Green A-type display device compatible with night vision imaging system

Abstract

The utility model discloses a green A-type display device compatible with a night vision imaging system, which belongs to the field of display device manufacturing, and comprises a display device which is an LED (light-emitting diode) light-emitting device and comprises a black surface-mounted support, a chip set, a positive electrode bonding pad and a negative electrode bonding pad, the chip set comprises a cyan chip and an emerald green chip, and the positive electrode bonding pad and the negative electrode bonding pad are positioned on the black surface-mounted support. Performing circuit connection on the black patch type bracket and the chip set based on a bonding wire; a high-heat-resistance packaging silica gel layer covers the interior of a black patch type support and the area where a chip set is located, silicate fluorescent powder with the weight ratio of 0.5%-2% is mixed in the high-heat-resistance packaging silica gel layer, after the silicate fluorescent powder is slightly excited by a cyan chip, green light emitted by the silicate fluorescent powder is compounded with a combination generated by the chip set, spectral components are further adjusted, and the spectral effect is improved. Therefore, the chromaticity coordinate of the LED device is ensured to accord with the NVIS green A standard. According to the utility model, the definition of the display device is improved.

Description

Technical Field

[0001] This utility model belongs to the field of display device manufacturing, specifically relating to a green A-type display device compatible with night vision imaging systems and its manufacturing method. Background Technology

[0002] LEDs (light-emitting diodes), as the fourth generation of green lighting sources, have been widely used in various fields such as lighting, display, and signal indication due to their high energy efficiency, long lifespan, and environmental friendliness. In military and civilian fields, night vision imaging systems (NVIS) are crucial for enhancing vision in low-light or no-light environments.

[0003] A similar prior art is disclosed in Chinese patent application CN102522291A, which discloses a plasma display screen and a method for manufacturing the same. The plasma display screen includes: a first substrate; a second substrate disposed opposite to and sealed together with the first substrate; an addressing electrode disposed on the side of the second substrate facing the first substrate; a first dielectric insulating layer covering the addressing electrode; a bus electrode disposed on the side of the first dielectric insulating layer facing the first substrate; a second dielectric insulating layer covering the bus electrode; and a barrier disposed on the side of the second dielectric insulating layer facing the first substrate and covered by the first substrate.

[0004] The existing display devices described above consume a lot of power and may not be suitable for use in extreme temperature or vibration environments. Therefore, there is a need for a green Type-A display device and its manufacturing method that is compatible with night vision imaging systems. This display device can provide natural light output during the day and is compatible with night vision systems at night, ensuring clear visual effects in any environment. Utility Model Content

[0005] To address the aforementioned problems, this invention provides a green A-type display device compatible with night vision imaging systems, thereby resolving the issues in the prior art.

[0006] To achieve the aforementioned utility model objective, this utility model proposes a green A-type display device compatible with night vision imaging systems. The display device is an LED light-emitting device, comprising: a surface mount bracket; a chipset, a positive electrode pad, and a negative electrode pad located on the surface mount bracket; the chipset includes a cyan chip and a green chip; and the surface mount bracket and the chipset are electrically connected based on bonding wires.

[0007] Furthermore, the two types of chips within the chipset are connected in series.

[0008] Furthermore, the cyan chip has a size of 12*13mil, a power consumption of 15.5-16.9mw, and a wavelength range of 495-500nm.

[0009] Furthermore, the emerald green chip has a size of 8*10mil, a power consumption of 6-7mw, and a wavelength range of 538-542nm.

[0010] Furthermore, the material of the patch-type bracket is pure black PPA material.

[0011] Furthermore, the interior of the black patch-type bracket and the area where the chipset is located are covered with a high heat-resistant encapsulation silicone layer.

[0012] Furthermore, the high heat-resistant encapsulating silicone layer contains 0.5%-2% by weight of silicate phosphor.

[0013] Furthermore, the silicate phosphor has a dominant wavelength of 534.2 nm, an error range of ±0.2 nm, a peak wavelength of 518 nm, a half-width of 62 nm, and an excitation wavelength of 400-475 nm.

[0014] Furthermore, the bonding wire is made of 99.99% metal wire.

[0015] Furthermore, the spectral intensity of the patch-type support conforms to the NVIS standard.

[0016] Compared with the prior art, the beneficial effects of this utility model are at least as follows:

[0017] This invention utilizes a 495-500nm cyan chip, a 538-542nm emerald green chip, a black surface mount bracket, green phosphor, and potting compound to form a display device. By combining different spectra, weakening the spectral absorption of the bracket, and combining the spectral composition of the green pigment, an LED device conforming to the NVIS Green A standard is manufactured. Since the LED light source uses a composite spectrum of multiple materials and all domestically produced raw materials available in the market, it facilitates mass production of the product design, reduces the cost of the light source, and adopts the integrated structure bracket of existing LED surface mount devices. The production process and procedures are universal with existing lighting devices, making the entire product manufacturing process simpler, cheaper, and more reliable. Attached Figure Description

[0018] Figure 1 This is a schematic diagram of the structure of a green A-type display device compatible with a night vision imaging system according to this utility model;

[0019] Figure 2 This is the NVIS Green A standard drawing of this utility model;

[0020] In the diagram: A1: Cyan chip, A2: Emerald green chip, B1: Positive electrode pad, B2: Negative electrode pad, J1: Connecting bonding wire, J2: Connecting bonding wire, J3: Connecting bonding wire, C1: Black support body. Detailed Implementation

[0021] To make the objectives, technical solutions, and advantages of this utility model clearer, the present utility model will be further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the present utility model and are not intended to limit the present utility model.

[0022] It is understood that the terms "first," "second," etc., used in this application may be used herein to describe various elements, but unless otherwise specified, these elements are not limited by these terms. These terms are used only to distinguish one element from another. For example, without departing from the scope of this application, a first script may be referred to as a second script, and similarly, a second script may be referred to as a first script.

[0023] like Figure 1 As shown, a green Type A display device compatible with night vision imaging systems is disclosed. The display device is an LED light-emitting device, comprising:

[0024] C1 surface mount bracket;

[0025] The chip set, positive pad B1, and negative pad B2 are located on the surface mount bracket C1. The chip set includes a cyan chip A1 and a green chip A2. The surface mount bracket and the chip set are connected by bonding wires J1, J2, and J3.

[0026] Specifically, such as Figure 1 The diagram shows the structure of an LED light-emitting device. The surface mount bracket C1 is the main structure of the entire LED display device. It not only supports the LED chip and pads, but may also contain mechanical structures for fixing the entire device. The positive pad B1 and the negative pad B2 are fixed to the black surface mount bracket C1 by welding or pasting. The positive pad B1 is connected to the green LED chip A2 through the bonding wire J1, and the negative pad B2 is connected to the cyan LED chip A1 through the bonding wire J1. The cyan chip A1 and the green chip A2 are connected by J3.

[0027] The two types of chips within the chipset are connected in series.

[0028] The cyan chip A1 has a size of 12*13mil, a power consumption of 15.5-16.9mw, and a wavelength range of 495-500nm. The emerald green chip A2 has a size of 8*10mil, a power consumption of 6-7mw, and a wavelength range of 538-542nm.

[0029] Specifically, the two different specifications of LED chips are both relatively small in physical size, which can consume less power while providing the same brightness. 495-500nm is cyan light, while 538-542nm is emerald green light. The selection of these wavelength ranges is crucial for achieving specific spectral output and color mixing.

[0030] A method for manufacturing a green Type-A display device compatible with a night vision imaging system, the method comprising the following steps:

[0031] A patch-type support C1 is made of pure black PPA material. Based on the fact that pure black PPA material absorbs all visible spectra, cyan chip A1 and emerald green chip A2 are mounted on the black patch-type support C1. The negative and positive terminals of the chip sets are connected to the positive and negative terminals of the black patch-type support C1 through bonding wires J1 and J2. The chip sets are connected to each other through bonding wire J3.

[0032] Specifically, a black surface mount bracket C1 is made of pure black PPA (polypropylene) material. PPA is chosen for its good heat resistance, chemical stability, and mechanical strength. The black bracket can absorb all wavelengths, reducing unnecessary light scattering and reflection, thereby weakening the spectral intensity and ensuring that the light emitted by the LED device meets the requirements of the NVIS Green A standard. Cyan chip A1 and emerald green chip A2 are mounted on the black surface mount bracket. These two chips emit light with wavelengths of 495-500nm and 538-542nm respectively, corresponding to the NVIS Green A standard. The positive and negative terminals of the chip group are connected to the positive and negative terminals of the bracket through bonding wires J1, J2, and J3 to ensure that the current can flow correctly through the chip and make the chip emit light.

[0033] Obtain the spectral information of cyan chip A1 and emerald green chip A2. The spectral information includes the wavelength range and intensity distribution of the light emitted by each chip. Combine the two spectral information to obtain different spectral combinations. Determine the chromaticity coordinates of the LED display device corresponding to each spectral combination. Select the spectral combination that conforms to the NVIS Green A standard as the standard combination.

[0034] Specifically, a spectrometer or other measuring equipment is used to obtain the spectral information of the cyan chip A1 and the emerald green chip A2. This information includes the wavelength range and intensity distribution of the light emitted by each chip. By adjusting the ratio of the luminous intensity of the two chips or using optical filters, the light from the cyan chip A1 and the emerald green chip A2 are combined. For example, combination 1: directly adding the spectra of the cyan and emerald green chips, resulting in a spectral range between 480nm and 550nm; combination 2: mixing 70% cyan light and 30% emerald green light, resulting in a spectrum biased towards cyan but containing emerald green components, with the specific wavelength range and intensity distribution depending on the mixing ratio; combination 3: alternating between cyan and emerald green light over time, for example, alternating between 1 second of cyan light and 1 second of emerald green light, this mode produces a flickering effect when displayed continuously. For each combination, a colorimeter or colorimetric analysis software is needed to determine its chromaticity coordinates. These coordinates are compared with the NVIS Green A standard to determine which combinations meet the standard. Combinations that meet the standards will be selected as standard combinations for use in LED display devices to ensure they have appropriate color performance under night vision conditions.

[0035] The interior of the black surface mount bracket C1 and the area where the chipset is located are covered with a high heat-resistant encapsulation silicone layer.

[0036] Specifically, a layer of high heat-resistant silicone is evenly applied inside the bracket and in the area where the chipset is located. After application, the silicone needs to undergo a curing process, which usually involves heating to a certain temperature to harden the silicone and form a stable protective layer. The main function of the high heat-resistant encapsulation silicone layer is to protect the LED chipset from physical damage and the effects of environmental factors (such as moisture, dust, etc.), thereby improving the durability of the LED display device and making it more resistant to external impacts and environmental changes.

[0037] The high heat-resistant encapsulation silicone layer contains 0.5%-2% silicate phosphor by weight. The silicate phosphor has a dominant wavelength of 534.2nm, an error range of ±0.2nm, a peak wavelength of 518nm, a half-width of 62nm, and an excitation wavelength of 400-475nm. After the silicate phosphor is weakly excited by the cyan chip, the emitted green light is combined with the standard combination generated by the chipset to further adjust the spectral composition, so as to ensure that the chromaticity coordinates of the LED device meet the NVIS Green A standard.

[0038] Specifically, the high heat-resistant encapsulating silicone layer is a silicone layer used to cover and protect the LED chipset. It has high heat resistance, can withstand the heat generated when the LED is working, and protects the LED from physical damage. When the silicate phosphor is excited by light of a specific wavelength, it emits light of a specific wavelength. In this case, the silicate phosphor is used to adjust the spectral output of the LED display device. The use of this phosphor can enhance the performance of the LED display device, such as increasing brightness, improving color quality, and increasing visual comfort. The mixing ratio of 0.5%-2% by weight is to precisely control the spectrum emitted by the LED display device to meet specific visual or technical standards, such as the NVIS Green A standard, without changing other properties of the silicone layer.

[0039] The bonding wire is made of 99.99% metal wire.

[0040] Specifically, bonding wires are tiny metal wires used in microelectronic packaging to connect different components. They are responsible for transmitting current in LED display devices to ensure that the LED chips can work properly. 99.99% wire indicates that the purity of the bonding wire material is very high, which means that the impurity content in the wire is extremely low. High-purity wire can provide better conductivity and more stable electrical characteristics.

[0041] The cyan chip A1 and the emerald green chip A2 were tested separately until the LED device formed by the two chips met the NVIS standard.

[0042] Specifically, after the LED display device is packaged, each LED chip needs to be tested to ensure that it meets the design specifications and performance standards. Testing verifies whether the optical and electrical performance of each chip meets expectations. This includes: spectral testing: measuring the spectrum emitted by the LED chip to ensure its wavelength, color, and intensity meet the requirements of the NVIS Green A standard; brightness testing: checking whether the brightness of the LED chip reaches the specified level to ensure visibility and clarity in various applications; color consistency: ensuring that the color of the light emitted by the LED chip is within an acceptable range to meet color reproduction requirements; and electrical characteristics: testing the electrical parameters of the LED chip, such as voltage, current, and power consumption.

[0043] The spectral intensity of the black patch-type bracket C1 conforms to the NVIS standard.

[0044] Specifically, selecting a black material that can absorb a specific spectrum and meets NVIS standards to make the bracket ensures that the LED display device can provide consistent spectral output in various environments, which is important for both military and civilian lighting equipment.

[0045] It should be understood that although the steps in the flowcharts of the various embodiments of this utility model are shown sequentially according to the arrows, these steps are not necessarily executed in the order indicated by the arrows. Unless explicitly stated herein, there is no strict order restriction on the execution of these steps, and they can be executed in other orders. Moreover, at least some steps in each embodiment may include multiple sub-steps or multiple stages. These sub-steps or stages are not necessarily completed at the same time, but can be executed at different times. The execution order of these sub-steps or stages is not necessarily sequential, but can be performed alternately or in turn with other steps or at least a portion of the sub-steps or stages of other steps.

[0046] The technical features of the above embodiments can be combined in any way. For the sake of brevity, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0047] The above embodiments only illustrate several implementation methods of this utility model, and their descriptions are relatively specific and detailed, but they should not be construed as limiting the scope of this utility model patent. It should be noted that those skilled in the art can make several modifications and improvements without departing from the concept of this utility model, and these all fall within the protection scope of this utility model.

[0048] The above are merely preferred embodiments of the present utility model and are not intended to limit the present utility model. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of the present utility model should be included within the protection scope of the present utility model.

Claims

1. A green A-scope display device compatible with a night vision imaging system, characterized in that, The display device is an LED light emitting device, comprising: a patch support; a chip set, a positive electrode pad and a negative electrode pad on the patch support, the chip set containing a cyan chip and a turquoise chip, the patch support and the chip set being electrically connected by a bonding wire; an area inside the patch support and where the chip set is located is covered with a high-heat-resistant packaging silica gel layer, 2% of silicate fluorescent powder by weight is mixed in the high-heat-resistant packaging silica gel layer, the main wavelength of the silicate fluorescent powder is 534.2nm, the error range is ±0.2nm, the peak wavelength is 518nm, the half-wave width is 62nm, and the excitation wavelength is 400-475nm; the cyan chip A1 and the turquoise chip A2 are mixed at 70% cyan light and 30% turquoise light.

2. The green A-mode display device compatible with a night vision imaging system according to claim 1, wherein, The connection mode of the two chips in the chip set is series connection.

3. The green A-type display device compatible with a night vision imaging system according to claim 2, characterized in that, The size of the cyan chip is 12*13mil, the power consumption is 15.5-16.9mw, and the wavelength range is 495-500nm.

4. The green A-mode display device compatible with a night vision imaging system according to claim 2, wherein, The size of the turquoise chip is 8*10mil, the power consumption is 6-7mw, and the wavelength range is 538-542nm.

5. The green A-mode display device compatible with a night vision imaging system according to claim 1, wherein, The material of the patch support is pure black PPA material.

6. The green A-mode display device compatible with a night vision imaging system according to claim 1, wherein, The bonding wire is made of 99.99% metal wire.

7. A green A-mode display device compatible with a night vision imaging system according to any one of claims 1-5, characterized in that, The spectral intensity of the patch support meets the NVIS standard.

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