LED lamp bead capable of emitting light from side face

Abstract

The utility model provides a side light emitting LED lamp bead, which comprises a substrate, a plurality of electrodes respectively arranged on the substrate, and an LED chip connected with the plurality of electrodes, the plurality of electrodes are respectively welded with a circuit board, the end part of each electrode is provided with a short contact surface and a long avoiding surface which are mutually connected, the short contact surface is contacted with the circuit board, the long avoiding surface is not contacted with the circuit board, and the LED chip is connected with the short contact surface. And the electrode is electrically connected with the circuit board through the soldering tin flowing to the long avoiding surface through the short contact surface. According to the LED lamp bead capable of emitting light from the side face, the soldering tin flowing from the short contact faces to the long avoiding faces on the electrodes is electrically connected with the circuit board, the influence of burrs on soldering tin climbing is reduced, the welding yield of the LED lamp bead is improved, the phenomenon that the burrs are generated due to cutting is reduced through the arrangement of the transition faces, and the service life of the LED lamp bead is prolonged. And the welding yield of the LED lamp beads is further improved.

Description

Technical Field

[0001] This utility model relates to the field of LED lamp bead technology, specifically to a side-emitting LED lamp bead. Background Technology

[0002] Side-emitting LED chips are semiconductor light sources that emit light from the side of the chip through a special structural design. Unlike traditional direct-emitting LEDs with their vertically arranged chips, side-emitting LED chips use silver paste or eutectic bonding technology to fix the LED chip to the substrate, with the light-emitting surface parallel to the substrate. A schematic diagram of the internal structure of a side-emitting LED chip is shown below. Figure 1 As shown, by setting electrode one and electrode two on the front side of the substrate, and connecting the LED chip on electrode two to electrode one via gold wire, the LED chip is activated by applying current to electrode one and electrode two on the back side of the substrate, respectively. The LED chip is then encapsulated using an epoxy resin lens to improve light emission. LED chip manufacturing often involves encapsulating multiple LED chips onto a substrate to form an LED chip module. See [link to documentation]. Figure 2 This is a schematic diagram of an LED chip packaging module, which is cut into individual LED chips along the cutting line using a cutting device.

[0003] However, in existing LED chips, the electrodes 1 and 2 often exhibit defects due to the ductility of the metal after cutting. Figure 3 The burrs shown can cause solder balls to form, leading to poor solder joints. This results in poor reliability of electrode one and electrode two on the circuit board, and consequently, a high defect rate in LED chip soldering. This solution addresses this technical problem. Utility Model Content

[0004] To address the shortcomings of existing technologies, this invention provides a side-emitting LED bead. By providing a short contact surface and a long clearance surface sequentially connected at the other end of electrode one, the short contact surface contacts the circuit board, while the long clearance surface does not. Solder flowing from electrode one through the short contact surface to the long clearance surface electrically connects to the circuit board, reducing the impact of burrs on solder creep and improving the yield rate of LED bead soldering. Furthermore, the transition surface reduces burr formation caused by cutting, further improving the yield rate of LED bead soldering.

[0005] To achieve the above objectives, the technical solution adopted by this utility model is as follows: a side-emitting LED bead, comprising a substrate, an electrode one and an electrode two respectively disposed on the substrate, and an LED chip respectively connected to the electrode one and the electrode two. The electrode one and the electrode two are respectively soldered to a circuit board. The end of the electrode one is provided with a short contact surface and a long clearance surface connected in sequence. The short contact surface contacts the circuit board, and the long clearance surface does not contact the circuit board. The electrode one is electrically connected to the circuit board through the solder flowing from the short contact surface to the long clearance surface.

[0006] The LED bead is a multi-color LED bead, and the substrate is also provided with multiple electrodes, the end structure of each electrode being the same as that of electrode one.

[0007] Two short contact surfaces are provided, and the long avoidance surface is connected and disposed between the two short contact surfaces.

[0008] Two long avoidance surfaces are provided, and one short contact surface is provided. The two ends of the short contact surface are respectively connected to the two long avoidance surfaces in an inverted trapezoidal shape.

[0009] Both the short contact surface and the long avoidance surface are provided, and the length of the short contact surface is less than the length of the long avoidance surface.

[0010] A transition surface is provided between the short contact surface and the outer surface of the first electrode.

[0011] The transition surface is an inclined plane.

[0012] The transition surface is an arc surface.

[0013] The inner sides of both electrode one and electrode two are covered by the outer side of the substrate, and the bottom of both electrode one and electrode two are connected to the circuit board.

[0014] A transition surface is provided between the side and bottom of the first electrode, and a transition surface is provided between the side and bottom of the second electrode.

[0015] One or more technical solutions proposed in this application have at least the following technical effects:

[0016] (1) By setting a short contact surface and a long clearance surface connected in sequence at the other end of electrode one, the short contact surface contacts the circuit board, and the long clearance surface does not contact the circuit board. Electrode one is electrically connected to the circuit board by the solder flowing from the short contact surface to the long clearance surface. This reduces the direct contact area between electrode one and the circuit board. By the solder creep, electrode one is fully in contact with the circuit board, further reducing the influence of burrs on solder creep and improving the yield of LED lamp bead welding. Since the long clearance side does not directly contact the circuit board, even if the position of the cutting line is deviated, it can be welded to the circuit board through the short contact side. Electrode one is welded to the circuit board by the solder creep phenomenon, and the welding of LED lamp beads is stable and reliable.

[0017] (2) When cutting the LED lamp bead packaging module, the two transition surfaces form a groove, that is, the intersection of electrode one and electrode two with the cutting line is thinner, which reduces the phenomenon of burrs caused by cutting, thereby reducing the impact of burrs on the solder climbing to electrode one and electrode two. In particular, when the transition surface is set to arc shape, the solder is well welded between electrode one and the circuit board, avoiding the generation of solder balls, and further improving the yield of LED lamp bead welding.

[0018] (3) After the LED beads are cut, there are transition surfaces between the sides and bottom of the first and second electrodes. When the LED beads are soldered to the circuit board, there are fewer burrs at the bottom of the two surfaces formed by bending. When soldering, the soldering of the first and second electrodes is good, which further improves the reliability and yield of LED bead soldering. The above design greatly improves the yield of LED bead soldering. Attached Figure Description

[0019] To more clearly illustrate the technical solutions in the embodiments of this utility model or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on the structures shown in these drawings without creative effort.

[0020] Figure 1 This is a schematic diagram of the internal structure of a side-emitting LED bead;

[0021] Figure 2 This is a schematic diagram of an existing LED bead packaging module;

[0022] Figure 3 This is a schematic diagram of the existing LED chip welding structure;

[0023] Figure 4 This is a structural schematic diagram of Embodiment 1 of the present invention;

[0024] Figure 5 This is a utility model Figure 4 A partially enlarged structural diagram of part A;

[0025] Figure 6 This is a schematic diagram of the cutting line structure of this utility model;

[0026] Figure 7 This is a utility model Figure 9 A partially enlarged structural diagram of part B;

[0027] Figure 8 This is a schematic diagram of the LED lamp bead welding structure in Embodiment 1 of this utility model;

[0028] Figure 9 This is a utility model Figure 8 A partially enlarged structural diagram of section C;

[0029] Figure 10 This is a schematic diagram of the welding state of the LED lamp bead particles of this utility model;

[0030] Figure 11 This is a schematic diagram of the long avoidance surface structure in Embodiment 2 of this utility model;

[0031] Figure 12 This is a schematic diagram of the structure of the long avoidance surface in Embodiment 3 of this utility model;

[0032] Figure 13 This is a schematic diagram of the structure of the long avoidance surface in Embodiment 4 of this utility model;

[0033] Figure 14 This is a schematic diagram of the transition surface in Embodiment 5 of this utility model;

[0034] Figure 15 This is a schematic diagram of the LED lamp bead structure in Embodiment Six of this utility model.

[0035] In the figure: 1. Substrate; 2. Electrode 1; 21. Short contact surface; 22. Long clearance surface; 23. Transition surface; 3. Electrode 2; 4. LED chip; 5. Gold wire; 6. Circuit board; 7. Lens; 101. Cutting line; 102. Burr; 103. Solder.

[0036] The realization of the purpose, functional features and advantages of this utility model will be further explained in conjunction with the embodiments and with reference to the accompanying drawings. Detailed Implementation

[0037] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the scope of protection of the present utility model.

[0038] It should be noted that if the embodiments of this utility model involve directional indicators (such as up, down, left, right, front, back, etc.), the directional indicators are only used to explain the relative positional relationship and movement of the components in a specific posture. If the specific posture changes, the directional indicators will also change accordingly.

[0039] Furthermore, if the embodiments of this utility model involve descriptions such as "first" or "second," these descriptions are for descriptive purposes only and should not be construed as indicating or implying their relative importance or implicitly specifying the number of technical features indicated. Therefore, a feature defined with "first" or "second" may explicitly or implicitly include at least one of those features. Additionally, the use of "and / or" or "and / or" throughout the text includes three parallel solutions. For example, "A and / or B" includes solution A, solution B, or a solution where both A and B are satisfied simultaneously. Furthermore, the technical solutions of the various embodiments can be combined with each other, but this must be based on the ability of those skilled in the art to implement them. When the combination of technical solutions is contradictory or impossible to implement, it should be considered that such a combination of technical solutions does not exist and is not within the scope of protection claimed by this utility model.

[0040] Example 1: See Figures 1-10 A side-emitting LED bead includes a substrate 1, an electrode 2 and an electrode 3 respectively disposed on the substrate 1, and an LED chip 4 connected to the electrode 2 and the electrode 3 respectively. The electrode 2 and the electrode 3 are respectively soldered to a circuit board 6. The end of the electrode 2 is provided with a short contact surface 21 and a long clearance surface 22 connected in sequence. The short contact surface 21 contacts the circuit board 6, and the long clearance surface 22 does not contact the circuit board 6. The solder 103 flowing from the short contact surface 21 to the long clearance surface 22 of the electrode 2 is electrically connected to the circuit board 6.

[0041] It is understandable that a transition surface 23 is provided between the short contact surface 21 and the outer surface of the electrode 2, that is, a transition surface 23 is provided between the side of the electrode 2 that does not contact the substrate 1 and the short contact surface 21, thereby reducing the thickness of the short contact surface 21 and reducing or avoiding burrs 102 caused by the ductility of the metal during cutting.

[0042] Specifically, there are two short contact surfaces 21, and a long clearance surface 22 is connected between the two short contact surfaces 21. Through the two short contact surfaces 21, liquid solder from both locations can be simultaneously lifted onto the long clearance surface 22, making the LED chip soldering more efficient and reliable.

[0043] It is understandable that the long clearance surface 22 is composed of multiple planes connected in sequence, or it can be an arc-shaped surface. The long clearance surface 22 is connected to the short contact surface 21 through its edge, and the rest of the part does not directly contact the circuit board 6.

[0044] Furthermore, the inner sides of electrode 1 2 and electrode 2 3 are both covered on the outer side of substrate 1, and the bottom of electrode 1 2 and the bottom of electrode 2 3 are both connected to circuit board 6, so that electrode 1 2 and electrode 2 3 are connected to circuit board 6 through side solder 103, making the LED beads more firmly and reliably fixed.

[0045] A transition surface 23 is provided between the side and bottom of electrode 1 2 and electrode 2 3. The transition surface 23 is a slope, which reduces the burrs 102 generated by cutting electrode 1 2 and electrode 2 3, and makes the welding effect of electrode 1 2 and electrode 2 3 better.

[0046] More specifically, in this embodiment, a gold wire 5 is connected between the LED chip 4 and one end of the electrode 2, and a lens 7 for encapsulating the LED chip 4 is provided on one side of the substrate 1.

[0047] The specific working process and principle of this utility model:

[0048] See Figure 6 and Figure 7 The LED chip packaging module is cut into individual LED chips along cutting line 101 using a cutting device. See [link / reference]. Figure 7 When cutting the LED chip packaging module, the two transition surfaces 23 form grooves, meaning the intersection of electrode 1 2 and electrode 2 3 with the cutting line 101 is thinner, reducing the phenomenon of burrs 102 caused by cutting. This reduces the impact of burrs 102 on the solder 103 climbing to electrode 1 2 and electrode 2 3, especially when the transition surface 23 is set to an arc shape. See [reference needed]. Figure 8 This is a schematic diagram of the LED bead welding structure in this embodiment. Figure 8 and Figure 9 Solder 103 provides a good solder joint between electrode 2 and circuit board 6, avoiding the formation of solder balls.

[0049] See Figure 4 and Figure 5By providing a short contact surface 21 and a long clearance surface 22 connected in sequence at the other end of electrode 2, the short contact surface 21 contacts the circuit board 6, while the long clearance surface 22 does not contact the circuit board 6. Electrode 2 connects to the circuit board 6 via the solder 103 flowing from the short contact surface 21 to the long clearance surface 22. This reduces the direct contact area between electrode 2 and circuit board 6. By allowing solder to climb, electrode 2 makes complete contact with circuit board 6, further reducing the impact of burrs 102 on the climbing of solder 103 and further improving the yield rate of LED lamp bead welding.

[0050] Furthermore, since the long clearance edge does not directly contact the circuit board 6, even if the position of the cutting line 101 is deviated, it can be soldered to the circuit board 6 through the short contact edge, and the electrode 2 is soldered to the circuit board 6 through the solder creep phenomenon, so the soldering of the LED beads is stable and reliable.

[0051] See Figure 7 After the LED beads are cut, transition surfaces 23 are provided between the sides and bottoms of electrodes 2 and 3. When the LED beads are soldered onto the circuit board 6, the burrs 102 at the bottom of the two surfaces formed by bending are reduced, resulting in good solder adhesion for electrodes 2 and 3 during soldering. This further improves the reliability and yield of LED bead soldering. The above design significantly improves the yield of LED bead soldering. See details... Figure 10 A schematic diagram of the welding state of LED lamp bead particles in this utility model.

[0052] Example 2: Based on Example 1, see... Figure 11 There are two long avoidance surfaces 22 and one short contact surface 21. The two ends of the short contact surface 21 are connected to the two long avoidance surfaces 22 respectively in an inverted trapezoidal shape.

[0053] The short contact surface 21 has a smaller direct base area with the circuit board 6, and the angle between the long clearance surface 22 and the short contact surface 21 is adjustable, so that the solder 103 can quickly and stably climb onto the long clearance surface 22, thereby making the solder 103 on the electrode 12 more full.

[0054] Example 3: Based on Example 1, see [link to Example 1] Figure 12 Both a short contact surface 21 and a long avoidance surface 22 are provided, and the length of the short contact surface 21 is less than the length of the long avoidance surface 22.

[0055] The processing of the long clearance surface 22 in electrode 2 is simpler, and the angle between the long clearance surface 22 and the short contact surface 21 is adjustable, which reduces the impact of the burrs 102 on the short contact surface 21 on the welding of electrode 2.

[0056] Example 4: Based on Example 1, see [link to Example 1] Figure 13Electrode 2 is provided with two interconnected long clearance surfaces 22, and two short contact surfaces 21 are respectively connected to the long clearance surfaces 22. Liquid solder is rapidly raised to the long clearance surfaces 22 through the two short contact surfaces 21, thereby firmly soldering electrode 2 to circuit board 6.

[0057] It should be noted that even if the solder 103 does not completely climb up to cover the long clearance surface 22, the soldering condition of electrode 2 can still be good, stable and reliable. Figure 13 The two dashed lines representing solder 103 indicate two different soldering contour states, both of which ensure reliable soldering of electrode 2.

[0058] Example 5: Based on Example 1, see [link to Example 1] Figure 14 The transition surface 23 is an arc surface.

[0059] The smooth transition between the short contact surface 21 and the transition surface 23 avoids the generation of burrs 102, thereby resulting in a higher welding yield of electrode 2.

[0060] Example 6: Based on Examples 1 to 5, the LED beads are multi-color LED beads, and multiple electrodes are also provided on the substrate 1. The end structure of each electrode is the same as that of electrode 2.

[0061] See Figure 15 When the LED bead is a tri-color LED bead, there will be 6 electrodes on the substrate 1. Each electrode is provided with a short contact surface 21, a long clearance surface 22 and a transition surface 23 as described in the above embodiment, so that each electrode is well soldered, thereby improving the LED bead soldering yield.

[0062] The above are merely exemplary embodiments of this utility model and do not limit the patent scope of this utility model. Any equivalent structural transformations made based on the technical concept of this utility model and the contents of the specification and drawings of this utility model, or direct / indirect applications in other related technical fields, are included within the patent protection scope of this utility model.

Claims

1. A side-emitting LED lamp bead, comprising a substrate (1), an electrode one (2) and an electrode two (3) respectively arranged on the substrate (1), and an LED chip (4) connected with the electrode one (2) and the electrode two (3) respectively, characterized in that, The electrode one (2) and the electrode two (3) are welded with the circuit board (6) respectively, the end of the electrode one (2) is provided with short contact surface (21) and long avoiding surface (22) which are connected in turn, the short contact surface (21) contacts with the circuit board (6), the long avoiding surface (22) does not contact with the circuit board (6), the electrode one (2) is connected with the circuit board (6) through the solder tin (103) on the long avoiding surface (22) flowed from the short contact surface (21).

2. The side-emitting LED lamp bead according to claim 1, characterized in that, The LED lamp bead is a multi-color LED lamp bead, a plurality of electrodes are further arranged on the substrate (1), and the end structure of each electrode is same as that of the electrode one (2).

3. The side emitting LED lamp bead of claim 1, wherein, The short contact surface (21) is provided with two, and the long avoiding surface (22) is arranged between the two short contact surfaces (21).

4. The side emitting LED lamp pearl according to claim 1, characterized in that, The long avoiding surface (22) is provided with two, and the short contact surface (21) is provided with one, and the two ends of the short contact surface (21) are connected with the two long avoiding surfaces (22) respectively to form an inverted trapezoid.

5. The side emitting LED lamp pearl according to claim 1, characterized in that, The short contact surface (21) and the long avoiding surface (22) are provided with one, and the length of the short contact surface (21) is less than that of the long avoiding surface (22).

6. The side emitting LED lamp pearl of claim 1, wherein, The short contact surface (21) and the outside of the electrode one (2) are provided with a transition surface (23).

7. The side emitting LED lamp pearl according to claim 6, characterized in that, The transition surface (23) is an inclined surface.

8. The side emitting LED lamp pearl according to claim 6, characterized in that, The transition surface (23) is an arc surface.

9. The side emitting LED lamp pearl according to claim 6, characterized in that, The inside of the electrode one (2) and the electrode two (3) is covered on the outside of the substrate (1), and the bottom of the electrode one (2) and the bottom of the electrode two (3) are connected with the circuit board (6).

10. The side emitting LED lamp bead of claim 9, wherein, The transition surface (23) is arranged between the side and the bottom of the electrode one (2), and the transition surface (23) is arranged between the side and the bottom of the electrode two (3).

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