Embedded magnetic shielding type high-integration memory bank circuit board with high wiring density

Abstract

The utility model discloses an embedded magnetic shielding type high-integration memory bank circuit board with high wiring density, which comprises a memory bank circuit board main body, a supporting piece is arranged at the bottom of the memory bank circuit board main body, and a limiting piece for quickly positioning the memory bank circuit board main body is arranged at the upper part of the supporting piece. And screws for fixing are arranged at four corners between the memory bank circuit board main body and the supporting piece. According to the utility model, through cooperative use of the side plates and the pressing plates, the memory bank circuit board main body is rapidly positioned, rapid butt joint installation of the memory bank circuit board main body and the supporting member is facilitated, and the situation that the installation effect is affected due to deviation during installation is avoided; meanwhile, the pressing plate is movably connected with the side plate, when the memory bank circuit board bodies with different thicknesses are arranged between the pressing plate and the supporting piece, the distance between the pressing plate and the supporting piece can be adjusted, then the memory bank circuit board bodies with different thicknesses can be rapidly positioned, and the applicability of the limiting piece is improved.

Description

Technical Field

[0001] This utility model belongs to the field of memory circuit board technology, specifically relating to a high-density embedded magnetic shielded high-integration memory circuit board. Background Technology

[0002] High-density circuit board manufacturing offers advantages such as reduced production costs of multilayer circuit boards, increased circuit density, high reliability, resistance to pollution, weather resistance, UV resistance, moisture resistance, good electrical performance, good aging resistance, high tensile strength, non-breakdown, and ease of use and maintenance.

[0003] Currently, electrical components can generate electromagnetic interference on circuit boards, causing signal lines within the circuit board to transmit incorrect signals, ultimately leading to malfunctions or misoperations of electronic equipment, damaging integrated circuits and precision electronic components, or accelerating component aging and reducing production yield.

[0004] Patent document CN221467969U discloses an electromagnetic shielding structure for high-density integrated circuit boards (HDI). Through the combination of conductive metal foil and magnetic tiles, electromagnetic waves generated by other electrical components are attenuated when passing through the magnetic tiles, while the remaining electromagnetic waves are intercepted when passing through the conductive metal foil. The intercepted electromagnetic waves are then converted by a primary heat sink, thereby blocking the electromagnetic waves from affecting the circuit board and achieving the purpose of electromagnetic shielding. The above solution, through the combination of a thermally conductive copper sheet and a secondary heat sink, allows the circuit board to dissipate heat through these two components when used with magnetic tiles, preventing overheating and damage during operation.

[0005] Although the aforementioned HDI high-density circuit board electromagnetic shielding structure adds a magnetic shielding cover to the circuit board to resist electromagnetic interference, it fixes the circuit board to the base plate with screws. However, during installation, the workers need to align the screw holes on the fixing plate with the screw holes on the base plate. When tightening the screws, deviations can easily occur, causing the holes to misalign, which in turn affects the installation effect. Utility Model Content

[0006] To address the aforementioned technical problems, the purpose of this invention is to provide a high-density embedded magnetically shielded, highly integrated memory circuit board, thereby resolving the technical issue of installation deviations affecting the installation effect in existing shielding structures.

[0007] To achieve the above objectives, this utility model provides the following technical solution:

[0008] A high-density embedded magnetically shielded highly integrated memory circuit board includes a memory circuit board body, a support member at the bottom of the memory circuit board body, a limiting member at the top of the support member for quick positioning of the memory circuit board body, and screws for fixing at the four corners between the memory circuit board body and the support member.

[0009] Among them, two sets of limiting members are symmetrically arranged on the top of the support member, and there are two limiting members in each set, one in front of the other. The limiting members and screws are arranged in a one-to-one correspondence.

[0010] The limiting component includes a side plate located on the top of the support component, a pressure plate on one side of the side plate, the pressure plate being located on the top of the memory module circuit board body, a through hole for screws to pass through on the pressure plate, and a retaining edge integrally formed on the rear side of the pressure plate located at the rear.

[0011] As a further embodiment of this utility model, the main body of the memory module circuit board includes a circuit board body, on which four mounting holes are arranged in a rectangular array. The mounting holes and through holes are arranged in a one-to-one correspondence. The side plate and the pressure plate respectively contact the side and top surfaces of the circuit board body.

[0012] As a further embodiment of this utility model, the support member includes a base plate located at the bottom of the circuit board body. The base plate has screw holes with the same number of mounting holes. The screw holes and mounting holes are arranged in a one-to-one correspondence. The end of the screw passes through the through hole and the mounting hole in sequence and extends into the screw hole. The screw is threadedly connected to the inner wall surface of the screw hole.

[0013] As a preferred embodiment of this utility model, a groove is provided on the side of the side plate facing the pressure plate, and a slider is fixedly connected to one side of the pressure plate, with the slider slidably connected to the inner cavity of the corresponding groove.

[0014] As a further preferred embodiment of this utility model, both the groove and the slider are in the shape of a dovetail or a T-shape.

[0015] As a preferred embodiment of this utility model, the front side of the pressure plate is integrally formed with a guide plate, which is inclined and the horizontal line of the front side of the guide plate is higher than the horizontal line of the rear side.

[0016] As a preferred embodiment of this utility model, the inner cavity of the mounting hole is provided with a protective rubber sleeve. The rubber sleeve is composed of an integrally formed gasket and a support sleeve. The top of the gasket contacts the pressure plate, and the support sleeve is fixedly connected to the inner wall surface of the mounting hole. The inner wall surfaces of both the gasket and the support sleeve are in contact with the screw.

[0017] Compared with existing technologies, the high wiring density embedded magnetic shielded highly integrated memory circuit board provided by this utility model has the following advantages:

[0018] This invention utilizes the combined use of a side plate and a pressure plate to quickly position the main body of the memory module circuit board, facilitating rapid docking and installation of the main body of the memory module circuit board with the support component, and avoiding deviations during installation that could affect the installation effect. Simultaneously, the pressure plate and side plate are movably connected, allowing the spacing between the pressure plate and support component to be adjusted when memory module circuit boards of different thicknesses are placed between them, thus enabling rapid positioning of memory module circuit boards of varying thicknesses and improving the applicability of the limiting component. Attached Figure Description

[0019] To more clearly illustrate the technical solutions of the embodiments of this utility model, the drawings used in the embodiments will be briefly introduced below. Obviously, the drawings described below are only examples of embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0020] Fig. 1 This is a schematic diagram of the structure of an embodiment of the present utility model;

[0021] Fig. 2 This is an exploded structural diagram of an embodiment of the present utility model;

[0022] Fig. 3 This is an exploded structural diagram of the limiting member in an embodiment of this utility model.

[0023] Figure label:

[0024] 100. Main body of the memory module circuit board; 110. Circuit board body; 120. Mounting holes;

[0025] 200. Support component; 210. Base plate; 220. Screw hole;

[0026] 300. Limiting component; 310. Side plate; 311. Slide groove; 320. Pressure plate; 321. Through hole; 322. Stop edge; 323. Slider; 324. Guide plate;

[0027] 400. Screws;

[0028] 500, rubber sleeve. Detailed Implementation

[0029] To make the objectives, technical solutions, and advantages of the embodiments of this utility model clearer, the embodiments of this utility model will be further described in detail below with reference to the accompanying drawings and examples. It should be understood that the specific embodiments described herein are only used to explain this utility model and are not intended to limit this utility model.

[0030] In the description of the embodiments of this utility model, it should be understood that the terms "upper", "lower", "front", "rear", "inner", "outer", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings. They are only for the convenience of describing the embodiments of this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on the embodiments of this utility model.

[0031] In the description of the embodiments of this utility model, it should be noted that, unless otherwise explicitly specified and limited, the terms "installation", "connection" and "connection" should be interpreted broadly. For example, they can refer to a fixed connection, an integral connection, or a detachable connection; they can refer to the internal connection of two components; they can refer to a direct connection or an indirect connection through an intermediate medium. For those skilled in the art, the specific meaning of the above terms in the embodiments of this utility model can be understood according to the specific circumstances.

[0032] See appendix Figs. 1-3 As shown in the figure, this utility model discloses a high-density embedded magnetically shielded highly integrated memory circuit board, including a memory circuit board body 100, a support member 200, a limiting member 300 for quick positioning of the memory circuit board body 100, and screws 400 for fixing. The support member 200 is located at the bottom of the memory circuit board body 100, the limiting member 300 is located on the support member 200, and the screws 400 are located at the four corners between the memory circuit board body 100 and the support member 200. Two sets of limiting members 300 are symmetrically arranged on the top of the support member 200, and two limiting members 300 are arranged in front and behind each other in every two sets. The limiting members 300 and the screws 400 are arranged in a one-to-one correspondence. The limiting member 300 includes a side plate 310 that is vertically arranged on the top of the support member 200. A pressure plate 320 is horizontally arranged on one side of the side plate 310. The pressure plate 320 is located on the top of the memory module circuit board body 100. A through hole 321 for the screws 400 to pass through is opened on the pressure plate 320. A retaining edge 322 is integrally formed on the rear side of the pressure plate 320 located at the rear.

[0033] It should be noted that the circuit board body 110 mentioned above can adopt an HDI high-density circuit board with electromagnetic shielding function disclosed in the existing publication number CN207783252U. By covering the upper surface of the first circuit board and the lower surface of the fourth circuit board with epoxy resin layers, and pressing a metal mesh on the epoxy resin layers, the circuit board and the components mounted on it can be mutually shielded, preventing the components from interfering with the signal transmission of the circuits within the circuit board, affecting the normal transmission of signals, and reducing the failure rate of the circuit board. It has the advantages of reducing the production cost of multilayer circuit boards, high reliability, pollution resistance, moisture resistance, good electrical performance and non-breakdown, and simple use and maintenance. It is existing technology, so it will not be described in detail in this technical solution.

[0034] In use, the memory module circuit board body 100 is inserted from front to back between the base plate 210 and the pressure plate 320. The memory module circuit board body 100 contacts the inclined surface of the guide plate 324, causing the guide plate 324 to be forced to move the pressure plate 320 upward. The pressure plate 320 causes the through hole 321, the slider 323 and the guide plate 324 to move upward, so that the slider 323 slides in the inner cavity of the slide groove 311 until one side of the memory module circuit board body 100 moves past the pressure plate 320 located in front.

[0035] The memory circuit board body 100 contacts and presses against the inclined surface of the rear guide plate 324. One side of the memory circuit board body 100 contacts the retaining edge 322. At this time, the central axes of the mounting hole 120, through hole 321, rubber sleeve 500 and screw hole 220 are all on the same straight line, thereby completing the quick positioning operation of the memory circuit board body 100. Multiple screws 400 are sequentially passed through the corresponding through hole 321 and rubber sleeve 500 and screwed into the screw hole 220, thus completing the assembly operation of the memory circuit board body 100 and the support 200, which facilitates the subsequent addition of the shielding cover and improves the shielding effect of electromagnetic waves.

[0036] In this embodiment of the utility model, the main body 100 of the memory module circuit board includes a circuit board body 110. The circuit board body 110 has four mounting holes 120 arranged in a rectangular array. The mounting holes 120 and the through holes 321 are arranged in a one-to-one correspondence. The side plate 310 and the pressure plate 320 respectively contact the side surface and the top surface of the circuit board body 110.

[0037] In order to support the main body 100 of the memory module circuit board and facilitate the subsequent installation and fixing of the shielding cover, the support member 200 includes a base plate 210 located at the bottom of the circuit board body 110. The base plate 210 has screw holes 220 with the same number as the mounting holes 120. The screw holes 220 are arranged in a one-to-one correspondence with the mounting holes 120. The end of the screw 400 passes through the through hole 321 and the mounting hole 120 in sequence and extends into the screw hole 220. The screw 400 is threaded to the inner wall of the screw hole 220.

[0038] To enable rapid positioning of memory circuit board bodies 100 of different thicknesses, a groove 311 is provided on the side of the side plate 310 facing the pressure plate 320. A slider 323 is fixedly connected to one side of the pressure plate 320. The slider 323 is slidably connected to the inner cavity of the corresponding groove 311. When memory circuit board bodies 100 of different thicknesses are inserted between the pressure plate 320 and the base plate 210, the pressure plate 320 can drive the slider 323 to slide in the inner cavity of the groove 311, so that the pressure plate 320 moves to the appropriate position.

[0039] To prevent the slider 323 from slipping out of the inner cavity of the groove 311, both the groove 311 and the slider 323 are dovetail-shaped or T-shaped structures, which can ensure that the slider 323 is always slidably connected to the inner cavity of the groove 311.

[0040] To facilitate the insertion of the memory circuit board body 100 by lifting the pressure plate 320 and simplify the operation, a guide plate 324 is integrally formed on the front side of the pressure plate 320. The guide plate 324 is inclined, and the horizontal line on the front side of the guide plate 324 is higher than the horizontal line on the rear side. When the memory circuit board body 100 is inserted between the pressure plate 320 and the base plate 210 from front to back, the memory circuit board body 100 can first contact the inclined surface of the guide plate 324, so that the guide plate 324 is subjected to force and drives the pressure plate 320 to move upward.

[0041] To extend the service life of the memory module circuit board body 100, a protective rubber sleeve 500 is provided in the inner cavity of the mounting hole 120. The rubber sleeve 500 is composed of an integrally formed washer and a support sleeve. The top of the washer contacts the pressure plate 320, and the support sleeve is fixedly connected to the inner wall of the mounting hole 120. The inner walls of both the washer and the support sleeve are in contact with the screw 400. The rubber sleeve 500 can prevent the pressure plate 320 and the screw 400 from directly contacting the circuit board body 110, so as to prevent the circuit board body 110 from being subjected to excessive force and causing indentation or wear.

[0042] This embodiment of the utility model utilizes the cooperation of the side plate 310 and the pressure plate 320 to quickly position the memory module circuit board body 100, facilitating rapid docking and installation of the memory module circuit board body 100 and the support member 200, and avoiding deviations during installation that could affect the installation effect. Simultaneously, the pressure plate 320 and the side plate 310 are movably connected, allowing the spacing between the pressure plate 320 and the support member 200 to be adjusted when memory module circuit board bodies 100 of different thicknesses are placed between them. This enables rapid positioning of memory module circuit board bodies 100 of different thicknesses, thereby improving the applicability of the limiting member 300.

[0043] The foregoing has shown and described the basic principles of the present invention. The above are merely preferred embodiments of the present invention and are not intended to limit the present invention. The above embodiments and descriptions in the specification are only illustrative of the principles of the present invention. Any modifications, equivalent substitutions, and improvements made within the scope of the present invention without departing from the scope of the present invention should be included within the protection scope of the present invention.

Claims

1. A high-density, embedded magnetically shielded, highly integrated memory module circuit board, comprising a memory module circuit board body (100), characterized in that: The bottom of the memory bank circuit board body (100) is provided with a support (200), the upper part of the support (200) is provided with a limiting piece (300) for quickly positioning the memory bank circuit board body (100), and the four corners between the memory bank circuit board body (100) and the support (200) are provided with screws (400) for fixing; The limiting piece (300) is symmetrically provided with two groups on the top of the support (200), and each two groups of the limiting piece (300) are provided with two in front and back, and the limiting piece (300) and the screw (400) are one-to-one corresponding. The limiting piece (300) includes a side plate (310) arranged on the top of the support (200), one side of the side plate (310) is provided with a pressing plate (320), the pressing plate (320) is located on the top of the memory bank circuit board body (100), and a through hole (321) is formed in the pressing plate (320) for the screw (400) to pass through, and a blocking edge (322) is integrally formed on the rear side of the pressing plate (320) located at the rear.

2. The high wiring density embedded magnetic shielding type high integration memory module wiring board according to claim 1, wherein: The memory bank circuit board body (100) includes a circuit board body (110), four mounting holes (120) arranged in a rectangular array are formed in the circuit board body (110), the mounting holes (120) and the through holes (321) are one-to-one corresponding, and the side plate (310) and the pressing plate (320) are respectively in contact with the side surface and the top surface of the circuit board body (110).

3. The high wiring density embedded magnetic shielding type high integration memory module wiring board according to claim 2, wherein: The support (200) includes a bottom plate (210) located at the bottom of the circuit board body (110), a plurality of screw holes (220) are formed in the bottom plate (210) and have the same number as the mounting holes (120), the screw holes (220) and the mounting holes (120) are one-to-one corresponding, the end of the screw (400) penetrates the through hole (321), the mounting hole (120) and extends into the screw hole (220) in sequence, and the screw (400) is screwed with the inner wall surface of the screw hole (220).

4. The high wiring density embedded magnetic shielding type high integration memory module wiring board according to claim 1, wherein: The side plate (310) is provided with a sliding groove (311) on the side facing the pressing plate (320), one side of the pressing plate (320) is fixedly connected with a sliding block (323), and the sliding block (323) is slidingly connected in the inner cavity of the corresponding sliding groove (311).

5. The high wiring density embedded magnetic shielding type high integration memory module printed circuit board according to claim 4, wherein: The sliding groove (311) and the sliding block (323) are dovetail-shaped or T-shaped structures.

6. The high wiring density embedded magnetic shielding type high integration memory module printed circuit board according to claim 1, wherein: The front side of the pressing plate (320) is integrally formed with a guide plate (324), the guide plate (324) is inclined, and the horizontal line on the front side of the guide plate (324) is higher than that on the rear side.

7. The high wiring density embedded magnetic shielding type high integration memory module printed circuit board according to claim 3, wherein: The inner cavity of the mounting hole (120) is provided with a rubber sleeve (500) for protection, the rubber sleeve (500) is composed of a grommet and a support which are integrally formed, the top of the grommet is in contact with the pressing plate (320), the support is fixedly connected to the inner wall surface of the mounting hole (120), and the inner wall surfaces of the grommet and the support are in contact with the screw (400).

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