Aluminum nitride metalized heat sink structure

Abstract

The utility model discloses an aluminum nitride metalized heat sink structure, which comprises a heat dissipation substrate, a heat sink frame and a heat conducting plate, the heat conducting plate is arranged in the middle of the top end of the heat sink frame in an embedding manner and is connected with the heat sink frame in an embedding manner, a plurality of heat transfer plates are arranged in the middle of the bottom of the heat sink frame, and the heat transfer plates are connected with the heat sink frame in an embedding manner. Heat transfer side plates are arranged on the two sides of the heat sink frame. The outer mounting groove is formed in the middle of the top end of the heat sink frame, the clamping groove is formed in the outer mounting groove, the heat conduction plate can be conveniently embedded and mounted through the outer mounting groove, the heat conduction plate can be clamped and fixed with the clamping groove through the insertion strip, mounting and dismounting are convenient, the heat dissipation substrate can be replaced, use is flexible, universality can be improved, and the heat dissipation efficiency is improved. The heat transfer plate is arranged in the middle of the bottom of the heat sink frame, the heat dissipation side strips are arranged on the two sides of the heat transfer plate, the heat dissipation effect of the heat sink frame can be improved through the heat dissipation side strips, and the heat transfer side plates are arranged on the two sides of the bottom of the heat sink frame, so that the heat exchange range is larger.

Description

Technical Field

[0001] This utility model relates to the field of heat sink structures, specifically an aluminum nitride metallized heat sink structure. Background Technology

[0002] A heat sink is a device whose temperature remains constant regardless of the amount of heat transferred to it. It can be an object such as the atmosphere or the earth. In industry, it refers to a miniature heat sink used to cool electronic chips. In aerospace engineering, it refers to a device that uses liquid nitrogen to coat the inner surface of a plate to simulate the cold, dark environment of space. In current LED lighting packaging, because LEDs generate a lot of heat when emitting light, high-thermal-conductivity copper pillars are used to conduct the heat to the outside of the package. These LED copper pillars are also called heat sinks. LDs (laser diodes) also generate a lot of heat and need to be mounted on heat sinks to help dissipate heat and stabilize their operating temperature.

[0003] For example, the authorized patent with publication number CN214898388U (parallel seam welded cover plate with embedded heat sink structure for electronic packaging shell): includes a parallel seam welded cover plate body and a heat sink structure. The heat sink structure is fixedly connected to the parallel seam welded cover plate body, and the parallel seam welded cover plate body is fixedly connected to the electronic packaging shell. Embedded heat-conducting pillars for heat conduction are provided in the heat sink structure. The embedded heat-conducting pillars extend continuously from one side of the heat sink structure to the other side of the heat sink structure, and multiple embedded heat-conducting pillars are spaced apart inside the cavity. This utility model can solve the problem of insufficient heat dissipation of existing parallel seam welded cover plates for packaging shells.

[0004] The aforementioned existing heat sink frame is a single unit that cannot be disassembled, making it inconvenient to install, resulting in low heat transfer efficiency. Furthermore, the heat transfer substrate cannot be replaced, limiting its versatility. Utility Model Content

[0005] The purpose of this utility model is to provide an aluminum nitride metallized heat sink structure to solve the problems mentioned in the background art, which are that the heat sink frame is an integral piece that cannot be disassembled, making it inconvenient to install, resulting in low heat transfer efficiency, and the inability to replace the heat transfer substrate, thus lacking versatility.

[0006] To achieve the above objectives, the present invention provides the following technical solution: an aluminum nitride metallized heat sink structure, comprising a heat dissipation substrate, a heat sink frame, and a heat conduction plate. The heat conduction plate is embedded in the center of the top of the heat sink frame, and the heat conduction plate is connected to the heat sink frame in an embedded manner. Multiple heat transfer plates are provided at the center of the bottom of the heat sink frame, and heat transfer side plates are provided on both sides of the heat sink frame.

[0007] In a further embodiment, an external mounting groove is provided at the center of the top of the heat sink rack, and a slot is provided on the external mounting groove.

[0008] In a further embodiment, the heat-conducting plate has inserts on both sides of its bottom, and the inserts are embedded in the slots.

[0009] In a further embodiment, the heat transfer plate is provided with multiple heat dissipation side strips, and the heat transfer plate and the heat sink frame are integrated into one structure.

[0010] In a further embodiment, the heat sink is an aluminum nitride structure, and the heat sink and the heat transfer side plate are an integral structure.

[0011] In a further embodiment, connecting frames are provided on both sides of the heat dissipation substrate, and the bottom of the connecting frame is connected to the heat-conducting plate through a connector. The heat-conducting plate is embedded in the external mounting groove.

[0012] Compared with the prior art, the beneficial effects of this utility model are:

[0013] The heat sink rack of this utility model has an external mounting groove at the top center, and a slot is provided on the external mounting groove. The external mounting groove facilitates the embedding and installation of the heat conduction plate, and the heat conduction plate can be fixed to the slot by the insert strip, which facilitates installation and disassembly, makes the heat dissipation base plate replaceable, and is more flexible in use, which can improve versatility.

[0014] The utility model has a heat transfer plate at the center of the bottom of the heat sink rack, and heat dissipation side strips on both sides of the heat transfer plate. The heat dissipation side strips can improve the heat dissipation effect of the heat sink rack. The heat transfer side plates on both sides of the bottom of the heat sink rack make the heat exchange range larger. Attached Figure Description

[0015] Figure 1 This is a schematic diagram of an aluminum nitride metallized heat sink structure according to the present invention.

[0016] Figure 2 This is the front view of the heat sink rack of this utility model;

[0017] Figure 3 This is a front view of the heat-conducting plate of this utility model;

[0018] Figure 4 This is a top view of the thermal sink rack of this utility model.

[0019] In the diagram: 1. Heat sink base plate; 2. Heat sink frame; 3. Heat transfer side plate; 4. Heat transfer plate; 5. External mounting slot; 6. Slot; 7. Heat dissipation side strip; 8. Connecting frame; 9. Heat conduction plate; 10. Insert strip. Detailed Implementation

[0020] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments of the present utility model. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments.

[0021] Please see Figure 1-4 This utility model provides an embodiment of an aluminum nitride metallized heat sink structure, including a heat dissipation substrate 1, a heat sink frame 2, and a heat-conducting plate 9. The heat-conducting plate 9 is embedded in the center of the top of the heat sink frame 2, and the heat-conducting plate 9 is connected to the heat sink frame 2 by embedding. Multiple heat transfer plates 4 are provided in the center of the bottom of the heat sink frame 2, and heat transfer side plates 3 are provided on both sides of the heat sink frame 2. The heat sink frame 2 is an aluminum nitride structure, and the heat sink frame 2 and the heat transfer side plates 3 are integrated into one structure. The integrated design makes the heat transfer efficiency higher. The heat-conducting plate 9 is used to transfer heat to the heat sink frame 2 so that it can perform heat sinking. The heat transfer side plates 3 are used for lateral heat transfer control. The multiple heat transfer plates 4 can perform multi-position heat transfer, which greatly improves the heat transfer efficiency.

[0022] The top center of the heat sink 2 is provided with an external mounting groove 5, and the external mounting groove 5 is provided with a slot 6. The heat sink 2 and the heat conduction plate 9 can be easily assembled through the external mounting groove 5. The insert strip 10 can be embedded and assembled through the slot 6. The bottom two sides of the heat conduction plate 9 are provided with insert strips 10, which are embedded and connected with the slot 6. This design facilitates the disassembly of the heat conduction plate 9.

[0023] The heat transfer plate 4 has multiple heat dissipation side strips 7 on its side. The heat transfer plate 4 and the heat sink 2 are integrated into one structure. Lateral heat dissipation can be controlled through the heat dissipation side strips 7.

[0024] Both sides of the heat dissipation substrate 1 are provided with connecting brackets 8. The bottom of the connecting bracket 8 is connected to the heat conduction plate 9 through a connector. The heat conduction plate 9 is embedded in the outer mounting groove 5. The connecting bracket 8 can efficiently transfer heat between the heat dissipation substrate 1 and the heat conduction plate 9 and strengthen the connection.

[0025] Working principle: In use, the heat-conducting plate 9 is embedded in the slot 6 through the insert 10, and the heat-conducting plate 9 is embedded in the external mounting slot 5. It is connected to the chip through the heat dissipation substrate 1. Heat is transferred to the heat-conducting plate 9 through the connecting bracket 8. The heat is transferred to the heat sink 2 through the heat-conducting plate 9. Heat is dissipated through the heat transfer side plate 3 and heat transfer plate 4. The heat dissipation efficiency can be enhanced by the heat dissipation side strips 7 on both sides. The heat transfer side plate 3 and heat transfer plate 4 can strengthen the support of the placed heat sink 2.

[0026] It will be apparent to those skilled in the art that this invention is not limited to the details of the exemplary embodiments described above, and that it can be implemented in other specific forms without departing from the spirit or essential characteristics of this invention. Therefore, the embodiments should be considered illustrative and non-limiting in all respects, and the scope of this invention is defined by the appended claims rather than the foregoing description. Thus, it is intended that all variations falling within the meaning and scope of equivalents of the claims be included within this invention. No reference numerals in the claims should be construed as limiting the scope of the claims.

Claims

1. An aluminum nitride metalized heat sink structure comprising a heat dissipation substrate (1), a heat sink frame (2) and a heat conducting plate (9), characterized in that: The top middle part of the heat sink frame (2) is provided with a heat conduction plate (9) in an inlaying mode, the heat conduction plate (9) is connected with the heat sink frame (2) in an inlaying mode, the bottom middle part of the heat sink frame (2) is provided with a plurality of heat transfer plates (4), and both sides of the heat sink frame (2) are provided with heat transfer side plates (3).

2. The aluminum nitride metallized heat sink structure of claim 1, wherein: The top middle part of the heat sink frame (2) is provided with an outer mounting groove (5), and the outer mounting groove (5) is provided with a clamping groove (6).

3. The aluminum nitride metallized heat sink structure of claim 1, wherein: Both sides of the bottom of the heat conduction plate (9) are provided with an insertion strip (10), and the insertion strip (10) is connected with the clamping groove (6) in an inlaying mode.

4. The aluminum nitride metallized heat sink structure of claim 1, wherein: The side of the heat transfer plate (4) is provided with a plurality of heat dissipation side strips (7), and the heat transfer plate (4) is provided as an integral structure with the heat sink frame (2).

5. The aluminum nitride metallized heat sink structure of claim 1, wherein: The heat sink frame (2) is provided as an aluminum nitride structure, and the heat sink frame (2) is provided as an integral structure with the heat transfer side plate (3).

6. The aluminum nitride metallized heat sink structure of claim 1, wherein: Both sides of the heat dissipation base plate (1) are provided with a connecting frame (8), the bottom of the connecting frame (8) is connected with the heat conduction plate (9) through a connecting head, and the heat conduction plate (9) is inlaid with the outer mounting groove (5).

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