Stamping processing equipment for solar silicon wafer loader

Abstract

The utility model provides stamping processing equipment for a solar silicon wafer loader. Relates to the technical field of silicon wafer loading tools. The solar silicon wafer loader stamping equipment comprises an L-shaped bearing frame, a supporting table is fixedly installed on one side of the L-shaped bearing frame, a female die is fixedly installed at the top of the supporting table, a first connecting arm is slidably installed on the L-shaped bearing frame, and a plurality of material ejecting pieces are fixedly installed on one side of the first connecting arm; the tops of the multiple material ejecting pieces penetrate through the supporting table and extend into the female die, the material ejecting pieces are slidably connected with the supporting table and the female die, the top end faces of the material ejecting pieces are flush with the inner wall of the bottom of the female die, and a second connecting arm is slidably installed on the L-shaped bearing frame. The automatic feeding device has the advantages that the punched inserting plate can be quickly fed into the next procedure, and the material taking speed and the punching efficiency are improved.

Description

Technical Field

[0001] This utility model relates to the field of silicon wafer loading tool technology, and in particular to a stamping processing equipment for a solar silicon wafer carrier. Background Technology

[0002] Solar silicon wafers are thin photovoltaic semiconductor wafers that generate electricity directly from sunlight. They are the core material of solar photovoltaic power generation technology. In the production and processing of solar silicon wafers, in order to load and store the finished silicon wafers, multiple solar silicon wafers are usually stored independently one by one using a silicon wafer carrier. This carrier generally has two insert plates, left and right, and each insert plate has a silicon wafer slot. By inserting a silicon wafer into the corresponding slot on the left and right insert plates, storage can be completed. Such a common carrier is proposed in patent document CN219668831U, which proposes a silicon wafer carrier to prevent silicon wafers from sticking together and can effectively load the silicon wafers.

[0003] However, including the aforementioned carrier, most similar carriers on the market require stamping equipment to directly punch out the slots on the side plates during manufacturing. However, conventional stamping equipment has found that after each stamping process, the stamping process needs to be paused. Then, the stamped plate, which is stuck in the die and has been punched, needs to be pried out manually with tools before the next plate substrate to be stamped is placed into the die. Then, the removed plate is sent to the next process. The time wasted in between is relatively long, making it difficult to achieve rapid loading and unloading and reducing work efficiency.

[0004] Therefore, it is necessary to provide a new stamping equipment for solar silicon wafer carriers to solve the above-mentioned technical problems. Utility Model Content

[0005] The purpose of this invention is to provide a solar silicon wafer carrier stamping processing equipment that can quickly feed the stamped insert into the next process, thereby improving the material handling speed and stamping efficiency.

[0006] To solve the above-mentioned technical problems, the solar silicon wafer carrier stamping processing equipment provided by this utility model includes: an L-shaped carrier frame, a support platform fixedly installed on one side of the L-shaped carrier frame, a die fixedly installed on the top of the support platform, a first connecting arm slidably installed on the L-shaped carrier frame, a plurality of ejector plates fixedly installed on one side of the first connecting arm, the tops of the plurality of ejector plates penetrating the support platform and extending into the die, the ejector plates being slidably connected to the support platform and the die, the top end face of the ejector plates being flush with the bottom inner wall of the die, a second connecting arm slidably installed on the L-shaped carrier frame, the bottom of the second connecting arm and the top of the first connecting arm being fixed by two connecting columns, the second connecting arm being located on the upper part of the die. In this configuration, a punch is fixedly mounted at the bottom of the second connecting arm, and the punch is adapted to the die. A rodless cylinder is fixedly mounted on the side of the L-shaped support frame away from the punch. A concave push rod is fixedly mounted on the slider of the rodless cylinder. The concave push rod passes through the L-shaped support frame and is slidably connected to the L-shaped support frame. The same pusher plate is fixedly mounted at both ends of the concave push rod. A third connecting arm is slidably mounted on the L-shaped support frame. A first telescopic cylinder is fixedly mounted at the bottom of the third connecting arm. The output shaft of the first telescopic cylinder is fixedly connected to the second connecting arm. A second telescopic cylinder is fixedly mounted on the side of the L-shaped support frame away from the first telescopic cylinder. The output shaft of the second telescopic cylinder is fixedly connected to the third connecting arm.

[0007] Preferably, the L-shaped support frame has a first long sliding opening, and the first connecting arm passes through the first long sliding opening and contacts the inner wall of the first long sliding opening.

[0008] Preferably, the L-shaped support frame has a second long sliding opening, and the second connecting arm passes through the second long sliding opening and contacts the inner wall of the second long sliding opening.

[0009] Preferably, the L-shaped support frame has a third long sliding opening, and the third connecting arm passes through the third long sliding opening and contacts the inner wall of the third long sliding opening.

[0010] Preferably, a buffer plate is hinged to one side of the support platform, and a conveyor belt unit is provided below one side of the buffer plate.

[0011] Preferably, a stabilizing plate is fixedly installed on the L-shaped support frame, and two guide arc rods are fixedly installed on the stabilizing plate. Both guide arc rods pass through the buffer plate and are slidably connected to the buffer plate. A buffer spring is sleeved on each of the two guide arc rods. The top end of the buffer spring is fixedly connected to the buffer plate, and its bottom end is fixedly connected to the stabilizing plate.

[0012] Preferably, two side baffles are fixedly installed on the top of the buffer plate.

[0013] Compared with related technologies, the solar silicon wafer carrier stamping equipment provided by this utility model has the following beneficial effects:

[0014] This utility model provides a stamping processing equipment for solar silicon wafer carriers. Through the combination of multiple top plates and the second telescopic cylinder and the rodless cylinder, the stamped insert plate can be quickly taken out from the die and fall into the conveyor belt unit along the buffer plate to be transferred to the next process. The whole process is smooth and efficient, thereby improving the stamping speed and overall work efficiency to a certain extent. Attached Figure Description

[0015] Figure 1 A schematic diagram of a preferred embodiment of the solar silicon wafer carrier stamping equipment provided by this utility model;

[0016] Figure 2 This is a schematic diagram of the oblique side view of the present invention;

[0017] Figure 3 This is a cross-sectional view of the L-shaped support frame, support platform, and second connecting arm in this utility model.

[0018] Figure 4 for Figure 3 The enlarged schematic diagram of part A shown below;

[0019] Figure 5 This is a schematic diagram of the connection structure between the first connecting arm and the top material plate in this utility model;

[0020] Figure 6 This is a schematic diagram of the bottom structure of the support platform and the punch in this utility model.

[0021] The following are the labels in the diagram: 1. L-shaped support frame; 2. Support platform; 3. Die; 4. First long slide; 5. First connecting arm; 6. Ejector plate; 7. Second long slide; 8. Second connecting arm; 9. Punch; 10. Rodless cylinder; 11. Concave push rod; 12. Push plate; 13. Connecting column; 14. Third long slide; 15. Third connecting arm; 16. First telescopic cylinder; 17. Second telescopic cylinder; 18. Buffer plate; 19. Stabilizing plate; 20. Guide arc rod; 21. Buffer spring. Detailed Implementation

[0022] The present invention will be further described below with reference to the accompanying drawings and embodiments.

[0023] Please refer to the following: Figures 1-6The solar silicon wafer carrier stamping equipment includes: an L-shaped carrier frame 1, with a support platform 2 fixedly installed on one side of the L-shaped carrier frame 1, and a die 3 fixedly installed on its top. A first connecting arm 5 is slidably installed on the L-shaped carrier frame 1, and multiple ejector plates 6 are fixedly installed on one side of the first connecting arm 5. The tops of the ejector plates 6 all penetrate the support platform 2 and extend into the die 3. The ejector plates 6 are slidably connected to the support platform 2 and the die 3. The top end face of the ejector plate 6 is flush with the bottom inner wall of the die 3. A second connecting arm 8 is slidably installed on the L-shaped carrier frame 1. The bottom of the second connecting arm 8 and the top of the first connecting arm 5 are fixedly connected by two connecting posts 13. The second connecting arm 8 is positioned above the die 3. A punch 9 is fixedly installed at the bottom of the second connecting arm 8. The punch 9 is adapted to the die 3. A rodless cylinder 10 is fixedly installed on the side of the L-shaped support frame 1 away from the punch 9. A concave push rod 11 is fixedly installed on its own slider. The concave push rod 11 passes through the L-shaped support frame 1 and is slidably connected to the L-shaped support frame 1. The same pusher plate 12 is fixedly installed at both ends of the concave push rod 11. The bottom end face of the pusher plate 12 is slightly higher than the top end face of the die 3, so that the ejected insert plate can be pushed away smoothly. A third connecting arm 15 is slidably installed on the L-shaped support frame 1. A first telescopic cylinder 16 is fixedly installed at the bottom of the third connecting arm 15. Its output shaft is fixedly connected to the second connecting arm 8. A second telescopic cylinder 17 is fixedly installed on the side of the L-shaped support frame 1 away from the first telescopic cylinder 16. Its output shaft is fixedly connected to the third connecting arm 15.

[0024] In the above method, in order to ensure that the first connecting arm 5, the second connecting arm 8 and the third connecting arm 15 form a linear lifting motion, a first long sliding opening 4 is provided on the L-shaped support frame 1, and the first connecting arm 5 passes through the first long sliding opening 4 and contacts the inner wall of the first long sliding opening 4; a second long sliding opening 7 is provided on the L-shaped support frame 1, and the second connecting arm 8 passes through the second long sliding opening 7 and contacts the inner wall of the second long sliding opening 7; a third long sliding opening 14 is provided on the L-shaped support frame 1, and the third connecting arm 15 passes through the third long sliding opening 14 and contacts the inner wall of the third long sliding opening 14.

[0025] In this method, in order to smoothly convey the insert plate pushed out by the pusher plate 12 to the next process, a buffer plate 18 is hinged to one side of the support platform 2, and a conveyor belt unit is provided below one side of the buffer plate 18. The pusher plate 12 pushes the insert plate pushed out by the top plate 6 onto the buffer plate 18, and then slides onto the conveyor belt unit through the buffer plate 18, thereby achieving the purpose of moving to the next process.

[0026] In this method, in order to make the stamped insert plate slide smoothly onto the conveyor belt unit, a stabilizing plate 19 is fixedly installed on the L-shaped support frame 1. Two guide arc rods 20 are fixedly installed on the stabilizing plate 19. Both guide arc rods 20 pass through the buffer plate 18 and are slidably connected to the buffer plate 18. A buffer spring 21 is sleeved on both guide arc rods 20. The top end of the buffer spring 21 is fixedly connected to the buffer plate 18, and its bottom end is fixedly connected to the stabilizing plate 19. In addition, two side baffles are fixedly installed on the top of the buffer plate 18 to prevent the insert plate from sliding sideways on the buffer plate 18.

[0027] The working principle of the solar silicon wafer carrier stamping equipment provided by this utility model is as follows:

[0028] In its initial state, the output shaft of the second telescopic cylinder 17 is extended, and the conveyor belt unit located below the buffer plate 18 is connected to the next process.

[0029] When stamping is required for the insert used to manufacture silicon wafer carriers, the substrate to be stamped is first placed into the die 3. Then, the output shaft of the first telescopic cylinder 16 is lowered, driving the second connecting arm 8 and the first connecting arm 5 to descend. The punch 9 also descends synchronously. When the punch 9 engages with the die 3, a stamping operation is performed on the substrate. After stamping, the output shaft of the first telescopic cylinder 16 retracts, causing the punch 9 to rise again. Then, the output shaft of the second telescopic cylinder 17 retracts, and the... The three connecting arms 15 will drive the first connecting arm 5 and the second connecting arm 8 to rise. During the rising process, multiple ejector plates 6 will push out the stamped insert plate that is stuck in the die 3. Then, the rodless cylinder 10 is activated, and the slider on it moves horizontally with the concave push rod 11, pushing it away from the top of the die 3 and onto the buffer plate 18. The buffer plate 18 will rotate downward under the weight of the insert plate itself, thus slowly transferring the stamped insert plate to the conveyor belt unit, and then to the next process.

[0030] Then, the slider of the rodless cylinder 10 pulls back the concave push rod 11, and then puts the next piece of substrate to be stamped into the die 3. Then the output shaft of the second telescopic cylinder 17 is activated to extend again, and the next stamping can be carried out according to the same stamping process as above.

[0031] Then, this process can be repeated to achieve automated material handling.

[0032] Compared with related technologies, the solar silicon wafer carrier stamping equipment provided by this utility model has the following beneficial effects:

[0033] This utility model provides a stamping processing equipment for solar silicon wafer carriers. Through the cooperation between multiple top plates 6, the second telescopic cylinder 17 and the rodless cylinder 10, the stamped insert plate can be quickly taken out from the die 3 and dropped into the conveyor belt unit along the buffer plate 18 to be transferred to the next process. The whole process is smooth and efficient, thereby improving the stamping speed and overall work efficiency to a certain extent.

[0034] The above description is merely an embodiment of this utility model and does not limit the patent scope of this utility model. Any equivalent structural or procedural transformations made based on the content of this utility model specification and drawings, or direct or indirect applications in other related technical fields, are similarly included within the patent protection scope of this utility model.

Claims

1. A solar silicon wafer carrier punching device comprising an L-shaped carrier frame, characterized in that, The side of the L-shaped bearing frame is fixedly installed with a supporting table, the top of the supporting table is fixedly installed with a female die, the first connecting arm is slidably installed on the L-shaped bearing frame, the side of the first connecting arm is fixedly installed with a plurality of top material pieces, the top of the plurality of top material pieces penetrates the supporting table and extends into the female die, the top material piece is slidably connected with the supporting table and the female die, the top end face of the top material piece is flush with the bottom inner wall of the female die, the second connecting arm is slidably installed on the L-shaped bearing frame, the bottom of the second connecting arm and the top of the first connecting arm are fixed by two linking columns, the second connecting arm is located above the female die, the bottom of the second connecting arm is fixedly installed with a male die, the male die is matched with the female die, the side of the L-shaped bearing frame away from the male die is fixedly installed with a rodless cylinder, the sliding block of the rodless cylinder is fixedly installed with a concave push rod, the concave push rod penetrates the L-shaped bearing frame and is slidably connected with the L-shaped bearing frame, the two ends of the concave push rod are fixedly installed with a same push material piece, the third connecting arm is slidably installed on the L-shaped bearing frame, the bottom of the third connecting arm is fixedly installed with a first telescopic cylinder, the output shaft of the first telescopic cylinder is fixedly connected with the second connecting arm, the side of the L-shaped bearing frame away from the first telescopic cylinder is fixedly installed with a second telescopic cylinder, the output shaft of the second telescopic cylinder is fixedly connected with the third connecting arm.

2. The solar silicon wafer carrier punching apparatus according to claim 1, wherein The first long sliding opening is formed in the L-shaped bearing frame, and the first connecting arm penetrates the first long sliding opening and is in contact with the inner wall of the first long sliding opening.

3. The solar silicon wafer carrier punching apparatus according to claim 1, wherein The second long sliding opening is formed in the L-shaped bearing frame, and the second connecting arm penetrates the second long sliding opening and is in contact with the inner wall of the second long sliding opening.

4. The solar silicon wafer carrier punching apparatus according to claim 1, wherein The third long sliding opening is formed in the L-shaped bearing frame, and the third connecting arm penetrates the third long sliding opening and is in contact with the inner wall of the third long sliding opening.

5. The solar silicon wafer carrier punching apparatus according to claim 1, wherein The supporting table is hingedly connected with a buffer plate, and the buffer plate is provided with a conveyor belt set below one side.

6. The solar silicon wafer carrier punching apparatus according to claim 5, wherein The L-shaped bearing frame is fixedly installed with a stable plate, the stable plate is fixedly installed with two guide arc rods, the two guide arc rods penetrate the buffer plate and are slidably connected with the buffer plate, a buffer spring is sleeved on each of the two guide arc rods, the top end of the buffer spring is fixedly connected with the buffer plate, and the bottom end of the buffer spring is fixedly connected with the stable plate.

7. The solar silicon wafer carrier punching apparatus according to claim 5, wherein The top of the buffer plate is fixedly installed with two side blocking pieces.

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