Alignment device

Abstract

The utility model relates to an alignment device, which is used for aligning a plurality of elements to a wafer comprising a plurality of crystal grains, and comprises a laser light source; a beam expander; and the liquid crystal board is provided with a plurality of liquid crystal switch units, each crystal grain corresponds to at least one liquid crystal switch unit, and a light beam irradiating a preset position of the crystal grain passes through the liquid crystal switch units by turning on the liquid crystal switch units, so that one element is arranged at the preset position in an aligned manner. Therefore, the light beam emitted by the laser light source is expanded by the beam expander, and then the light beam is controlled by the liquid crystal switch unit so as to be emitted to the preset positions of the plurality of elements on the wafer, so that the plurality of elements can be aligned at the same time, the working efficiency of the alignment device is improved, and the productivity is effectively improved.

Description

Technical Field

[0001] This application relates to an alignment device, and more particularly to an alignment device for simultaneously aligning multiple elements onto a wafer containing multiple dies. Background Technology

[0002] With the booming development of portable electronic products in recent years, the development of various related products is also trending towards high density, high performance, and lightweight, thin, short, and small designs. Simultaneously, semiconductor devices are gradually moving towards heterogeneous integration, leading to the rise of 3D multi-chip packaging technology. To improve signal transmission speed between the increasing number of chips and components within semiconductor devices, as well as between semiconductor devices and external circuits or components, optical communication technology has been introduced, using optical fibers as the signal propagation medium in critical signal paths. Among these technologies, co-packaged optics (CPO) technology has become a key technology that the industry has been vigorously developing in recent years.

[0003] In existing manufacturing processes, when attaching a fiber optic connector to a semiconductor device such as an optical engine (OE) chip or wafer, the operator typically first manually points a laser beam at the predetermined installation position of the fiber optic connector on a single chip, and then aligns and fixes the fiber optic connector to the predetermined installation position illuminated by the beam using methods such as adhesive application.

[0004] However, since this alignment method can only align a single die or a single mounting position on a single wafer at a time, the alignment equipment and alignment operation are extremely inefficient, severely limiting the capacity of the entire production line.

[0005] Therefore, overcoming the various problems of the existing technologies has become a pressing issue for the industry. Utility Model Content

[0006] In view of the various deficiencies of the prior art, this application provides an alignment device for aligning multiple components onto a wafer containing multiple uncut dies. The alignment device includes: a laser source; a beam expander disposed between the laser source and the wafer to receive a beam emitted by the laser source and expand its range before emitting it toward the wafer; and a liquid crystal panel disposed between the beam expander and the wafer and having multiple liquid crystal switching units, wherein each die on the wafer corresponds to at least one liquid crystal switching unit, and by turning on the liquid crystal switching unit, a beam of light irradiated from the beam expander toward a predetermined setting position of the corresponding die passes through, so that a component is aligned and set at the predetermined setting position.

[0007] This application also provides a method for using an alignment device, the method comprising: providing a wafer containing a plurality of uncut dies; orienting an alignment device as described above toward the wafer so that a light beam passing through the activated liquid crystal switching unit passes through a predetermined setting position for setting the element; and setting the element at the predetermined setting position reached by the light beam passing through the liquid crystal switching unit.

[0008] In the aforementioned alignment device and its application method, the alignment device further includes a control circuit that is signal-connected to the liquid crystal panel and controls the liquid crystal switching unit to turn on so as to allow the beam of light from the beam expander toward the predetermined setting position to pass through.

[0009] In the aforementioned alignment device and its application method, the alignment device further includes a control circuit that is signal-connected to the liquid crystal panel and controls the liquid crystal switching unit to close to block the light beam that is not directed toward the predetermined setting position from passing through.

[0010] In the aforementioned alignment device and its application method, the wafer has multiple predetermined positions for multiple components to be configured one-to-one.

[0011] In the aforementioned alignment device and its application method, the plurality of components are first disposed on a carrier, and after alignment is completed by the alignment device, they are then attached to the wafer by the carrier.

[0012] The aforementioned method of applying the alignment device further includes: performing a dispensing step, which places the adhesive at the predetermined setting position reached by the light beam passing through the liquid crystal switching unit; causing the element to adhere to the predetermined setting position through the adhesive; curing the adhesive; and cutting the components to separate the individual crystals on which the element is disposed.

[0013] In the aforementioned method of applying the alignment device, the wafer has multiple predetermined positions for multiple components to be set one-to-one, and the multiple components are first set on a carrier, and then the carrier is used to adhere the multiple components to the predetermined positions by the adhesive after the dispensing step is completed.

[0014] In the aforementioned method of applying the alignment device, the carrier is made of a material that is cured by ultraviolet light. The colloid is a thermosetting material. After the multiple components are attached to the predetermined setting position by the carrier through the colloid, the carrier is first cured by ultraviolet light, then the carrier is removed, and then the colloid is thermoset.

[0015] As can be seen from the above, this application expands the beam emitted by the laser source through a beam expander, and then controls the beam to be directed to multiple predetermined positions on the wafer through multiple liquid crystal switching units of the liquid crystal panel, so that multiple components can be aligned at the same time, thereby improving the working efficiency of the alignment device and effectively increasing production capacity. Attached Figure Description

[0016] Figure 1A This is a schematic diagram of an embodiment of the alignment device of this application;

[0017] Figure 1B This is a top view schematic diagram of a wafer for an embodiment of the alignment device of this application;

[0018] Figure 1C This is a top view schematic diagram of the liquid crystal panel of an embodiment of the alignment device of this application;

[0019] Figures 2A to 2H This is a schematic diagram of an embodiment of the alignment device application method of this application;

[0020] Figure 3A and Figure 3B This is a schematic diagram of another embodiment of the application method of the alignment device of this application.

[0021] Explanation of reference numerals in the attached figures

[0022] 1 Alignment device

[0023] 10. Laser source

[0024] 20 Beam expanders

[0025] 30 LCD panels

[0026] 31,31' LCD switching unit

[0027] 40 Control Circuit

[0028] 50 dispensing device

[0029] b1 laser beam

[0030] b2 Extended Beam

[0031] b3 Alignment Beam

[0032] C component

[0033] Cr carrier

[0034] D grain

[0035] G colloid

[0036] H heat

[0037] P Pre-set location

[0038] UV light

[0039] W wafer. Detailed Implementation

[0040] The following specific embodiments illustrate the implementation of this application. Those skilled in the art can easily understand other advantages and effects of this application from the content disclosed in this specification.

[0041] It should be understood that the structures, proportions, sizes, etc., depicted in the accompanying drawings are merely for illustrative purposes to aid those skilled in the art in understanding and reading the content disclosed herein, and are not intended to limit the scope of this application. Therefore, they have no substantial technical significance. Any modifications to the structure, changes in proportions, or adjustments to size, without affecting the effectiveness and purpose of this application, should still fall within the scope of the technical content disclosed herein. Furthermore, terms such as "above," "below," "one," "first," and "second" used in this specification are merely for clarity of description and are not intended to limit the scope of this application. Changes or adjustments to their relative relationships, without substantially altering the technical content, should also be considered within the scope of this application's implementation.

[0042] Figure 1A This is a schematic diagram of an embodiment of the alignment device of this application; Figure 1B This is a top view schematic diagram of a wafer for an embodiment of the alignment device of this application; Figure 1C This is a top view schematic diagram of the liquid crystal panel of an embodiment of the alignment device of this application; Figures 2A to 2H This is a schematic diagram of an embodiment of the alignment device application method of this application; Figure 3A and Figure 3B This is a schematic diagram of another embodiment of the application method of the alignment device of this application.

[0043] like Figures 1A to 1C As shown, this embodiment provides a solution for multiple components C (please also refer to...) Figures 2D to 2H Alignment device 1 is used to align components onto a wafer W containing multiple uncut dies D. Each die D is, for example, an optical engine die (OE die), and each component C may be a fiber optic connector, but is not limited to those exemplified herein.

[0044] like Figure 1A As shown, the alignment device 1 includes: a laser source 10, a beam expander 20, and a liquid crystal panel 30.

[0045] The laser source 10 is used to provide a laser beam (beam) b1. The laser beam b1 is emitted toward the beam expander 20 and the wafer W. Generally, the laser source 10 used in this embodiment provides a laser beam b1 in the visible light band, but a laser beam b1 in the non-visible light band, such as ultraviolet (UV), can also be used. This embodiment does not have any particular limitation on this.

[0046] A beam expander 20 is positioned between the laser source 10 and the wafer W to receive the laser beam b1 emitted by the laser source 10, expand its range (diameter), and then direct the expanded beam b2 toward the wafer W, so that the predetermined irradiation range of the expanded beam b2 can cover... Figure 1B The wafer W shown has multiple grains D. Preferably, the diameter of the expanded beam b2 formed after the beam is amplified by the beam expander 20 is greater than or equal to the diameter of the wafer W, so that all grains D on the wafer W can be covered by the expanded beam b2, but this embodiment does not impose any limitations on this.

[0047] A liquid crystal panel 30 is disposed between the beam expander 20 and the wafer W and has multiple liquid crystal switching units 31. These multiple liquid crystal switching units 31 can be controlled by electrical signals to switch on and off. When a liquid crystal switching unit 31 is turned on, light is allowed to pass through it; when it is turned off, light is blocked. Generally, each die D in the wafer W corresponds to at least one liquid crystal switching unit 31. By turning on the liquid crystal switching unit 31, the portion of the expanded beam b2 from the beam expander 20 corresponding to the turned-on liquid crystal switching unit 31 passes through, forming a alignment beam (beam) b3 with the same cross-section as the liquid crystal switching unit 31. This alignment beam b3 then irradiates a predetermined setting position P on the corresponding die D. That is, the position irradiated by the alignment beam b3 is the predetermined setting position P of the component C. Thus, whether operated manually by personnel or by automated equipment, multiple components C can be correctly installed at their respective predetermined setting positions P according to the position irradiated by the alignment beam b3.

[0048] In a preferred embodiment, the alignment device 1 further includes a control circuit 40. The control circuit 40 is signal-connected to the liquid crystal panel 30 to control the activation of each liquid crystal switching unit 31 on the liquid crystal panel 30, allowing the portion of the expanded beam b2 from the beam expander 20 that is irradiated toward the predetermined setting position P to become the aforementioned alignment beam b3 through the liquid crystal switching unit 31.

[0049] In some variations of the implementation, the control circuit 40 can not only control the activation of each liquid crystal switch unit 31, but also control other liquid crystal switch units 31' to deactivate them, thereby blocking the passage of light beams not directed towards the predetermined setting position P. This design makes the liquid crystal panel 30 a universal type that can accommodate wafers W with various designs of the die D. Before use, the manufacturer only needs to select the corresponding liquid crystal switch unit, such as the liquid crystal switch unit 31 in this embodiment, for the predetermined setting position P on different dies D, and set the control circuit 40 to activate it. For those liquid crystal switch units that do not correspond to the predetermined setting position P on the die D, such as the liquid crystal switch unit 31' in this embodiment, the control circuit 40 can be set to remain deactivated. This allows the liquid crystal panel 30 to be compatible with and applied to wafers W with dies D having various predetermined setting positions P of the components C.

[0050] Furthermore, since a wafer W typically contains multiple dies D that require the mounting of the component C, such as optical engine dies D that require the mounting of fiber optic connectors, the wafer W generally has multiple predetermined mounting positions P for the multiple components C to be mounted one-to-one. In some more advanced manufacturing processes, some optical engine dies D even require the mounting of multiple fiber optic connectors each; this embodiment does not impose any particular limitations on this.

[0051] Furthermore, to further improve process efficiency, the multiple components C to be installed can be first placed on the bottom surface of the carrier Cr (please also refer to...). Figure 2D and Figure 2E The alignment device 1 is used to align all the components C on the bottom surface of the carrier Cr at the same time, and after the alignment is completed, the carrier Cr is used to attach the multiple components C to the wafer W.

[0052] Please refer to the following at the same time. Figures 2A to 2H This embodiment also provides an application method of the alignment device 1, including: providing a wafer W containing a plurality of uncut dies D; orienting the alignment device 1 toward the wafer W so that a light beam passing through the activated liquid crystal switching unit 31 passes to a predetermined setting position P for setting the element C; and setting the element C at the predetermined setting position P reached by the light beam passing through the liquid crystal switching unit 31.

[0053] In detail, in the application method provided in this embodiment, such as Figure 2A As shown, the first step is to provide a wafer W, on which a plurality of dies D have been arranged or formed but have not yet been cut, and as mentioned above, each die D has a predetermined mounting position P for a predetermined mounting element C.

[0054] Next, as Figure 2B As shown, the alignment device 1 is oriented toward the wafer W, that is, each alignment beam b3 after the liquid crystal switch unit 31 that has been turned on passes through and illuminates a predetermined setting position P of a die D on the wafer W for setting the element C.

[0055] Please also see Figure 1A In a preferred embodiment, the alignment device 1 further includes a control circuit 40 that is signal-connected to the liquid crystal panel 30. The control circuit 40 controls individual liquid crystal switching units 31 to open, allowing alignment beams directed toward each predetermined setting position P to pass through. As for liquid crystal switching units 31' that correspond to beams not directed toward the predetermined setting position P, they can be controlled by the control circuit 40 to close to block the beams from passing through.

[0056] like Figure 2C As shown, the next step is the dispensing step. In this step, the dispensing device 50 applies an adhesive G, for example, made of a thermosetting material, to each predetermined setting position P reached by the plurality of alignment beams of each of the activated liquid crystal switch units 31, in order to subsequently adhere the component C to be installed.

[0057] Since wafer W has multiple dies D, and each die D has at least one predetermined mounting position P for mounting components C, meaning wafer W has multiple predetermined mounting positions P that correspond one-to-one with multiple components C for mounting, in order to improve the efficiency of the mounting process, the multiple components C can first be mounted on the bottom surface of a carrier Cr. For example... Figure 2D As shown, the carrier Cr is, for example, made of a transparent material cured by ultraviolet light. The carrier Cr can be manufactured to the same shape and size as the wafer W, including having the same flat edges, notches, or other types of alignment marks (not shown) as the wafer W, so that operators or automated equipment can first align the carrier Cr with the wafer W. Then, the carrier Cr, along with the components C on its bottom surface, is placed on the surface of the wafer W, and the components C are adhered to their corresponding predetermined positions P by the adhesive G previously applied to the wafer W (please also refer to...). Figure 1B In some variations of the embodiment, a release film or tape (not shown) may be attached to each element C to protect the element C, and the element C may be placed on the bottom surface of the carrier Cr by the release film or tape, but this embodiment does not impose any restrictions on this.

[0058] Next, as Figure 2E As shown, the Cr carrier is irradiated with ultraviolet (UV) light to cure it. After this UV curing step is completed, then... Figure 2FAs shown, the carrier Cr is removed, leaving only the components C attached to the surface of the wafer W with their corresponding colloid G. If the components C are in the form of a release film or tape as described above, the release film or tape can be removed together with the carrier Cr after the carrier Cr has cured.

[0059] Then as Figure 2G As shown, heat H is applied to the surface of the wafer W to cure the colloid G made of thermosetting material. After the colloid G has also cured, each component C is correctly and firmly set at the predetermined setting position P of each die D on the wafer W.

[0060] like Figure 2H As shown, the next step is to perform a dicing operation, in which the multiple dies D, which have been correctly installed and set up with the components C, are cut off from the wafer W and separated from each other, so as to obtain multiple dies D with the components C correctly set up.

[0061] like Figure 3A As shown, in a modified embodiment, after completing the dispensing step (see...), Figure 2C Afterwards, multiple discrete components C can be directly aligned to the colloid G on the wafer W, instead of as... Figure 2D As shown, the multiple components C are first placed on the carrier Cr. Then, each component C is directly adhered to its corresponding predetermined placement position P using the colloid G (please also refer to...). Figure 1B The colloid G is then heated to cure it, the difference from the previous embodiment being that the carrier Cr is omitted in this embodiment. Finally, as... Figure 3B The dicing is performed as shown, and in this way, multiple dies D with correctly configured components C can also be obtained.

[0062] In summary, this application expands the laser beam emitted by the laser source using a beam expander, and then controls multiple correct beams to pass simultaneously through multiple liquid crystal switching units of the liquid crystal panel, so that they irradiate various predetermined positions on the wafer, thereby enabling multiple components to be aligned simultaneously. This significantly improves the working efficiency of the alignment device and effectively increases production capacity.

[0063] The above embodiments are used to illustrate the principles and effects of this application, and are not intended to limit this application. Those skilled in the art can modify the above embodiments without departing from the spirit and scope of this application. Therefore, the scope of protection of this application should be as set forth in the claims.

Claims

1. An alignment device for aligning multiple components onto a wafer containing multiple uncutterd dies, characterized in that, The alignment device comprises: a laser light source; a beam expander disposed between the laser light source and the wafer to receive a light beam emitted by the laser light source and expand the light beam before emitting it toward the wafer; and a liquid crystal panel disposed between the beam expander and the wafer and having a plurality of liquid crystal switching units, each of the liquid crystal switching units corresponding to at least one of the crystals, and the light beam from the beam expander to a predetermined setting position of the corresponding crystal is allowed to pass through by opening the liquid crystal switching unit, so that the component is aligned at the predetermined setting position.

2. The alignment apparatus of claim 1, wherein The alignment device further comprises a control circuit connected to the liquid crystal panel, and the liquid crystal switching unit is controlled to be opened by the control circuit to allow the light beam from the beam expander to pass through the predetermined setting position.

3. The alignment apparatus of claim 1, wherein The alignment device further comprises a control circuit connected to the liquid crystal panel, and the liquid crystal switching unit is controlled to be closed by the control circuit to block the light beam from passing through the position other than the predetermined setting position.

4. The alignment apparatus of claim 1, wherein The wafer has a plurality of the predetermined setting positions for a plurality of the components to be set one by one.

5. The alignment apparatus of claim 1, wherein The plurality of components are first set on a carrier, and then the carrier is placed on the wafer.

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