Wafer carrying device, vacuum reaction cavity and semiconductor process equipment
By introducing a limiting mechanism into the wafer handling device, the collision problem caused by the lifting failure of the ejector pin rod was solved, and safer wafer transfer was achieved.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-04-09
- Publication Date
- 2026-03-10
AI Technical Summary
Existing wafer handling devices lack limiting structures, which may cause the ejector pin rod to collide with the reaction chamber cover or slit when it malfunctions, affecting the safety of wafer handling.
Introducing a limiting mechanism into the wafer handling device, through the coordinated action of the limiting block and the limiting switch, restricts the lifting and rotation of the ejector pin rod, ensuring that the handling fingers operate within a specific height range.
It improves the safety of wafer handling, prevents the ejector pin from colliding with the reaction chamber cover or slit, and ensures smooth wafer transfer.
Smart Images
Figure CN223987363U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to the field of semiconductor equipment technology, specifically to a wafer handling device, a vacuum reaction chamber, and semiconductor process equipment. Background Technology
[0002] Figure 1 An existing semiconductor process apparatus is shown, comprising a vacuum reaction chamber 10', a vacuum lock 20', and a vacuum gate valve 30' disposed between the vacuum reaction chamber 10' and the vacuum lock 20'. The top opening of the vacuum reaction chamber 10' is closed by a reaction chamber cover 11', and the top opening of the vacuum lock 20' is closed by a vacuum lock cover 21'. The vacuum lock 20' is also connected to a wafer front-end device (not shown) via an atmospheric gate valve 40'. The vacuum reaction chamber 10' contains a wafer transport device, which includes a wafer stage 51', a stage 51 support 52', a ejector pin 53', a connecting rod 54', a wafer tray 55', and a sealing ring 56'. During wafer processing in the vacuum reaction chamber 10', a drive device (not shown) lowers the ejector pin 53' until the wafer on the wafer tray 55' contacts the wafer stage 51', and then wafer processing is performed.
[0003] After processing is completed, the wafer tray 55' is lifted by the ejector pin 53', lifting the wafer from the wafer stage 51'. Then, the ejector pin 53' is driven by the drive device to rotate, causing the wafer tray 55' to rotate from the vacuum reaction chamber 10' through the slit into the vacuum lock 20', until the wafer tray 55' is above the wafer support 22' in the vacuum lock 20'. After that, the wafer tray 55' descends, and the wafer is lifted by the wafer support 22', completing the wafer transfer between the vacuum reaction chamber 10' and the vacuum lock 20'.
[0004] However, the aforementioned wafer handling device does not have a corresponding limiting structure, which may cause the wafer tray 55' to collide with the reaction chamber cover 11' due to the lifting failure of the ejector pin 53', or to collide with the slit due to the mismatch between its height and the height of the vacuum lock 20' when it rotates. Utility Model Content
[0005] To address the shortcomings of the prior art, this invention provides a wafer handling device, a vacuum reaction chamber, and semiconductor process equipment to enhance the limiting function of the ejector pins during lifting and lowering in the wafer handling device, thereby improving the safety of wafer handling.
[0006] To achieve the above objectives, the present invention adopts the following technical solution:
[0007] In a first aspect, this utility model provides a wafer handling device, including a stage, handling fingers, ejector pins, a first driving device, and a limiting mechanism;
[0008] The platform is equipped with a liftable ejector pin, and the ejector pin rod is vertically arranged on one side of the platform. The top of the ejector pin rod is connected to the handling finger for handling wafers via a connecting rod. The first driving device is used to drive the ejector pin rod to lift and rotate, so as to drive the handling finger to lift and rotate from the vacuum reaction chamber through the slit into the vacuum lock.
[0009] The limiting mechanism includes a limiting block installed on the ejector pin rod, and a first mounting rod and a second mounting rod arranged longitudinally adjacent to the ejector pin rod. The first mounting rod is equipped with a first upper limit switch and a first lower limit switch arranged opposite to each other, and the second mounting rod is equipped with a second upper limit switch and a second lower limit switch arranged opposite to each other.
[0010] Specifically, when the transport finger rotates to a position above the stage, the limiting block rotates to a position between the first upper limit switch and the first lower limit switch; when the height of the transport finger approaches the top of the vacuum reaction chamber, the limiting block triggers the first upper limit switch to shut down the first driving device; when the height of the transport finger approaches the stage, the limiting block triggers the first lower limit switch to shut down the first driving device.
[0011] When the transport finger rotates to move away from above the platform, the limiting block rotates to be positioned between the second upper limit switch and the second lower limit switch; when the height of the transport finger approaches the top of the slit, the limiting block triggers the second upper limit switch to shut down the first drive device; when the height of the transport finger approaches the bottom of the slit, the limiting block triggers the second lower limit switch to shut down the first drive device.
[0012] Preferably, the first upper limit switch is configured to be triggered when the limit block is contacted or when the limit block enters the sensing area of the first upper limit switch;
[0013] The first lower limit switch is configured to be triggered when it contacts the limit block or when the limit block enters the sensing area of the first lower limit switch;
[0014] The second upper limit switch is configured to be triggered when the limit block is contacted or when the limit block enters the sensing area of the second upper limit switch;
[0015] The second lower limit switch is configured to be triggered when it contacts the limit block or when the limit block enters the sensing area of the second lower limit switch.
[0016] Preferably, the first mounting rod is provided with a first slide rail, and the first upper limit switch and the first lower limit switch are slidably engaged with the first slide rail; and / or,
[0017] The second mounting rod is provided with a second slide rail, and the second upper limit switch and the second lower limit switch are slidably engaged with the second slide rail.
[0018] Preferably, the cross-section of the limiting block is approximately fan-shaped.
[0019] Secondly, the present invention provides a vacuum reaction chamber, including the wafer handling device as described above, wherein the ejector pin passes through the bottom plate of the vacuum reaction chamber, and the first driving device and the limiting mechanism are disposed outside the vacuum reaction chamber.
[0020] Preferably, a sealing ring is provided between the ejector pin rod and the bottom plate of the vacuum reaction chamber.
[0021] Thirdly, the present invention provides a semiconductor process apparatus, including a vacuum reaction chamber and a vacuum lock as described above, wherein a vacuum gate valve is provided between the vacuum reaction chamber and the vacuum lock.
[0022] Preferably, the vacuum lock is provided with at least two wafer support platforms, and the at least two wafer support platforms are mounted on a lifting seat, which is driven to rise and fall by a second drive device.
[0023] Preferably, the process equipment includes multiple vacuum reaction chambers, and each vacuum reaction chamber is connected to the vacuum lock through the vacuum valve.
[0024] Preferably, the semiconductor process equipment is a WCVD equipment.
[0025] By adopting the above technical solution, this utility model has the following beneficial effects:
[0026] This invention adds a limiting mechanism. When the transport finger rotates to a position above the stage, the lifting height of the transport finger is limited between the top of the vacuum reaction chamber and the stage through the coordinated action of the limiting block, the first upper limit switch, and the first lower limit switch. After the wafer is processed on the stage, the transport finger removes the wafer, and the ejector rod begins to rotate until the limiting block rotates between the second upper limit switch and the second lower limit switch. At this point, the ejector rod rises, so that the height of the transport finger matches the slit. During this process, due to the coordinated action of the limiting block, the second upper limit switch, and the second lower limit switch, the lifting height of the transport finger is limited between the top and bottom of the slit, ensuring that the transport finger can pass through the slit smoothly, thereby improving the safety of wafer transport. Attached Figure Description
[0027] Figure 1 This is a schematic diagram of a semiconductor process equipment in the prior art;
[0028] Figure 2 This is a schematic diagram of a semiconductor process equipment that integrates the wafer handling device of this utility model. Detailed Implementation
[0029] To make the objectives, technical solutions, and advantages of this utility model clearer, the present utility model will be further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the present utility model and are not intended to limit the present utility model. All other embodiments obtained by those skilled in the art based on the embodiments of this utility model without inventive effort are within the scope of protection of this utility model.
[0030] The terminology used in this invention is for the purpose of describing particular embodiments only and is not intended to be limiting of this disclosure. The singular forms “a,” “the,” and “the” as used in this disclosure and the appended claims are also intended to include the plural forms unless the context clearly indicates otherwise. It should also be understood that the term “and / or” as used herein refers to and includes any or all possible combinations of one or more of the associated listed items.
[0031] Example 1
[0032] This embodiment provides a wafer handling device for handling wafers in semiconductor process equipment. For example... Figure 2 As shown, the semiconductor process equipment includes a vacuum reaction chamber 10, a vacuum lock 20, and a vacuum gate valve 30 disposed between the vacuum reaction chamber 10 and the vacuum lock 20. The top opening of the vacuum reaction chamber 10 is closed by a reaction chamber cover 11, and the top opening of the vacuum lock 20 is closed by a vacuum lock cover 21. The vacuum lock 20 is also connected to a wafer front-end device (not shown) via an atmospheric gate valve 40. A through slit is formed between the vacuum reaction chamber 10, the vacuum lock 20, and the vacuum gate valve 30.
[0033] like Figure 2 As shown, the wafer handling device of this embodiment includes a stage 51, a push pin 53, a handling finger 55, a first driving device (not shown), and a limiting mechanism. The stage 51 is equipped with a liftable push pin 52, and the push pin 53 is vertically disposed on one side of the stage 51. The top of the push pin 53 is connected to the handling finger 55 for handling wafers via a connecting rod 54. The first driving device is used to drive the push pin 53 to move up and down and rotate, thereby driving the handling finger 55 to move up and down and rotate from the vacuum reaction chamber 10 through a slit into the vacuum lock 20.
[0034] In this embodiment, the limiting mechanism specifically includes a limiting block 61 installed on the ejector rod 53, and a first mounting rod 62 and a second mounting rod 63 arranged longitudinally adjacent to the ejector rod 53. The first mounting rod 62 is equipped with a first upper limit switch 64 and a first lower limit switch 65 arranged opposite to each other, and the second mounting rod 63 is equipped with a second upper limit switch 66 and a second lower limit switch 67 arranged opposite to each other.
[0035] Specifically, when the transport finger 55 rotates to a position above the stage 51, the limiting block 61 rotates to a position between the first upper limit switch 64 and the first lower limit switch 65; when the height of the transport finger 55 approaches the top of the vacuum reaction chamber 10, the limiting block 61 triggers the first upper limit switch 64 to shut down the first drive device; when the height of the transport finger 55 approaches the stage 51, the limiting block 61 triggers the first lower limit switch 65 to shut down the first drive device.
[0036] When the transport finger 55 rotates to move away from above the platform 51, the limit block 61 rotates to be positioned between the second upper limit switch 66 and the second lower limit switch 67; when the height of the transport finger 55 approaches the top of the slit, the limit block 61 triggers the second upper limit switch 66 to shut down the first drive device; when the height of the transport finger 55 approaches the bottom of the slit, the limit block 61 triggers the second lower limit switch 67 to shut down the first drive device.
[0037] The specific working principle of the wafer handling device in this embodiment is as follows:
[0038] During wafer processing within the vacuum reaction chamber 10, the transport finger 55 is first moved above the stage 51. The first driving device then lowers the ejector rod 53 until the wafer held or adsorbed by the transport finger 55 contacts the ejector pin on the stage 51. The wafer 100 is then placed on the ejector pin, allowing it to descend and be placed on the stage 51 for processing. During this process, if the ejector rod 53 malfunctions, the cooperation of the limit block 61 and the first upper limit switch 64 prevents it from colliding with the top of the vacuum reaction chamber 10. Similarly, the cooperation of the limit block 61 and the first lower limit switch 65 prevents the transport finger 55 from breaking or the ejector pin 52 from being damaged after a collision with the wafer 100, thus preventing further descent of the transport finger 55 and collision with the stage 51, and avoiding damage to the stage 51.
[0039] After wafer 100 is processed on stage 51, the transport finger 55 removes wafer 100, and the ejector rod 53 begins to rotate. When the limit block 61 rotates between the second upper limit switch 66 and the second lower limit switch 67, the ejector rod 53 begins to rise, raising the height of the transport finger 55 to match the slit. During this process, if the ejector rod 53 malfunctions, the coordinated action of the limit block 61, the second upper limit switch 66, and the second lower limit switch 67 can limit the height of the transport finger 55 between the top and bottom of the slit, ensuring that the transport finger 55 can smoothly pass through the slit and transfer the wafer to the wafer support platform 22 inside the vacuum lock 20, thereby improving the safety of wafer handling.
[0040] In this embodiment, the first upper limit switch 64, the first lower limit switch 65, the second upper limit switch 66, and the second lower limit switch 67 can be contact limit switches (such as mechanical switches) or non-contact limit switches (such as photoelectric switches). Therefore, the first upper limit switch 64 can be configured to be triggered when the limit block 61 is contacted, or when the limit block 61 enters the sensing area of the first upper limit switch 64; the first lower limit switch 65 can be configured to be triggered when the limit block 61 is contacted, or when the limit block 61 enters the sensing area of the first lower limit switch 65; the second upper limit switch 66 can be configured to be triggered when the limit block 61 is contacted, or when the limit block 61 enters the sensing area of the second upper limit switch 66; and the second lower limit switch 67 can be configured to be triggered when the limit block 61 is contacted, or when the limit block 61 enters the sensing area of the second lower limit switch 67.
[0041] In one feasible embodiment, the first mounting rod 62 may also be provided with a first slide rail (not shown), with the first upper limit switch 64 and the first lower limit switch 65 slidingly engaged with the first slide rail; the second mounting rod 63 may also be provided with a second slide rail (not shown), with the second upper limit switch 66 and the second lower limit switch 67 slidingly engaged with the second slide rail. This allows the height of each limit switch to be adjusted, accommodating semiconductor devices with different size requirements.
[0042] In this embodiment, the cross-section of the limiting block 61 is preferably approximately fan-shaped, but this embodiment does not impose any specific restrictions on the shape of the limiting block 61.
[0043] Example 2
[0044] This embodiment provides a vacuum reaction chamber, wherein the vacuum reaction chamber includes a wafer transport device as provided in Embodiment 1. Figure 1 As shown, during installation, the ejector pin 53 passes through the bottom plate of the vacuum reaction chamber 10, and the first drive device and the limiting mechanism are located outside the vacuum reaction chamber 10.
[0045] Preferably, a sealing ring 56 is provided between the ejector pin 53 and the bottom plate of the vacuum reaction chamber 10 to improve the sealing performance of the vacuum reaction chamber 10.
[0046] Since the vacuum reaction chamber 10 of this embodiment uses the wafer handling device in Embodiment 1, the safety of wafer handling can be improved.
[0047] Example 3
[0048] This embodiment provides a semiconductor process apparatus, including a vacuum reaction chamber 10 and a vacuum lock 20 as provided in Embodiment 2, and a vacuum gate valve 30 is provided between the vacuum reaction chamber 10 and the vacuum lock 20.
[0049] Preferably, to improve wafer processing efficiency, the vacuum lock 20 of this embodiment is provided with at least two wafer support platforms 22, so that at least two wafers 100 can be obtained from the wafer front-end device at one time. Preferably, the at least two wafer support platforms 22 are mounted on the same lifting seat 23, which is driven to rise and fall by a second drive device (not shown) to raise and lower the corresponding wafer support platform 22 to the corresponding height before the transport finger 55 reaches the vacuum lock 20, thereby improving wafer handling efficiency.
[0050] In one feasible embodiment, the process equipment of this embodiment includes a plurality of vacuum reaction chambers 10 as provided in Embodiment 2, and each vacuum reaction chamber 10 is connected to a vacuum lock 20 via a vacuum gate valve 30.
[0051] Preferably, the semiconductor process equipment in this embodiment is a WCVD (tungsten chemical vapor deposition) equipment. However, it should be understood that this embodiment does not impose any specific limitations on the type of semiconductor process equipment.
[0052] While specific embodiments of this utility model have been described above, those skilled in the art should understand that these are merely illustrative examples, and the scope of protection of this utility model is defined by the appended claims. Those skilled in the art can make various changes or modifications to these embodiments without departing from the principles and essence of this utility model, but all such changes and modifications fall within the scope of protection of this utility model.
Claims
1. A wafer handling device, characterized by, The carrier, the carrying finger, the ejector rod, the first driving device and the limiting mechanism are included. The carrier is provided with a liftable ejector pin, the ejector rod is vertically arranged on one side of the carrier, the top of the ejector rod is connected with the carrying finger for carrying the wafer through a connecting rod, the first driving device is used to drive the ejector rod to lift and rotate, so as to drive the carrying finger to lift and rotate from the vacuum reaction chamber to the vacuum lock through the slit. The limiting mechanism includes a limiting block mounted on the ejector rod, a first mounting rod and a second mounting rod longitudinally arranged adjacent to the ejector rod, the first upper limiting switch and the first lower limiting switch are oppositely arranged on the first mounting rod, and the second upper limiting switch and the second lower limiting switch are oppositely arranged on the second mounting rod. When the carrying finger rotates to be above the carrier, the limiting block rotates to be between the first upper limiting switch and the first lower limiting switch; when the height of the carrying finger approaches the top of the vacuum reaction chamber, the limiting block triggers the first upper limiting switch; when the height of the carrying finger approaches the carrier, the limiting block triggers the first lower limiting switch. When the carrying finger rotates to be away from the carrier, the limiting block rotates to be between the second upper limiting switch and the second lower limiting switch; when the height of the carrying finger approaches the top of the slit, the limiting block triggers the second upper limiting switch; when the height of the carrying finger approaches the bottom of the slit, the limiting block triggers the second lower limiting switch.
2. The wafer handling device of claim 1, wherein The first upper limiting switch is configured to be triggered when contacting the limiting block or when the limiting block enters the sensing area of the first upper limiting switch; The first lower limiting switch is configured to be triggered when contacting the limiting block or when the limiting block enters the sensing area of the first lower limiting switch; The second upper limiting switch is configured to be triggered when contacting the limiting block or when the limiting block enters the sensing area of the second upper limiting switch; The second lower limiting switch is configured to be triggered when contacting the limiting block or when the limiting block enters the sensing area of the second lower limiting switch.
3. The wafer handling device of claim 1, wherein The first mounting rod is provided with a first sliding rail, and the first upper limiting switch and the first lower limiting switch are in sliding fit with the first sliding rail; and / or The second mounting rod is provided with a second sliding rail, and the second upper limiting switch and the second lower limiting switch are in sliding fit with the second sliding rail.
4. The wafer handling device of claim 1, wherein The cross section of the limiting block is substantially fan-shaped.
5. A vacuum reaction chamber, characterized in that, The wafer carrying device includes the carrier, the carrying finger, the ejector rod, the first driving device and the limiting mechanism, wherein the ejector rod penetrates through the bottom plate of the vacuum reaction chamber, and the first driving device and the limiting mechanism are arranged outside the vacuum reaction chamber.
6. The vacuum reaction chamber according to claim 5, characterized in that A sealing ring is arranged between the ejector rod and the bottom plate of the vacuum reaction chamber.
7. A semiconductor process apparatus characterized by comprising: The vacuum reaction chamber and the vacuum lock include the wafer carrying device according to any one of the preceding claims 1-4, the ejector rod penetrates through the bottom plate of the vacuum reaction chamber, and the first driving device and the limiting mechanism are arranged outside the vacuum reaction chamber. A sealing ring is arranged between the ejector rod and the bottom plate of the vacuum reaction chamber. The vacuum reaction chamber and the vacuum lock include the wafer carrying device according to any one of the preceding claims 1-4, the ejector rod penetrates through the bottom plate of the vacuum reaction chamber, and the first driving device and the limiting mechanism are arranged outside the vacuum reaction chamber.
8. The semiconductor process apparatus according to claim 7, wherein The vacuum lock is internally provided with at least two layers of wafer support platforms, and the at least two layers of wafer support platforms are installed on a lifting seat, and the lifting seat is driven to lift by a second driving device.
9. The semiconductor process apparatus according to claim 8, wherein The process equipment comprises a plurality of vacuum reaction cavities, and each vacuum reaction cavity is communicated with the vacuum lock through the vacuum door valve.
10. The semiconductor process apparatus according to any one of claims 7 to 9, characterized by, The semiconductor process equipment is a WCVD equipment.