Solder strip transfer device and solar cell production unit

Abstract

The utility model provides a solder strip transfer device and a solar cell production unit, and relates to the technical field of photovoltaic cells. The device comprises a fixing support, a connecting rod and a connecting rod, one end of the connecting assembly is connected to the fixed bracket; the contact plate is fixed to the end, away from the fixing support, of the connecting assembly, and an adsorption hole with one end communicating with the pipe section is formed in the contact plate; the moving mechanism is connected to the fixing support and used for driving the fixing support to move. And under the condition of negative pressure in the pipe section, the moving mechanism drives the welding strip adsorbed by the contact plate to move. Negative pressure generated by the vacuum pump is conducted along the pipe section, so that the adsorption holes in the surface of the contact plate have adsorption force, the welding strip is adsorbed through the adsorption force generated by the negative pressure, then the welding strip is driven to move through the moving mechanism, and the situation that mechanical force is directly applied to the welding strip is reduced through vacuum adsorption of the welding strip to move; and the problem of indentation or surface damage possibly caused by mechanical clamping is relieved.

Description

Technical Field

[0001] This application belongs to the field of photovoltaic cell technology, and in particular relates to a ribbon transfer device and a solar cell production unit. Background Technology

[0002] In the fabrication process of solar cell modules, solar cells are connected in series using solder ribbons to achieve efficient current conduction. In traditional fabrication processes, mechanical grippers are typically used to pick up the solder ribbons and then mechanically transfer them to the surface of the solar cells. However, the mechanical grippers may leave indentations or mechanical damage on the surface of the solder ribbons, which not only affects their appearance but may also reduce their conductivity, leading to a decrease in current transmission efficiency.

[0003] It should be noted that the above content is not necessarily prior art, nor is it intended to limit the scope of patent protection of this application. Utility Model Content

[0004] This application provides a ribbon transfer device and a solar cell production unit to solve or alleviate one or more technical problems in the prior art.

[0005] The first aspect of this application provides a welding strip transfer device, comprising:

[0006] Fixed bracket, with internal pipe sections;

[0007] A connecting component, one end of which is connected to the fixed bracket;

[0008] A contact plate is fixed to the end of the connecting assembly away from the fixed bracket, and the contact plate has an adsorption hole inside which one end communicates with the pipe section;

[0009] A moving mechanism is connected to the fixed bracket and is used to move the fixed bracket;

[0010] When the pipe section is under negative pressure, the moving mechanism drives the welding strip adsorbed by the contact plate to move.

[0011] Optionally, the pipe segment includes a first pipe segment disposed on the fixed bracket, a third pipe segment connected to the adsorption hole, and the first pipe segment and the third pipe segment are connected through a second pipe segment disposed inside the connecting assembly;

[0012] There are multiple third pipe sections, and one end of each third pipe section is connected to the second pipe section;

[0013] There are multiple adsorption holes, and each adsorption hole is connected to a corresponding third pipe segment.

[0014] Optionally, the side of the contact plate away from the fixed bracket is a plane.

[0015] Optionally, the contact plate includes opposing first and second ends;

[0016] The first end is provided with a first limiting part, which is perpendicular to the contact plate and extends toward the side away from the fixed bracket;

[0017] The second end is provided with a second limiting part, which is perpendicular to the contact plate and extends toward the side away from the fixed bracket.

[0018] Optionally, the first limiting part is slidably mounted on the contact plate, and the second limiting part is slidably mounted on the contact plate;

[0019] The first limiting part and the second limiting part can move toward each other or toward each other.

[0020] Optionally, the side of the contact plate away from the fixed bracket is an arc-shaped surface.

[0021] Optionally, there are multiple connecting components, and the multiple connecting components are arranged at intervals along a predetermined direction;

[0022] There are multiple contact plates, and each contact plate is connected to a corresponding connection component.

[0023] Optionally, the welding strip transfer device further includes a negative pressure gauge, which is connected to the pipe section and used to detect the adsorption vacuum value of the pipe section.

[0024] Optionally, the moving mechanism includes:

[0025] A vertical moving component, one end of which is connected to the fixed bracket, is used to drive the fixed bracket to move in the vertical direction;

[0026] A horizontal moving component is connected to the other end of the vertical moving component, and the horizontal moving component is used to drive the vertical moving component to move in the horizontal direction.

[0027] A second aspect of this application provides a solar cell production unit, including a ribbon transfer device as described in any of the preceding claims.

[0028] The embodiments of this application employing the above-described technical solution may have the following advantages:

[0029] The negative pressure generated by the vacuum pump is conducted along the pipe section, giving the adsorption holes on the surface of the contact plate an adsorption force. The welding ribbon can be adsorbed by the adsorption force generated by the negative pressure, and then the welding ribbon is moved by the moving mechanism to facilitate the transfer of the welding ribbon to the surface of the battery cell. Compared with the method of mechanical grippers grasping the welding ribbon by physical pressure, the method of moving the welding ribbon by vacuum adsorption reduces the direct application of mechanical force to the welding ribbon and alleviates the problems of indentation or surface damage that may be caused by mechanical clamping.

[0030] The above overview is for illustrative purposes only and is not intended to be limiting in any way. In addition to the illustrative aspects, embodiments, and features described above, further aspects, embodiments, and features of this application will become readily apparent from the accompanying drawings and the following detailed description. Attached Figure Description

[0031] In the accompanying drawings, unless otherwise specified, the same reference numerals throughout the various drawings denote the same or similar parts or elements. These drawings are not necessarily drawn to scale. It should be understood that these drawings depict only some embodiments disclosed in this application and should not be construed as limiting the scope of this application.

[0032] Figure 1 A schematic diagram of the structure of the welding strip transfer device provided in the embodiments of this application;

[0033] Figure 2 for Figure 1 A magnified view of a portion of point A in the middle.

[0034] Explanation of reference numerals in the attached figures:

[0035] Fixed bracket 10; connecting assembly 20; contact plate 30; vacuum pump 50; first pipe section 601; second pipe section 602; third pipe section 603; adsorption hole 302; first limiting part 303; second limiting part 304; vertical moving assembly 41; horizontal moving assembly 42. Detailed Implementation

[0036] The embodiments of this application are described in detail below, examples of which are illustrated in the accompanying drawings. In the drawings, for clarity, the dimensions of layers, regions, elements, and their relative dimensions may be exaggerated. The same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain this application, and should not be construed as limiting this application.

[0037] It should be understood that when an element or layer is referred to as "on," "adjacent to," "connected to," or "coupled to" other elements or layers, it may be directly on, adjacent to, connected to, or coupled to other elements or layers, or there may be intervening elements or layers. Conversely, when an element is referred to as "directly on," "directly adjacent to," "directly connected to," or "directly coupled to" other elements or layers, there are no intervening elements or layers. It should be understood that although the terms first, second, third, etc., may be used to describe various elements, components, areas, layers, and / or portions, these elements, components, areas, layers, and / or portions should not be limited by these terms. These terms are only used to distinguish one element, component, area, layer, or portion from another element, component, area, layer, or portion. Therefore, without departing from the teachings of this application, the first element, component, area, layer, or portion discussed below may be referred to as a second element, component, area, layer, or portion. And the discussion of a second element, component, area, layer, or portion does not imply that the first element, component, area, layer, or portion necessarily exists in this application.

[0038] In this application, unless otherwise expressly specified and limited, the terms "installation," "connection," "joining," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components, unless otherwise expressly limited. Those skilled in the art can understand the specific meaning of the above terms in this application according to the specific circumstances.

[0039] It should be noted that the terms "first," "second," etc., in the specification, claims, and accompanying drawings of this application are used to distinguish similar objects and are not necessarily used to describe a specific order or sequence. It should be understood that such terms can be used interchangeably where appropriate so that the embodiments of this application described herein can be implemented, for example, in orders other than those illustrated or described herein. Furthermore, the terms "comprising" and "having," and any variations thereof, are intended to cover a non-exclusive inclusion; for example, a process, method, system, product, or apparatus that comprises a series of steps or units is not necessarily limited to those steps or units explicitly listed, but may include other steps or units not explicitly listed or inherent to such processes, methods, products, or apparatus.

[0040] In this application, when numerical intervals (i.e., numerical ranges) are involved, unless otherwise specified, the distribution of selectable numerical values ​​within the numerical interval is considered continuous, and includes the two endpoints of the numerical interval (i.e., the minimum and maximum values), as well as every numerical value between these two endpoints. Unless otherwise specified, when a numerical interval refers only to integers within that numerical interval, it includes the two endpoint integers of the numerical range, as well as every integer between the two endpoints, which is equivalent to directly listing every integer. When multiple numerical ranges are provided to describe features or characteristics, these numerical ranges can be merged. In other words, unless otherwise specified, the numerical ranges disclosed in this application should be understood to include any and all subranges included therein. The "numerical value" in the numerical interval can be any quantitative value, such as a number, percentage, ratio, etc. The term "numerical interval" can be broadly included to include percentage intervals, ratio intervals, proportion intervals, etc.

[0041] This application provides a solder strip transfer device and a solar cell production unit. This aims to alleviate the problem of potential damage to the solder strip when gripped by mechanical grippers. Details are provided below.

[0042] Exemplary embodiments according to this application will now be described in more detail with reference to the accompanying drawings. It should be understood that these exemplary embodiments may be implemented in many different forms and should not be construed as being limited to the embodiments set forth herein.

[0043] Please see Figure 1 and Figure 2 This application provides a welding strip transfer device, which includes a fixed bracket 10, a connecting assembly 20, a contact plate 30, and a moving mechanism. The following is a detailed description:

[0044] The fixed bracket 10 has a tube section inside. Specifically, the tube section can be evacuated by the vacuum pump 50 to continuously provide negative pressure to the tube section, so that the end of the tube section can generate an adsorption force.

[0045] One end of the connecting component 20 is connected to the fixed bracket 10.

[0046] The contact plate 30 is fixed to the end of the connecting assembly 20 away from the fixed bracket 10, and the surface of the contact plate 30 is also provided with an adsorption hole 302 that communicates with the pipe section.

[0047] The moving mechanism is connected to the fixed bracket 10 and is used to move the fixed bracket 10 in three-dimensional space. When the vacuum pump 50 evacuates air to create a negative pressure in the pipe section, the moving mechanism moves the welding strip adsorbed by the contact plate 30.

[0048] Specifically, the fixed support 10 can be moved horizontally or vertically via electric or pneumatic means to precisely transfer the solder strip from one location to another after it has been adsorbed, such as from the storage area to the soldering position of the battery cell. The moving mechanism can be integrated with an automated control system, allowing specific movement paths, speeds, and rhythms to be set according to the needs of the production line, achieving high-precision automated operation.

[0049] In this embodiment, the negative pressure generated by the vacuum pump 50 is conducted along the pipe section, so that the adsorption holes 302 on the surface of the contact plate 30 have adsorption force. The welding strip can be adsorbed by the adsorption force generated by the negative pressure. Then, the welding strip is moved by the moving mechanism to facilitate the transfer of the welding strip to the surface of the battery cell. Compared with the method of mechanical grippers grasping the welding strip by physical pressure, the welding strip is moved by vacuum adsorption, which reduces the direct application of mechanical force to the welding strip and alleviates the problem of indentation or surface damage that may be caused by mechanical clamping.

[0050] Furthermore, in this embodiment, the pipe segment includes a first pipe segment 601 disposed on the fixed bracket, a third pipe segment 603 connected to the adsorption hole, and the first pipe segment 601 and the third pipe segment 603 are connected through a second pipe segment 602 disposed inside the connecting assembly; there can be multiple third pipe segments 603, and one end of each third pipe segment 603 is connected to the second pipe segment 602; there are multiple adsorption holes 302, and one adsorption hole 302 is connected to a corresponding third pipe segment 603.

[0051] The connecting component 20 serves as the connection medium between the fixed bracket 10 and the contact plate 30, playing a dual role in connecting and transmitting negative pressure. The second tube section 602 inside the connecting component 20 is used to transmit the negative pressure generated by the vacuum pump 50 to the third tube section 603 inside the contact plate 30. The negative pressure is transmitted through the connecting component 20 to the adsorption hole 302 on the contact plate 30, thereby ensuring that the welding ribbon can be stably adsorbed. In some embodiments, the connecting component 20 may include through-hole screws.

[0052] Furthermore, in this embodiment, there are multiple third tube segments 603, one end of each third tube segment 603 is connected to the second tube segment 602, and there are multiple adsorption holes 302, one adsorption hole 302 is connected to a corresponding third tube segment 603.

[0053] Multiple adsorption holes 302 can evenly distribute negative pressure at multiple locations on the surface of the contact plate 30. This generates adsorption force on multiple areas of the solder ribbon, ensuring that the adsorption force is not concentrated at a single point but is evenly applied to different parts of the solder ribbon, thereby alleviating the situation where excessive local adsorption causes deformation or damage to the solder ribbon.

[0054] In one embodiment, the multiple adsorption pores 302 can be distributed along the same straight line, or evenly distributed in a rectangular matrix or circular matrix. Specifically, in this embodiment, the number of adsorption pores 302 can be 10 to 15, and they are evenly spaced along the same straight line.

[0055] In an optional embodiment, each adsorption hole 302 may include three sub-adsorption holes 302. The three sub-adsorption holes 302 are evenly distributed in the shape of an equilateral triangle. The equilateral triangle layout can ensure that each adsorption point generates a relatively uniform force distribution on the surface of the solder ribbon, so that the contact plate 30 can provide a more balanced adsorption force during the adsorption process, avoid the concentrated force caused by a single adsorption hole 302, thereby improving the stability of adsorption and preventing the solder ribbon from tilting or shifting during adsorption.

[0056] In an alternative embodiment, the side of the contact plate 30 away from the fixed bracket 10 is flat.

[0057] When adsorbing rectangular solder ribbon, the flat surface of the contact plate 30 can fit against one side of the rectangular solder ribbon, so that the adsorption force is evenly distributed across the entire surface of the solder ribbon, reducing the risk of localized poor adsorption and ensuring the stability of the solder ribbon during movement. Furthermore, the flat surface of the contact plate 30 facilitates cleaning of the contact plate 30 surface, removing residual solder ribbon residue or other debris.

[0058] In other embodiments, the surface of the contact plate 30 facing the solder strip can be adaptively adjusted according to the shape of the solder strip.

[0059] Furthermore, in this embodiment, the contact plate 30 includes a first end and a second end opposite to each other. The first end is provided with a first limiting portion 303, which extends perpendicular to the contact plate 30 and away from the fixed bracket 10. The second end is provided with a second limiting portion 304, which extends perpendicular to the contact plate 30 and away from the fixed bracket 10. The first limiting portion 303, the second limiting portion 304, and the contact plate 30 form a receiving groove for receiving and limiting the solder strip.

[0060] During the adsorption and movement of the welding strip, the welding strip may be displaced or slide on the contact plate 30 due to inertia. By setting a first limiting part 303 and a second limiting part 304 at both ends of the contact plate 30, the welding strip can be effectively fixed between the first limiting part 303 and the second limiting part 304, thus alleviating the problem of the welding strip shifting or tilting during adsorption and movement.

[0061] Specifically, the distance between the first limiting part 303 and the second limiting part 304 is slightly larger than the width of the welding strip, so that after the contact plate 30 adsorbs the welding strip, there is a slight gap between the welding strip and the first limiting part 303 and the second limiting part 304, thereby reducing the direct friction between the welding strip and the limiting part, avoiding scratches or indentations caused by friction during the adsorption, transfer and release of the welding strip, maintaining the surface flatness and integrity of the welding strip, and avoiding damage.

[0062] In some embodiments, after the solder ribbon is adsorbed, the distance between the first limiting part 303 and the second limiting part 304 can be shortened to assist in clamping the solder ribbon with the first limiting part 303 and the second limiting part 304, thereby reducing the possibility of the solder ribbon falling off during the transfer process.

[0063] Furthermore, in this embodiment, the first limiting part 303 is slidably mounted on the contact plate 30, and the second limiting part 304 is slidably mounted on the contact plate 30. The first limiting part 303 and the second limiting part 304 can move toward each other or away from each other.

[0064] The distance between the first limiting part 303 and the second limiting part 304 is adjustable to accommodate welding strips of different widths. When transferring welding strips of different specifications, the distance between the first limiting part 303 and the second limiting part 304 can be adjusted to accommodate the width of welding strips of different specifications, thereby providing appropriate limiting for welding strips of different specifications and improving the versatility and flexibility of the welding strip transfer device.

[0065] In some embodiments, sensors and control systems can be integrated into the ribbon transfer device to detect the width of the ribbon to be adsorbed by the sensors, and to dynamically adjust the distance between the first limiting part 303 and the second limiting part 304 according to the detected width, so as to ensure a better gripping effect.

[0066] In an optional embodiment, the surface of the contact plate 30 is provided with a buffer layer (not shown in the figure). During the process of the contact plate 30 adsorbing the solder ribbon, vibration or impact may occur. The buffer layer can absorb these vibrations, reduce the impact on the solder ribbon, and avoid the impact generated during the adsorption of the solder ribbon from causing indentations or damage to the surface of the solder ribbon.

[0067] Specifically, the buffer layer can be made of soft materials such as rubber or foam. Rubber has excellent elasticity and shock absorption properties, which can effectively absorb impacts and vibrations.

[0068] In one optional embodiment, the side of the contact plate 30 away from the fixed bracket 10 is arc-shaped. When adsorbing circular welding strips, the arc-shaped surface of the contact plate 30 can fit against the outer wall of the circular welding strip, reducing the gap between the contact plate 30 and the circular welding strip, thereby reducing air permeation between them, reducing airflow interference in the adsorption area, improving the efficiency of vacuum adsorption, and ensuring the firmness of the adsorbed welding strip. In other embodiments, the surface of the contact plate 30 facing the welding strip can be adaptively adjusted according to the shape of the welding strip.

[0069] In one optional embodiment, there are multiple connecting components 20, which are arranged at intervals along a predetermined direction. There are also multiple contact plates 30, with each contact plate 30 connected to a corresponding connecting component 20. Multiple contact plates 30 can correspond to multiple solder ribbons, allowing one contact plate 30 to adsorb one solder ribbon. This enables the solder ribbon transfer device to simultaneously adsorb multiple solder ribbons, maintaining consistency during transfer. Alternatively, it can adsorb a corresponding number of solder ribbons based on the number of grid lines in the assembled battery module, thus completing the solder ribbon assembly of a group of battery cells in a single transfer.

[0070] In an optional embodiment, the welding strip transfer device further includes a negative pressure gauge (not shown in the figure), which is connected to the pipe section and used to detect the adsorption vacuum value of the pipe section. In this embodiment, the negative pressure gauge is connected to the first pipe section 601 and used to detect the adsorption vacuum value of the first pipe section 601. Since the first pipe section 601, the second pipe section 602, and the third pipe section 603 are interconnected, the adsorption vacuum value detected by the negative pressure gauge can be regarded as the vacuum adsorption value of the adsorption holes 302 on the contact plate 30, and this vacuum adsorption value can be expressed as the adsorption intensity of the adsorption holes 302. In some embodiments, the negative pressure gauge can also directly detect the negative pressure state inside the vacuum pump 50.

[0071] The welding strip transfer device may also include an alarm component. When a fault such as air leakage occurs in the pipeline, the negative pressure in the pipeline will drop, and the negative pressure detection gauge will detect that the adsorption vacuum value will also drop. When the adsorption vacuum value drops and falls below a preset threshold, the alarm component will issue a warning, so that operators can detect and deal with the abnormality at the first time, avoid batch welding quality abnormalities, and reduce the rework rate.

[0072] The welding strip transfer device also includes a main control component, which is used to determine whether to transfer the welding strip based on the adsorption vacuum value detected by the negative pressure detector. In some embodiments, the main control component determines that the welding strip can be transferred normally only when the adsorption vacuum value detected by the negative pressure detector is greater than a preset threshold, and then executes the welding strip transfer (including adsorption and movement).

[0073] In one optional embodiment, the moving mechanism includes a vertical moving component 41 and a horizontal moving component 42. One end of the vertical moving component 41 is connected to the fixed bracket 10 and is used to drive the fixed bracket 10 to move in the vertical direction. The horizontal moving component 42 is connected to the other end of the vertical moving component 41 and is used to drive the vertical moving component 41 to move in the horizontal direction.

[0074] After the contact plate 30 absorbs the solder ribbon, the solder ribbon can be lifted by the vertical moving component 41, and then moved to the designated position by the horizontal moving component 42 for assembly with the battery module. The vertical moving component 41 and the horizontal moving component 42 work together to move the solder ribbon flexibly in three-dimensional space to adapt to different production needs.

[0075] Specifically, the vertical moving component 41 can be extended and retracted by a cylinder to achieve vertical movement; the horizontal moving component 42 can include a slide rail and a motor, with one end of the vertical moving component 41 connected to the slide rail so that the vertical moving component 41 can be driven by the motor to move horizontally.

[0076] In some embodiments, the moving mechanism may also include a first connecting component 20 and a second connecting component 20, which are connected by a ball joint. One end of the first connecting component 20 is connected to the fixed bracket 10, and the first connecting component 20 can perform three-dimensional movement around the ball joint.

[0077] This application also provides a solar cell production unit, including a ribbon transfer device as described in any of the above embodiments. In one embodiment, the solar cell production unit further includes a laminating device for stacking encapsulation materials (such as EVA, glass, etc.) onto the upper and lower sides of the cell string, and for firmly bonding the materials together by heating and pressure to form a solar cell module.

[0078] It should be noted that the terms "center," "longitudinal," "lateral," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," "counterclockwise," "axial," "radial," and "circumferential," etc., are used only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation on this application. The directional terms "inner" and "outer" refer to the inside or outside relative to the outline of the component itself. For example, if a device in the drawings is inverted, a device described as "above" or "on top of" other devices or structures will subsequently be positioned as "below" or "under" other devices or structures. Thus, the exemplary term "above" can include both "above" and "below." The device may also be positioned in other different ways (rotated 90 degrees or in other orientations), and the spatial relative descriptions used herein are interpreted accordingly.

[0079] It should also be noted that the terms "one embodiment," "another embodiment," and "embodiment" used in this application refer to specific features, structures, or characteristics described in connection with that embodiment, which are included in at least one embodiment described in the general description of this application. The appearance of the same expression in multiple places in the specification does not necessarily refer to the same embodiment. Furthermore, when a specific feature, structure, or characteristic is described in connection with any embodiment, the intention is to suggest that implementing such a feature, structure, or characteristic in conjunction with other embodiments also falls within the scope of this application.

[0080] In the above embodiments, the descriptions of each embodiment have different focuses. For parts not described in detail in a certain embodiment, please refer to the relevant descriptions in other embodiments.

[0081] It should also be noted that the above are merely preferred embodiments of this application and do not limit the scope of patent protection of this application. Any equivalent structural or procedural changes made using the content of this application’s specification and drawings, or direct or indirect applications in other related technical fields, are similarly included within the scope of patent protection of this application.

Claims

1. A solder strip transfer device, characterized by, The application relates to a solder strip transfer device. The device comprises: a fixed support with a pipe section inside; a connecting assembly connected to the fixed support at one end; a contact plate fixed to the connecting assembly at an end away from the fixed support, the contact plate being provided with adsorption holes in communication with the pipe section; a moving mechanism connected to the fixed support and used for moving the fixed support; 2. The solder strip transfer device of claim 1, wherein, wherein, under the condition of negative pressure in the pipe section, the moving mechanism moves the solder strip adsorbed by the contact plate. The pipe section comprises a first pipe section arranged in the fixed support, a third pipe section connected to the adsorption holes, and the first pipe section and the third pipe section being connected through a second pipe section arranged inside the connecting assembly; the third pipe section is a plurality of pipe sections, and one end of each of the third pipe sections is in communication with the second pipe section; 3. The solder strip transfer device of claim 1, wherein, the adsorption holes are a plurality of holes, and one adsorption hole is in communication with one corresponding third pipe section.

4. The solder strip transfer device of claim 3, wherein, The side of the contact plate away from the fixed support is a plane. The contact plate comprises opposite first and second ends; the first end is provided with a first limiting part extending perpendicularly to the contact plate and away from the fixed support; 5. The solder strip transfer device of claim 4, wherein, the second end is provided with a second limiting part extending perpendicularly to the contact plate and away from the fixed support. The first limiting part is slidably arranged on the contact plate, and the second limiting part is slidably arranged on the contact plate; 6. The solder strip transfer device of claim 1, wherein, wherein, the first limiting part and the second limiting part can move towards each other or away from each other.

7. The solder strip transfer device according to any one of claims 1 to 6, characterized in that The side of the contact plate away from the fixed support is an arc-shaped surface. The connecting assembly is a plurality of assemblies, and the assemblies are arranged at intervals along a predetermined direction; 8. The solder strip transfer device according to any one of claims 1 to 6, characterized in that the contact plate is a plurality of plates, and one contact plate is connected to one corresponding connecting assembly.

9. The solder strip transfer device according to any one of claims 1 to 6, characterized in that The solder strip transfer device further comprises a negative pressure detection table in communication with the pipe section and used for detecting the adsorption vacuum value of the pipe section. The moving mechanism comprises: a vertical moving assembly connected to the fixed support at one end and used for moving the fixed support in a vertical direction; 10. A solar cell production unit, characterized by, a horizontal moving assembly connected to the other end of the vertical moving assembly, the horizontal moving assembly being used for driving the vertical moving assembly to move in a horizontal direction. The application further relates to a solder strip transfer device comprising any one of the devices according to claims 1-9.

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