Heat dissipation substrate for gallium nitride-based device

Abstract

The utility model discloses a heat dissipation substrate for a gallium nitride-based device, which comprises a base, a stand column fixedly arranged on the top surface of the base, a placing frame fixedly arranged at one end of the stand column far away from the base, and a processing assembly arranged below the placing frame. A motor is started, a rotating rod fixedly installed at the output end of the motor rotates along with the motor, and a gear fixedly installed at the end of the rotating rod rotates along with the motor, so that the heat of the bottom of the placing frame is evenly dissipated, and due to the fact that the outer wall of a rotating disc and the inner side of a limiting block are arranged in a sliding mode, and the interior of the rotating disc and the outer wall of a gear ring are fixedly arranged in a sleeving mode, under limitation of the rotating disc, the rotating disc rotates; the rotating gear drives the gear ring engaged with the rotating gear to rotate, so that the gear ring drives the turntable to rotate on the top surface of the base, and the cooling fan fixedly mounted on the top surface of the turntable rotates along with the turntable, thereby uniformly cooling the bottom of the placement rack and providing a constant environment for the gallium nitride-based device.

Description

Technical Field

[0001] This utility model relates to the field of semiconductor device technology, specifically to a heat dissipation substrate for gallium nitride-based devices. Background Technology

[0002] Gallium nitride (GaN)-based devices are semiconductor devices made from gallium nitride (GaN) as the base material. Gallium nitride is a wide-bandgap semiconductor material with excellent properties such as high electron mobility, high saturation electron velocity, and high breakdown electric field. These properties enable GaN-based devices to perform well in applications requiring high frequency, high power, and high temperature. Heat dissipation substrates for GaN-based devices are materials used to provide physical support and heat dissipation during the manufacturing process of GaN-based semiconductor devices.

[0003] As disclosed in Chinese Patent CN113421865A, a heat dissipation substrate for gallium nitride-based devices and its preparation method are used. The remote epitaxial growth technique can grow gallium nitride van der Waals thin films with perfect interfaces on ultrathin graphene layers. This is because epitaxial growth of gallium nitride van der Waals thin films through thick graphene layers not only consumes a lot of growth materials, but also may cause the substrate to bend, crack, or delaminate when the temperature drops sharply. This is not conducive to large-scale industrial production. Therefore, using single-layer graphene can not only improve the yield of the substrate, but also has a lower cost.

[0004] While this structure can improve substrate performance, it is not convenient for rapid heat dissipation. Therefore, we propose a heat dissipation substrate for gallium nitride-based devices that can quickly dissipate heat and improve the manufacturing environment. Utility Model Content

[0005] The purpose of this invention is to provide a heat dissipation substrate for gallium nitride-based devices to solve the problems mentioned in the background art.

[0006] To achieve the above objectives, the present invention provides the following technical solution: a heat dissipation substrate for gallium nitride-based devices, comprising a base, a column fixedly mounted on the top surface of the base, a placement frame fixedly mounted on the end of the column away from the base, and a processing assembly disposed below the placement frame, the processing assembly including a heat dissipation assembly disposed above the base, and a cooling assembly disposed on the outside of the heat dissipation assembly.

[0007] Preferably, the heat dissipation assembly includes a bracket fixedly mounted on the top surface, a motor fixedly mounted on the outer wall of the bracket, a rotating rod fixedly mounted on the output end of the motor, a gear fixedly mounted on the end of the rotating rod away from the motor, a gear ring meshing on the outer wall of the gear, a turntable fixedly sleeved on the outer wall of the gear ring, a limit block fixedly mounted on the top surface of the base, and a cooling fan fixedly mounted on the top surface of the turntable.

[0008] Preferably, the cooling assembly includes an anti-slip disc fitted inside the placement frame, a support plate fixedly installed on the outer wall of the base, a cooling box fixedly installed on the top surface of the support plate, and a cooling pipe connected to the outer wall of the cooling box.

[0009] Preferably, there are four cooling fans distributed in a circle around the center of the turntable. With the cooling fans in place, the gallium nitride-based devices above the mounting rack can be cooled.

[0010] Preferably, the outer wall of the turntable is slidably disposed with respect to the inner side of the limiting block. There are four limiting blocks, which are distributed around the center of the turntable. Under the restriction of the limiting blocks, the gear drives the turntable to rotate stably through the gear ring.

[0011] Preferably, there are two cooling boxes, symmetrically distributed around the center line of the top surface of the base, which can deliver cooling water to the inside of the cooling pipes under the constraint of the cooling boxes.

[0012] Preferably, the top surface of the anti-slip disk is coated with an anti-slip coating, and the outer wall of the anti-slip disk is fitted inside the placement rack, so that the gallium nitride-based device is stably placed under the restriction of the anti-slip disk.

[0013] Compared with the prior art, the beneficial effects of this utility model are:

[0014] 1. The heat dissipation substrate for this gallium nitride-based device is composed of a heat dissipation component. When heat dissipation is required for the gallium nitride-based device, it is placed on the top surface of the anti-slip disk, and the cooling fan is turned on to blow air onto the bottom of the placement rack. To ensure uniform heat dissipation at the bottom of the placement rack, the motor is started, and the rotating rod fixedly installed at its output end rotates accordingly. The gear fixedly installed at the end of the rotating rod also rotates. Since the outer wall of the turntable slides against the inner side of the limiting block, and the inside of the turntable is fixedly fitted with the outer wall of the gear ring, under its restriction, the rotating gear drives the gear ring meshing with it to rotate accordingly, so that the gear ring drives the turntable to rotate on the top surface of the base. The cooling fan fixedly installed on the top surface of the turntable rotates accordingly, uniformly dissipating heat at the bottom of the placement rack and providing a constant environment for the gallium nitride-based device. This structure uniformly dissipates heat at the bottom of the placement rack through a self-rotating and rotating cooling fan.

[0015] 2. The heat dissipation substrate of the gallium nitride-based device is composed of a cooling component. When heat dissipation of the gallium nitride-based device is required, it is placed on the top surface of the anti-slip plate. Under the restriction of the anti-slip plate, the gallium nitride-based device can be prevented from sliding. At this time, the cooling box delivers cooling water to the cooling pipe to dissipate heat at the contact point between the anti-slip plate and the gallium nitride-based device. When the cooling pipe returns to a warm temperature, another cooling box is activated to pump the water inside the cooling pipe and cool the water through the other cooling box. The first cooling box then delivers cooling water into the cooling pipe, and the water is repeatedly cooled at the bottom of the anti-slip plate. Attached Figure Description

[0016] Figure 1This is a three-dimensional view of the structure of this utility model.

[0017] Figure 2 This is a three-dimensional cross-sectional view of the structure of this utility model.

[0018] Figure 3 This is a diagram of the heat dissipation component structure of this utility model.

[0019] Figure 4 This is an exploded view of the heat dissipation component of this utility model.

[0020] Figure 5 This is a diagram of the cooling component structure of this utility model.

[0021] Figure 6 This is a partial schematic diagram of the cooling component of this utility model.

[0022] In the diagram: 1. Base; 2. Column; 3. Placement rack; 4. Processing component; 41. Heat dissipation component; 42. Cooling component; 411. Bracket; 412. Motor; 413. Rotating rod; 414. Gear; 415. Gear ring; 416. Turntable; 417. Limiting block; 418. Cooling fan; 421. Anti-slip disc; 422. Support plate; 423. Cooling box; 424. Cooling pipe. Detailed Implementation

[0023] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments of the present utility model. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments.

[0024] Examples of the embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and intended to explain the present invention, and should not be construed as limiting the present invention.

[0025] In the description of this utility model, it should be understood that the terms "center", "longitudinal", "transverse", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc., indicating the orientation or positional relationship are based on the orientation or positional relationship shown in the accompanying drawings, and are only for the convenience of describing this utility model and simplifying the description, and are not intended to indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this utility model.

[0026] In this utility model, unless otherwise explicitly specified and limited, the terms "installation," "connection," "joining," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model according to the specific circumstances.

[0027] Example 1: A preferred embodiment of the heat dissipation substrate for gallium nitride-based devices provided by this utility model is as follows: Figures 1 to 6 As shown: A heat dissipation substrate for gallium nitride-based devices includes a base 1;

[0028] A column 2 is fixedly installed on the top surface of the base 1;

[0029] A placement rack 3 is fixedly installed at the end of the column 2 away from the base 1;

[0030] The processing component 4 is located below the placement rack 3. The processing component 4 includes a heat dissipation component 41 located above the base 1. The heat dissipation component 41 includes a bracket 411 fixedly installed on the top surface. A motor 412 is fixedly installed on the outer wall of the bracket 411. A rotating rod 413 is fixedly installed at the output end of the motor 412. A gear 414 is fixedly installed at the end of the rotating rod 413 away from the motor 412. A gear ring 415 meshes with the outer wall of the gear 414. A turntable 416 is fixedly sleeved on the outer wall of the gear ring 415. A limit block 417 is fixedly installed on the top surface of the base 1. A cooling fan 418 is fixedly installed on the top surface of the turntable 416.

[0031] In this embodiment, when heat dissipation of gallium nitride-based devices is required, they are placed on the top surface of the anti-slip disk 421, and the cooling fan 418 is started to blow air to the bottom of the placement rack 3 for heat dissipation. To ensure uniform heat dissipation at the bottom of the placement rack 3, the motor 412 is started, and the rotating rod 413 fixedly installed at its output end rotates accordingly. The gear 414 fixedly installed at the end of the rotating rod 413 also rotates accordingly. Since the outer wall of the turntable 416 slides against the inner side of the limiting block 417, and the inside of the turntable 416 is fixedly sleeved with the outer wall of the gear ring 415, under its restriction, the rotating gear 414 drives the gear ring 415 that meshes with it to rotate accordingly, so that the gear ring 415 drives the turntable 416 to rotate on the top surface of the base 1. The cooling fan 418 fixedly installed on the top surface of the turntable 416 rotates accordingly, uniformly dissipating heat at the bottom of the placement rack 3 and providing a constant environment for the gallium nitride-based devices. This structure uniformly dissipates heat at the bottom of the placement rack 3 through the self-rotating and rotating cooling fan 418.

[0032] Furthermore, there are four cooling fans 418, which are distributed in a circle around the center of the turntable 416. Under the constraint of the cooling fans 418, the gallium nitride-based devices above the mounting bracket 3 can be cooled.

[0033] Furthermore, the outer wall of the turntable 416 is slidably set to the inner side of the limiting block 417. There are four limiting blocks 417, which are distributed around the center of the turntable 416. Under the restriction of the limiting blocks 417, the gear 414 drives the turntable 416 to rotate stably through the gear ring 415.

[0034] Example 2: Based on Example 1, a preferred embodiment of the heat dissipation substrate for gallium nitride-based devices provided by this utility model is as follows: Figures 1 to 6 As shown: The cooling assembly 42 includes an anti-slip disc 421 fitted inside the placement rack 3, a support plate 422 fixedly installed on the outer wall of the base 1, a cooling box 423 fixedly installed on the top surface of the support plate 422, and a cooling pipe 424 connected to the outer wall of the cooling box 423.

[0035] In this embodiment, when heat dissipation of gallium nitride-based devices is required, they are placed on the top surface of the anti-slip disk 421. Under the restriction of the anti-slip disk 421, the gallium nitride-based devices can be prevented from sliding. At this time, the cooling box 423 delivers cooling water to the cooling pipe 424 to dissipate heat at the contact point between the anti-slip disk 421 and the gallium nitride-based devices. When the cooling pipe 424 returns to a warm temperature, another cooling box 423 is activated to pump the water inside the cooling pipe 424 and cool the water through the other cooling box 423. The first cooling box 423 then delivers cooling water into the cooling pipe 424, and the water is repeatedly cooled at the bottom of the anti-slip disk 421.

[0036] Furthermore, there are two cooling boxes 423, which are symmetrically distributed around the center line of the top surface of the base 1. Under the constraint of the cooling boxes 423, cooling water can be delivered to the inside of the cooling pipes 424.

[0037] In addition, the top surface of the anti-slip disk 421 is coated with an anti-slip coating, and the outer wall of the anti-slip disk 421 is fitted inside the placement rack 3. Under the restriction of the anti-slip disk 421, the gallium nitride-based device is placed stably.

[0038] The above are merely illustrative embodiments of this utility model and are not intended to limit the scope of this utility model. Any equivalent changes and modifications made by those skilled in the art without departing from the concept and principles of this utility model should fall within the protection scope of this utility model. Furthermore, it should be noted that the components of this utility model are not limited to the overall application described above. Each technical feature described in the specification can be used individually or in combination as needed. Therefore, this utility model naturally covers other combinations and specific applications related to the points of this utility model.

Claims

1. A heat dissipation substrate for gallium nitride-based devices, comprising a base (1); The top surface of the base (1) is fixedly provided with a stand (2); The end of the stand (2) away from the base (1) is fixedly provided with a rack (3); and a processing assembly (4) arranged below the placing rack (3), characterized in that: The processing assembly (4) comprises a heat dissipation assembly (41) arranged above the base (1), and the outer side of the heat dissipation assembly (41) is provided with a cooling assembly (42).

2. The heat dissipating substrate for a gallium nitride based device according to claim 1, wherein: The heat dissipation assembly (41) comprises a support (411) fixedly installed on the top surface, an electric motor (412) fixedly installed on the outer wall of the support (411), a rotating rod (413) fixedly installed on the output end of the electric motor (412), a gear (414) fixedly installed on the end of the rotating rod (413) away from the electric motor (412), a gear ring (415) engaged with the outer wall of the gear (414), a rotating disc (416) fixedly sleeved on the outer wall of the gear ring (415), a limiting block (417) fixedly installed on the top surface of the base (1), and a heat dissipation fan (418) fixedly installed on the top surface of the rotating disc (416).

3. The heat dissipation substrate for a gallium nitride based device according to claim 1, wherein: The cooling assembly (42) comprises an anti-skid disc (421) sleeved in the rack (3), a support plate (422) fixedly installed on the outer wall of the base (1), a cooling box (423) fixedly installed on the top surface of the support plate (422), and a cooling pipe (424) communicated on the outer wall of the cooling box (423).

4. The heat dissipating substrate for a gallium nitride based device according to claim 2, wherein: The number of heat dissipation fans (418) is four, which are distributed in the circumferential direction of the center of the rotating disc (416).

5. The heat spreader substrate for a gallium nitride based device of claim 2, wherein: The outer wall of the rotating disc (416) is slidably arranged with the inner side of the limiting block (417), and the number of limiting blocks (417) is four, which are distributed in the circumferential direction of the center of the rotating disc (416).

6. The heat dissipating substrate for a gallium nitride based device according to claim 3, wherein: The number of cooling boxes (423) is two, which are distributed in the center line of the top surface of the base (1) in a symmetrical manner.

7. The heat dissipating substrate for a gallium nitride based device according to claim 3, wherein: The top surface of the anti-skid disc (421) is coated with an anti-skid coating, and the outer wall of the anti-skid disc (421) is sleeved with the inner part of the rack (3).

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