering apparatus according to claim 2, characterized by The image collecting module (501) is further configured to collect a second thermal imaging image corresponding to the PCB on the preheating table, the second thermal imaging image comprising a plurality of second image units; the temperature value obtaining module (502) is further configured to obtain a plurality of second temperature values corresponding to the plurality of second image units respectively; the comparison module (503) is further configured to compare the plurality of second temperature values with a preheating standard temperature value respectively, and generate a second comparison result; and the control device (600) is configured to control the temperature of the preheating table according to the second comparison result.
6. The wave soldering apparatus according to claim 5, characterized in that When the second comparison result is that the second temperature value is greater than the preheating standard temperature value, the control device (600) reduces the temperature of the preheating table. When the second comparison result is that the second temperature value is less than the preheating standard temperature value, the control device (600) increases the temperature of the preheating table.